09204581 B2 20151201 13676098 43247 Method for performing chip level electromagnetic interference reduction, and associated apparatus *** BRS DOCUMENT BOUNDARY *** WKU 09204581 SIZE 43509 DWKU 9204581 APT B2 DID US 9204581 B2 GISD 20151201 ARD 676098 AFD 20121114 APY 2012 SRC 13 APNR 13676098 APP 13/676098 TRX 213 IPCG 20060101 A H05K H05K9/00 F I B US H 20151201 IPCC H05K IPCP H05K9/00 20060101 H05K009/00 CLOI H05K CPOI H05K9/0066 20130101 CPOG H H05K H05K9/0066 20130101 F I 20151201 US TTL Method for performing chip level electromagnetic interference reduction, and associated apparatus URPN 2003/0169838 URNM Greenstreet et al. URPD 20030900 URCL 375/376 URGP US 2003/0169838 A1 20030900 Greenstreet et al. 375/376 cited by examiner URPN 2009/0169874 URNM McCloskey et al. URPD 20090700 URCL 428/336 URGP US 2009/0169874 A1 20090700 McCloskey et al. 428/336 cited by examiner URPN 2009/0207538 URNM Crawley et al. URPD 20090800 URCL 361/56 URGP US 2009/0207538 A1 20090800 Crawley et al. 361/56 cited by examiner URPN 2009/0322441 URNM Chen et al. URPD 20091200 URCL 333/12 URGP US 2009/0322441 A1 20091200 Chen et al. 333/12 cited by examiner URPN 2010/0127739 URNM Ebuchi et al. URPD 20100500 URCL 327/148 URGP US 2010/0127739 A1 20100500 Ebuchi et al. 327/148 cited by examiner URPN 2011/0234318 URNM Abugharbieh et al. URPD 20110900 URCL 330/253 URGP US 2011/0234318 A1 20110900 Abugharbieh et al. 330/253 cited by examiner FRCO CN FRPN 1402605 FRPD 20030300 FRCL N/A FRGP CN 1402605 A 20030300 cited by examiner FRCO CN FRPN 1760783 FRPD 20060400 FRCL N/A FRGP CN 1760783 A 20060400 cited by applicant FRCO CN FRPN 1845666 FRPD 20061000 FRCL N/A FRGP CN 1845666 A 20061000 cited by applicant FRCO CN FRPN 102064808 FRPD 20110500 FRCL N/A FRGP CN 102064808 A 20110500 cited by applicant FRCO JP FRPN 201045940 FRPD 20100200 FRCL N/A FRGP JP 201045940 20100200 cited by applicant ORPL "International Search Report" mailed on Feb. 28, 2013 for International application No. PCT/CN2012/084589, International filing date:Nov. 14, 2012. cited by applicant NCL 20 ECL 1 CIFS 361/763 CIFS 361/800 CIFS 361/816 CIFS 361/818 CFSC 361 CFSS 763;800;816;818 CIFS 174/350 CIFS 174/353 CIFS 174/362 FSCP H05K 9/0066 FSCL H05K CFSC 174 CFSS 350;353;362 NDR 15 NFG 15 COND us-provisional-application US 61559247 20111114 RLPY US RLAN 61559247 RLFD 20111114 PDID US 20130120958 A1 PPCC US PPNR 20130120958 PPKC A1 PPPD 20130516 AANM MEDIATEK INC. AACI Hsin-Chu AAST N/A AAZP N/A AACO TW AATX N/A AAGP MEDIATEK INC. Hsin-Chu TW INNM Yu; Long-Kun INSA N/A INCI New Taipei INST N/A INZP N/A INCO TW INTX N/A INGP Yu; Long-Kun New Taipei TW INNM Deng; Kuo-Liang INSA N/A INCI Miaoli County INST N/A INZP N/A INCO TW INTX N/A INGP Deng; Kuo-Liang Miaoli County TW LRFW Hsu; Winston LRFW Margo; Scott ASNM MEDIATEK INC. ASTC 03 ASCI Science-Based Industrial Park, Hsin-Chu ASST N/A ASZP N/A ASCO TW ASTX N/A ASGP MEDIATEK INC. Science-Based Industrial Park, Hsin-Chu TW 03 ART 2848 EXP Wagner; Jenny L EXA McFadden; Michael P ABPR A method for performing chip level electromagnetic interference (EMI) reduction is provided, where the method is applied to an electronic device. The method includes: providing at least one EMI suppression circuit within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip. In particular, the at least one chip includes a first chip and a second chip; and the at least one EMI suppression circuit includes a first EMI suppression circuit positioned within the first chip, and further includes a second EMI suppression circuit positioned within the second chip. An associated apparatus is also provided. CRTX CROSS REFERENCE TO RELATED APPLICATIONS CRTX This application claims the benefit of U.S. Provisional Application No. 61/559,247, which was filed on Nov. 14, 2011 and is entitled "Chip Level EMI Reduction Method and Apparatus", and is included herein by reference. BSTX BACKGROUND BSTX The present invention relates to electromagnetic interference (EMI) reduction of an electronic device, and more particularly, to a method for performing chip level EMI reduction, and to an associated apparatus. BSTX According to the related art, although there are plenty of proposed EMI solutions, the conventional electronic devices still suffer from some problems. For example, a certain EMI solution of the related art focuses on altering signal paths on printed circuit boards (PCBs), which may cause unacceptable delay of launching the products onto the market. In another example, some other EMI solutions of the related art may focus on adding or re-arranging some components on PCBs, which may cause uncertainty and additional material and labor costs. In another example, another EMI solution of the related art may focus on adding shielding materials to cover some signal paths on PCBs, which may cause additional material and labor costs. In conclusion, the related art does not serve the end user well. Thus, a novel method is required for enhancing EMI reduction of an electronic device. BSTX SUMMARY BSTX It is therefore an objective of the claimed invention to provide a method for performing chip level electromagnetic interference (EMI) reduction, and to provide an associated apparatus, in order to solve the above-mentioned problems. BSTX An exemplary embodiment of a method for performing chip level EMI reduction is provided, where the method is applied to an electronic device. The method comprises: providing at least one EMI suppression circuit within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip. For example, the at least one chip comprises a first chip and a second chip, and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the second chip. In another example, the at least one chip comprises a first chip, and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the first chip. BSTX An exemplary embodiment of an apparatus for performing chip level EMI reduction is provided, where the apparatus comprises at least one portion of an electronic device. The apparatus comprises at least one chip of the electronic device, and further comprises at least one EMI suppression circuit integrated into the at least one chip of the electronic device, wherein the at least one EMI suppression circuit within the at least one chip is arranged to perform EMI reduction on at least one signal within the at least one chip. For example, the at least one chip comprises a first chip and a second chip, and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the second chip. In another example, the at least one chip comprises a first chip, and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the first chip. BSTX These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. DETX BRIEF DESCRIPTION OF THE DRAWINGS DETX FIG. 1 is a diagram of an apparatus for performing chip level electromagnetic interference (EMI) reduction according to a first embodiment of the present invention. DETX FIG. 2 illustrates a flowchart of a method for performing chip level EMI reduction according to an embodiment of the present invention. DETX FIG. 3 illustrates some implementation details of the apparatus shown in FIG. 1 according to an embodiment of the present invention. DETX FIG. 4 illustrates some radiation problems that may occur in a situation where the EMI suppression circuits shown in FIG. 3 are temporarily disabled according to an embodiment of the present invention. DETX FIG. 5 illustrates that the radiation problems that may occur in the above-mentioned situation of the embodiment shown in FIG. 4 can be reduced or eliminated since the EMI suppression circuits shown in FIG. 3 are implemented within the chip 110, without being disabled, according to another embodiment of the present invention. DETX FIG. 6 illustrates another configuration of implementing the EMI suppression circuits shown in FIG. 3 within the chip 110 according to another embodiment of the present invention. DETX FIG. 7 is a diagram of an apparatus for performing chip level EMI reduction according to an embodiment of the present invention. DETX FIG. 8 illustrates some implementation details of the input/output (I/O) pad unit shown in FIG. 5 according to an embodiment of the present invention. DETX FIG. 9 illustrates some implementation details of the I/O pad unit shown in FIG. 5 with an EMI low pass filter (LPF) being taken as an example of the EMI suppression circuit shown in FIG. 5 according to another embodiment of the present invention. DETX FIG. 10 illustrates some implementation details of the I/O pad modules shown in FIG. 3 according to an embodiment of the present invention. DETX FIG. 11 illustrates some implementation details of the I/O pad modules shown in FIG. 3 according to another embodiment of the present invention. DETX FIG. 12 illustrates some implementation details of the I/O pad modules shown in FIG. 3 according to another embodiment of the present invention. DETX FIG. 13 illustrates some implementation details of the I/O pad modules shown in FIG. 3 according to another embodiment of the present invention. DETX FIG. 14 illustrates some implementation details of the I/O pad modules shown in FIG. 3 according to another embodiment of the present invention. DETX FIG. 15 illustrates some implementation details of the I/O pad modules shown in FIG. 3 according to another embodiment of the present invention. DETX DETAILED DESCRIPTION DETX Certain terms are used throughout the following description and claims, which refer to particular components. As one skilled in the art will appreciate, electronic equipment manufacturers may refer to a component by different names. This document does not intend to distinguish between components that differ in name but not in function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to . . . ". Also, the term "couple" is intended to mean either an indirect or direct electrical connection. Accordingly, if one device is coupled to another device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections. DETX Please refer to FIG. 1, which illustrates a diagram of an apparatus 100 for performing chip level electromagnetic interference (EMI) reduction according to a first embodiment of the present invention. According to different embodiments, such as the first embodiment and some variations thereof, the apparatus 100 may comprise at least one portion (e.g. a portion or all) of an electronic device. For example, the apparatus 100 may comprise a portion of the electronic device mentioned above, and more particularly, can be a control circuit such as a chipset comprising one or more integrated circuits (ICs) within the electronic device. In another example, the apparatus 100 can be the whole of the electronic device mentioned above. In another example, the apparatus 100 can be an audio/video system comprising the electronic device mentioned above. Examples of the electronic device may include, but not limited to, a mobile phone (e.g. a multifunctional mobile phone), a personal digital assistant (PDA), a portable electronic device such as the so-called tablet, and a personal computer such as a laptop computer or desktop computer. DETX According to this embodiment, the apparatus 100 may comprise at least one chip of the electronic device, and may further comprise at least one EMI suppression circuit integrated into the at least one chip of the electronic device. As shown in FIG. 1, in addition to the chip 10, the aforementioned at least one chip of the electronic device comprises the chip 110, and the aforementioned at least one EMI suppression circuit integrated into the aforementioned at least one chip comprises the EMI suppression circuit 112 (labeled "SC" in FIG. 1, for brevity, where "SC" stands for "suppression circuit"). In addition, the aforementioned at least one EMI suppression circuit (e.g. the EMI suppression circuit 112) is arranged to perform EMI reduction on at least one signal within the aforementioned at least one chip (e.g. at least one signal within the chip 110). Additionally, the bus shown in FIG. 1 is arranged to electrically connect the chip 10 and the chip 110, where the aforementioned at least one EMI suppression circuit (e.g. the EMI suppression circuit 112) is positioned within the aforementioned at least one chip such as the chip 110, rather than being positioned on the bus shown in FIG. 1. This is for illustrative purposes only, and is not meant to be a limitation of the present invention. According to some variations of this embodiment, the aforementioned at least one EMI suppression circuit may comprise multiple EMI suppression circuits, and/or the aforementioned at least one chip may comprise multiple chips. For example, the at least one chip may comprise a first chip (e.g. the chip 110) and a second chip (which differs from the chip 10), and the aforementioned at least one EMI suppression circuit may comprise a first EMI suppression circuit (e.g. the EMI suppression circuit 112) positioned within the first chip (e.g. the chip 110), and further comprises a second EMI suppression circuit (e.g. a copy of the EMI suppression circuit 112, or a variant thereof) positioned within the second chip. In another example, the aforementioned at least one chip may comprise a first chip (e.g. the chip 110), and the aforementioned at least one EMI suppression circuit may comprise a first EMI suppression circuit (e.g. the EMI suppression circuit 112) positioned within the first chip (e.g. the chip 110), and may further comprise a second EMI suppression circuit (e.g. a copy of the EMI suppression circuit 112, or a variant thereof) positioned within the first chip (e.g. the chip 110). DETX FIG. 2 illustrates a flowchart of a method 200 for performing chip level EMI reduction according to an embodiment of the present invention. The method shown in FIG. 2 can be applied to the apparatus 100 shown in FIG. 1, and can be applied to the apparatus 100 of any of the above-disclosed variations of the first embodiments. The method is described as follows. DETX In Step 210, the apparatus 100 provides at least one EMI suppression circuit within at least one chip of the electronic device. For example, the aforementioned at least one EMI suppression circuit in the first embodiment can be taken as an example of the at least one EMI suppression circuit mentioned in Step 210, and the aforementioned at least one chip in the first embodiment can be taken as an example of the at least one chip mentioned in Step 210. In some other examples, the aforementioned at least one EMI suppression circuit may comprise multiple EMI suppression circuits, and/or the aforementioned at least one chip may comprise multiple chips. DETX In Step 220, the apparatus 100 utilizes the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip, whereby radiation of at least one signal path outside the at least one chip is reduced. For example, in a situation where the aforementioned at least one EMI suppression circuit in the first embodiment is taken as an example of the at least one EMI suppression circuit mentioned in Step 210 and the aforementioned at least one chip in the first embodiment is taken as an example of the at least one chip mentioned in Step 210, the aforementioned at least one signal in the first embodiment can be taken as an example of the at least one signal mentioned in Step 210. In some other examples, in a situation where the aforementioned at least one EMI suppression circuit comprises multiple EMI suppression circuits and/or the aforementioned at least one chip comprises multiple chips, the aforementioned at least one signal may comprise multiple signals within the aforementioned at least one chip. DETX According to this embodiment, the aforementioned at least one chip may comprise the first chip such as the chip 110, and the aforementioned at least one EMI suppression circuit may comprise the first EMI suppression circuit positioned within the first chip, such as the EMI suppression circuit 112. In a situation where the aforementioned at least one signal comprises a first signal within the first chip (e.g. the chip 110), the apparatus 100 typically utilizes the EMI suppression circuit (e.g. the EMI suppression circuit 112) positioned within the first chip (e.g. the chip 110) to perform EMI reduction on the first signal within the first chip. This is for illustrative purposes only, and is not meant to be a limitation of the present invention. As mentioned, the aforementioned at least one EMI suppression circuit may comprise multiple EMI suppression circuits, and/or the aforementioned at least one chip may comprise multiple chips. For example, in a situation where the aforementioned at least one chip further comprises the aforementioned second chip (which differs from the chip 10) and the aforementioned at least one EMI suppression circuit further comprises the aforementioned second EMI suppression circuit (e.g. a copy of the EMI suppression circuit 112, or a variant thereof) positioned within the second chip, the aforementioned at least one signal comprises the first signal within the first chip and further comprises a second signal within the second chip, and the apparatus 100 utilizes the first EMI suppression circuit positioned within the first chip to perform EMI reduction on the first signal within the first chip and further utilizes the second EMI suppression circuit positioned within the second chip to perform EMI reduction on the second signal within the second chip. In another example, in a situation where the aforementioned at least one EMI suppression circuit further comprises the aforementioned second EMI suppression circuit (e.g. a copy of the EMI suppression circuit 112, or a variant thereof) positioned within the first chip (e.g. the chip 110), the aforementioned at least one signal comprises the first signal within the first chip and further comprises a second signal within the first chip, and the apparatus 100 utilizes the first EMI suppression circuit positioned within the first chip to perform EMI reduction on the first signal within the first chip and further utilizes the second EMI suppression circuit positioned within the first chip to perform EMI reduction on the second signal within the first chip. DETX According to a variation of the embodiment shown in FIG. 2, the first EMI suppression circuit is electrically connected to an internal signal path of the first chip, where the internal signal path is coupled to an input/output (I/O) pad of the first chip. According to another variation of the embodiment shown in FIG. 2, at least one non-ground terminal of the first EMI suppression circuit is electrically connected to an internal signal path of the first chip, and at least one ground terminal of the first EMI suppression circuit is electrically connected to ground or virtual-ground of the first chip. DETX FIG. 3 illustrates some implementation details of the apparatus 100 shown in FIG. 1 according to an embodiment of the present invention. The chip 110 comprises a digital circuit 300 comprising output buffers 301-1, 301-2, . . . , and 301-N respectively receiving a main clock and some signals, and further comprises an I/O pad ring 310 comprising I/O pad modules 312-1, 312-2, . . . , and 312-N, where an I/O pad module 312-n within the I/O pad modules 312-1, 312-2, . . . , and 312-N (with the notation n representing an integer falling within the range of the interval [1, N] comprises an I/O pad unit 302-n and an EMI suppression circuit 112-n (labeled "SC" in FIG. 3), and the EMI suppression circuit 112-1, 112-2, . . . , and 112-N can be taken as examples of the aforementioned at least one EMI suppression circuit. The curves illustrated between the I/O pad modules 312-1, 312-2, . . . , and 312-N of the chip 110 and the fingers 52-0, 52-1, 52-2, . . . , and 52-N positioned within the package 50 of the chip 110 represent bond wires. As the EMI suppression circuit 112-1, 112-2, . . . , and 112-N are within the chip 110, most harmonic components of the digital signals of the digital circuit 300 (e.g. most harmonic components of the main clock and the signals shown in FIG. 3) can be suppressed successfully. As a result of performing chip level EMI reduction by utilizing the aforementioned at least one EMI suppression circuit such as the EMI suppression circuit 112-1, 112-2, . . . , and 112-N are within the chip 110, it is unnecessary to implement with the aforementioned EMI solutions of the related art, and therefore, the related art problems can be prevented. DETX FIG. 4 illustrates some radiation problems that may occur in a situation where the EMI suppression circuits 112-1, 112-2, . . . , and 112-N shown in FIG. 3 are temporarily disabled (as if they are not implemented within the chip 110) according to an embodiment of the present invention. For example, the EMI suppression circuits 112-1, 112-2, . . . , and 112-N of this embodiment may be temporarily disabled by utilizing some switching units that can electrically disconnect the EMI suppression circuits 112-1, 112-2, . . . , and 112-N from other portions within the chip 110. The digital chip shown in FIG. 4 may represent the combination of the chip 110 and the package 50 shown in FIG. 3 except that the EMI suppression circuits 112-1, 112-2, . . . , and 112-N shown in FIG. 3 are temporarily disabled. In addition, the printed circuit board (PCB) shown in FIG. 4 may represent the PCB where the digital chip shown in FIG. 4 is mounted, where the notation "RF ANT" stands for antenna of the radio frequency (RF) module. Additionally, the I/O pad unit 302 of this embodiment may represent any of the I/O pad units 302-1, 302-2, . . . , and 302-N shown in FIG. 3, such as the I/O pad unit 302-n mentioned above. Please note that the bond wire, the package trace, the PCB trace and the associated via(s) all have antenna radiation effect due to the high frequency components corresponding to the sharp edges of the digital signals. DETX FIG. 5 illustrates that the radiation problems that may occur in the above-mentioned situation of the embodiment shown in FIG. 4 can be reduced or eliminated since the EMI suppression circuits 112-1, 112-2, . . . , and 112-N shown in FIG. 3 are implemented within the chip 110, without being disabled, according to another embodiment of the present invention. The digital chip shown in FIG. 5 may represent the combination of the chip 110 and the package 50 shown in FIG. 3. In addition, the PCB shown in FIG. 5 may represent the PCB where the digital chip shown in FIG. 5 is mounted. Additionally, the I/O pad unit 302 of this embodiment may represent any of the I/O pad units 302-1, 302-2, . . . , and 302-N shown in FIG. 3, such as the I/O pad unit 302-n mentioned above. Please note that the high frequency components corresponding to the sharp edges of the digital signals (more particularly, the clock harmonics) are suppressed in the I/O pad module 312-n, which comprises the I/O pad unit 302-n and the EMI suppression circuits 112-n, where the I/O pad unit 302 and the EMI suppression circuits 112 shown in FIG. 5 can be regarded as the I/O pad unit 302-n and the EMI suppression circuits 112-n mentioned above, respectively. As a result, the antenna radiation effect mentioned above can be reduced. DETX FIG. 6 illustrates another configuration of implementing the EMI suppression circuits 112-1, 112-2, . . . , and 112-N shown in FIG. 3 within the chip 110 according to another embodiment of the present invention. In comparison with the configuration of implementing the EMI suppression circuits 112-1, 112-2, . . . , and 112-N that is disclosed in the embodiment shown in FIG. 5, the EMI suppression circuits 112 of this embodiment is implemented as the previous stage of the I/O pad unit 302, where the I/O pad unit 302 is positioned between the EMI suppression circuits 112 and the terminal for bounding the bound wire. DETX FIG. 7 is a diagram of an apparatus 700 for performing chip level EMI reduction according to an embodiment of the present invention, where the apparatus 700 can be implemented as an application system. The aforementioned at least one chip comprises multiple chips such as the chips 110-1, 110-2, 110-3, and 110-4, examples of which can be a 4.sup.th Generation/3.sup.rd Generation/2.sup.nd Generation RF circuit (labeled "4G/3G/2G RF", for brevity), a 4.sup.th Generation baseband circuit (labeled "4G BB", for brevity), an application Bluetooth/Wireless-Fidelity circuit (labeled "AP BT/WiFi", for brevity), and a memory (e.g. a dynamic random access memory (DRAM) or a Flash memory), respectively, where the chips 110-1 and 110-2 are positioned within the package labeled "Modem", and the chips 110-3 and 110-4 are positioned within the package labeled "AP". In addition, the notation ANT stands for antenna. As shown in FIG. 7, the apparatus 700 may further comprise an I/O module 730 (labeled "I/O", for brevity) comprising a Universal Serial Bus (USB) interface circuit 732, a Mass Storage Device Class (MSDC) circuit 734, and a Security Digital I/O (SDIO) circuit 736. DETX FIG. 8 illustrates some implementation details of the I/O pad unit 302 shown in FIG. 5 according to an embodiment of the present invention. Based upon the architecture 800 shown in FIG. 8, the I/O pad unit 302 comprises a transmitter buffer TX and a receiver buffer RX respectively coupled to the I/O terminal 10 for bounding the bound wire shown in FIG. 5, where the notation T.sub.TX represents an input terminal of the transmitter buffer TX, and the notation T.sub.RX represents an output terminal of the receiver buffer RX. The control terminal TX_En of the transmitter buffer TX is utilized for selectively enabling or disabling the transmitter buffer TX by using a control signal input into the control terminal TX_En, and the control terminal RX_En of the receiver buffer RX is utilized for selectively enabling or disabling the receiver buffer RX by using a control signal input into the control terminal RX_En. DETX FIG. 9 illustrates some implementation details of the I/O pad unit 302 shown in FIG. 5 with an EMI low pass filter (LPF) being taken as an example of the EMI suppression circuit 112 shown in FIG. 5 according to another embodiment of the present invention. Based upon the architecture 900 shown in FIG. 9, the I/O pad unit 302 comprises the transmitter buffer TX and the receiver buffer RX shown in FIG. 8, and more particularly, can be the same as the I/O pad unit 302 shown in FIG. 8. In addition, the 3-dB-bandwidth (labeled "3 dB BW" in FIG. 9) of the EMI LPF may be defined by a specific configuration of the EMI LPF. DETX FIG. 10 illustrates some implementation details of the I/O pad modules 312-1, 312-2, . . . , and 312-N shown in FIG. 3 according to an embodiment of the present invention. In practice, the I/O pad modules 312-n may comprise M cells, each of which comprises a p-type Metal Oxide Semiconductor Field Effect Transistor (MOSFET) Mp1 having a terminal being biased by a predetermined voltage level VDD and an n-type MOSFET Mn1 having a terminal being grounded and further comprises two resistors, where the I/O terminal 10 for bounding the bound wire shown in FIG. 5 is electrically connected to an intermediate node between the two resistors. The 2.sup.nd order LPF shown in FIG. 10 (labeled "2.sup.nd LPF", for brevity) is taken as an example of the EMI suppression circuit 112-n associated to the I/O pad modules 312-n. DETX FIG. 11 illustrates some implementation details of the I/O pad modules 312-1, 312-2, . . . , and 312-N shown in FIG. 3 according to another embodiment of the present invention. In comparison with the embodiment shown in FIG. 10, the aforementioned 2.sup.nd order LPF further comprises two diodes, each of which may have its equivalent capacitance, where the equivalent capacitance is illustrated in FIG. 11 for better comprehension. Similar descriptions for this embodiment are not repeated in detail here. DETX FIG. 12 illustrates some implementation details of the I/O pad modules 312-1, 312-2, . . . , and 312-N shown in FIG. 3 according to another embodiment of the present invention. In comparison with the embodiment shown in FIG. 10, the capacitors C1 and Ct within the aforementioned 2.sup.nd order LPF are tunable in this embodiment. Similar descriptions for this embodiment are not repeated in detail here. DETX FIG. 13 illustrates some implementation details of the I/O pad modules 312-1, 312-2, . . . , and 312-N shown in FIG. 3 according to another embodiment of the present invention. In comparison with the embodiment shown in FIG. 11, the capacitors C1 and Ct within the aforementioned 2.sup.nd order LPF are tunable in this embodiment. Similar descriptions for this embodiment are not repeated in detail here. DETX FIG. 14 illustrates some implementation details of the I/O pad modules 312-1, 312-2, . . . , and 312-N shown in FIG. 3 according to another embodiment of the present invention. In comparison with the embodiment shown in FIG. 12, the originally grounded terminal of the capacitor C1 within the aforementioned 2.sup.nd order LPF is redirected to a virtual ground node VGND. As shown in FIG. 14, the I/O pad modules 312-n may comprise a set of p-type MOSFETs {Mps}, each of which has a terminal being biased by the predetermined voltage level VDD, and may further comprise a set of n-type MOSFETs {Mns}, each of which has a terminal being grounded, where the device width WMps (or the channel width) of each p-type MOSFET Mps and the device width WMns (or the channel width) of each n-type MOSFET Mns can be expressed as follows: WMps=WMp1/N; and WMns=WMn1/N; where the notations WMp1 and WMn1 represent the device widths (or the channel widths) of the p-type MOSFET Mp1 and the n-type MOSFET Mn1, respectively. Similar descriptions for this embodiment are not repeated in detail here. DETX FIG. 15 illustrates some implementation details of the I/O pad modules 312-1, 312-2, . . . , and 312-N shown in FIG. 3 according to another embodiment of the present invention. In comparison with the embodiment shown in FIG. 13, the originally grounded terminal of the capacitor C1 within the aforementioned 2.sup.nd order LPF is redirected to a virtual ground node such as the virtual ground node VGND disclosed in the embodiment shown in FIG. 14. In addition, the set of p-type MOSFETs {Mps} and the set of n-type MOSFETs {Mns} of this embodiment can be the same as that of the embodiment shown in FIG. 14, respectively. Similar descriptions for this embodiment are not repeated in detail here. DETX It is an advantage of the present invention that, while utilizing the present invention method and apparatus, the high frequency components corresponding to the sharp edges of the digital signals (more particularly, the clock harmonics) are suppressed in the I/O pad module(s), where the antenna radiation effect mentioned above can be reduced. As a result of performing chip level EMI reduction by utilizing the aforementioned at least one EMI suppression circuit, it is unnecessary to implement with the aforementioned EMI solutions of the related art, and therefore, the related art problems can be prevented. DETX Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims. CLST What is claimed is: CLPR 1. A method for performing chip level electromagnetic interference (EMI) reduction, the method being applied to an electronic device, the method comprising: providing at least one EMI suppression circuit, positioned within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit to perform EMI reduction on at least one signal within the at least one chip, wherein the at least one EMI suppression circuit is integrated into the at least one chip. CLPR 2. The method of claim 1, wherein the at least one chip comprises a first chip and a second chip; and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the second chip. CLPR 3. The method of claim 2, wherein the at least one signal comprises a first signal within the first chip, and further comprises a second signal within the second chip; and utilizing the at least one EMI suppression circuit within the at least one chip to perform the EMI reduction on the at least one signal within the at least one chip further comprises: utilizing the first EMI suppression circuit positioned within the first chip to perform EMI reduction on the first signal within the first chip; and utilizing the second EMI suppression circuit positioned within the second chip to perform EMI reduction on the second signal within the second chip. CLPR 4. The method of claim 1, wherein the at least one chip comprises a first chip; and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the first chip. CLPR 5. The method of claim 4, wherein the at least one signal comprises a first signal within the first chip, and further comprises a second signal within the first chip; and utilizing the at least one EMI suppression circuit within the at least one chip to perform the EMI reduction on the at least one signal within the at least one chip further comprises: utilizing the first EMI suppression circuit positioned within the first chip to perform EMI reduction on the first signal within the first chip; and utilizing the second EMI suppression circuit positioned within the first chip to perform EMI reduction on the second signal within the first chip. CLPR 6. The method of claim 1, wherein the at least one chip comprises a first chip; and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip. CLPR 7. The method of claim 6, wherein the at least one signal comprises a first signal within the first chip; and utilizing the at least one EMI suppression circuit within the at least one chip to perform the EMI reduction on the at least one signal within the at least one chip further comprises: utilizing the first EMI suppression circuit positioned within the first chip to perform EMI reduction on the first signal within the first chip. CLPR 8. The method of claim 6, wherein the first EMI suppression circuit is electrically connected to an internal signal path of the first chip; and the internal signal path is coupled to an input/output (I/O) pad of the first chip. CLPR 9. The method of claim 6, wherein at least one non-ground terminal of the first EMI suppression circuit is electrically connected to an internal signal path of the first chip; and at least one ground terminal of the first EMI suppression circuit is electrically connected to ground or virtual-ground of the first chip. CLPR 10. The method of claim 1, wherein utilizing the at least one EMI suppression circuit within the at least one chip to perform the EMI reduction on the at least one signal within the at least one chip further comprises: utilizing the at least one EMI suppression circuit within the at least one chip to perform the EMI reduction on the at least one signal within the at least one chip, whereby radiation of at least one signal path outside the at least one chip is reduced. CLPR 11. An apparatus for performing chip level electromagnetic interference (EMI) reduction, the apparatus comprising at least one portion of an electronic device, the apparatus comprising: at least one chip of the electronic device; and at least one EMI suppression circuit integrated into the at least one chip of the electronic device, wherein the at least one EMI suppression circuit positioned within the at least one chip is arranged to perform EMI reduction on at least one signal within the at least one chip. CLPR 12. The apparatus of claim 11, wherein the at least one chip comprises a first chip and a second chip; and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the second chip. CLPR 13. The apparatus of claim 12, wherein the at least one signal comprises a first signal within the first chip, and further comprises a second signal within the second chip; the first EMI suppression circuit positioned within the first chip performs EMI reduction on the first signal within the first chip; and the second EMI suppression circuit positioned within the second chip performs EMI reduction on the second signal within the second chip. CLPR 14. The apparatus of claim 11, wherein the at least one chip comprises a first chip; and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip, and further comprises a second EMI suppression circuit positioned within the first chip. CLPR 15. The apparatus of claim 14, wherein the at least one signal comprises a first signal within the first chip, and further comprises a second signal within the first chip; the first EMI suppression circuit positioned within the first chip performs EMI reduction on the first signal within the first chip; and the second EMI suppression circuit positioned within the first chip performs EMI reduction on the second signal within the first chip. CLPR 16. The apparatus of claim 11, wherein the at least one chip comprises a first chip; and the at least one EMI suppression circuit comprises a first EMI suppression circuit positioned within the first chip. CLPR 17. The apparatus of claim 16, wherein the at least one signal comprises a first signal within the first chip; and the first EMI suppression circuit positioned within the first chip performs EMI reduction on the first signal within the first chip. CLPR 18. The apparatus of claim 16, wherein the first EMI suppression circuit is electrically connected to an internal signal path of the first chip; and the internal signal path is coupled to an input/output (I/O) pad of the first chip. CLPR 19. The apparatus of claim 16, wherein at least one non-ground terminal of the first EMI suppression circuit is electrically connected to an internal signal path of the first chip; and at least one ground terminal of the first EMI suppression circuit is electrically connected to ground or virtual-ground of the first chip. CLPR 20. The apparatus of claim 11, wherein the at least one EMI suppression circuit within the at least one chip performs the EMI reduction on the at least one signal within the at least one chip, whereby radiation of at least one signal path outside the at least one chip is reduced. ICUS Y DSRC US 09204582 B2 20151201 14577134 75551 Electronic device protection *** BRS DOCUMENT BOUNDARY *** WKU 09204582 SIZE 76264 DWKU 9204582 APT B2 DID US 9204582 B2 GISD 20151201 ARD 577134 AFD 20141219 APY 2014 SRC 14 APNR 14577134 APP 14/577134 IPCG 20060101 A H05K H05K9/00 F I B US H 20151201 IPCC H05K IPCP H05K9/00 20060101 H05K009/00 IPCG 20060101 A H01Q H01Q15/00 L I B US H 20151201 IPCC H01Q IPCS H01Q15/00 20060101 H01Q015/00 CLOI H05K CPOI H05K9/0086 20130101 CPOG H H05K H05K9/0086 20130101 F I 20151201 US CLOI H01Q CPOI H01Q15/006 20130101 CPOG H H01Q H01Q15/006 20130101 L I 20151201 US CLOI H01Q CPOI H01Q15/0013 20130101 CPOG H H01Q H01Q15/0013 20130101 L I 20151201 US TTL Electronic device protection URPN 4922253 URNM Nathanson et al. URPD 19900500 URCL N/A URGP US 4922253 A 19900500 Nathanson et al. cited by applicant URPN 5214432 URNM Kasevich et al. 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URPD 20080800 URCL 345/60 URGP US 2008/0198100 A1 20080800 Itokawa et al. 345/60 cited by examiner URPN 2008/0238822 URNM Lee URPD 20081000 URCL 345/60 URGP US 2008/0238822 A1 20081000 Lee 345/60 cited by examiner URPN 2009/0218310 URNM Zu et al. URPD 20090900 URCL N/A URGP US 2009/0218310 A1 20090900 Zu et al. cited by applicant FRCO DE FRPN 69219993 FRPD 19971200 FRCL N/A FRGP DE 69219993 T2 19971200 cited by applicant FRCO EP FRPN 1137102 FRPD 20010900 FRCL N/A FRGP EP 1137102 A2 20010900 cited by applicant ORPL B.G. Chae et al, "Abrupt matal-insulator transition observed in VO2 thin films induced by a switching voltage pulse," Physica B, 369; Jul. 2005; 4 pages. cited by applicant ORPL European Search Report for Application No. 1117695.1, dated Nov. 18, 2011, 6 pages. cited by applicant ORPL "Timing Nature's Fastest Optical Shutter," PHYSorg.com, http://www.physorg.com/news3629.html; Apr. 7, 2005; 3 pages. cited by applicant ORPL Aurelian, C. et al., "Exploiting the Semiconductor-Metal Phase Transition of VO2 Materials: A Novel Direction Towards Tuneable Devices and Systems for RF-Mircrowave Applications," Advanced Microwave and Millimeter Wave Technologies: Semiconductor Devices; Mar. 1, 2010; pp. 35-56. cited by applicant ORPL Kim, J. et al., "2.45 GHz Microwave-Excited Atmospheric Pressure Air Microplasmas Based on Microstrip Technology," Applied Physics Letter 86, May 5, 2005, 3 pages. cited by applicant ORPL Lessner, G., "Stochastic Statistical Mechanics and Electric Conductivity of a Cold Plasma," Physics Letter A 221, Oct. 7, 1996, pp. 293-300. cited by applicant ORPL Ogata, K. et al., "Characterizations of Strip-Line Microwave Micro Atmospheric Plasma and Its Application to Neutralization," Journal of Applied Physics 106, Jul. 16, 2009, 6 pages. cited by applicant ORPL Otteni, G., "Plane Wave Reflection From a Rectangular-Mesh Ground Screen," IEEE Transactions on Antennas and Propagation, vol. AP-21, No. 6, Nov. 1973, pp. 843-851. cited by applicant ORPL Yang, Z. et al., "Oxide Electronics Utilizing Ultrafast Metal-Insulator Transitions," Annual Review of Materials Research, vol. 41, http://www.annualreviews.org; Mar. 30, 2011; pp. 337-369. cited by applicant NCL 20 ECL 1 CIFS 361/753 CIFS 361/767 CIFS 361/777 CIFS 361/803 CIFS 361/816 CIFS 361/818 CIFS 361/799 CFSC 361 CFSS 753;767;777;803;816;818;799 CIFS 174/350 CIFS 174/357 CIFS 174/387 CIFS 174/390 CIFS 174/392 CFSC 174 CFSS 350;357;387;390;392 CIFS 248/457 CIFS 248/458 CIFS 248/423.5 CIFS 248/423.7 CIFS 248/423.8 CIFS 248/423.9 CFSC 248 CFSS 457;458;423.5;423.7;423.8;423.9 CIFS 343/909 CFSC 343 CFSS 909 NDR 11 NFG 17 COND division parent-doc US 13303416 20111123 US 8947892 child-doc US 14577134 RLPY US RLAN 13303416 RLFD 20111123 RLPY US RLPN 8947892 RLCY US RLCN 14577134 COND continuation-in-part parent-doc US 12857413 20100816 US 8325495 20121204 child-doc US 13303416 RLPY US RLAN 12857413 RLFD 20100816 RLPY US RLPN 8325495 RLFD 20121204 RLCY US RLCN 13303416 PDID US 20150101860 A1 PPCC US PPNR 20150101860 PPKC A1 PPPD 20150416 AANM The Boeing Company AACI Chicago AAST IL AAZP N/A AACO US AATX N/A AAGP The Boeing Company Chicago IL US INNM Lam; Tai A. INSA N/A INCI Kent INST WA INZP N/A INCO US INTX N/A INGP Lam; Tai A. Kent WA US LRFM Toler Law Group, PC ASNM The Boeing Company ASTC 02 ASCI Chicago ASST IL ASZP N/A ASCO US ASTX N/A ASGP The Boeing Company Chicago IL US 02 ART 2835 EXP Bui; Hung S ABPR A method includes permitting a first signal having a first electromagnetic waveform to pass through an apparatus. The method further includes blocking a second signal having a second electromagnetic waveform at the apparatus, wherein the second electromagnetic waveform is different than the first electromagnetic waveform. The apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate, where the conductive members are arranged to form a first discontinuous mesh, where regions between the conductive members of the first discontinuous mesh include a phase change material, and where the phase change material undergoes a phase transition from substantially non-conductive to substantially conductive. CRTX CLAIM OF PRIORITY CRTX The present application claims priority from, and is a divisional application of, U.S. patent application Ser. No. 13/303,416, filed Nov. 23, 2011, which is a continuation-in-part of U.S. patent application Ser. No. 12/857,413 (now issued as U.S. Pat. No. 8,325,495), filed Aug. 16, 2010, the contents of each of which are incorporated by reference herein in their entirety. BSTX FIELD OF THE DISCLOSURE BSTX The present disclosure is generally related to apparatus, systems and methods for electronic device protection. BSTX BACKGROUND BSTX Low-noise amplifiers in antennas and direction arrival estimation systems may be susceptible to high-power microwave attacks or interference from other devices located near the low-noise amplifiers. In phased array antenna systems and certain other communication systems, silicon carbide (SiC)-based limiters may be placed in-line to provide protection against high-power signals. For example, the SiC-based limiters may be placed between an antenna and the low-noise amplifiers to reduce the amount of power that goes through the low-noise amplifiers. The SiC-based limiters may be integrated at each element of a phased array antenna. Since phased array antennas may include thousands of elements, placing limiters at each element may introduce significant costs and complexity. BSTX Another method of protecting electronic devices, such as low-noise amplifiers, from exposure to high-power electromagnetic radiation, e.g., high-power microwave radiation, may be to place a switchable transistorized mesh system in front of an antenna array. The switchable transistorized mesh system may include conductors arranged in a mesh with discontinuities. A transistor may be present at each discontinuity. When the transistors are off (e.g., behaving like an open switch), electromagnetic energy may pass through the mesh. When the transistors are on (e.g., behaving like a closed switch), the mesh is effectively continuous, and electromagnetic energy may be reflected from the mesh. Since each transistor is provided with power for switching, significant complexity may be added by using such a switchable transistorized mesh system. Further, switching time of the transistors may add an unacceptable delay. BSTX SUMMARY BSTX Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh. Regions between the conductive members of the first discontinuous mesh include a phase change material. The phase change material undergoes a phase transition from substantially non-conductive to substantially conductive responsive to a change of energy. BSTX A particular system includes an electronic device and a protection apparatus to protect the electronic device by selectively blocking electromagnetic radiation. The protective apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh. Regions between the conductive members of the first discontinuous mesh include a phase change material. The phase change material undergoes a phase transition from substantially non-conductive to substantially conductive responsive to a first electromagnetic waveform. BSTX A particular method includes permitting a first signal having a first electromagnetic waveform to pass through an apparatus and blocking a second signal having a second electromagnetic waveform at the apparatus. The second electromagnetic waveform is different than the first electromagnetic waveform. The apparatus includes a non-conductive substrate, a discontinuous mesh of conductive members, and a phase change material disposed between the conductive members of the discontinuous mesh. The phase change material undergoes a phase transition from substantially non-conductive to substantially conductive at least partially responsive to the second electromagnetic waveform. BSTX The features, functions, and advantages that have been described can be achieved independently in various embodiments or may be combined in yet other embodiments, further details of which are disclosed with reference to the following description and drawings, which are not to scale. DETX BRIEF DESCRIPTION OF THE DRAWINGS DETX FIG. 1A is a plan view of a particular embodiment of an apparatus to protect an electronic device; DETX FIG. 1B is a view of a particular portion of the apparatus of FIG. 1A; DETX FIG. 2A is a sectional view of a gap between cells of a first embodiment of the apparatus of FIG. 1A in a first operational state; DETX FIG. 2B is a sectional view of a gap between cells of the first embodiment of the apparatus of FIG. 1A in a second operational state; DETX FIG. 3A is a sectional view of a gap between cells of a second embodiment of the apparatus of FIG. 1A in a first operational state; DETX FIG. 3B is a sectional view of a gap between cells of the second embodiment of the apparatus of FIG. 1A in a second operational state; DETX FIG. 4A is a perspective view of a first particular embodiment of a system to protect an electronic device in a first operational state; DETX FIG. 4B is a perspective view of the system of FIG. 4A in a second operational state; DETX FIG. 5 is a perspective view of a second particular embodiment of a system to protect an electronic device; DETX FIG. 6 is a flow chart of a first particular embodiment of a method to protect an electronic device; DETX FIG. 7 is a flow chart of a second particular embodiment of a method to protect an electronic device; DETX FIG. 8 is a graph of simulated scattering parameters of a particular embodiment of a protection device in a first operational state; DETX FIG. 9 is a graph of simulated scattering parameters of a particular embodiment of a protection device in a second operational state; DETX FIG. 10 is a graph of simulated electric field characteristics across half of a gap of a discontinuous mesh according to a first particular embodiment; DETX FIG. 11 is a graph of simulated electric field characteristics across half of a gap of a discontinuous mesh according to a second particular embodiment; DETX FIG. 12 is a graph of simulated electric field characteristics across half of a gap of a discontinuous mesh according to a third particular embodiment; and DETX FIG. 13 is a graph of estimated turn on time of a protection device according to a particular embodiment. DETX DETAILED DESCRIPTION DETX Embodiments disclosed herein include an inexpensive low-loss, wide-bandwidth, radio frequency (RF) shutter for use in protecting electronic devices, such as low-noise amplifiers and other communication systems. The RF shutter may include conductive elements arranged in a mesh. The conductive elements of the mesh may have a plurality of intersections. The conductive elements may be separated by a gap or a phase change material. For example, an area between the conductive elements may include discontinuities formed by a phase change material or phase change materials. The phase change material may be substantially non-conductive in a first phase and substantially conductive in a second phase. As used herein, a substantially non-conductive material refers to a material that has few mobile charge carriers, such as an insulator or dielectric. Thus, a substantially non-conductive material has a high dielectric constant. In contrast, a substantially conductive material herein refers to a material with an abundance of moveable charge carriers, such as a metal or plasma. To illustrate, the phase change material may be a material such as vanadium dioxide, which undergoes a metal-insulator phase transition. In another example, the phase change material may be a gas that undergoes a gas-to-plasma phase transition. The phase transition from the first phase to the second phase may be triggered responsive to particular electromagnetic waveforms. DETX The discontinuities between the conductive elements enable the discontinuous mesh to be transparent to certain electromagnetic waves (e.g., relatively low-power, low-frequency signals). However, in the presence of other electromagnetic waves (e.g., relatively high-power or high-frequency signals), the phase change material in the discontinuities may become conductive. For example, a gas in microgaps between the conductive elements may form a plasma. The plasma is conductive and electrically bridges the microgap causing the mesh to behave as a continuous mesh and to reflect the electromagnetic waves. In another example, an insulator-metal phase change material between the conductive elements may undergo a phase transition from an insulator (i.e., substantially nonconductive) phase to a metal (i.e., substantially conductive) phase, thereby electrically bridging the conductive elements. DETX In a particular embodiment, when a plasma is formed between the conductive elements, the plasma may be a cold plasma. A cold plasma may be only partially ionized. For example, in a cold plasma as little as about 1% of a gas may be ionized. This is in contrast to a thermal or hot plasma, in which a much higher proportion of the gas may be ionized. When an insulator-metal phase change material is used, the insulator-metal phase change material may include a dopant or other material that changes phase transition properties of the insulator-metal phase change material. For example, a dopant may be added to adjust conditions at which the insulator-metal phase change material undergoes the phase transition. DETX Electronic devices protected by the RF shutter may retain normal operation (e.g., transmission and reception of relatively low-power, low-frequency signals) during periods between exposures to relatively high-power or high-frequency signals. However, during exposure to the high-power or high-frequency signals, the RF shutter may respond quickly and with little complexity to protect the electronic devices. To illustrate, when a high-power or high-frequency signal is received at the RF shutter, a large electric field may be generated in each microgap. The electric field may be sufficient to form an atmospheric pressure plasma or to initiate a phase transition in a phase change material, causing the mesh to behave as a continuous mesh. Thus, the mesh may act like a ground plane and reflect the high-power or high-frequency signal to protect the electronics behind it. Accordingly, a passive RF shutter can protect electronics from high-power and high-frequency signals when in an "on" state and allow transmission and reception of lower power, lower frequency signals when in an "off" state. A power level and a frequency of an incoming signal may determine whether the RF shutter is on or off. DETX FIG. 1A is a plan view of a particular embodiment of an apparatus 100 to protect an electronic device, and FIG. 1B is a closer view of a particular portion of the apparatus 100. The apparatus 100 includes a non-conductive substrate 102 and a plurality of conductive members 106. The conductive members 106 are arranged to form a discontinuous mesh 104. For example, the conductive members 106 may be arranged in cells, two of which are illustrated in FIG. 1B, with a gap 110 between adjacent cells. For example as shown in FIG. 1B, two cells including conductive members 106 and 107 are separated by the gap 110. Each of the cells has a characteristic dimension 114, such as width from center to center of adjacent gaps or a width from center to center of the conductive members 106 and 107. In a particular embodiment, the cells are approximately square and the characteristic dimension 114 is selected based on a first wavelength of a first signal to be allowed to pass through the apparatus 100 and a second wavelength of a second signal that is to be blocked by the apparatus 100. For example, the characteristic dimension 114 may be much smaller than the first wavelength, e.g., approximately one twenty-fifth of the first wavelength. In another example, the characteristic dimension 114 may be smaller than but closer to the second wavelength, e.g., approximately one half of the second wavelength. However, other proportions between the characteristic dimension 114 and the wavelength of the first signal and the second signal may also be used. DETX A width of the gaps 110 is related to electric field strength present in the gap 110 when the conductive elements 106 and 107 are subjected to electromagnetic radiation. For a particular frequency of electromagnetic radiation, a smaller gap width leads to a stronger electric field in the gap 110 and a larger gap width provides a weaker electric field in the gap 110. DETX The non-conductive substrate 102 may include a ceramic material, a polymer material, or another material that is not conductive or is dielectric. The non-conductive substrate 102 may be substantially transparent to electromagnetic energy in a particular range of concern. For example, the non-conductive substrate 102 may be transparent to a wavelength of signals intended to be transmitted and received through the apparatus 100 (e.g., relatively low-power, relatively low-frequency signals). The non-conductive substrate 102 may also be substantially transparent to signals to be blocked from transmissions through the apparatus 100 (e.g., relatively high-power or relatively high-frequency signals). The non-conductive substrate 102 may have a thickness sufficient to provide desired structural stability. In a particular embodiment, the non-conductive substrate 102 may be formed of a material that facilitates removal of heat that may be built up by the apparatus 100 during use. For example, the non-conductive substrate 102 may be formed of aluminum nitride, which is electrically insulating but may have suitable thermal conductivity. DETX The conductive members 106 and 107 may include any suitable conductor, such as silver, gold, copper, aluminum, or another metal or conductor selected for a particular application. In a particular embodiment, materials used to form the non-conductive substrate 102 and the conductive members 106 and 107 may be selected to facilitate low cost manufacturing of the apparatus 100. For example, the materials may be selected to facilitate manufacturing of the apparatus 100 using relatively inexpensive fabrication techniques that are commonly employed to manufacture integrated circuits and other electronic devices. To illustrate, the materials may be selected to enable manufacturing the apparatus 100 using wet etch, dry etch, deposition, photolithography, imprint lithography, chemical mechanical polishing, printing, or other additive or subtractive processes that are used to manufacture electronics and integrated circuits. For purposes of simulations described below the conductive members 106 and 107 were simulated to be formed of copper. The conductive members 106 and 107 may have a thickness of as little as a few skin depths. For example, for copper conductive members the skin depth may be approximately 3 microns, so a thickness of several skin depths, e.g., about 10 microns, may be sufficient. DETX In a particular embodiment, a phase change material 112 may be present at each of the gaps 110. For example, as described with reference to FIGS. 2A and 2B, the phase change material 112 may include a gas that undergoes a phase transition to a plasma. In another example, as described with reference to FIGS. 3A and 3B, the phase change material 112 may include a material that undergoes an insulator-metal phase transition, such as vanadium dioxide. The phase change material 112 may undergo a phase transition from a substantially non-conductive phase to a substantially conductive phase at least partially responsive to an incident electromagnetic waveform at the apparatus 100. Thus, the discontinuous mesh 104 may act as a continuous mesh responsive to the incident electromagnetic waveform. Accordingly, the apparatus 100 may selectively inhibit transmission of electromagnetic radiation based, for example, on characteristics of the electromagnetic radiation. DETX FIG. 2A is a sectional side view of a gap 110 between cells of a first embodiment of the apparatus 100 of FIG. 1A in a first operational state. FIG. 2B is a sectional side view of the gap 110 between the cells of the first embodiment of the apparatus 100 of FIG. 1A in a second operational state. As illustrated in FIG. 2A, a first signal having a first waveform 120 may be received at the apparatus 100 and may be transmitted or permitted to propagate through the apparatus 100. Referring to FIG. 2B, a second signal having a second waveform 122 may be received at the apparatus 100 and may cause a gas (e.g., the phase change material 112 in the embodiment of FIG. 2A) in a cavity 116 defined proximate the gap 110 to form a plasma 130. The plasma 130 provides a conductive path across the gap 110. The plasma 130 may be electrically conductive enough to bridge the gap 110 to cause the discontinuous mesh formed by the conductive members 106 and 107 to behave as a continuous mesh. For example, electron density in the gap 110 may range from about 10^13 electrons per cubic centimeter to as much as 10^17 electrons per cubic centimeter, with a conductivity measuring from about 10^2 Siemens per meter (S/m) to about 10^4 S/m. Thus, the second signal having the second waveform 122 stimulates formation of the plasma 130 and thereby causes the discontinuous mesh to be continuous, blocking or inhibiting transmission or propagation of the second signal. DETX In the embodiment of FIGS. 2A and 2B, the cavity 116 may be formed in the non-conductive substrate 102 at the gap 110 between the adjacent conductive members 106 and 107. The cavity 116 may undercut a portion of the adjacent conductive members 106 and 107. The cavity 116 may have a depth of a same order of magnitude as the width of the gap 110. For example, when the width of the gap 110 is about 20 .mu.m, the cavity 116 may have a depth of about 10 .mu.m to about 40 .mu.m. The cavity 116 may include the gas that forms the plasma 130 when the gas is excited by particular electromagnetic waveforms. DETX In a particular embodiment, the gas is retained by an overlaying substrate 103. In yet another embodiment, the overlaying substrate 103 may be large enough to encapsulate the whole mesh array rather than at individual gap 110 areas. The overlaying substrate 103 may be formed of the same material as the non-conductive substrate 102. For example, the conductive members 106 and 107 may be substantially encased or embedded within the non-conductive substrate 102 and the overlaying substrate 103. In another particular embodiment, the overlaying substrate 103 may not be present. For example, an upper surface 108 of the apparatus 100 may be exposed to air, and the air may form the plasma 130. In another example, the upper surface 108 of the apparatus 100 may be covered to retain the gas that forms the plasma 130. The gas may include air, a noble gas (e.g., argon), or another gas that has an acceptable operating range between an electric field strength that causes the gas to generate the plasma 130 and an electric field strength that causes dielectric breakdown of the gas, as described further below. For example, the dielectric breakdown field strength for air is about 60 times the plasma generation field strength, providing a dynamic operating range of about 18 decibels. DETX The apparatus 100 may selectively inhibit transmission of electromagnetic radiation based on characteristics of the electromagnetic radiation. For example, the gas may form the plasma 130 that electrically bridges the gap 110 to form an electrically continuous mesh in response to electromagnetic radiation having first characteristics (e.g., the second waveform 122). When the plasma 130 electrically bridges the gaps, the electromagnetic radiation having the first characteristics is inhibited from passing through the apparatus 100. However, the apparatus 100 allows electromagnetic radiation that has second characteristics (e.g., the first waveform 120) to pass through the apparatus 100. DETX FIG. 3A is a sectional side view of a gap 110 between cells of a second embodiment of the apparatus 100 of FIG. 1A in a first operational state. FIG. 3B is a sectional side view of the gap 110 between the cells of the second embodiment of the apparatus 100 of FIG. 1A in a second operational state. As illustrated in FIG. 3A, in the first operational state, the phase change material 112 is in a substantially non-conductive phase, and a first signal having a first waveform 120 may be received at the apparatus 100 and may be transmitted or permitted to propagate through the apparatus 100. Referring to FIG. 3B, a second signal having a second waveform 122 may be received at the apparatus 100 and may cause the apparatus 100 to transition to the second operation state. For example, the second waveform 122 may cause the phase change material 112 to undergo a phase transition to a substantially conductive state. In the substantially conductive state, the phase change material 112 provides a conductive path across the gap 110. Thus, in the substantially conductive state, the phase change material 112 causes the discontinuous mesh to become continuous, blocking or inhibiting transmission or propagation of the second signal. DETX In the embodiment of FIGS. 3A and 3B, the phase change material 112 may include any material that undergoes a solid-solid metal-insulator phase transition. Such solid-solid metal-insulator phase transitions are also referred to in the art as semiconductor-metal phase transitions. Examples of such materials that undergo a solid-solid metal-insulator phase transition include, but are not limited to, GeSb.sub.2Te.sub.4, RNiO.sub.3 (where R=Pr, Nd, or Sm), LaCoO.sub.3, particular transition metal oxides, such as certain titanium oxides, e.g., titanium sequioxide (Ti.sub.2O.sub.3), certain vanadium oxides, e.g., vanadium dioxide (VO.sub.2), and vanadium sequioxide (V.sub.2O.sub.3). The phase change material 112 may also be doped with another material to modify characteristics of the phase transition, such as a phase transition critical temperature or another critical property at which the phase transition occurs (e.g., electric field strength, current, voltage, etc.). Dopants may include, for example, W, Cr, Ta, Al or another material. DETX The apparatus 100 may selectively inhibit transmission of electromagnetic radiation based on characteristics of the electromagnetic radiation. For example, the phase change material 112 may undergo the phase transition responsive, at least partially, to the characteristics of the electromagnetic radiation. That is, the characteristics of the electromagnetic radiation alone or in concert with other factors (e.g., a temperature of the apparatus 100, a bias current applied to the apparatus 100, another signal applied to the apparatus 100, or another factor that preconditions or biases the phase change material 112 to be near a phase transition critical point) may cause the phase change material 112 to undergo the phase transition. To illustrate, the first waveform 120 may have first characteristics (e.g., frequency, power, electric field generated in the gap 110) that do not cause the phase change material 112 to undergo the phase transition, and the second waveform 122 may have second characteristics (e.g., frequency, power, electric field generated in the gap 110) that cause the phase change material 112 to undergo the phase transition. DETX FIG. 4A is a perspective view of a first particular embodiment of a system to protect an electronic device in a first operational state. The system includes an electronic device 404 coupled to an antenna 402 and protected by the apparatus 100. The electronic device 404 may include one or more low-noise amplifiers or other devices to be protected from high-power or high-frequency signals. DETX A first signal having a first waveform 420 may be transmitted by a transmitter 406 and received at the antenna 402. The first waveform 420 may have characteristics (such as a wavelength 408) that do not cause a phase change material present in gaps of the apparatus 100 to undergo a phase transition. Thus, the first signal is able to pass through the apparatus 100, to be received at the antenna 402, and to be sent as a signal 410 to the electronic device 404. DETX FIG. 4B is a perspective view of the system of FIG. 4A in a second operational state. In FIG. 4B, the transmitter 406 transmits a second signal having a second waveform 432. The second waveform 432 may be characterized by particular parameters, such as a second wavelength 430, an amplitude, a signal strength, and so forth. When the second signal is received at the apparatus 100, the second signal may stimulate the phase change material of the apparatus 100 to undergo the phase transition. Accordingly, the apparatus 100 in FIG. 4B is illustrated as continuous (i.e., without gaps) due to the presence of the substantially conductive phase of the phase change material in the gaps of the apparatus 100. The apparatus 100 may act as a ground plane to reflect or block transmission of the second signal, resulting in the second signal not being received at the antenna 402. As illustrated in FIG. 4B, no second signal 434 is received at the electronic device 404, and the electronic device 404 is protected from harm as a result of the second signal. DETX Thus, the apparatus 100 acts as a passive RF shutter to that allows some signals to pass through and blocks or reflects other signals. Put another way, the apparatus 100 has a first operational state in which the apparatus 100 is substantially transparent to a first electromagnetic waveform and a second operational state that is engaged when the apparatus 100 is exposed to a second electromagnetic waveform that is different than the first electromagnetic waveform. In the second operational state, the apparatus 100 may be substantially opaque to the first electromagnetic waveform and to the second electromagnetic waveform. The apparatus 100 is able to block certain signals quickly, with little added complexity, and without the use of external control systems and power systems. Rather, the signal to be blocked itself stimulates the phase transition that causes the signal to be blocked. Accordingly, the switching time required to switch the apparatus 100 from the first operational state (where signals are allowed to pass through) to the second operational state (where signals are not allowed to pass through) may be less than about 2 nanoseconds. In some embodiments, the switching time may be less than a nanosecond. For example, the switching time when a solid-solid phase change material is used may be less than one picoseconds, e.g., about 100 femtoseconds. DETX FIG. 5 is a perspective view of a second particular embodiment of a system to protect the electronic device 404. The system of FIG. 5 is an active protection system for the electronic device 404. The system includes a third transmitter 526 that sends a third signal having a third waveform 522. The third waveform 522 may include particular characteristics, such as a third wavelength 524, an amplitude, and signal strength when received at the apparatus 100. As previously described, the apparatus 100 is discontinuous and substantially transparent to signals having certain waveforms, which enables those signals to be received at the antenna 402. In a particular embodiment, the third waveform 522 is selected to stimulate the phase transition in the phase change material present in the gaps of the apparatus 100. For example, the third transmitter 526 may be a relatively low power, high frequency transmitter located relatively near the antenna 402. DETX In a particular embodiment, the third transmitter 526 is under control of a controller 540 associated with the electronic device 404. The third transmitter 526 may be used to turn on protective characteristics of the apparatus 100 in response to the controller 540. For example, the transmitter 406 may be a perceived threat to the electronic device 404. That is, the transmitter 406 may be capable of transmitting a fourth signal 520 that may be harmful to the electronic device 404. The controller 540 may engage the third transmitter 526 to stimulate the phase transition of the phase change material of the apparatus 100 when the perceived threat is near the electronic device 404. DETX In another example, the transmitter 406 may be a relatively high-power transmitter that is collocated with the electronic device 404. The transmitter 406 may periodically or occasionally transmit signals that could be harmful to the electronic device 404. The controller 540 may selectively engage the third transmitter 526 to stimulate the phase transition of the phase change material of the apparatus 100 when the transmitter 406 is transmitting or is about to transmit the potentially harmful fourth signal 520. DETX In yet another example, the third transmitter 526 may send the third signal to stimulate the phase transition of the phase change material all of the time except for when the electronic device 404 is to send or receive signals via the antenna 402. To illustrate, the third transmitter 526 may leave the apparatus 100 "on" (e.g., in the second operational state described above) to block signals from being received at the electronic device 404 until a particular time when the signals are expected or desired, at which point the third transmitter 526 may cease sending the third signal to turn the apparatus 100 "off" (e.g., in the first operational state described above). DETX In a particular embodiment, the system includes the first apparatus 100 and a second apparatus 550. The second apparatus 550 may be included as a layer over or under the first apparatus 100. The second apparatus 550 may include a second discontinuous mesh formed by second conductive members spaced apart by second gaps. The second apparatus 550 may be configured to transition from the first operational state, in which the mesh of the second apparatus 550 is discontinuous, to the second operation state, in which the mesh of the second apparatus 550 behaves as continuous, in a different manner than or responsive to different conditions than the first apparatus 100. For example, the second gaps may have different widths than the gaps of the apparatus 100. The width of the gap may be related to the electric field strength in the gap when a mesh is exposed to electromagnetic radiation. Thus, smaller gaps may exhibit a stronger electric field than larger gaps. Accordingly, the larger gaps of the second apparatus 550 may experience smaller electric fields than the smaller gaps of the first apparatus 100 when both are subjected to the fourth signal 520. Thus, a phase change that is responsive to electric field strength may occur under different circumstance in the second apparatus 550 than at the first apparatus 100. To illustrate, a higher power signal or higher frequency signal may cause the phase transition of the second apparatus 550 than a signal that causes the phase transition of the first apparatus 100. A very high power signal may cause failure of the first apparatus 100, e.g., by exceeding a dielectric breakdown threshold of the phase change material. In this circumstance, the second apparatus 550 provides a higher power tolerance backup to the first apparatus 100, while the first apparatus 100 provides lower power switching to the second operational state (e.g., "on" state) to provide a fast switching response to the fourth signal 520. DETX To illustrate, when the phase change material is a gas that undergoes a phase transition to a plasma and when the fourth signal 620 is a relatively high-power signal, the smaller gaps of the apparatus 100 may have a strong enough electric field to exceed a dielectric breakdown threshold of the gas in the gaps of the apparatus 100. Thus, the gaps of the apparatus 100 may experience damaging arching or coronal discharge. The second gaps of the second apparatus 550 are larger and have a smaller electric field. When the apparatus 100 and the second apparatus 550 use the same gas in their respective gaps, the second gaps can endure a stronger signal than the gaps of the apparatus 100 without exceeding the dielectric breakdown threshold of the gas. In a particular embodiment, the apparatus 100 and the second apparatus 550 may use different gases with different dielectric breakdown threshold to provide protection against signals with different signal strengths. DETX In another example, the first apparatus 100 may include a first metal-insulator phase change material and the second apparatus 550 may include a second metal-insulator phase change material. The first metal-insulator phase change material may undergo a phase transition under different circumstances than the second metal-insulator phase change material. Thus, the first metal-insulator phase change material and the second metal-insulator phase change material may be responsive to different signal characteristics and thus provide protection against different signals. Alternately, or in addition, the first metal-insulator phase change material may fail (e.g., due to resistive heating) under different circumstances than the second metal-insulator phase change material. Thus, the second apparatus 550 may be a backup to the first apparatus 100. DETX In yet another example, the phase change materials used in each of the apparatuses 100, 550 are of different types. To illustrate, the first apparatus 100 may include a metal-insulator phase change material, and the second apparatus 550 may include a gas that undergoes a phase transition to a plasma. Alternately, the second apparatus 550 may include the metal-insulator phase change material, and the first apparatus 100 may include the gas that undergoes the phase transition to the plasma. The particular types of the phase change materials of each apparatus 100, 550 and the arrangement of the apparatuses 100, 550 may be selected based on protective characteristics that are desired for the system. For example, since the solid-solid metal-insulator phase transition is generally faster than a gas-plasma phase transition, the first apparatus 100 may use a solid-solid metal-insulator phase change material to provide a rapid response solid-solid metal-insulator phase change material that may break down at a lower power level than a plasma generated in relatively large gaps of the second apparatus 550. Accordingly, a gas-plasma material may be used with the relatively large gaps in the second apparatus 550. DETX Gaps widths, characteristic dimensions, phase change materials (e.g., gases, dopants, etc.), or any combination thereof of the apparatus 100 and the second apparatus 550 may be selected to cause the apparatus 100 and the second apparatus 550 to provide different protection characteristics. For example, the second apparatus 550 may have a different characteristic dimension than the characteristic dimension 114 (shown in FIG. 1) of the first apparatus 100. Thus, the first apparatus 100 and the second apparatus 550 may turn on (e.g., transition to the second operational state) in response to different waveforms and may be able to endure different waveforms without being overpowered (e.g., before a dielectric breakdown threshold is reached). In another example, when both of the apparatuses 100, 550 use metal-insulator phase change materials in the gaps, the gaps of the apparatuses 100, 550 may be the same size and the metal-insulator phase change materials may be different to provide different response characteristics of the apparatuses 100, 550. To illustrate, the first metal-insulator phase change material may be doped, and the second metal-insulator phase change material may be undoped or differently doped to provide response characteristics that are distinct from response characteristics of the first metal-insulator phase change material. DETX Further, although only two apparatuses are illustrated in FIG. 5, the system may include more than two apparatuses or layers. When more than two apparatuses are included, the additional apparatus or apparatuses may have characteristic dimensions, phase change materials (e.g., gases, dopants, etc.) and/or gaps selected to provide desired protection characteristics. Additionally, although the second apparatus 550 is only shown in the active system illustrated in FIG. 5, the second apparatus 550 or other layers may be used with a passive system, such as the system described with reference to FIGS. 4A and 4B. DETX FIG. 6 illustrates a first particular embodiment of a method of protecting an electronic device. The method includes, at 602, permitting a first signal having a first electromagnetic waveform to pass through an apparatus. For example, the apparatus may be a protection device, such as the apparatus 100 of FIG. 1, that includes a non-conductive substrate and a discontinuous mesh of conductive members. A phase change material may be disposed between the conductive members of the discontinuous mesh. The phase change material may undergo a phase transition from substantially non-conductive to substantially conductive at least partially responsive to the second electromagnetic waveform. For example, the phase transition may include a solid-solid metal-insulator phase transition, a gas-plasma phase transition, or another phase transition that results in a non-conductive to substantially conductive material becoming conductive. DETX The method also includes, at 604, blocking a second signal having a second electromagnetic waveform at the apparatus. The second electromagnetic waveform may be different than the first electromagnetic waveform. The second electromagnetic waveform may cause the phase change material to undergo the phase transition and to become substantially conductive. For example, a wavelength of the second electromagnetic waveform may be smaller than a wavelength of the first electromagnetic waveform, at 606. The phase change material may undergo the phase transition responsive, at least in part, to effects of the wavelength of the second electromagnetic waveform on the apparatus or on the phase change material. In another example, a power of the second signal may be greater than the first signal, at 608. The phase change material may undergo the phase transition responsive, at least in part, to effects of the power of the second electromagnetic waveform. DETX The method may also include, at 610, applying an activation signal to the apparatus to cause the second signal to be blocked. For example, a transmitter, such as the third transmitter 526 of FIG. 5, may be used to selectively turn the apparatus "on," so that signals are blocked, or "off," so that signals can pass through. In a particular embodiment, the activation signal may have a first polarization and an incoming signal may have a second polarization that is different from the first polarization. The incoming signal may be blocked based on first polarization of the activation signal, at 612. DETX FIG. 7 illustrates a second particular embodiment of a method of protecting an electronic device. The method includes, at 702, permitting a first signal having a first electromagnetic waveform to pass through an apparatus. For example, the apparatus may be a protection device, such as the apparatus 100, that includes a discontinuous mesh of conductive members separated by gaps. The apparatus may include a non-conductive substrate and a plurality of cells including conductive members. Conductive members may be arranged to form the discontinuous mesh. Each conductive member of a cell is separated from conductive members of adjacent cells by a gap. A cavity may be defined in the non-conductive substrate at each gap. In response to exposure to particular electromagnetic waveforms, a plasma may be formed in the cavity at each gap. DETX The method also includes, at 704, blocking a second signal having a second electromagnetic waveform at the apparatus. The second electromagnetic waveform may be different than the first electromagnetic waveform. For example, the second electromagnetic waveform may cause a material present in the cavity at each gap to be ionized to form a plasma, at 706. To illustrate, a wavelength of the second electromagnetic waveform may be smaller than a wavelength of the first electromagnetic waveform, at 708. The wavelength of the second electromagnetic waveform may stimulate or excite the material present in the cavity to form the plasma. In another illustrative example, the power of the second signal may be greater than the first signal, at 710. The plasma may be stimulated in the cavity at each gap in response to the second signal due to the signal strength. DETX The method may also include, at 712, applying an activation signal to the apparatus to cause the second signal to be blocked. For example, a transmitter, such as the third transmitter 526 of FIG. 5, may be used to selectively turn the apparatus "on," so that signals are blocked, or "off," so that signals can pass through. In a particular embodiment, the activation signal may have a first polarization and an incoming signal may have a second polarization that is different from the first polarization. The incoming signal may be blocked based on first polarization of the activation signal, at 714. DETX FIGS. 8-13 illustrate results of simulations that were conducted to characterize performance of a protection device, such as the apparatus 100 described above. For purposes of the simulations, the conductive members 106 and 107 of the apparatus 100 were simulated as 70 .mu.m wide copper traces with gaps midway between intersections of vertical and horizontal traces. For a first simulation, results of which are illustrated in FIGS. 8, 9, 10 and 12, the gaps 110 were simulated as having a width of approximately 20 .mu.m, and the cell size or characteristic dimension 114 of the cells was simulated as about 5 mm. For a second simulation, results of which are illustrated in FIG. 11, the gaps 110 were simulated as having a width of approximately 80 .mu.m, and the cell size or characteristic dimension 114 of the cells was simulated as about 5 mm. DETX FIG. 8 is a graph of scattering parameters of a simulated protection device in a first operational state in which the gaps are discontinuities in the conductive members. As shown in FIG. 8, when subjected to a 2.45 gigahertz signal, substantially all of the signal is transmitted through the apparatus, with less than a 30 decibel reflection at 2.45 gigahertz. DETX FIG. 9 is a graph of simulated scattering parameters of a particular embodiment of a protection device in a second operational state in which no discontinuities are present in the conductive members. FIG. 9 shows that with the gaps bridged, the apparatus 100 acts as an effective ground plane and reflects most of the incoming signal with less than 12 decimals getting through at 2.45 gigahertz. It is noted that performance of the apparatus 100 may be improved by adjusting a size of the mesh (e.g., a distance between intersection points or approximate size of the cells) to be more sub-wavelength. The performance of the apparatus 100 may also be improved by using several layers of mesh with different characteristics. DETX FIG. 10 is a graph of simulated electric field characteristics across half of a gap of a discontinuous mesh according to a first particular embodiment. Magnitude of the electric field is shown along the y-axis. A location along the gap is shown along the x-axis, starting at distance 0, which is the edge of a conductive member, and extending to a distance 10 .mu.m from the edge of the conductive member, which is approximately a center of the gap. The electric field across the gap is believed to be approximately symmetric about the center of the gap; thus, only half of the gap was simulated. The graph in FIG. 10 shows the electric field strength at points in the gap when the conductive members are exposed to a 2.45 GHz signal at various incident power levels. For example, at an incident power of about 1 watt/cm^2, the electric field strength inside the gap ranges from about 3.5.times.10^5 volts per meter to about 6.times.10^5 volts per meter, as shown by line 1004. At an incident power of 0.1 watt/cm^2, the electric field strength ranges from about 1.times.10^5 volts per meter to about 1.9.times.10^5 volts per meter, as shown by line 1008. Both of these incident power levels produce sufficient electric field strength to initiate plasma in the gap. That is, both incident power levels exceed a plasma threshold of air 1010. Yet both of these incident power levels remain safely below the dielectric breakdown threshold of air 1002. DETX Studies by others have shown that vanadium (IV) oxide (VO.sub.2) can be stimulated to transition from an insulator phase to a metal phase by 7.1 volts over a 3 micron gap, or a field strength of 2.4.times.10^6 volts per meter, which is less than the field strength for a gap of a few microns at incident power of 1 W/cm^2. Accordingly, it is believed that threshold power for vanadium oxide can be lowered significantly below 1 W/cm^2 with a smaller gap, even sub-micron sizes. DETX Different gap sizes may accommodate different incident power levels without exceeding the dielectric breakdown threshold of air 1002. Additionally, different gases may have different plasma thresholds and dielectric breakdown thresholds. Accordingly, a gap size and a gas may be selected to provide protection for particular incident power levels of particular frequencies of electromagnetic radiation. DETX FIG. 11 is a graph of simulated electric field characteristics across half of a gap of a discontinuous mesh according to a second particular embodiment. As in FIG. 10, only a half-gap is illustrated. The gap simulated for FIG. 11 has a width of gap at 80 .mu.m. Since the electric field strength is believed to be symmetrical in the gap, the x-axis shows the distance from the edge of a conductive member at 0 to the midpoint of the gap at 40 .mu.m. The graph in FIG. 11 also shows the dielectric breakdown threshold of air 1002 and the plasma threshold of air 1010. The graph shows electric field strength for a 2.45 GHz signal at various incident power levels. DETX The electric field strength in the gap for a 1 watt/cm^2 incident power is shown by line 1108. Thus, for the 80 .mu.m gap, 1 watt/cm^2 incident power is sufficient to surpass the plasma threshold of air 1010 but remains below the dielectric breakdown threshold of air 1002. The electric field strength in the gap for a 5 watt/cm^2 incident power is shown by line 1106, and the electric field strength in the gap for a 10 watt/cm^2 incident power is shown by line 1104. Both the 5 watt/cm^2 incident power and the 10 watt/cm^2 incident power are sufficient to surpass the plasma threshold of air 1010 but remain below the dielectric breakdown threshold of air 1002. Thus, by widening the gap from the 20 .mu.m gap simulated in FIG. 10 to the 80 .mu.m gap simulated in FIG. 11, a higher incident power level signal can be blocked. For example, the 80 .mu.m gap can withstand at least a 10 watt/cm^2 incident power level without reaching the dielectric breakdown threshold of air 1002. DETX FIG. 12 is a graph of simulated electric field characteristics across half of a gap of a discontinuous mesh according to a third particular embodiment. For FIG. 12, the gap was simulated as having a width of 20 .mu.m, with half of the gap shown in FIG. 12. FIG. 12 shows how a higher frequency signal with a lower incident power level affects the electric field in the gap. Specifically, FIG. 12 shows the electric field in the gap for various incident power levels of a 30.6 GHz signal, as compared to the 2.45 GHz signal used for FIG. 10 with the same gap width. The plasma threshold of air 1010 and the dielectric breakdown threshold of air 1002 are also shown in FIG. 12. DETX The higher frequency signal used for FIG. 12 may provide better coupling across the gap using less power. To illustrate, line 1206 shows the electric field across the gap at a 1 mW/cm^2 incident power level. Thus, using a 30.6 GHz signal, an incident power level as low as 1 mW/cm^2 is sufficient to generate a plasma in the gap. The line 1204 shows the electric field across the gap at a 10 mW/cm^2 incident power level. DETX While the simulations described above illustrate effects of frequency of a received signal and gap width and power on generation of a plasma, another consideration is response time. That is, how long it takes for the mesh to switch from an inactive state to an active state. The switching response time may be approximated by a time required for the phase change. For example, when the phase change material used is a gas that transitions to a plasma, the switching response time is approximately the plasma initiation time, e.g., how much time is required to initiate the plasma. The plasma is initiated when electrons of the gas in the gap become ionized. Thus, a time required for an electron to achieve ionization energy in response to an electric field is an estimate of the plasma initiation time. DETX FIG. 13 is a graph of estimated turn on time of a protection device according to a particular embodiment. FIG. 13 graphs an approximation of the time required for an electron in an electric field to gain enough energy for ionization neglecting electron energy lost during inelastic collisions with gas molecular species. This graph demonstrates that for various electric field strengths, the time required for an electron to become ionized is less than about two nanoseconds. Accordingly, the turn on response time for this particular embodiment is expected to be about two nanoseconds or less. The solid-solid metal insulator phase transition in vanadium dioxide has been estimated in some tests to take approximately 100 femtoseconds. Accordingly, embodiments that use a solid-solid metal insulator phase change material may have a response time that is less than one picoseconds, e.g., about 100 femtoseconds. DETX Various embodiments disclosed provide protection devices to protect electronics. A protection device includes a discontinuous mesh that can act as a protective screen for communication systems and other electronic systems that may be susceptible to electromagnetic damage due to high-power electromagnetic radiation. The discontinuous mesh may act as a nonlinear element that is substantially transparent to electromagnetic radiation at low powers or particular frequencies and that becomes substantially opaque or reflective to high-power electromagnetic radiation. The protection device may be passive in that it reacts to switch from the transparent state to the opaque state in response to the incident electromagnetic radiation that is to be blocked. The protection device may also be actively controlled by transmitting a signal having a desired modulation toward the discontinuous mesh when it is desired to switch the discontinuous mesh to a protection state. The protection device may include multiple layers of the discontinuous mesh to provide protection at different incident power levels. DETX The discontinuous mesh may act as an electromagnetic shutter to provide passive protection without requiring sensing systems or other complex circuitry for switching. Characteristics of an incident signal (e.g., the incident power level and frequency) may determine whether the incident signal is allowed to pass through the discontinuous mesh or is blocked by the discontinuous mesh. DETX Using active modulation, it is possible to illuminate the discontinuous mesh using a relatively high frequency, low power illumination signal in order to activate the protection device. The frequency of the illumination signal may be approximately a resonant frequency of the discontinuous mesh based on cell size (e.g., spacing of conductive members of the discontinuous mesh). Thus, the illumination signal may have a wavelength on an order of about two times the cell size. Since the discontinuous mesh may be designed for a working signal (e.g., a signal that is allowed to pass through) with a wavelength on an order of about twenty-five times the cell size there may be little interference between the working signal and the illumination signal. Frequency of the illumination signal can also be chosen to be between harmonics of operating frequencies of an aperture associated with the protection device to avoid unwanted coupling of the aperture. When active modulation of the discontinuous mesh is used, polarization of the illumination signal may cause the screen to selectively block signals having a particular polarity. For example, depending on polarization of the illumination signal, either vertically or horizontally polarized incoming signals may be blocked. DETX A unit cell size of the discontinuous mesh may be selected to improve performance for particular incident signals. For example, the unit cell size may be selected to be much smaller than a wavelength of the particular incident signal to increase a reflection coefficient of the discontinuous mesh. A gap width of the discontinuous mesh can be selected to mitigate a specific threshold level of incident power. For example, larger gaps may be used to mitigate higher incident power levels. Additionally, multiple discontinuous mesh layers with varying gap widths can be used to mitigate a broader range of incident power levels. For example, two mesh layers may be used with a first layer having wider gaps than a second layer. The first layer may only turn on for relatively high incident power levels. The second layer may be activated for lower incident power levels, but may be overpowered by the higher incident power levels. Additionally, when the first layer is on top of the second layer, the second layer may be activated by "spill over" from the first layer, providing additional protection. That is, when a relatively high-power signal activates the first layer, a portion of the high-power signal may pass through the first layer. The portion of the high-power signal that passes through the first layer may be sufficient to activate the second layer, enabling the second layer to provide additional protection. Each layer may provide up to about 25 decibels of attenuation and up to about 18 decibels of dynamic operating range of the incident power level. DETX The illustrations of the embodiments described herein are intended to provide a general understanding of the structure of the various embodiments. The illustrations are not intended to serve as a complete description of all of the elements and features of apparatus and systems that utilize the structures or methods described herein. Many other embodiments may be apparent to those of skill in the art upon reviewing the disclosure. Other embodiments may be utilized and derived from the disclosure, such that structural and logical substitutions and changes may be made without departing from the scope of the disclosure. For example, method steps may be performed in a different order than is shown in the figures or one or more method steps may be omitted. Accordingly, the disclosure and the figures are to be regarded as illustrative rather than restrictive. DETX Moreover, although specific embodiments have been illustrated and described herein, it should be appreciated that any subsequent arrangement designed to achieve the same or similar results may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all subsequent adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art upon reviewing the description. DETX The Abstract of the Disclosure is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, various features may be grouped together or described in a single embodiment for the purpose of streamlining the disclosure. This disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, the claimed subject matter may be directed to less than all of the features of any of the disclosed embodiments. CLST What is claimed is: CLPR 1. A method, comprising: permitting a first signal having a first electromagnetic waveform to pass through an apparatus; and blocking a second signal having a second electromagnetic waveform at the apparatus, wherein the second electromagnetic waveform is different than the first electromagnetic waveform; wherein the apparatus comprises: a non-conductive substrate; a plurality of cells including conductive members coupled to the non-conductive substrate, wherein the conductive members are arranged to form a first discontinuous mesh, wherein regions between the conductive members of the first discontinuous mesh include a phase change material, wherein the phase change material undergoes a phase transition from substantially non-conductive to substantially conductive. CLPR 2. The method of claim 1, wherein the non-conductive substrate comprises a ceramic material, a polymer material, or a combination thereof. CLPR 3. The method of claim 1, wherein dimensions of the conductive members are selected to permit propagation of the first electromagnetic waveform and to block propagation of the second electromagnetic waveform. CLPR 4. The method of claim 3, wherein each cell of the plurality of cells is approximately square and has a length is approximately one-twenty-fifth of a first wavelength of the first electromagnetic waveform. CLPR 5. The method of claim 4, wherein the length is approximately one-half of a second wavelength of the second electromagnetic waveform. CLPR 6. The method of claim 1, wherein the apparatus further comprises second conductive members arranged to form a second discontinuous mesh, wherein the second discontinuous mesh is layered over or under the first discontinuous mesh, wherein the conductive members of the first discontinuous mesh are separated from each other by a first distance and the second conductive members of the second discontinuous mesh are separated from each other by a second distance, and wherein the second distance is different from the first distance. CLPR 7. The method of claim 1, wherein a gap is defined between the conductive members of the first discontinuous mesh at regions between the conductive members, and wherein the phase change material includes a gas that forms a plasma when the gas is excited by particular electromagnetic waveforms. CLPR 8. The method of claim 1, wherein the phase change material includes vanadium (IV) oxide. CLPR 9. A method, comprising: permitting a first signal having a first electromagnetic waveform to pass through an apparatus to an electronic device when the apparatus is in a first operational state; and selectively blocking a second signal from passing to the electric device when the electronic device is in a second operational state, the second signal having a second electromagnetic waveform that is different than the first electromagnetic waveform. CLPR 10. The method of claim 9, wherein the apparatus comprises: a non-conductive substrate; a discontinuous mesh of conductive members; and a phase change material disposed between the conductive members of the discontinuous mesh, wherein to transition from the first operational state to the second operational state the phase change material undergoes a phase transition from substantially non-conductive to substantially conductive at least partially responsive to the second electromagnetic waveform. CLPR 11. The method of claim 9, further comprising transmitting a signal having the second electromagnetic waveform to cause the apparatus to transition to the second operational state. CLPR 12. The method of claim 11, wherein a time required to switch from the first operational state to the second operational state is about 2 nanoseconds or less. CLPR 13. The method of claim 12, wherein the time required to switch from the first operational state to the second operational state is less than one picosecond. CLPR 14. The method of claim 9, further comprising directing, by a second electronic device, a third signal having a third electromagnetic waveform toward the apparatus to cause a portion of the apparatus to undergo a phase transition to switch from the first operational state to the second operational state. CLPR 15. The method of claim 14, wherein the first electromagnetic waveform has a first polarization and further comprising selectively blocking a fourth signal having a second polarization responsive to the second electronic device directing the third signal toward the apparatus. CLPR 16. The method of claim 9, wherein a transition from the first operational state to the second operational state is a metal-insulator phase transition. CLPR 17. A method, comprising: permitting a first signal having a first electromagnetic waveform to pass through an apparatus; undergoing a phase transition at a portion of the apparatus responsive to a second signal having a second electromagnetic waveform; and blocking the second signal having the second electromagnetic waveform at the apparatus responsive to undergoing the phase transition, wherein the second electromagnetic waveform is different than the first electromagnetic waveform. CLPR 18. The method of claim 17, wherein a wavelength of the second electromagnetic waveform is less than a first wavelength of the first electromagnetic waveform. CLPR 19. The method of claim 17, wherein a power of the second signal at the apparatus is greater than a first power of the first signal at the apparatus. CLPR 20. The method of claim 17, wherein the phase transition is a metal-insulator phase transition. ICUS Y DSRC US 09204583 B2 20151201 13483436 31923 Cylindrical electromagnetic bandgap and coaxial cable having the same *** BRS DOCUMENT BOUNDARY *** WKU 09204583 SIZE 32314 DWKU 9204583 APT B2 DID US 9204583 B2 GISD 20151201 ARD 483436 AFD 20120530 APY 2012 SRC 13 APNR 13483436 APP 13/483436 PRCO KR PRAN 10-2011-0055402 PRAD 20110609 PRAY 2011 PRAI 2011KR-10-2011-0055402 TRX 431 IPCG 20060101 A H01B H01B11/00 F I B US H 20151201 IPCC H01B IPCP H01B11/00 20060101 H01B011/00 IPCG 20060101 A H05K H05K9/00 L I B US H 20151201 IPCC H05K IPCS H05K9/00 20060101 H05K009/00 CLOI H05K CPOI H05K9/0098 20130101 CPOG H H05K H05K9/0098 20130101 F I 20151201 US TTL Cylindrical electromagnetic bandgap and coaxial cable having the same URPN 3963854 URNM Fowler URPD 19760600 URCL 174/36 URGP US 3963854 A 19760600 Fowler 174/36 cited by examiner URPN 4327248 URNM Campbell URPD 19820400 URCL 174/107 URGP US 4327248 A 19820400 Campbell 174/107 cited by examiner URPN 4533784 URNM Olyphant, Jr. URPD 19850800 URCL 174/36 URGP US 4533784 A 19850800 Olyphant, Jr. 174/36 cited by examiner URPN 4598165 URNM Tsai URPD 19860700 URCL 174/36 URGP US 4598165 A 19860700 Tsai 174/36 cited by examiner URPN 5349133 URNM Rogers URPD 19940900 URCL 174/36 URGP US 5349133 A 19940900 Rogers 174/36 cited by examiner URPN 6284971 URNM Atalar et al. URPD 20010900 URCL 174/36 URGP US 6284971 B1 20010900 Atalar et al. 174/36 cited by examiner URPN 6867362 URNM Cherniski et al. URPD 20050300 URCL 174/36 URGP US 6867362 B2 20050300 Cherniski et al. 174/36 cited by examiner URPN 7105739 URNM Abe URPD 20060900 URCL 174/28 URGP US 7105739 B2 20060900 Abe 174/28 cited by examiner URPN 7525045 URNM Archambeault et al. URPD 20090400 URCL 174/102R URGP US 7525045 B2 20090400 Archambeault et al. 174/102R cited by examiner URPN 7737362 URNM Ogura URPD 20100600 URCL 174/102R URGP US 7737362 B2 20100600 Ogura 174/102R cited by examiner URPN 8005429 URNM Conway et al. URPD 20110800 URCL 455/63.1 URGP US 8005429 B2 20110800 Conway et al. 455/63.1 cited by examiner URPN 8492648 URNM Smith et al. URPD 20130700 URCL 174/36 URGP US 8492648 B2 20130700 Smith et al. 174/36 cited by examiner URPN 2003/0002691 URNM Ono et al. URPD 20030100 URCL 381/94.1 URGP US 2003/0002691 A1 20030100 Ono et al. 381/94.1 cited by examiner URPN 2004/0055772 URNM Tsutsui et al. URPD 20040300 URCL 174/36 URGP US 2004/0055772 A1 20040300 Tsutsui et al. 174/36 cited by examiner URPN 2006/0185884 URNM Ortiz et al. URPD 20060800 URCL 174/74R URGP US 2006/0185884 A1 20060800 Ortiz et al. 174/74R cited by examiner URPN 2011/0266050 URNM Su et al. URPD 20111100 URCL 174/74R URGP US 2011/0266050 A1 20111100 Su et al. 174/74R cited by examiner URPN 2012/0273247 URNM Matsuura URPD 20121100 URCL 174/102R URGP US 2012/0273247 A1 20121100 Matsuura 174/102R cited by examiner NCL 18 ECL 1 CIFS 174/68.1 CIFS 174/102R CIFS 174/102C CIFS 174/104 CIFS 174/350 CIFS 174/32 CIFS 174/106R CIFS 174/70R CIFS 174/102SP CIFS 174/108 CIFS 174/33 CIFS 174/36 CIFS 174/34 CIFS 174/107 CFSC 174 CFSS 68.1;102R;102C;104;350;32;106R;70R;102SP;108;33;36;34;107 CIFS 455/63.1 FSCP H05K 9/00 FSCL H05K FSCP H05K 9/0098 FSCL H05K FSCP H01B 11/18 FSCL H01B CFSC 455 CFSS 63.1 NDR 13 NFG 13 PDID US 20120312578 A1 PPCC US PPNR 20120312578 PPKC A1 PPPD 20121213 AANM Park; Hyun Ho AACI Suwon-si AAST N/A AAZP N/A AACO KR AATX N/A AAGP Park; Hyun Ho Suwon-si KR AANM Park; Hark Byeong AACI Hwaseong-si AAST N/A AAZP N/A AACO KR AATX N/A AAGP Park; Hark Byeong Hwaseong-si KR INNM Park; Hyun Ho INSA N/A INCI Suwon-si INST N/A INZP N/A INCO KR INTX N/A INGP Park; Hyun Ho Suwon-si KR INNM Park; Hark Byeong INSA N/A INCI Hwaseong-si INST N/A INZP N/A INCO KR INTX N/A INGP Park; Hark Byeong Hwaseong-si KR LRFM Staas & Halsey LLP ASNM SAMSUNG ELECTRONICS CO., LTD. ASTC 03 ASCI Suwon-Si ASST N/A ASZP N/A ASCO KR ASTX N/A ASGP SAMSUNG ELECTRONICS CO., LTD. Suwon-Si KR 03 ART 2848 EXP Estrada; Angel R EXA Cruz; Dimary Lopez ABPR A cylindrical electromagnetic bandgap to reduce electromagnetic interference of a cable and a coaxial cable having the same includes a conductor patch having a curved surface to be spaced apart from the surface of the cylindrical cable to an outer side by a predetermined gap distance, and a via connecting the surface of the cylindrical cable to the conductor patch. BSTX CROSS-REFERENCE TO RELATED APPLICATIONS BSTX This application claims the priority benefit of Korean Patent Application No. 10-2011-0055402, filed on Jun. 9, 2011 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. BSTX BACKGROUND BSTX 1. Field BSTX The following description relates to a cylindrical electromagnetic bandgap capable of improving electromagnetic interference (EMI) and a coaxial cable having the same. BSTX 2. Description of the Related Art BSTX In general, EMI (electromagnetic interference) has been considered a chronic problem in operating an electronic device with a high frequency. BSTX RFI (Radio Frequency Interference) is an electromagnetic interference that occurs inside a product, and such phenomenon particularly reduces the function of wireless reception. The operating frequencies of recent electronic products range from several hundred MHz to several GHz. Accordingly, as various wireless functions such as wireless Internet, GPS, WiFi, or Bluetooth, for example, have been adopted, the effect of an EMI or a RFI has received significant attention. BSTX Also, for electronic products that use RF cables, such as notebook PCs, tablet PCs, or handheld phones, for example, the noise of electromagnetic waves developed inside the system interferes with the cable, resulting in induced common-mode currents that affect a signal received through an antenna, and degrade the reception sensitivity. BSTX SUMMARY BSTX Therefore, it is an aspect of the present disclosure to provide a cylindrical electromagnetic bandgap capable of improving an EMI. BSTX It is another aspect of the present disclosure to provide a coaxial cable, in which a cylindrical electromagnetic bandgap is installed to prevent induced electric current induced on the surface of an outer conductor from flowing to an inner conductor, such that a reception sensitivity is improved. BSTX Additional aspects of the disclosure will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the disclosure. BSTX In accordance with an aspect of the present disclosure, a cylindrical electromagnetic bandgap, which is provided in a cylindrical shape to prevent a flow of induced currents on a surface of a cylindrical cable, includes a conductor patch and a via. The conductor path has a curved surface to be spaced apart by a predetermined gap distance from the surface of the cylindrical cable to an outer side. The via connects the surface of the cylindrical cable to the conductor patch. BSTX The cylindrical electromagnetic bandgap is provided in a plurality while being spaced apart by a predetermined distance from each other lengthwise along the cylindrical cable. BSTX At least one of a dielectric and a ferrite material is provided between the outer surface of the cylindrical cable and the conductor patch. BSTX A frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change of an area of at least one of the conductor patch and the via. BSTX A frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change in thickness of at least one of the conductor patch and the via. BSTX A frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change in a gap of at least one of the conductor patch and the via. BSTX The cylindrical electromagnetic bandgap is provided in a stacking structure so that a portion of a conductor patch of one cylindrical electromagnetic bandgap overlaps with a portion of a conductor path of another cylindrical electromagnetic bandgap. BSTX In accordance with another aspect of the present disclosure, an electromagnetic bandgap for reducing electromagnetic interference of a cable includes a conductor patch and a via. The conductor patch has a curved surface to be spaced apart by a predetermined gap distance from a surface of the cable to an outer side. The via connects the conductor patch to the cable. The conductor patch is provided in a plurality of cylindrical conductor patches that are arranged at an equal interval and the via is provided in a plurality of cylindrical vias that are arranged at an equal interval. BSTX The electromagnetic bandgap is provided in a plurality of rows of electromagnetic bandgaps while being spaced apart from each other lengthwise along the cable by a predetermined distance. BSTX A frequency characteristic of the electromagnetic bandgap is adjusted according to the change of at least one of area, thickness, and gap distance of the conductor patch or the via. BSTX At least one of a dielectric and a ferrite material is provided between the conductor patch and the cable. BSTX In accordance with another aspect of the present disclosure, a coaxial cable having an inner conductor and an outer conductor provided outside the inner conductor includes a cylindrical electromagnetic bandgap. The cylindrical electromagnetic bandgap is formed at an outer side of the coaxial cable to block noise current induced on a surface of the coaxial cable. BSTX The cylindrical electromagnetic bandgap includes a conductor patch and a via. The conductor patch has a curved surface to be spaced apart by a predetermined gap distance from an outer side of the outer conductor. The via connects the conductor patch to the outer conductor. BSTX Each of the conductor patch and the via is provided in a cylindrical shape such that the cylindrical electromagnetic bandgap covers the cable. BSTX The cylindrical electromagnetic bandgap is provided in a plurality of rows of cylindrical electromagnetic bandgaps that are arranged lengthwise along the cable. BSTX A frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change of at least one of area, thickness, and gap distance of the conductor patch or the via. BSTX At least one of a dielectric and a ferrite material is provided between the outer conductor and the conductor patch. BSTX The cylindrical electromagnetic bandgap is provided in a stacking structure so that a portion of a conductor patch of one cylindrical electromagnetic bandgap overlaps with a portion of a conductor path of another cylindrical electromagnetic bandgap. BSTX According to an embodiment of the present disclosure, the noise current induced on the outer surface of a cylindrical cable is blocked, so that the electromagnetic interference is reduced. BSTX In addition, the noise current induced on the surface of a coaxial cable is blocked from flowing to an inner conductor that is connected to an antenna, thereby preventing signal attenuation or poor reception caused by external electromagnetic noise when signals are transmitted through a coaxial cable and thus improving the reception sensitivity in a RF frequency band. DETX BRIEF DESCRIPTION OF THE DRAWINGS DETX These and/or other aspects of the disclosure will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which: DETX FIG. 1 is a view schematically illustrating a notebook PC in which a cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure, is applied to a coaxial cable. DETX FIG. 2 is a view schematically illustrating a coaxial cable, according to an embodiment of the present disclosure. DETX FIG. 3 is a view schematically illustrating the coaxial cable using the cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure. DETX FIG. 4 is a cross-sectional view schematically illustrating the coaxial cable using the cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure. DETX FIG. 5 is a cross-sectional view schematically illustrating a coaxial cable to which a cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure, is applied. DETX FIG. 6 is a view schematically illustrating the coaxial cable using the cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure. DETX FIGS. 7A, 7B, 8A, and 8B are views that explain a simulation of showing a noise current transfer characteristic in use of the cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure. DETX FIG. 9 is a view schematically illustrating a result of noise current transfer characteristics shown in use of the cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure. DETX FIGS. 10 and 11 are views schematically illustrating the coaxial cable using the cylindrical electromagnetic bandgap, according to an embodiment of the present disclosure. DETX DETAILED DESCRIPTION DETX Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. DETX As illustrated in FIGS. 1 and 2, a coaxial cable 10 transmits electrical signals from an electronic device 1 (a notebook PC, for example) to an antenna (A). The electronic device is equipped with a main board embodied with a RF circuit, or a digital circuit, for example. The coaxial cable has one end connected to a connector (not shown) attached to a wireless apparatus 2 of a board 3, and the other end connected to the antenna (A). DETX The coaxial cable 10 is a type of transmission line used for data transmission that can transmit electric signals, because the coaxial cable 10 is formed with an outer conductor 10b and an inner conductor 10a in a concentric circle. The coaxial cable 10 has the ability to transmit low frequency electrical signals and high frequency electrical signals, in addition to direct current. DETX A dielectric D1 is provided between the outer conductor 10b and the inner conductor 10a of the coaxial cable 10. DETX However, in the case where the coaxial cable 10 is positioned inside the electronic apparatus 1 where such various circuits and system are provided, noise in the form of electromagnetic waves developed from a PCB located inside the electronic apparatus 1 is conveyed through the surface of the coaxial cable 10 after being induced as noise currents on the coaxial cable 10. DETX Because the outer conductor 10b is not provided on a connecting portion between the inner conductor 10a of the coaxial cable 10 and the antenna (A), noise in the form of an electromagnetic wave interference is developed inside the inner conductor 10a that affects signals received from the antenna (A), disturbing signal reception. DETX According to an embodiment of the present disclosure, in order to prevent signal reduction or decreased reception as a result of induced noise currents on a surface of the coaxial cable 10 affecting the inner conductor 10a or the antenna (A), a cylindrical electromagnetic bandgap 20 is installed on the coaxial cable 10. DETX Referring to FIG. 3 and FIG. 4, the cylindrical electromagnetic bandgap 20 of the present disclosure is provided to cover the outside of the coaxial cable 10. DETX The cylindrical electromagnetic bandgap 20 includes a conductor patch (or shield) 21 and a via (or connecting link) 22. DETX Each of the conductor patch 21 and the via 22 is provided in a cylindrical shape to cover the coaxial cable 10, and each of the conductor patch 21 and the via 22 is provided in a plurality to form a nearly complete cylindrical shape. DETX The conductor patch 21 has a curved surface to be spaced apart by a predetermined gap distance from the outer conductor 10b of the coaxial cable 10. DETX The conductor patch 21 is coaxially formed in relation to the outer conductor 10b and the inner conductor 10a of the coaxial cable 10. DETX The via 22 connects the outer conductor 10b of the coaxial cable 10 to the conductor patch 21. DETX The via 22 extends perpendicularly from an inner surface of the conductor patch having a curved surface, and makes contact with the outer conductor 10b of the coaxial cable 10 to connect the conductor patch 21 and the outer conductor 10b of the coaxial cable 10 both structurally and electrically. The via 22 may be composed of the same material as the conductor patch 21. DETX A dielectric D2 may be provided between the outer conductor 10b and the conductor patch 21, that is, between the cylindrical electromagnetic bandgap 20 and the coaxial cable 10. DETX In addition, ferrite material (F) may be provided between the coaxial cable 10 and the cylindrical electromagnetic bandgap 20. That is, the dielectric D1 is formed between the inner conductor 10a and the outer conductor 10b of the coaxial cable 10 while forming ferrite material (F) between the conductor patch 21 and the outer conductor 10b. The dielectric D2 between the outer conductor 10b and the conductor patch 21 may include the same dielectric material as the dielectric D1 or include a predetermined dielectric material that has the same or different dielectric constant as the dielectric D1. DETX The ferrite material (F) is used as highly permeable magnetic material between a low frequency and several hundred MHz frequency range, and is effective in shielding electromagnetic wave noise of a low frequency (see FIG. 5). DETX Therefore, the use of dielectrics D1 and D2 and/or ferrite material F result in a decrease of electromagnetic waves both in a low frequency range and a high frequency range. DETX In addition, according to this embodiment of the present disclosure, the cylindrical electromagnetic bandgap 20 is formed using four conductor patches 21 and four vias 22. However, the number of vias 22 or the conductor patches 21 is not limited to these numbers. DETX In particular, the frequency characteristic of the cylindrical electromagnetic bandgap 20 may be changed by changing an area (W*L), a thickness, or a gap distance (g) of the conductor patch 21, and therefore, tuning a frequency is possible. DETX The area (W*L) of the conductor patch 21 is a size of an area that is represented by multiplying a width (W) by a length (L) of the conductor patch 21, while the gap distance (g) represents a gap between adjacent conductor patches 21. DETX In addition, although not shown, the frequency characteristic of the cylindrical electromagnetic bandgap 20 may be changed by changing an area, a thickness, or a gap distance of the via 22. DETX Here, the thickness of the via 22 represents a cross-sectional area of the via 22, and the gap distance of the via 22 represents a gap between adjacent vias 22. DETX Therefore, the cylindrical electromagnetic bandgap 20 according to the embodiment of the present disclosure is installed on the coaxial cable 10 that connects the internal wireless apparatus 2 to the antenna (A) inside the electronic device 1, as illustrated in FIG. 6. DETX The cylindrical electromagnetic bandgap 20 may be formed in plurality of rows (1, 2, 3 . . . n) of cylindrical electromagnetic bandgaps 20 in a longitudinal direction of the coaxial cable 10. DETX The conductor patches 21 of the cylindrical electromagnetic bandgap 20 are spaced apart in a longitudinal direction of the coaxial cable 10 by a predetermined gap from one another. By changing such gap, the frequency characteristic of the cylindrical electromagnetic bandgap 20 may be changed. DETX In this configuration, the cylindrical electromagnetic bandgap 20 installed around the coaxial cable 10 can shield electromagnetic wave noise conveyed on the surface of the coaxial cable 10. The cylindrical electromagnetic bandgap 20, when transmitting signals from the coaxial cable 10, can improve signal reduction and reception sensitivity, and therefore, a reception of a wireless function on an electronic apparatus can be improved. DETX With reference to the case illustrated by FIGS. 7A and 7B where a conventional coaxial cable 10 is placed on a conductor panel (P), and the case illustrated by FIGS. 8A and 8B where the coaxial cable 10 having the cylindrical electromagnetic bandgap 20 is placed on a conductor panel P, ports are established at both ends of the cables to perform a simulation. The simulation is performed to obtain characteristics of electromagnetic wave noise being conveyed between two ports. DETX The coaxial cable 10 is provided at a height of 7 mm (I) above a ground surface (100*102.1 mm) while having a length of 102.1 mm. The inner conductor has a radius of 0.5 mm, and the outer conductor has a radius of 0.2 mm with a thickness of 0.2 mm. DETX The cylindrical electromagnetic bandgap 20 is provided to have 4 conductor patches per segment, forming a cylinder with a radius of 4.6 mm and a length of 5.0 mm. In this case, a total number of conductor patches is 80. DETX The via is set to have a radius of 0.1 mm and a length of 0.1 mm. DETX FIG. 9 shows a simulation result comparing the coaxial cable 10 with the cylindrical electromagnetic bandgap 20 according to the embodiment of the present disclosure. As seen, the electromagnetic noise transfer characteristic is reduced compared to a conventional coaxial cable by more than 20 dB (marked as dotted line on FIG. 9) in frequencies in the range of approximately 5 GHz to approximately 6 GHz, which corresponds to a wireless LAN (local area network) band. DETX Therefore, in a case when the coaxial cable 10 is adopted with the cylindrical electromagnetic bandgap 20, it is determined that a reception of the WLAN band can be improved by more than 20 dB compared to a conventional coaxial cable. DETX In addition, the frequency characteristic of such frequency band can be changed by adjusting an area, a thickness, or a gap of each of the conductor patch 21 and the via 22 that together form the cylindrical electromagnetic bandgap 20. DETX Referring to FIGS. 10 and 11, a cylindrical electromagnetic bandgap according to an embodiment of the present disclosure has a stacking structure that covers an outer side of the cylindrical electromagnetic bandgap 20 that covers the coaxial cable 10. DETX The cylindrical electromagnetic bandgap with a stacking structure includes a first cylindrical electromagnetic bandgap 20 that is formed in a cylindrical shape to cover the outer conductor 10b of the coaxial cable 10, and a second cylindrical electromagnetic bandgap 20a that covers the first cylindrical electromagnetic bandgap 20. DETX The second cylindrical electromagnetic bandgap 20a also includes a conductor patch 21a having a curved surface and a via 22a connecting the conductor patch 21a to the outer conductor 10b of the cylindrical cable 10. DETX A gap (g) is present between a plurality of conductor patches 21 of the first cylindrical electromagnetic bandgap 20. The via 22a of the second cylindrical electromagnetic bandgap 20a is inserted into the gap (g) and connects an outer conductor 10b of the coaxial cable 10 to a conductor patch 21a of the second cylindrical electromagnetic bandgap 20a both structurally and electrically. DETX The second cylindrical electromagnetic bandgap 20a is provided so that a portion of the conductor patch 21a of the second cylindrical electromagnetic bandgap 20a overlaps with a portion of the conductor patch 21 of the first cylindrical electromagnetic bandgap 20, and therefore, has a characteristic as a bandgap for broadband electromagnetic waves. DETX Between the first and the second cylindrical electromagnetic bandgaps 20 and 20a and the coaxial cable 10, that is, between each conductor patch 21 and 21a and the outer conductor patch 10b, the dielectric D2 or ferrite material F can be formed. Therefore, the first and second cylindrical electromagnetic bandgaps 20 and 20a can have a characteristic in reduced electromagnetic waves both in a low frequency band and in a high frequency band. DETX Although a few embodiments of the present disclosure have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents. For example, the cylindrical electromagnetic bandgap of the present disclosure can be applied to a cylindrical cable by use of a structure and material that can block the flow of organic currents instead of a conductor patch and a via. Therefore, changes and modifications made in these embodiments without departing from the principles and spirit of the disclosure are to be included in the claim. CLST What is claimed is: CLPR 1. A cylindrical electromagnetic bandgap provided in a cylindrical shape to prevent a flow of induced currents on a conductive surface of a cylindrical cable, the cylindrical electromagnetic bandgap comprising: a conductor patch having a curved surface to be spaced apart from the conductive surface of the cylindrical cable to an outer side by a predetermined gap distance; and a via connecting the conductive surface of the cylindrical cable to the conductor patch. CLPR 2. The cylindrical electromagnetic bandgap of claim 1, wherein the cylindrical electromagnetic bandgap is provided in a plurality while being spaced apart from each other lengthwise along the cylindrical cable by a predetermined distance. CLPR 3. The cylindrical electromagnetic bandgap of claim 1, wherein at least one of a dielectric and a ferrite material is provided between the outer surface of the cylindrical cable and the conductor patch. CLPR 4. The cylindrical electromagnetic bandgap of claim 1, wherein a frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change of an area of at least one of the conductor patch and the via. CLPR 5. The cylindrical electromagnetic bandgap of claim 1, wherein a frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change in thickness of at least one of the conductor patch and the via. CLPR 6. The cylindrical electromagnetic bandgap of claim 1, wherein a frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change in a gap of at least one of the conductor patch and the via. CLPR 7. The cylindrical electromagnetic bandgap of claim 1, wherein the cylindrical electromagnetic bandgap is provided in a stacking structure so that a portion of a conductor patch of one cylindrical electromagnetic bandgap overlaps with a portion of a conductor path of another cylindrical electromagnetic bandgap. CLPR 8. An electromagnetic bandgap for reducing electromagnetic interference of a cable, the electromagnetic bandgap comprising: a conductor patch having a curved surface to be spaced apart from a surface of the cable to an outer side by a predetermined gap distance; and a via connecting the conductor patch to a conductive surface of the cable, wherein the conductor patch is provided in a plurality of cylindrical conductor patches that are arranged at an equal interval and the via is provided in a plurality of cylindrical vias that are arranged at an equal interval. CLPR 9. The electromagnetic bandgap of claim 8, wherein the electromagnetic bandgap is provided in a plural of rows of electromagnetic bandgaps while being spaced apart from each other lengthwise along the cable by a predetermined distance. CLPR 10. The electromagnetic bandgap of claim 8, wherein a frequency characteristic of the electromagnetic bandgap is adjusted according to the change of at least one of area, thickness, and gap distance of the conductor patch or the via. CLPR 11. The electromagnetic bandgap of claim 8, wherein at least one of a dielectric and a ferrite material is provided between the conductor patch and the cable. CLPR 12. A coaxial cable having an inner conductor and an outer conductor provided outside the inner conductor, the coaxial cable comprising: a cylindrical electromagnetic bandgap which is formed at an outer side of the coaxial cable to block noise current induced on a surface of the coaxial cable, wherein the cylindrical electromagnetic bandgap comprises a plurality of conductor patches having a curved surface to be spaced apart from an outer side of the outer conductor by a predetermined gap distance, and wherein the plurality of conductor patches are spaced apart in a longitudinal direction of the coaxial cable by a predetermined gap from one another. CLPR 13. The coaxial cable of claim 12, wherein the cylindrical electromagnetic bandgap comprises a via connecting the conductor patch to the outer conductor. CLPR 14. The coaxial cable of claim 13, wherein each of the conductor patch and the via is provided in a cylindrical shape such that the cylindrical electromagnetic bandgap covers around the cable. CLPR 15. The coaxial cable of claim 12, wherein the cylindrical electromagnetic bandgap is provided in a plurality of rows of cylindrical electromagnetic bandgaps arranged lengthwise along the cable. CLPR 16. The coaxial cable of claim 12, wherein a frequency characteristic of the cylindrical electromagnetic bandgap is adjusted according to the change of at least one of area, thickness, and gap distance of the conductor patch or the via. CLPR 17. The coaxial cable of claim 12, wherein at least one of a dielectric and a ferrite material is provided between the outer conductor and the conductor patch. CLPR 18. The coaxial cable of claim 12, wherein the cylindrical electromagnetic bandgap is provided in a stacking structure so that a portion of a conductor patch of one cylindrical electromagnetic bandgap overlaps with a portion of a conductor path of another cylindrical electromagnetic bandgap. ICUS Y DSRC US 09204584 B2 20151201 13970609 45923 Testing system for testing a portable electronic device *** BRS DOCUMENT BOUNDARY *** WKU 09204584 SIZE 46061 DWKU 9204584 APT B2 DID US 9204584 B2 GISD 20151201 ARD 970609 AFD 20130820 APY 2013 SRC 13 APNR 13970609 APP 13/970609 PRCO CN PRAN 2013 1 0195919 PRAD 20130523 PRAY 2013 PRAI 2013CN-2013 1 0195919 TRX 346 IPCG 20110101 A G01M G01M99/00 F I B US H 20151201 IPCC G01M IPCP G01M99/00 20110101 G01M099/00 IPCG 20060101 A H05K H05K13/00 L I B US H 20151201 IPCC H05K IPCS H05K13/00 20060101 H05K013/00 IPCG 20060101 A G06F G06F11/26 L I B US H 20151201 IPCC G06F IPCS G06F11/26 20060101 G06F011/26 IPCG 20060101 A G06F G06F11/273 L I B US H 20151201 IPCC G06F IPCS G06F11/273 20060101 G06F011/273 CLOI H05K CPOI H05K13/00 20130101 CPOG H H05K H05K13/00 20130101 F I 20151201 US CLOI G06F CPOI G06F11/26 20130101 CPOG G G06F G06F11/26 20130101 L I 20151201 US CLOI G06F CPOI G06F11/2736 20130101 CPOG G G06F G06F11/2736 20130101 L I 20151201 US TTL Testing system for testing a portable electronic device URPN 3597981 URNM Wakabayashi URPD 19710800 URCL 73/865.9 URGP US 3597981 A 19710800 Wakabayashi 73/865.9 cited by examiner URPN 5827983 URNM Ortoli URPD 19981000 URCL 714/E11.159 URGP US 5827983 A 19981000 Ortoli 714/E11.159 cited by examiner URPN 6314825 URNM Fan URPD 20011100 URCL 73/865.3 URGP US 6314825 B1 20011100 Fan 73/865.3 cited by examiner URPN 6581483 URNM Yeh URPD 20030600 URCL 73/865.3 URGP US 6581483 B1 20030600 Yeh 73/865.3 cited by examiner URPN 8099253 URNM Rau URPD 20120100 URCL 400/473 URGP US 8099253 B1 20120100 Rau 400/473 cited by examiner URPN 2013/0152711 URNM Xu URPD 20130600 URCL 73/865.9 URGP US 2013/0152711 A1 20130600 Xu 73/865.9 cited by examiner NCL 17 ECL 1 CFSC None CFSS None NDR 14 NFG 14 PDID US 20140345395 A1 PPCC US PPNR 20140345395 PPKC A1 PPPD 20141127 AANM Wistron Corporation AACI New Taipei AAST N/A AAZP N/A AACO TW AATX N/A AAGP Wistron Corporation New Taipei TW INNM Wang; Zhen INSA N/A INCI New Taipei INST N/A INZP N/A INCO TW INTX N/A INGP Wang; Zhen New Taipei TW INNM Hu; Wei INSA N/A INCI New Taipei INST N/A INZP N/A INCO TW INTX N/A INGP Hu; Wei New Taipei TW INNM Liao; Bing INSA N/A INCI New Taipei INST N/A INZP N/A INCO TW INTX N/A INGP Liao; Bing New Taipei TW INNM Wang; Bin INSA N/A INCI New Taipei INST N/A INZP N/A INCO TW INTX N/A INGP Wang; Bin New Taipei TW INNM Liao; Yen-Wei INSA N/A INCI New Taipei INST N/A INZP N/A INCO TW INTX N/A INGP Liao; Yen-Wei New Taipei TW LRFW Hsu; Winston LRFW Margo; Scott ASNM Wistron Corporation ASTC 03 ASCI Hsichih, New Taipei ASST N/A ASZP N/A ASCO TW ASTX N/A ASGP Wistron Corporation Hsichih, New Taipei TW 03 ART 2856 EXP Raevis; Robert R ABPR A testing system includes a base, a frame installed on the base, a platform, a first driving mechanism, a second driving mechanism, a locating component, a third driving mechanism and a control unit. Two guiding tracks and a sliding component which slides along the two guiding tracks are disposed under two sides of the platform. The second driving mechanism is connected to the sliding component, and the third driving mechanism is disposed on the sliding component and connected to the locating component. The control unit is for controlling the first driving mechanism to drive the platform to move in a first direction, so that the locating component presses a portable electronic device disposed on the base. The control unit is further for controlling the second driving mechanism and the third driving mechanism to drive the locating component to move in a second direction and a third direction. BSTX BACKGROUND OF THE INVENTION BSTX 1. Field of the Invention BSTX The present invention relates to a testing system, and more specifically, to a testing system for testing a portable electronic device. BSTX 2. Description of the Prior Art BSTX In the modern market, a portable electronic device, such as a notebook computer, is widespread and very popular. In order to ensure good quality of the products, the notebook computer is tested with various tests before delivery, so as to ensure that every function of the notebook computer can perform normally. For example, it can test whether there are broken buttons of a keyboard, can test whether a display module of the portable electronic device displays images normally, or can test whether a touch module operates normally. However, every test described above has to be performed by an operator in factory, resulting in wasting a lot of manpower and time. Therefore, it is an important issue to design a test system for testing the portable electronic device automatically. BSTX SUMMARY OF THE INVENTION BSTX The present invention is to provide a testing system for testing a portable electronic device to solve above problems. BSTX According to the disclosure, a testing system includes a base, a frame, two connecting components, a platform, a first driving mechanism, a second driving mechanism, a guiding component, a locating component, a third driving mechanism and a control unit. The base is for supporting the portable electronic device. The frame is installed on the base. The platform is disposed between the base and the frame and movably installed on the two connecting components. Two guiding tracks and a sliding component are respectively disposed under two sides of the platform, and the sliding component is slidably installed on the two guiding tracks. The first driving mechanism is connected to the platform for driving the platform to move in a first direction along the two connecting components. The second driving mechanism is connected to the sliding component, and the second driving mechanism is for driving the sliding component to move in a second direction along the two guiding tracks. Two ends of the guiding component are connected to two ends of the sliding component respectively. The locating component sheathes the guiding component, and the locating component includes a roller. The third driving mechanism is disposed on the sliding component and connected to the locating component, and the third driving mechanism is for driving the locating component to move in a third direction along the guiding component. The control unit is for controlling the first driving mechanism to drive the platform to move in the first direction, so that the roller of the locating component presses the portable electronic device. The control unit is further for controlling the second driving mechanism and the third driving mechanism to drive the locating component to move in the second direction and the third direction. BSTX According to the disclosure, the first driving mechanism includes a first driving rod and a first driving component. The first driving rod is connected to the platform. The first driving component is installed on the frame and connected to the first driving rod, and the first driving component is for driving the first driving rod to move the platform in the first direction along the two connecting components. BSTX According to the disclosure, the second driving mechanism includes a moving component, a second driving rod and a second driving component. The moving component is connected to the sliding component. The second driving rod passes through the moving component. The second driving component is connected to the second driving rod, and the second driving component is for driving the second driving rod to move the moving component in the second direction, so as to drive the sliding component to move in the second direction along the two guiding tracks. BSTX According to the disclosure, the third driving mechanism further includes a third driving rod and a third driving component. The third driving rod passes through the locating component and connected to the sliding component. The third driving component is connected to the third driving rod, and the third driving component is for driving the third driving rod to move the locating component in the third direction along the guiding component. BSTX According to the disclosure, the first driving component is a cylinder, and the second driving component and the third driving component are motors, respectively. BSTX According to the disclosure, the testing system further includes a testing rod and a fourth driving mechanism. The fourth driving mechanism is installed on the locating component and connected to the testing rod, and the control unit is further for controlling the fourth driving mechanism to drive the testing rod and controlling the second driving mechanism and the third driving mechanism to drive the locating component, so as to drive the fourth driving mechanism and the testing rod, so that the testing rod contacts against a touch module of the portable electronic device. BSTX According to the disclosure, an end of the testing rod which is for contacting against the touch module is made of conductive material with a print, and the control unit is further for controlling the fourth driving mechanism to drive the testing rod, so that the end of the testing rod contacts against a fingerprint identification module of the portable electronic device. BSTX According to the disclosure, the fourth driving mechanism is a cylinder. BSTX According to the disclosure, the roller is made of resilient material. BSTX According to the disclosure, the testing further includes a distance sensing unit electrically connected to the control unit and disposed on an end of the platform nearby the portable electronic device for sensing a distance between a display module of the portable electronic device and the end of the platform, and the control unit being further for controlling operation of the testing system according to a sensing result of the distance sensing unit. BSTX According to the disclosure, the distance sensing unit is an ultrasound sensing device. BSTX According to the disclosure, the testing system further includes a fixing frame and a reflecting component. The reflecting component is disposed on the fixing frame, and the reflecting component is for reflecting an image displayed on a display module of the portable electronic device, so that an image capturing module of the portable electronic device captures the image reflected by the reflecting component, so as to determine whether the display module and the image capturing module operate normally according to the image reflected by the reflecting component and captured by the image capturing module. BSTX According to the disclosure, the testing system further includes a plug testing unit electrically connected to the control unit, and the plug testing unit includes a supporting component and a plug module. The supporting component is disposed on the base for supporting the portable electronic device. The plug module is disposed on the supporting component, and the plug module is aligned to a socket of the portable electronic device. The control unit is further for controlling the plug module to insert into or unplug from the socket. BSTX According to the disclosure, the plug module includes a plug component, a pushing component, two guiding blocks and a cylinder. The plug component is for inserting into the socket. The pushing component is connected the plug component. The two guiding blocks are for guiding movement of the pushing component. The cylinder is connected to the pushing component, and the control unit is further for controlling the cylinder to drive the pushing component to drive the plug component to insert into the socket of the portable electronic device. BSTX According to the disclosure, at least one positioning column is disposed on the base, at least one positioning hole is disposed on the supporting component, and the at least one positioning column is engaged with the at least one positioning hole, so as to locate the supporting component on the base. BSTX According to the disclosure, at least one positioning component is disposed on the supporting component, and the at least one positioning component is for inserting into an opening of the portable electronic device, so as to position the portable electronic device on the supporting component. BSTX According to the disclosure, the testing system further includes a foolproof unit disposed on the supporting component and electrically connected to the control unit, the foolproof unit being for generating a signal as the portable electronic device is disposed on the supporting component to press the foolproof unit, and the control unit being further for controlling the plug testing unit as receiving the signal generated by the foolproof unit. BSTX The testing system of the present invention includes the first driving mechanism, the second driving mechanism, the third driving mechanism and the control unit. As the control unit controls the first driving mechanism to drive the platform to get close to the portable electronic device, and the control unit controls the second driving mechanism and the third driving mechanism to drive the locating component to press the portable electronic device, so that it can test whether the keyboard module, the touch module, the fingerprint identification module, the display module and the image capturing module operate normally. In addition, the testing system further includes the plug testing unit, and the control unit controls the plug testing unit to test whether the sockets of the portable electronic device operate normally. Therefore, the testing system of the present invention can solve the conventional problem that all tests have to be performed by the operator in factory, resulting in wasting a lot of manpower and time. BSTX These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings. DETX BRIEF DESCRIPTION OF THE DRAWINGS DETX FIG. 1 is a functional diagram of a testing system according to an embodiment of the present invention. DETX FIG. 2 is a structural diagram of the testing system according to the embodiment of the present invention. DETX FIG. 3 is a partial diagram of the testing system according to the embodiment of the present invention. DETX FIG. 4 is a diagram illustrating that a roller presses a portable electronic device according to the embodiment of the present invention. DETX FIG. 5 is a diagram of the testing system in another state according to the embodiment of the present invention. DETX FIG. 6 is an enlarged diagram of a fourth driving mechanism and a testing rod according to the embodiment of the present invention. DETX FIG. 7 is a diagram illustrating that the testing rod presses a touchpad according to the embodiment of the present invention. DETX FIG. 8 is a diagram illustrating the testing rod contacts against a fingerprint identification module according to the embodiment of the present invention. DETX FIG. 9 is a diagram of the testing system in another view according to the embodiment of the present invention. DETX FIG. 10 is a side view of the testing system according to the embodiment of the present invention. DETX FIG. 11 is a diagram of a plug testing unit according to the embodiment of the present invention. DETX FIG. 12 is a diagram illustrating that the portable electronic device is disposed on the plug testing unit according to the embodiment of the present invention. DETX FIG. 13 is a diagram of the portable electronic device according to the embodiment of the present invention. DETX FIG. 14 is a diagram of a base of the testing system according to the embodiment of the present invention. DETX DETAILED DESCRIPTION DETX Please refer to FIG. 1 to FIG. 3. FIG. 1 is a functional diagram of a testing system 50 according to an embodiment of the present invention. FIG. 2 is a structural diagram of the testing system 50 according to the embodiment of the present invention. FIG. 3 is a partial diagram of the testing system 50 according to the embodiment of the present invention. The testing system 50 of the present invention is for testing a portable electronic device 51, such as a notebook computer. The testing system 50 includes abase 52, a frame 54, two connecting components 56, a platform 58, a first driving mechanism 60, a second driving mechanism 62, a guiding component 64, a locating component 66, a third driving mechanism 68 and a control unit 70. The base 52 is for supporting the portable electronic device 51, and the frame 54 is installed on the base 52. As shown in FIG. 2, the platform 58 is disposed between the base 52 and the frame 54 and movably installed on the two connecting components 56. As shown in FIG. 3, two guiding tracks 581 and a sliding component 72 are respectively disposed under two sides of the platform 58, and the sliding component 72 is slidably installed on the two guiding tracks 581. The first driving mechanism 60 is connected to the platform 58 for driving the platform 58 to move in a first direction (.+-.X direction) along the two connecting components 56. Each connecting component 56 can be a rod component. The first driving mechanism 60 includes a first driving rod 601 and a first driving component 603. The first driving rod 601 is connected to the platform 58, and the first driving component 603 is installed on the frame 54 and connected to the first driving rod 601. The first driving component 603 is for driving the first driving rod 601 to move in the first direction (.+-.X direction) along the two connecting components 56. In this embodiment, the first driving component 603 can be a cylinder, and the first driving rod 601 can be a cylinder arm, but are not limited to it. DETX As shown in FIG. 3, the second driving mechanism 62 is connected to the sliding component 72, and the second driving mechanism 62 is for driving the sliding component 72 to move in a second direction (.+-.Y direction) along the two guiding tracks 581. The second driving mechanism 62 includes a moving component 621, a second driving rod 623 and a second driving component 625. The moving component 621 is connected to the sliding component 72, so that the moving component 621 can be driven by the sliding component 72 simultaneously to move in the first direction (.+-.X direction) as the sliding component 72 moves in the first direction (.+-.X direction). The second driving rod 623 passes through the moving component 621, and the second driving component 625 is connected to the second driving rod 623. Therefore, the second driving component 625 is for driving the second driving rod 623 to drive the moving component 621 to move in the second direction (.+-.Y direction), so as to drive the sliding component 72 to move in the second direction (.+-.Y direction) along the two guiding tracks 581. Two ends of the guiding component 64 are connected to two ends of the sliding component 72 respectively. The locating component 66 includes a roller 661, and the roller 661 can be made of resilient material. The locating component 66 sheathes the guiding component 64, so that the locating component 66 can move back and forth along the guiding component 64. The third driving mechanism 68 is disposed on the sliding component 72 and connected to the locating component 66. The third driving mechanism 68 is for driving the locating component 66 to move in a third direction (.+-.Z direction) along the guiding component 64. As shown in FIG. 3, the third driving mechanism 68 includes a third driving rod 681 and a third driving component 683. The third driving rod 681 passes through the locating component 66 and is connected to an end of the sliding component 72 which is close to the second driving mechanism 62. The third driving component 683 is connected to the third driving rod 681, and the third driving component 683 is for driving the third driving rod 681 to move the locating component 66 in the third direction (.+-.Z direction) along the guiding component 64. In this embodiment, the second driving component 625 and the third driving component 683 can be motors, respectively, and the second driving rod 623 and the third driving rod 681 can be screws, respectively, but are not limited to it. All mechanisms for driving the moving component 621 and the locating component 66 are within the scope of the present invention. DETX Please refer to FIG. 1 to FIG. 4. FIG. 4 is a diagram illustrating that the roller 661 presses the portable electronic device 51 according to the embodiment of the present invention. As shown in FIG. 1, the first driving component 603, the second driving mechanism 62 and the third driving mechanism 68 are electrically connected to the control unit 70, so that the control unit 70 can control the first driving mechanism 60 to drive the platform 58 to move in the first direction (.+-.X direction), so as to make the roller 661 of the locating component 66 press the portable electronic device 51. As shown in FIG. 4, the roller 661 of the locating component 66 is for pressing a keyboard module of the portable electronic device 51. Then, the control unit 70 is further for controlling the second driving mechanism 62 and the third driving mechanism 68 to drive the locating component 66 to move in the second direction (.+-.Y direction) and in the third direction (.+-.Z direction) on the keyboard module of the portable electronic device 51. That is, the control unit 70 can control the second driving mechanism 62 and the third driving mechanism 68 to move in a predetermined path, so that the roller 661 of the locating component 66 moves in the second direction (.+-.Y direction) and in the third direction (.+-.Z direction) to press all of buttons of the keyboard module once, so as to achieve a purpose of testing whether each button of the keyboard module operates normally. DETX Please refer to FIG. 1 and FIG. 5 to FIG. 6. FIG. 5 is a diagram of the testing system 50 in another state according to the embodiment of the present invention. FIG. 6 is an enlarged diagram of a fourth driving mechanism 74 and a testing rod 76 according to the embodiment of the present invention. In this embodiment, the testing system 50 further includes the fourth driving mechanism 74 and the testing rod 76. The fourth driving mechanism 74 can be a cylinder, such as a tiny moving pen-type cylinder for performing a tiny movement, but is not limited to it. The fourth driving mechanism 74 is installed on the locating component 66 and connected to the testing rod 76. The control unit 70 is further for controlling the fourth driving mechanism 74 to drive the testing rod 76 and for controlling the second driving mechanism 62 and the third driving mechanism 68 to drive the locating component 66, so as to drive the fourth driving mechanism 74 and the testing rod 76, so that the testing rod 76 contacts against a touch module of the portable electronic device 51. As shown in FIG. 1 and FIG. 5, the control unit 70 can control the first driving mechanism 60 to drive the platform 58 to move in the first direction (.+-.X direction), so that the testing rod 76 gets close to the portable electronic device 51. Then, the control unit 70 controls the second driving mechanism 62 and the third driving mechanism 68 to drive the locating component 66, so as to drive the fourth driving mechanism 74 and the testing rod 76 to be aligned to the touch module of the portable electronic device 51. Finally, the control unit 70 controls the fourth driving mechanism 74 to drive the testing rod 76 to press two buttons 511 of the touch module in the first direction (.+-.X direction), so as to achieve a purpose of testing whether two buttons 511 of the touch module operate normally, as shown in FIG. 5. DETX Moreover, the testing rod 76 can be further for testing a touchpad 512 of the touch module of the portable electronic device 51 and a fingerprint identification module 513 of the portable electronic device 51. Please refer to FIG. 7 and FIG. 8 with other figures. FIG. 7 is a diagram illustrating that the testing rod 76 presses the touchpad 512 according to the embodiment of the present invention. FIG. 8 is a diagram illustrating the testing rod 76 contacts against the fingerprint identification module 513 according to the embodiment of the present invention. As shown in FIG. 7, the testing rod 76 is made of conductive material, so that the testing rod 76 can be simulated as a human's fingerprint to touch the touchpad 512, so as to achieve a purpose of testing whether the touchpad 512 operates normally. After the control unit 70 controls the fourth driving mechanism 74 to drive the testing rod 76 to touch the touchpad 512, the control unit 70 can control the second driving mechanism 62 and the third driving mechanism 68, so that the testing rod 76 moves from an upper left corner to a lower right corner, and then moves from the lower right corner to an upper right corner. Finally, the testing rod 76 moves from the upper right corner to a lower left corner, so as to ensure that a touch function can operate normally in all positions of the touchpad 512. As shown in FIG. 8, the testing rod 76 is further for testing the fingerprint identification module 513 of the portable electronic device 51. In this embodiment, an end of the testing rod 76 for contacting against the touch module is made of conductive material with a print. Therefore, the testing rod 76 with the print can be simulated as the human's fingerprint. The control unit 70 is further for controlling the fourth driving mechanism 74 to drive the testing rod 76, so that the end of the testing rod 76 contacts against the fingerprint identification module 513 of the portable electronic device 51, so as to achieve a purpose of testing whether the fingerprint identification module 513 operates normally. DETX Please refer to FIG. 9. FIG. 9 is a diagram of the testing system 50 in another view according to the embodiment of the present invention. The testing system 50 can further include a distance sensing unit 78 electrically connected to the control unit 70. The distance sensing unit 78 is disposed on an end of the platform 58 nearby the portable electronic device 51 for sensing a distance between a display module 514 of the portable electronic device 51 and the end of the platform 58, and the control unit 70 is further for controlling the operation of the testing system 50 according to a sensing result of the distance sensing unit. In a procedure of controlling the first driving mechanism 60 to drive the platform 58 to move in the first direction (.+-.X direction) by the control unit 70, the control unit 70 further controls the distance sensing unit 78 to sense the distance between the display module 514 and the end of the platform 58. As the sensed distance between the display module 514 and the end of the platform 58 is less than a predetermined distance, the control unit 70 stops the operation of the first driving mechanism 60 accordingly, so as to prevent the platform 58 from colliding the display module 514 of the portable electronic device 51. In this embodiment, the distance sensing unit 78 can be an ultrasound sensing device, but is not limited to it. All devices capable of sensing the distance are within the scope of the present invention. For example, the distance sensing unit 78 also can be a laser sensing device. DETX Please refer to FIG. 10. FIG. 10 is a side view of the testing system 50 according to the embodiment of the present invention. The testing system 50 can further include a fixing frame 80 and a reflecting component 82. As shown in FIG. 10, the fixing frame 80 is connected to an end of the platform 58. The reflecting component 82 is disposed on the fixing frame 80, and the reflecting component 82 is for reflecting an image displayed on the display module 514 of the portable electronic device 51, so that an image capturing module 515 of the portable electronic device 51 captures the image reflected by the reflecting component 82, so as to determine whether the display module 514 and the image capturing module 515 operate normally according to the image reflected by the reflecting component 82 and captured by the image capturing module 515. For example, it can analyze whether the image captured by the image capturing module 515 is abnormal by the software embedded in the portable electronic device 51, so as to test whether the image capturing module 515 captures the image correctly and whether the display module 514 displays the image normally. DETX Please refer to FIG. 2 and FIG. 11 to FIG. 14. FIG. 11 is a diagram of a plug testing unit 84 according to the embodiment of the present invention. FIG. 12 is a diagram illustrating that the portable electronic device 51 is disposed on the plug testing unit 84 according to the embodiment of the present invention. FIG. 13 is a diagram of the portable electronic device 51 according to the embodiment of the present invention. FIG. 14 is a diagram of the base 52 of the testing system 50 according to the embodiment of the present invention. The plug testing unit 84 is electrically connected to the control unit 70, and the plug testing unit 84 includes a supporting component 86 and at least one plug module 88. As shown in FIG. 11, the testing system 50 of the present invention includes two plug modules 88. Amounts and positions of the plug module 88 are not limited to this embodiment, and it depends on practical design demands. As shown in FIG. 2 and FIG. 12, the supporting component 86 is disposed on the base 52 for supporting the portable electronic device 51, and the plug module 88 is disposed on the supporting component 86. The plug module 88 is aligned to a socket 516 of the portable electronic device 51 corresponding to the plug module 88, and the control unit 70 is further for controlling the plug module 88 to insert into or unplug from the socket 516, so as to test whether the socket 516 functions normally. As shown in FIG. 11 and FIG. 12, the plug module 88 includes at least one plug component 881, a pushing component 882, two guiding blocks 883 and a cylinder 884. The at least one plug component 881 is for inserting into the socket 516. In this embodiment, the plug module 88 can include two plug components 881. The pushing component 882 is connected to the two plug components 881, and the two guiding blocks 883 is for guiding movement of the pushing component 882. The cylinder 884 is connected to the pushing component 882, and the control unit 70 is further for controlling the cylinder 884 to drive the pushing component 882 to drive the plug component 881 to insert into the socket 516 of the portable electronic device 51 corresponding to the plug module 88. The control unit 70 can control the plug module 88 to insert into or unplug from the socket 516, so as to test whether the socket 516 functions normally. DETX Please refer to FIG. 11 and FIG. 14. In this embodiment, at least one positioning column 521 is disposed on the base 52, and at least one positioning hole 861 is disposed on the supporting component 86. The at least one positioning column 521 is engaged with the at least one positioning hole 861, so as to locate the supporting component 86 on the base 52. In this embodiment, four positioning columns 521 are disposed on the base 52, and four positioning holes 861 are disposed on the supporting component 86. Amounts and positions of the positioning column 521 and the positioning hole 861 are not limited to this embodiment, and it depends on practical design demands. Moreover, please refer to FIG. 1, FIG. 11 and FIG. 13. At least one positioning component 862 is disposed on the supporting component 86 for inserting into an opening 517 of the portable electronic device 51, so as to position the portable electronic device 51 on the supporting component 86 stably. In this embodiment, four positioning components 862 are disposed on the supporting component 86, and four openings 517 are disposed on the portable electronic device 51. Amounts and positions of the positioning component 862 and the opening 517 are not limited to this embodiment, and it depends on practical design demands. DETX Furthermore, as shown in FIG. 11 and FIG. 12, the testing system 50 of the present invention further includes a foolproof unit 90 disposed on the supporting component 86 and electrically connected to the control unit 70. The foolproof unit 90 is for generating a signal as the portable electronic device 51 is disposed on the supporting component 86 to press the foolproof unit 90, and the control unit 70 is further for controlling the plug testing unit 84 as receiving the signal generated by the foolproof unit 90. In this embodiment, the testing system 50 of the present invention includes two foolproof units 90, but is not limited to it. As the portable electronic device 51 is disposed on the supporting component 86 correctly and is perpendicular to the supporting component 86 exactly, the two foolproof units 90 are activated to generate the signal to the control unit 70. At this time, the control unit 70 can determine that the portable electronic device 51 is positioned on the supporting component 86 exactly, and then the control unit 70 controls the plug module 88 to perform the testing operation. However, as the portable electronic device 51 is disposed on the supporting component 86, but the portable electronic device 51 does not contact the two foolproof units 90 at the same time, it means that the portable electronic device 51 is not disposed on the portable electronic device 51 correctly. Therefore, the control unit 70 does not control the plug module 88 to perform the testing operation, so that it can prevent the plug module 88 from scratching the appearance of the portable electronic device 51. DETX In contrast to the prior art, the testing system of the present invention includes the first driving mechanism, the second driving mechanism, the third driving mechanism and the control unit. As the control unit controls the first driving mechanism to drive the platform to get close to the portable electronic device, and the control unit controls the second driving mechanism and the third driving mechanism to drive the locating component to press the portable electronic device, so that it can test whether the keyboard module, the touch module, the fingerprint identification module, the display module and the image capturing module operate normally. In addition, the testing system further includes the plug testing unit, and the control unit controls the plug testing unit to test whether the sockets of the portable electronic device operate normally. Therefore, the testing system of the present invention can solve the conventional problem that all tests have to be performed by the operator in factory, resulting in wasting a lot of manpower and time. DETX Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims. CLST What is claimed is: CLPR 1. A testing system for testing a portable electronic device, comprising: a base for supporting the portable electronic device; a frame installed on the base; two connecting components; a platform disposed between the base and the frame and movably installed on the two connecting components, two guiding tracks and a sliding component being respectively disposed under two sides of the platform, and the sliding component being slidably installed on the two guiding tracks; a first driving mechanism connected to the platform for driving the platform to move in a first direction along the two connecting components; a second driving mechanism connected to the sliding component, the second driving mechanism being for driving the sliding component to move in a second direction along the two guiding tracks; a guiding component, two ends of the guiding component being connected to two ends of the sliding component respectively; a locating component sheathing the guiding component, the locating component comprising a roller; a third driving mechanism disposed on the sliding component and connected to the locating component, the third driving mechanism being for driving the locating component to move in a third direction along the guiding component; and a control unit for controlling the first driving mechanism to drive the platform to move in the first direction, so that the roller of the locating component presses the portable electronic device, and the control unit being further for controlling the second driving mechanism and the third driving mechanism to drive the locating component to move in the second direction and the third direction. CLPR 2. The testing system of claim 1, wherein the first driving mechanism comprises: a first driving rod connected to the platform; and a first driving component installed on the frame and connected to the first driving rod, the first driving component being for driving the first driving rod to move the platform in the first direction along the two connecting components. CLPR 3. The testing system of claim 2, wherein the second driving mechanism comprises: a moving component connected to the sliding component; a second driving rod passing through the moving component; and a second driving component connected to the second driving rod, the second driving component being for driving the second driving rod to move the moving component in the second direction, so as to drive the sliding component to move in the second direction along the two guiding tracks. CLPR 4. The testing system of claim 3, wherein the third driving mechanism further comprises: a third driving rod passing through the locating component and connected to the sliding component; and a third driving component connected to the third driving rod, the third driving component being for driving the third driving rod to move the locating component in the third direction along the guiding component. CLPR 5. The testing system of claim 4, wherein the first driving component is a cylinder, and the second driving component and the third driving component are motors, respectively. CLPR 6. The testing system of claim 1, further comprising: a testing rod; and a fourth driving mechanism installed on the locating component and connected to the testing rod, and the control unit being further for controlling the fourth driving mechanism to drive the testing rod and controlling the second driving mechanism and the third driving mechanism to drive the locating component, so as to drive the fourth driving mechanism and the testing rod, so that the testing rod contacts against a touch module of the portable electronic device. CLPR 7. The testing system of claim 6, wherein an end of the testing rod for contacting against the touch module is made of conductive material with a print, and the control unit is further for controlling the fourth driving mechanism to drive the testing rod, so that the end of the testing rod contacts against a fingerprint identification module of the portable electronic device. CLPR 8. The testing system of claim 6, wherein the fourth driving mechanism is a cylinder. CLPR 9. The testing system of claim 1, wherein the roller is made of resilient material. CLPR 10. The testing system of claim 1, further comprises a distance sensing unit electrically connected to the control unit and disposed on an end of the platform nearby the portable electronic device for sensing a distance between a display module of the portable electronic device and the end of the platform, and the control unit being further for controlling operation of the testing system according to a sensing result of the distance sensing unit. CLPR 11. The testing system of claim 10, wherein the distance sensing unit is an ultrasound sensing device. CLPR 12. The testing system of claim 1, further comprising: a fixing frame connected to an end of the platform; and a reflecting component disposed on the fixing frame, and the reflecting component being for reflecting an image displayed on a display module of the portable electronic device, so that an image capturing module of the portable electronic device captures the image reflected by the reflecting component, so as to determine whether the display module and the image capturing module operate normally according to the image reflected by the reflecting component and captured by the image capturing module. CLPR 13. The testing system of claim 1, further comprising a plug testing unit electrically connected to the control unit, and the plug testing unit comprising: a supporting component disposed on the base for supporting the portable electronic device; and a plug module disposed on the supporting component, the plug module being aligned to a socket of the portable electronic device, and the control unit being further for controlling the plug module to insert into or unplug from the socket. CLPR 14. The testing system of claim 13, wherein the plug module comprises: a plug component for inserting into the socket; a pushing component connected the plug component; two guiding blocks for guiding movement of the pushing component; and a cylinder connected to the pushing component, and the control unit being further for controlling the cylinder to drive the pushing component to drive the plug component to insert into the socket of the portable electronic device. CLPR 15. The testing system of claim 13, wherein at least one positioning column is disposed on the base, at least one positioning hole is disposed on the supporting component, and the at least one positioning column is engaged with the at least one positioning hole, so as to locate the supporting component on the base. CLPR 16. The testing system of claim 13, wherein at least one positioning component is disposed on the supporting component, and the at least one positioning component is for inserting into an opening of the portable electronic device, so as to position the portable electronic device on the supporting component. CLPR 17. The testing system of claim 13, further comprising a foolproof unit disposed on the supporting component and electrically connected to the control unit, the foolproof unit being for generating a signal as the portable electronic device is disposed on the supporting component to press the foolproof unit, and the control unit being further for controlling the plug testing unit as receiving the signal generated by the foolproof unit. ICUS Y DSRC US 09204585 B2 20151201 14148417 60307 Configurations of apertures in a miniature electronic component carrier mask *** BRS DOCUMENT BOUNDARY *** WKU 09204585 SIZE 60560 DWKU 9204585 APT B2 DID US 9204585 B2 GISD 20151201 ARD 148417 AFD 20140106 APY 2014 SRC 14 APNR 14148417 APP 14/148417 TRX 103 IPCG 20060101 A B65D B65D85/00 F I B US H 20151201 IPCC B65D IPCP B65D85/00 20060101 B65D085/00 IPCG 20060101 A H05K H05K13/00 L I B US H 20151201 IPCC H05K IPCS H05K13/00 20060101 H05K013/00 CLOI H05K CPOI H05K13/0084 20130101 CPOG H H05K H05K13/0084 20130101 F I 20151201 US CLOA Y10T CPOA Y10T29/49121 20150115 CPOG Y Y10T Y10T29/49121 20150115 L A 20151201 US TTL Configurations of apertures in a miniature electronic component carrier mask URPN 4099615 URNM Lemke et al. URPD 19780700 URCL 206/716 URGP US 4099615 A 19780700 Lemke et al. 206/716 cited by examiner URPN 5007534 URNM Tamaki et al. URPD 19910400 URCL 206/722 URGP US 5007534 A 19910400 Tamaki et al. 206/722 cited by examiner URPN 5226382 URNM Braden URPD 19930700 URCL 118/406 URGP US 5226382 A 19930700 Braden 118/406 cited by examiner URPN 5996985 URNM Balz et al. URPD 19991200 URCL 269/48.1 URGP US 5996985 A 19991200 Balz et al. 269/48.1 cited by examiner URPN 6216419 URNM Sakurai URPD 20010400 URCL 206/713 URGP US 6216419 B1 20010400 Sakurai 206/713 cited by examiner URPN 6442825 URNM Pomerantz URPD 20020900 URCL 29/558 URGP US 6442825 B1 20020900 Pomerantz 29/558 cited by examiner URPN 6919532 URNM Swenson et al. URPD 20050700 URCL 219/121.69 URGP US 6919532 B2 20050700 Swenson et al. 219/121.69 cited by examiner URPN 7243776 URNM Whiteman et al. URPD 20070700 URCL 198/345.3 URGP US 7243776 B2 20070700 Whiteman et al. 198/345.3 cited by examiner URPN 2002/0017240 URNM Obana et al. URPD 20020200 URCL 118/712 URGP US 2002/0017240 A1 20020200 Obana et al. 118/712 cited by examiner URPN 2004/0011700 URNM Brahmbhatt et al. URPD 20040100 URCL 206/713 URGP US 2004/0011700 A1 20040100 Brahmbhatt et al. 206/713 cited by examiner URPN 2004/0094450 URNM Whiteman et al. URPD 20040500 URCL 206/701 URGP US 2004/0094450 A1 20040500 Whiteman et al. 206/701 cited by examiner NCL 20 ECL 1 CIFS 206/716 CIFS 206/713 CIFS 206/330 CIFS 206/460 CIFS 206/320 CIFS 206/206 CIFS 206/231 CIFS 206/338 FSCP H05K 13/0084 FSCL H05K FSCP Y10T 29/49121 FSCL Y10T CFSC 206 CFSS 716;713;330;460;320;206;231;338 NDR 8 NFG 18 COND continuation parent-doc US 13624697 20120921 US 8622218 child-doc US 14148417 RLPY US RLAN 13624697 RLFD 20120921 RLPY US RLPN 8622218 RLCY US RLCN 14148417 COND division parent-doc US 11090958 20050325 ABANDONED child-doc US 13624697 RLPY US RLAN 11090958 RLFD 20050325 RLPC ABANDONED RLCY US RLCN 13624697 PDID US 20140116922 A1 PPCC US PPNR 20140116922 PPKC A1 PPPD 20140501 AANM Electro Scientific Industries, Inc. AACI Portland AAST OR AAZP N/A AACO US AATX N/A AAGP Electro Scientific Industries, Inc. Portland OR US INNM Saunders; William J. INSA N/A INCI Tigard INST OR INZP N/A INCO US INTX N/A INGP Saunders; William J. Tigard OR US INNM Garcia; Douglas J. INSA N/A INCI Beaverton INST OR INZP N/A INCO US INTX N/A INGP Garcia; Douglas J. Beaverton OR US INNM Tubbs; Nick A. INSA N/A INCI Beaverton INST OR INZP N/A INCO US INTX N/A INGP Tubbs; Nick A. Beaverton OR US INNM Boe; Gerald F. INSA N/A INCI Newberg INST OR INZP N/A INCO US INTX N/A INGP Boe; Gerald F. Newberg OR US LRFM Stoel Rives LLP ASNM Electro Scientific Industries, Inc. ASTC 02 ASCI Portland ASST OR ASZP N/A ASCO US ASTX N/A ASGP Electro Scientific Industries, Inc. Portland OR US 02 ART 3728 EXP Cheung; Chun ABPR A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture. CRTX RELATED APPLICATIONS CRTX This is a continuation of U.S. patent application Ser. No. 13/624,697, filed Sep. 21, 2012, now U.S. Pat. No. 8,622,218, which is a division of U.S. patent application Ser. No. 11/090,958, filed Mar. 25, 2005, abandoned. BSTX COPYRIGHT NOTICE BSTX .COPYRGT. 2014 Electro Scientific Industries, Inc. A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever. 37 CFR .sctn.1.71(d). BSTX TECHNICAL FIELD BSTX This disclosure relates to a carrier for miniature components and, in particular, to a miniature component carrier having dimensionally precise slots shaped to grip the corners of a miniature electronic component and hold it in a controlled orientation without damaging the electrically conductive portions of the electronic component. BSTX BACKGROUND INFORMATION BSTX Computers and other electronic equipment are becoming more powerful and can perform a wider range of tasks. These increases in power and applicability result at least in part from an increase in the number of miniature electronic components included in each computer or other piece of electronic equipment. To help minimize the sizes of the computers and other electronic equipment and to facilitate their operation at higher speeds, electronic circuits used in computers and other electronic equipment include miniature electronic components positioned in high density packing arrangements. BSTX One such miniature electronic component, a solid state capacitor, is a tiny rectangular "chip" that is smaller than a grain of rice. FIG. 1 shows a capacitor chip 10 that has a solid enclosed body 12 of square or rectangular cross section and made of ceramic or other dielectric material. Body 12 includes opposed upper and lower surfaces 14 and 16 spaced apart by a body thickness 18 and bound by opposed side wall surfaces 22 and 24 and opposed end wall surfaces 26 and 28. The linear region along which two edges of any of the surfaces (e.g., upper, lower, side wall, or end wall surfaces) meet and form an angle is called a corner region 32. Capacitor chip 10 includes multiple linear corner regions 32, such as, for example, (1) corner regions 32 defined by the intersection of an edge of upper surface 14 with an edge of one of side wall surfaces 22 and 24 or one of end wall surfaces 26 and 28, (2) corner regions 32 defined by the intersection of an edge of lower surface 16 with an edge of one of side wall surfaces 22 and 24 or one of end wall surfaces 26 and 28, and (3) corner regions 32 defined by the intersection of an edge of one of side wall surfaces 22 and 24 with an edge of one of end wall surfaces 26 and 28. Linear corner regions 32 may also include the point at which three edges meet, such as, for example, the point at which an edge of upper surface 14 meets with an edge of each of side wall surface 22 and end wall surface 26. BSTX Capacitor chip 10 contains within body thickness 18 multiple spaced-apart metal plates (not shown). One terminal end of each of alternate metal plates is connected to the exterior of body 12 and is adapted by a metallizing process to form a pair of spaced-apart mutually opposed electronic contact surfaces or ends 36. One or more of contact surfaces 36 of capacitor chip 10 are striped with a solderable paste that is dried and then fired to produce surfaces that can later be soldered directly onto a circuit board. This process is commonly referred to as "termination." U.S. Pat. No. 5,226,382 describes a machine for placing a stripe or trace of solderable paste on the contact surfaces of a chip and drying the paste so that the paste can later be fired. This machine uses a metal carrier belt or tape in which slotted rubber masks are formed. Apertures in the masks receive chips in position for processing, such as covering opposed ends of the chips with solderable paste. BSTX A relatively new miniature electronic component, an integrated passive component (IPC) or array chip, is composed of multiple circuit components fit into a single array chip that is simultaneously solderable to one of a number of different electronic circuits. This device is called an "array chip" because it comprises a plurality or an array of circuit components, such as four or five separate capacitors stacked together in a single chip. U.S. Pat. No. 5,863,331 describes a machine for placing stripes of solderable paste on the contact surfaces of a chip array. BSTX FIG. 2A shows a typical array chip 40 with its side wall surfaces 22 and 24 covered with stripes 42 of solderable paste. Optionally, end wall surfaces 26 and 28 may be covered with stripes 42 of solderable paste (not shown). Array chip 40 has overall dimensions such as 3.2 mm (0.125 in) long and 1.5 mm (0.060 in) wide upper and lower surfaces 14 and 16; 1.5 mm (0.060 in) wide and 0.8 mm (0.031 in) high opposed end wall surfaces 26 and 28; and 0.8 mm (0.031 in) high and 3.2 mm (0.125 in) long opposed side wall surfaces 22 and 24. Where both end wall surfaces and side wall surfaces include stripes 42 of solderable paste, formation of stripes 42 on end wall surfaces 26 and 28 may occur before or after formation of stripes 42 on side wall surfaces 22 and 24. BSTX FIG. 2B shows that installing array chip 40 into an electronic circuit entails placing separate solderable paste stripes 42 along opposite wall surfaces, such as side wall surfaces 22 and 24 (as shown) or end wall surfaces 26 and 28 (not shown), and soldering paste stripes 42 to copper traces 44 formed on a circuit board 46. The width of each stripe 42 is typically set at 0.38.+-.0.18 mm (0.015.+-.0.007 in), with a 0.3.+-.0.18 mm (0.012.+-.0.007 in) turn-down edge at the end of each stripe 42 along the adjacent wall as shown on respective upper and lower surfaces 14 and 16 in FIG. 2A. As with other electronic components, after the paste is applied, it is subjected to a heat-drying cycle to set the paste and thereafter to a firing cycle to fuse the paste on array chip 40. BSTX The small size of an array chip and the small differences between its width and height dimensions raise the importance of handling the array chip and its insertion into the mask of a carrier belt or tape. The multiple stripes are placed on only the appropriate circuit board surfaces, and their placement is accomplished with extreme accuracy. Splashing of the paste onto other surfaces of the array chip would provide a site for a short circuit and thereby significantly degrade electronic equipment function. Accordingly, a feed device places the array chip onto the carrier belt in a correct position and location, and the array chip is handled correctly so that the appropriate surface is exposed in proper orientation to receive the paste stripes within a specified accuracy. BSTX Typically, miniature component carriers that transport miniature electronic components and present them for processing include an endless belt or tape that carries multiple miniature electronic components, such as capacitor chips 10 and array chips 40. The endless tape is formed with a plurality of transversely oriented, elongated apertures arranged centrally between and uniformly spaced apart along the marginal edges of the tape. Each of the apertures is adapted to receive in coplanar fixed registration a thin, resilient mask having at least one aperture, and preferably multiple apertures, of a size and shape to compliantly receive and hold the miniature components in a specific orientation so that the surfaces intended for termination extend outwardly from the mask. The term "mask" is used in the art to define an element made of silicone rubber, or other resilient material, that surrounds and partly encloses an electronic component during some stage of its fabrication process. The purpose of a mask is to provide a generally elongated, resilient-walled holder in which an electronic component may be temporarily held during the process of metallizing its opposite ends. BSTX FIG. 3 shows an exemplary endless belt-type component carrier having a flexible metal tape 50 formed of stainless steel or other high-strength metal. Tape 50 is approximately 0.13 mm (0.005 in) thick and about 5.1 cm (2.0 in) wide and is of an "endless" variety in that it has no beginning or end but is maneuvered about a series of pulleys and sprocket wheels between various processing stations, as is described in U.S. Pat. No. 5,226,382. Tape 50 is defined by multiple spaced-apart, mutually parallel side margins 52 and 54 and includes a series of pilot or sprocket holes 56 that serve as drive perforations to receive drive stubs of drive sprocket wheels (not shown). Sprocket holes 56 are disposed adjacent to at least one and preferably both of side margins 52 and 54 and are uniformly spaced along the length of tape 50. BSTX As shown in FIGS. 3-6, tape 50 is formed with a variety of first apertures 60 of different shape and size into which a thin, resilient mask 66 can be inserted. Each of first apertures 60 is adapted to receive in coplanar fixed registration mask 66, which includes one or more second apertures 74 and preferably a series of second apertures 74 of sizes and shapes to compliantly receive multiple electronic components in specific orientation so that their end surfaces intended for termination extend outwardly from mask 66. BSTX First apertures 60 are preferably formed in discrete patterns and are preferably spaced centrally between and uniformly along the marginal edges of tape 50. First apertures 60 are typically a series of closely spaced round openings as shown in FIG. 3, a series of elongated rectangular openings as shown in the end portions of FIG. 4, or a series of elongated openings in repeated patterns in a side-by-side arrangement as shown in the center portion of FIG. 4. In a configuration of other than round holes, first apertures 60 are generally defined by a pair of spaced-apart, elongated side edges 62 bound by a pair of short-end edges 64. Each of first apertures 60 receives a mask 66 that is of a size and shape to remain fixed to tape 50 and to carry multiple electronic components. BSTX Mask 66 is preferably formed of silicone rubber, but may be formed of any conventional elastomeric material having sufficient elasticity to receive and grip a miniature component in a controlled orientation. FIGS. 7A and 7B show that mask 66 is defined by a pair of spaced-apart top and bottom exterior surfaces 70 and 72 that, when mask 66 is fixed in place on tape 50, lie coplanar with and, respectively, above and below the surfaces of tape 50. In its simplest form, shown in FIG. 3, each mask 66 is cast in place about a first aperture 60 so that a plurality of masks 66 may be arranged in a pattern parallel or transverse to the longitudinal axis of tape 50. One or more second apertures 74 of a size smaller than that of first aperture 60 are formed in each mask 66 to keep the metal core of tape 50 out of contact with the electronic component. The size of second apertures 74 is slightly smaller than that of the electronic component in at least one direction so that the electronic component can be positionally accepted and resistively grasped during advancement of the electronic component from one processing stage to another. Mask 66 is defined by, in addition to respective top and bottom surfaces 70 and 72, a pair of opposed elongated slots 76 positioned intermediate of respective top and bottom surfaces 70 and 72 for receipt of elongated side edges 62 of first aperture 60 formed in tape 50. The length of removable mask 66 is less than the width of tape 50 and is preferably less than the distance between adjacent sprocket holes 56. BSTX FIGS. 8A and 8B are, respectively, plan and enlarged fragmentary views of an alternative component carrier tape 50' that is similar to tape 50, with the exception that silicone rubber masks 66' molded into or coated over first apertures 60' are of generally rectangular shape with curved ends in a core portion. Second apertures 74' are formed in a single row in each mask 66' along the width of carrier tape 50'. BSTX FIGS. 7A, 7B, and 9 show masks 66 having second apertures 74 of different geometries. Mask 66 of FIG. 7A includes a series of closely spaced second apertures 74 of round shape. These second apertures 74 include a single, closed curvilinear side margin 78. BSTX Mask 66 of FIG. 7B includes two second apertures 74 of "sawtooth" shape, each of which is capable of holding multiple electronic components. Each sawtooth-shaped second aperture 74 is an elongated aperture having multiple side margins 78 that form multiple resilient teeth 82 that extend into second aperture 74, as is more fully described in U.S. Pat. No. 5,226,382. The arrangement of side margins 78 of sawtooth-shaped second aperture 74 forms multiple individual openings 80, each of which is capable of holding a single electronic component. BSTX Mask 66 of FIG. 9 includes multiple second apertures 74 of a "dog bone" or "bow tie" shape and including opposed side margins 88 separated along their lengths by longer distances at opposite ends 90 and by a shorter distance at a medial location 92 between ends 90. In a preferred embodiment, the slot distances become gradually smaller from opposite ends 90 to medial location 92. BSTX An array electronic component is held in the second aperture under compression by an interference fit. For example, a 0.05 mm (0.002 in) desired interference fit nominally requires a .+-.0.025 mm (.+-.0.001 in) second aperture tolerance range, and a 0.51 mm (0.02 in) thick array electronic component typically requires a 0.43-0.48 mm (0.017-0.019 in) second aperture. A less than -0.025 mm (-0.001 in) second aperture width tolerance results in a second aperture that is too tight, causing the silicone rubber nubs of the second aperture to deflect (rather than compress) and thereby cant the array electronic component held in the second aperture. A second aperture opening width of greater than 0.025 mm (0.001 in) lets the component fall out of the belt. BSTX When loaded, individual electronic components must be centered in two directions (horizontally and vertically) within a second aperture. Currently available loading techniques require two processing steps to correctly position an electronic component within each second aperture. First, an electronic component is loaded into a second aperture such that the electronic component is centered in only one direction, typically horizontally. Second, the electronic component is centered between the top and bottom exterior surfaces of the mask. Exemplary secondary operations include, for example, (1) exposing the electronic component to a high-pressure gust of air that forces the electronic component into the desired alignment and (2) mechanically pushing the electronic component into the desired alignment, as described in U.S. Pat. Nos. 5,863,331 and 5,226,382. Both of these exemplary secondary operations involve contact with the loaded electronic component. Further, because of the tight fit of the electronic component in the second aperture, a significant amount of force is required to center the electronic component. Consequently, the secondary operation often results in mechanical damage to the loaded component. Further, the secondary operation is an additional processing step that requires the use of additional machinery and increases processing time for each electronic component. BSTX Also, some of the prior art second aperture geometries, e.g., the sawtooth formation shown in FIG. 7B, do not consistently hold electronic components in the desired orientation, causing them to move during processing and thereby reducing the overall yield of usable electronic components. With specific reference to the sawtooth formation shown in FIG. 7B, this is so because each of the individual openings that comprise the elongated second aperture have incongruous side margins and thus lack sufficient aperture side margin grip to tightly and securely hold multiple electronic components. BSTX Additionally, because the second apertures are shaped such that the sides of the electronic component tightly contact the side margins of the second aperture, the electrically conductive portions of the electronic components can be damaged during processing. Further, removing the terminated electronic components from the second apertures as shown in U.S. Pat. No. 5,863,331 requires a significant amount of force because of the tight fit necessary to hold the electronic component in the desired orientation during processing. This force can mechanically damage the terminated electronic component, thereby reducing the overall yield of usable electronic components. Further, during the receipt, gripping, positioning, and ejection processes, the terminated electronic component may be subject to smearing of the conductive stripes 42 as the electronic components slide along the side margins of the second aperture, which degrades the finished component's performance. BSTX In the case of using a round second aperture 74, as shown in FIG. 7A, the side margins of the second aperture tightly contact the side and end wall surfaces of the electronic component, and any previously formed electrically conductive stripes on the electronic components can be damaged during receipt of the electronic component into the second aperture. Further, the method of removing the terminated electronic components from the second apertures described in U.S. Pat. No. 5,863,331 requires a significant amount of force because of the tight fit necessary to hold the electronic component in the desired orientation during processing. Application of this force can result in mechanical damage to the terminated electronic component, thereby reducing the overall yield of usable electronic components. Further, the terminated electronic component may be subject to smearing of the conductive stripes as they slide along the side margins of the second aperture. BSTX What is needed, therefore, is a mask including miniature component apertures capable of receiving in a single step miniature electronic components and of gripping them in a controlled orientation during termination of the ends of the electronic components without damaging their electrically conductive portions. BSTX SUMMARY OF THE DISCLOSURE BSTX A miniature electronic component carrier capable of receiving and holding multiple miniature components includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which has a periphery that is sized and shaped to compliantly receive and grip a miniature electronic component in a controlled orientation during termination processing. This controlled orientation ensures that the electronic component surfaces intended for termination (e.g., the upper and lower surfaces of a chip capacitor and the side wall surfaces of a chip array) extend outwardly from the mask. In some embodiments, the apertures have peripheries that form rhomboidal or elliptical apertures. The shapes of the peripheries of these apertures facilitate placement of a miniature electronic component in each aperture such that component holding regions of the periphery of the aperture contact and grip primarily the corner regions of the miniature electronic component. The shapes and sizes of the peripheries of the multiple spaced-apart apertures confine gripped electronic components by contact within an operational tolerance with any one of the side and end wall surfaces of the electronic components to prevent mechanical damage to the side and end wall surfaces resulting from their contact with the peripheries during receipt, gripping, positioning, and ejection of the miniature electronic components. BSTX Some embodiments of the miniature electronic component carrier may also include one or more relief openings that extend from or are adjacent to the apertures. The relief openings facilitate temporary deformation of the resilient mask during receipt and gripping of a miniature electronic component. One exemplary type of relief opening is a slot that extends outwardly from a vertex of a rhomboidal aperture. Another exemplary type of relief opening includes one or more relief opening side margins that form a square, rectangular, circular, triangular, elliptical, trapezoidal, curved, or semicircular relief opening. This type of relief opening is positioned adjacent to a side margin of a rhomboidal or elliptical aperture. BSTX Additional aspects and advantages will be apparent from the following detailed description of preferred embodiments, which proceeds with reference to the accompanying drawings. DETX BRIEF DESCRIPTION OF THE DRAWINGS DETX FIG. 1 is an enlarged isometric pictorial view of a capacitor chip. DETX FIG. 2A is an enlarged isometric pictorial view of a typical integrated passive component or array chip coated with solderable paste. DETX FIG. 2B is an enlarged isometric pictorial view of the array chip of FIG. 2A mounted on a surface of a circuit board. DETX FIG. 3 is a fragmentary top plan view of a component carrier tape in which a series of apertures carries masks that hold electronic components. DETX FIG. 4 is a fragmentary plan view showing a carrier tape having a variety of different apertures. DETX FIG. 5 is a fragmentary isometric view of a carrier tape carrying masks that are formed over the apertures. DETX FIG. 6 is a sectional view of the carrier tape and masks taken along lines 6-6 in FIG. 5. DETX FIGS. 7A and 7B are fragmentary isometric views of two exemplary patterns of apertures formed through the masks of FIG. 6 for carrying electronic components. DETX FIG. 8A is a plan view of an alternative type of carrier tape to that of the carrier tape of FIG. 3, and FIG. 8B is an enlarged fragmentary view of the component-holding apertures in the mask strips of the carrier tape of FIG. 8A. DETX FIG. 9 is a diagram of a mask in which apertures of a dog bone or bow tie shape are cut. DETX FIG. 10 is a plan view of a carrier tape that includes a mask in which multiple apertures of varying geometries have been formed. DETX FIGS. 11 and 12 are enlarged plan views of rectangular electronic components seated within, respectively, the rhomboidal and elliptical apertures shown at opposite ends of the carrier tape of FIG. 10. DETX FIGS. 13A and 13B are enlarged fragmentary plan views of a carrier tape including a mask in which multiple apertures and relief openings of varying geometries have been formed. DETX FIG. 14 is a plan view of a carrier tape that includes a transparent mask, each of the carrier tape and the transparent mask having multiple apertures formed in them. DETX DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS DETX When used in reference to a mask, the term "apertures" refers to the above-described second apertures. Preferred embodiments of a miniature component carrier include a thin, resilient mask through which are formed multiple spaced-apart apertures each of which has a periphery that is sized and shaped to compliantly receive and grip the corner regions of a miniature electronic component. Gripping the corner region limits contact between component holding regions of the periphery of each aperture and the side and end wall surfaces of each gripped electronic component. Limiting such contact reduces mechanical damage to the side and end wall surfaces resulting from their contact with the periphery during receipt, gripping, positioning, and ejection of the miniature component. The shape and size of each aperture also ensure that the electronic component gripped and held by the aperture maintains a controlled orientation during termination processing. This controlled orientation ensures that the surfaces intended for termination (i.e., the upper and lower surfaces of a capacitor chip and the side wall surfaces of an array chip) extend outwardly from the mask. Exemplary aperture shapes that facilitate receipt and grip of the corner regions of a miniature electronic component include substantially rhomboidal and elliptical apertures. DETX FIG. 10 shows a mask 100 that includes multiple apertures of various geometries. Skilled persons will recognize that, in practice, masks for use in miniature component carriers typically include multiple apertures having a single geometry. The depiction in FIG. 10 of a carrier tape having apertures of various geometries is meant to show some exemplary embodiments of apertures that may be formed in mask 100. DETX A leftmost aperture 104.sub.1 in mask 100 has four linear side margins 102 that form a rhomboidal aperture 104 having four vertices 105. The term "rhomboidal" refers to a parallelogram with unequal adjacent sides, such as a rhombus, diamond, or rhomboid. FIG. 11 is an enlarged plan view of an electronic component 106 seated within rhomboidal aperture 104.sub.1 of FIG. 10. A portion of each aperture side margin 102 forms a linear holding region 108 where aperture side margin 102 contacts a corner region 110 of electronic component 106. As stated above, corner region 110 is a linear region along which two edges of any of the surfaces (e.g., upper, lower, side wall, or end wall surfaces) of electronic component 106 meet and form an angle. Corner region 110 may include the point at which three of the edges meet, such as, for example, the point at which an edge of the upper surface meets an edge of a side wall surface and an edge of an end wall surface. In addition to contacting corner region 110, holding region 108 may contact a minimal portion (e.g., 7%) of side wall surfaces 22 and 24 and/or end wall surfaces 26 and 28 of electronic component 106. The 7% overlap of holding region 108 and side wall surfaces 22 and 24 and/or end wall surfaces 26 and 28 represents an operational tolerance beyond which undesirable damage to the side and end wall surfaces of the electronic component may result. An overlap of greater than 7% will result in excessive interference between holding region 108 and stripes 42. DETX When seated in rhomboidal aperture 104.sub.1, electronic component 106 places mechanical stress or pressure on holding regions 108 of side margins 102. To reduce the amount of mechanical stress on holding regions 108, relief openings 114 provided in mask 100 facilitate temporary deformation of mask 100 during receipt and gripping of miniature electronic component 106. Apertures 104.sub.2-104.sub.9 shown in FIG. 10 include relief openings 114. Relief openings 114.sub.s shown in FIG. 10 are slots that extend outwardly from at least one of vertices 105 of rhomboidal aperture 104. The length of each slot-type relief opening 114.sub.s is preferably between about 10% and 100% of the length of one of side margins 102. In the embodiments shown in FIG. 10, slot-type relief openings 114.sub.s include a bulbous hole 118. Slot-type relief openings 114.sub.s may be formed without bulbous hole 118. Although each of apertures 104.sub.2-104.sub.9 shown in FIG. 10 includes multiple slot-type relief openings 114.sub.s, some embodiments of aperture 104 may include only a single slot-type relief opening 114.sub.s. In embodiments where an even number of slot-type relief openings 114.sub.s are present, they preferably extend from opposed vertices 105 of aperture 104. DETX A rightmost aperture 120.sub.10 shown in FIG. 10 includes curved side margins 102.sub.1 and 102.sub.2 that are of convex shape curving outward relative to the aperture interior and are portions of a single, closed curvilinear side margin 102 that forms an elliptical aperture 120 having a major axis 122 and a minor axis 124 (shown in FIG. 12). Elliptical aperture 120.sub.10 has sufficient eccentricity to confine within the operational tolerance described above contact between side margins 102 of aperture 120 and side wall surfaces 22 and 24 and end wall surfaces 26 and 28 of electronic component 106. Some embodiments of elliptical apertures 120 are of a rhomboidal-ellipsis shape. FIG. 12 is an enlarged diagram of electronic component 106 seated within elliptical aperture 120.sub.10 of FIG. 10. Portions of side margin 102 of elliptical aperture 120 form holding regions 108 where aperture side margin 102 contacts corner region 110 of electronic component 106. As stated above, in addition to contacting corner region 110, holding region 108 may contact a minimal portion (e.g., 7%) of side wall surfaces 22 and 24 and/or end wall surfaces 26 and 28 of electronic component 106. DETX FIGS. 13A and 13B show masks 100 that include multiple aperture/relief opening combinations each of which have a different geometry. As stated above, skilled persons will recognize that, in practice, masks for use in miniature component carriers typically include a single aperture/relief opening geometry. The depiction in FIGS. 13A and 13B of a carrier tape having aperture/relief opening combinations of various geometries is meant to show some exemplary aperture/relief opening combinations that may be formed in mask 100. The exemplary relief openings shown in FIGS. 13A and 13B include relief opening side margins that form, for example, square, rectangular, circular, triangular, elliptical, semicircular, curved, and trapezoidal relief openings. Any of the exemplary relief openings shown in FIGS. 13A and 13B may be positioned adjacent to at least one side margin 102 or vertex 105 of either of rhomboidal aperture 104 or elliptical aperture 120. Skilled persons will recognize that additional relief opening geometries that are not shown in FIGS. 13A and 13B may be formed. DETX To reduce the number of reference numerals shown in FIGS. 13A and 13B, reference numerals 102 (referring to the aperture side margins) and 105 (referring to a vertex of a rhomboidal aperture) are not shown. DETX A leftmost aperture 104.sub.11 in mask 100 of FIG. 13A has four linear side margins 102 that form a rhomboidal aperture 104. Aperture 104.sub.11 does not include any relief openings. DETX An aperture/relief opening combination 128 in mask 100 of FIG. 13A includes an aperture that has four linear side margins 102 and four rounded vertices 105 that form a substantially rhomboidal aperture 104. Adjacent to each side margin 102 is a rectangular relief opening 127. Each of the four rectangular relief openings 127 includes four linear relief opening side margins 126, one of which is positioned adjacent to a linear side margin 102 of aperture 104. In some embodiments, the length of each relief opening side margin 126 is equal to or less than the length of each side margin 102. Skilled persons will recognize that rectangular relief openings 127 may be square relief openings. Further, skilled persons will recognize that substantially rhomboidal aperture 104 may be replaced with elliptical aperture 120. DETX An aperture/relief opening combination 130 in mask 100 of FIG. 13A includes an aperture that has four linear side margins 102 and four rounded vertices 105 that form a substantially rhomboidal aperture 104. Adjacent to each side margin 102 is a triangular relief opening 132. Each of triangular relief openings 132 includes three linear relief opening side margins 126 that form a right triangle whose hypotenutical side margin 133 is positioned adjacent to a linear side margin 102 of aperture 104. Skilled persons will recognize that triangular relief openings 132 are not limited to right triangles and that any of the legs of triangular relief openings 132 may be positioned adjacent to side margins 102 of aperture 104. Further, skilled persons will recognize that substantially rhomboidal aperture 104 may be replaced with elliptical aperture 120. DETX An aperture/relief opening combination 136 in mask 100 of FIG. 13A includes an aperture that has four linear side margins 102 and four rounded vertices 105 that form a substantially rhomboidal aperture 104. Adjacent to each side margin 102 is a semicircular relief opening 140. Each of the four semicircular relief openings 140 includes a curvilinear relief opening side margin 142 and a linear relief opening side margin 144. Linear relief opening side margin 144 is positioned adjacent to linear side margin 102 of aperture 104. Skilled persons will recognize that curvilinear relief opening side margin 142 may be positioned adjacent to linear side margin 102 of aperture 104 and that substantially rhomboidal aperture 104 may be replaced with elliptical aperture 120. DETX An aperture/relief opening combination 148 in mask 100 of FIG. 13A includes an aperture that has four linear side margins 102 and four rounded vertices 105 that form a substantially rhomboidal aperture 104. Adjacent to each side margin 102 is a generally trapezoidal relief opening 150. Each of the four trapezoidal relief openings 150 includes two spaced-apart, parallel relief opening side margins 152 and two end relief opening side margins 154. As shown in FIG. 13A, the longer of the two spaced-apart, parallel relief opening side margins 152 is positioned adjacent to linear side margins 102 of substantially rhomboidal aperture 104. Skilled persons will recognize that either of the parallel side margins 152 or either of the end relief opening side margins 154 may be positioned adjacent to side margins 102. Further, skilled persons will recognize that substantially rhomboidal aperture 104 may be replaced with elliptical aperture 120. DETX An aperture/relief opening combination 158 in mask 100 of FIG. 13A includes an aperture that has four linear side margins 102 and four rounded vertices 105 that form a substantially rhomboidal aperture 104. Adjacent to each of two opposed vertices 105 is a curved, or arc-shaped, relief opening 160. Each of the two curved relief openings 160 includes two curvilinear relief opening side margins 162, two end relief opening side margins 164, and an apex region 166. Apex region 166 of each curved relief opening 160 is positioned adjacent to opposed ones of vertices 105. Skilled persons will recognize that curvilinear relief opening side margins 162 may be positioned in other locations, such as, for example, adjacent to linear side margins 102 of substantially rhomboidal aperture 104 and adjacent to each of vertices 105 of substantially rhomboidal aperture 104. DETX An aperture/relief opening combination 168 in mask 100 of FIG. 13B includes elliptical aperture 120 and two curved relief openings 160 positioned adjacent to curvilinear side margin 102. Each of the curved relief openings 160 includes two curvilinear relief opening side margins 162, two end relief opening side margins 164, and an apex region 166. Each curved relief opening 160 is positioned adjacent to side margin 102 of aperture 120 such that major axis 122 (not shown) intersects apex region 166 of each curved relief opening 160. Skilled persons will recognize that curvilinear relief opening side margins 162 may be positioned in other locations, such as, for example, intersecting minor axis 124 (not shown) of elliptical aperture 120. DETX An aperture/relief opening combination 169 in mask 100 of FIG. 13B includes elliptical aperture 120 and four triangular relief openings 132 positioned adjacent to curvilinear side margin 102. One of the three linear relief opening side margins 126 of each of the four triangular relief openings 132 is positioned adjacent to a curvilinear side margin 102 of aperture 120. Further, triangular relief openings 132 are positioned such that they intersect neither major axis 122 (not shown) nor minor axis 124 (not shown) of elliptical aperture 120. Skilled persons will recognize that triangular relief openings 132 may be positioned along either or both of major and minor axes 122 and 124 (not shown) and that a vertex 174 of each triangular relief opening may be positioned adjacent to side margins 102 of aperture 120. DETX An aperture/relief opening combination 170 in mask 100 of FIG. 13B includes an aperture that has four linear side margins 102 and two opposed rounded vertices 105 that form a substantially rhomboidal aperture 104. Adjacent to each side margin 102 is a circular relief opening 172. Each of the four circular relief openings 172 is positioned adjacent to a different one of the four linear side margins 102 of substantially rhomboidal aperture 104. Also, two slot-type relief openings 114.sub.s extend from opposed vertices 105 of substantially rhomboidal aperture 104. Skilled persons will recognize that slot-type relief openings 114.sub.s may extend from fewer or more of vertices 105 and that substantially rhomboidal aperture 104 may be replaced with elliptical aperture 120. DETX An aperture/relief opening combination 176 in mask 100 of FIG. 13B includes elliptical aperture 120 and two slot-type relief openings 114.sub.s extending generally along major axis 122 (not shown) of elliptical aperture 120. Each of the two slot-type relief openings 114.sub.s includes bulbous hole 118 on their ends. The right-most aperture in mask 100 of FIG. 13B is an elliptical aperture 120 without a relief opening. DETX Apertures 104 and 120 may be formed in mask 100 by laser processing, molding, and die punching. One exemplary method of laser processing is described in U.S. Pat. No. 6,919,532, which is assigned to the assignee of the present application. In this method of laser processing, an ultraviolet (UV) laser beam is directed to cut through a component carrier mask made of thin elastomeric material to form apertures having the desired shape and size. A preferred embodiment uses a UV laser beam to form by ablation multiple apertures in a resilient mask made of elastomeric material. Ablation of the elastomeric material, which is preferably silicone rubber, ensures formation of apertures of the required shape and dimensional quality. The absorption of conventional elastomeric materials, including silicone rubber, at the UV laser ablation wavelength region (shorter than about 400 nm) is insufficiently strong to cut apertures at commercially acceptable throughput rates. To overcome this drawback, preferred methods of UV laser processing entail introducing a light absorptivity enhancement material into the silicone rubber to form a flexible support blank that operationally adequately absorbs light within a laser ablation wavelength region, and using a UV laser beam to cut the apertures. Iron oxide and titanium dioxide are preferred dye dopants that function as light absorptivity enhancement materials. DETX FIG. 14 is a plan view of carrier tape 50 including transparent mask 100. Each one of carrier tape 50 and transparent mask 100 has multiple apertures formed in them. The apertures formed in mask 100 are second apertures (referred to above as apertures 104 and 120), and the apertures formed in tape 50 are first apertures (as described in the Background Information section). As shown in FIG. 14, some embodiments of first apertures 180 of tape 50 have geometries similar to the above-described geometries of apertures 104 and 120. Further, the general shapes of first apertures 180 may outline the shape of slot-type relief openings 114.sub.s where such relief openings extend from apertures 104 and 120. DETX As shown by the leftmost first aperture 180.sub.1 in tape 50 of FIG. 14, an exemplary first aperture 180.sub.1 has a generally rhomboidal shape that is similar to, or outlines, the shape of rhomboidal aperture 104 in mask 100. In some embodiments, rhomboidal aperture 104 of mask 100 is positioned directly above first rhomboidal aperture 180.sub.1. As shown in FIG. 14, rhomboidal-shaped first aperture 180.sub.1 lies below and has a greater area than that of rhomboidal aperture 104. DETX First aperture 180.sub.2 in tape 50 of FIG. 14 has a generally rhomboidal shape that includes the outline of two slot-type relief openings 114.sub.5 that form a portion of second aperture 104 that lies above first aperture 180.sub.2. First apertures 60 shown in FIG. 14 are prior art rectangular first apertures. DETX First aperture 180.sub.3 shown in FIG. 14 has a generally rhomboidal shape that includes the outline of four slot-type relief openings 114.sub.s that extend from each of vertices 105 of second aperture 104 and that each include a bulbous hole 118. DETX First aperture 180.sub.4 of FIG. 14 has a generally rhomboidal shape that includes the outline of two slot-type relief openings 114.sub.5 forming a portion of second aperture 104 that lies above first aperture 180.sub.4. DETX A rightmost first aperture 180.sub.5 is an elliptical-shaped aperture whose shape generally outlines the shape of elliptical aperture 120 in mask 100. First aperture 180.sub.5 is positioned directly below elliptical aperture 120. As shown in FIG. 14, elliptical first aperture 180.sub.5 has a greater area than that of elliptical aperture 120. DETX Skilled persons will recognize that first apertures 180 may have shapes other than rhomboidal and elliptical and can include relief opening geometries other than those shown in FIG. 14. DETX Some embodiments of masks 100 may be acceptable for use in a Model 752B Automatic Termination System or a Model 332 High Throughput Discrete Termination System, both of which are manufactured by Electro Scientific Industries, Inc. of Portland, Oreg. (the assignee of the present application). DETX As one skilled in the art will appreciate in light of this disclosure, certain embodiments are capable of achieving certain advantages over the known prior art, including some or all of the following. Miniature electronic components can be tightly held in a desired orientation without significant mechanical damage (1) to the electrically conductive portions of the electronic component and/or (2) to the termination paste that is applied to the electronic component during electronic component processing. The inclusion of relief openings in the mask extends the life of the mask because the relief openings relieve some of the mechanical stress on the side margins of the apertures. Also, the relief openings enhance the flexibility of the mask and thereby facilitate receipt and grip of electronic components having varying geometries and dimensions. DETX It will be obvious to those having skill in the art that many changes may be made to the details of the above-described embodiments without departing from the underlying principles of the invention. The scope of the present invention should, therefore, be determined only by the following claims. CLST The invention claimed is: CLPR 1. A miniature component carrier including a thin, resilient mask through which are formed multiple spaced-apart elongated apertures that are sized and shaped to compliantly receive and hold multiple miniature electronic components in a controlled orientation, the electronic components having applied electrically conductive material, each electronic component having opposed upper and lower surfaces spaced apart by a component thickness bound by opposed side wall surfaces and opposed end wall surfaces, and each electronic component further having multiple corner regions in which one of the upper surface or the lower surface meets at least one of a side wall surface and an end wall surface, comprising: each of the multiple spaced-apart elongated apertures having a periphery, a major axis, and a minor axis, wherein the major axis has a major axis length that is longer than a minor axis length of the minor axis, each periphery defining an aperture interior and shaped to compliantly receive and hold one of the electronic components, each periphery including side margins of convex shape curving outward relative to the aperture interior and converging to form vertices having opposite rounded end portions that face outwardly from each other, each periphery including component holding regions that contact and grip primarily the corner regions of an electronic component received by the aperture, and each periphery configured to grip the received electronic component in a controlled orientation and confine the gripped electronic component by contact within an operational tolerance with any one of the side and end wall surfaces to prevent damage to the applied electrically conductive material during ejection of the gripped electronic component from the aperture. CLPR 2. The component carrier of claim 1, in which the side margins of convex shape form a substantially rhomboidal aperture. CLPR 3. The component carrier of claim 1, in which the side margins of convex shape are portions of a closed curvilinear side margin that forms an elliptical aperture having sufficient eccentricity to confine within the operational tolerance contact with any one of the side and end wall surfaces. CLPR 4. The component carrier of claim 1, in which the each periphery is configured to prevent smearing the applied electrically conductive material during insertion and extraction of the electronic component from the aperture. CLPR 5. The component carrier of claim 1, further including a flexible metal tape having multiple holes that are sized and shaped to compliantly receive and hold the resilient mask. CLPR 6. The component carrier of claim 1, in which the miniature component is one of a chip capacitor and an integrated passive electronic component. CLPR 7. The component carrier of claim 1, in which one holding region of the aperture is operable to overlap 7% or less of one side wall surface or one end wall surface of one of the miniature electronic components. CLPR 8. The component carrier of claim 1, in which the vertices are oriented in a direction transverse to the minor axis. CLPR 9. A miniature component carrier capable of receiving and holding multiple miniature components, each miniature component including opposed upper and lower surfaces spaced apart by a component thickness bound by opposed side wall surfaces and opposed end wall surfaces, and each miniature component further including multiple corner regions defined by intersection of one of the upper surface or the lower surface with at least one of a side wall surface and an end wall surface, comprising: a thin, resilient mask through which is formed multiple spaced-apart apertures each of which has a periphery that defines an aperture interior and is sized and shaped to compliantly receive and grip a miniature component in a controlled orientation, at least some of the apertures having peripheries that each include side margins of convex shape curving outward relative to the aperture interior and converging to form vertices having opposite rounded end portions that face outwardly from each other to form one of a substantially rhomboidal or elliptical aperture, each periphery that includes side margins of convex shape also including a major axis and a minor axis wherein the major axis has a major axis length that is longer than a minor axis length of the minor axis, each periphery that includes side margins of convex shape including component holding regions that contact and grip primarily the corner regions of a miniature component received by the aperture, and each periphery that includes side margins of convex shape configured to grip the received miniature component in a controlled orientation and confine the gripped miniature component by contact within an operational tolerance with any one of the side and end wall surfaces to prevent damage to the miniature component during its ejection from the aperture. CLPR 10. The component carrier of claim 9, in which the thin, resilient mask further includes a relief opening that extends from one of the apertures, the relief opening facilitating temporary deformation of the resilient mask during receipt and gripping of the miniature component. CLPR 11. The component carrier of claim 10, in which the relief opening is a slot that extends outwardly from one of a vertex of the substantially rhomboidal aperture and a major axis of the elliptical aperture. CLPR 12. The component carrier of claim 9, in which the miniature component is one of a chip capacitor and an integrated passive electronic component. CLPR 13. The component carrier of claim 9, further including a flexible metal tape having multiple holes that are sized and shaped to compliantly receive and hold the resilient mask. CLPR 14. The component carrier of claim 9, in which one holding region of the aperture is operable to overlap 7% or less of one side wall surface or one end wall surface of one of the miniature electronic components. CLPR 15. The component carrier of claim 9, in which the vertices are oriented in a direction transverse to the minor axis. CLPR 16. A miniature component carrier including a thin, resilient mask through which are formed multiple spaced-apart elongated apertures that are sized and shaped to compliantly receive and hold multiple miniature electronic components in a controlled orientation, the electronic components having applied electrically conductive material and being one of a chip capacitor and an integrated passive electronic component, each electronic component having opposed upper and lower surfaces spaced apart by a component thickness bound by opposed side wall surfaces and opposed end wall surfaces, and each electronic component further having multiple corner regions in which one of the upper surface or the lower surface meets at least one of a side wall surface and an end wall surface, comprising: each of the multiple spaced-apart elongated apertures having a periphery, a major axis, and a minor axis, wherein the major axis has a major axis length that is longer than a minor axis length of the minor axis, each periphery defining an aperture interior and shaped to compliantly receive and hold one of the electronic components, each periphery including side margins of convex shape curving outward relative to the aperture interior and converging to form vertices having opposite rounded end portions that face outwardly from each other to form a substantially rhomboidal or elliptical aperture having sufficient eccentricity to confine within an operational tolerance contact with any one of the side and end wall surfaces to prevent damage to the applied electrically conductive material, each periphery including component holding regions that contact and grip primarily the corner regions of an electronic component received by the aperture, and each periphery configured to grip the received electronic component in a controlled orientation and confine the gripped electronic component by contact within the operational tolerance with any one of the side and end wall surfaces to prevent damage to the applied electrically conductive material during ejection of the gripped electronic component from the aperture. CLPR 17. The component carrier of claim 16, in which one holding region of the aperture is operable to overlap 7% or less of one side wall surface or one end wall surface of one of the miniature electronic components. CLPR 18. The component carrier of claim 16, in which the vertices are oriented in a direction transverse to the minor axis. CLPR 19. The component carrier of claim 16, further including a flexible metal tape having multiple holes that are sized and shaped to compliantly receive and hold the resilient mask. CLPR 20. The component carrier of claim 16, in which the miniature component is one of a chip capacitor and an integrated passive electronic component. ICUS Y DSRC US 09204586 B2 20151201 13154837 223492 Electronic-circuit assembling process *** BRS DOCUMENT BOUNDARY *** WKU 09204586 SIZE 223933 DWKU 9204586 APT B2 DID US 9204586 B2 GISD 20151201 ARD 154837 AFD 20110607 APY 2011 SRC 13 APNR 13154837 APP 13/154837 PRCO JP PRAN 2010-133232 PRAD 20100610 PRAY 2010 PRAI 2010JP-2010-133232 TRX 281 IPCG 20060101 A H05K H05K13/04 F I B US H 20151201 IPCC H05K IPCP H05K13/04 20060101 H05K013/04 IPCG 20060101 A H05K H05K13/08 L I B US H 20151201 IPCC H05K IPCS H05K13/08 20060101 H05K013/08 CLOI H05K CPOI H05K13/0452 20130101 CPOG H H05K H05K13/0452 20130101 F I 20151201 US CLOI H05K CPOI H05K13/08 20130101 CPOG H H05K H05K13/08 20130101 L I 20151201 US CLOA Y10T CPOA Y10T29/49124 20150115 CPOG Y Y10T Y10T29/49124 20150115 L A 20151201 US TTL Electronic-circuit assembling process URPN 5570993 URNM Onodera et al. URPD 19961100 URCL 414/783 URGP US 5570993 A 19961100 Onodera et al. 414/783 cited by examiner URPN 6718629 URNM Stanzl URPD 20040400 URCL 29/832 URGP US 6718629 B1 20040400 Stanzl 29/832 cited by examiner URPN 7966718 URNM Kodama et al. URPD 20110600 URCL 29/739 URGP US 7966718 B2 20110600 Kodama et al. 29/739 cited by examiner URPN 2006/0085973 URNM Kodama et al. URPD 20060400 URCL 29/740 URGP US 2006/0085973 A1 20060400 Kodama et al. 29/740 cited by examiner FRCO CN FRPN 1714611 FRPD 20051200 FRCL N/A FRGP CN 1714611 A 20051200 cited by applicant FRCO JP FRPN A-6-143669 FRPD 19940500 FRCL N/A FRGP JP A-6-143669 19940500 cited by applicant FRCO JP FRPN A-10-229296 FRPD 19980800 FRCL N/A FRGP JP A-10-229296 19980800 cited by applicant FRCO JP FRPN A-11-87805 FRPD 19990300 FRCL N/A FRGP JP A-11-87805 19990300 cited by applicant FRCO JP FRPN A-2003-283199 FRPD 20031000 FRCL N/A FRGP JP A-2003-283199 20031000 cited by applicant FRCO JP FRPN A-2004-104075 FRPD 20040400 FRCL N/A FRGP JP A-2004-104075 20040400 cited by applicant FRCO JP FRPN A-2004-221518 FRPD 20040500 FRCL N/A FRGP JP A-2004-221518 20040500 cited by applicant FRCO JP FRPN 2005136023 FRPD 20050500 FRCL N/A FRGP JP 2005136023 A 20050500 cited by examiner FRCO JP FRPN A-2005-136023 FRPD 20050500 FRCL N/A FRGP JP A-2005-136023 20050500 cited by applicant FRCO JP FRPN A-2006-261325 FRPD 20060900 FRCL N/A FRGP JP A-2006-261325 20060900 cited by applicant FRCO JP FRPN A-2009-10319 FRPD 20090100 FRCL N/A FRGP JP A-2009-10319 20090100 cited by applicant FRCO JP FRPN A-2011-35175 FRPD 20110200 FRCL N/A FRGP JP A-2011-35175 20110200 cited by applicant FRCO WO FRPN 2009087872 FRPD 20090700 FRCL N/A FRGP WO 2009087872 A1 20090700 cited by examiner FRCO WO FRPN WO 2009/087872 FRPD 20090700 FRCL N/A FRGP WO WO 2009/087872 A1 20090700 cited by applicant ORPL Feb. 25, 2014 Office Action issued in Japanese Patent Application No. 2010-133232 (with translation). cited by applicant ORPL Dec. 15, 2014 Office Action issued in Chinese Patent Application No. 201110162680.3. cited by applicant ORPL Office Action mailed Sep. 24, 2014 in Japanese Patent Application No. 2010-133232 (with translation). cited by applicant NCL 16 ECL 1 CIFS 29/832 CIFS 29/840 CFSC 29 CFSS 832;840 CIFS 700/900 FSCP H05K 13/02 FSCL H05K FSCP H05K 13/04 FSCL H05K FSCP H05K 13/046 FSCL H05K FSCP H05K 13/0452 FSCL H05K FSCP H05K 3/341 FSCL H05K CFSC 700 CFSS 900 NDR 13 NFG 20 PDID US 20110302776 A1 PPCC US PPNR 20110302776 PPKC A1 PPPD 20111215 AANM Kato; Daisuke AACI Kuwana AAST N/A AAZP N/A AACO JP AATX N/A AAGP Kato; Daisuke Kuwana JP AANM Haneda; Hiroyuki AACI Nagoya AAST N/A AAZP N/A AACO JP AATX N/A AAGP Haneda; Hiroyuki Nagoya JP INNM Kato; Daisuke INSA N/A INCI Kuwana INST N/A INZP N/A INCO JP INTX N/A INGP Kato; Daisuke Kuwana JP INNM Haneda; Hiroyuki INSA N/A INCI Nagoya INST N/A INZP N/A INCO JP INTX N/A INGP Haneda; Hiroyuki Nagoya JP LRFM Oliff PLC ASNM FUJI MACHINE MFG. CO., LTD. ASTC 03 ASCI Chiryu ASST N/A ASZP N/A ASCO JP ASTX N/A ASGP FUJI MACHINE MFG. CO., LTD. Chiryu JP 03 ART 3729 EXP Arbes; Carl ABPR An electronic-circuit assembling process to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting electronic circuit components supplied from a component supplier, onto a circuit board, wherein the electronic circuit components includes at least one of different-property components having respective different electrical properties. The process includes: (a) a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a-i) a property-related information that enables recognition of the electrical property of the different-property component supplied from the component supplier and (a-ii) a different-property-component supply position that is a position of the component supplier supplying the different-property component, such that the different-property-component-related information is obtained by detecting the property-related information and/or the different-property-component supply position; (b) a mounting step of mounting, based on information related to the different-property-component supply position, the electronic circuit components including the different-property component, onto the circuit board; and (c) a property-related information providing step of providing the circuit board with the property-related information of the different-property component mounted on the circuit board. BSTX CROSS REFERENCE TO RELATED APPLICATION BSTX This application claims priority from Japanese Patent Application No. 2010-138232 filed on Jun. 10, 2010, the disclosure of which is herein incorporated by reference in its entirety. BSTX BACKGROUND OF THE INVENTION BSTX 1. Field of the Invention BSTX The present invention relates to a process and a system for assembling an electronic circuit by mounting electronic circuit components onto a circuit board. BSTX 2. Discussion of Related Art BSTX As disclosed in JP2003-283199A, there is known a technique for providing a circuit board with information representing electrical characteristics or properties of electronic circuit components that are mounted on the circuit board. This publication of the Japanese Patent Application discloses an electronic-circuit assembling system including two electronic-circuit-component mounters each of which is configured to mount a corresponding one of two kinds of electronic circuit components, onto the circuit board, so that the mounted electronic circuit components constitute an electric circuit formed on the circuit board. In this electronic-circuit assembling system, one of the two kinds of electronic circuit components are mounted on the circuit board by a corresponding one of the two electronic-circuit-component mounters, and then the other of the two kinds of electronic circuit components are mounted on the circuit board by the other of the two electronic-circuit-component mounters. In the above-described one of the two electronic-circuit-component mounters (which is configured to carry out the mounting operations prior to the mounting operations that are to be carried out by the other of the two electronic-circuit-component mounters), bar codes indicative of some information are printed onto the circuit board. This information indicated by the bar codes is information obtained from a database, and specifies ones of the electronic circuit components (of the other of the two kinds), which are to be associated with ones of the electronic circuit components (of the one of the two kinds) mounted by the one of the two electronic-circuit-component mounters, for providing the circuit board with a desired performance. Thereafter, in the above-described other of the two electronic-circuit-component mounters (which is configured to carry out the mounting operations after the mounting operations that have been carried out by the one of the two electronic-circuit-component mounters), the information indicated by the printed barcode is read out by the barcode reader, and the above-described ones of the electronic circuit components (of the other of the two kinds) specified by the information of the bar codes are mounted onto the circuit board, for thereby preventing an undesirable association of two electronic circuit components which does not guarantee the desired performance of the circuit board, namely, preventing such two electronic circuit components to be undesirably mounted in association with each other on the circuit board. BSTX SUMMARY OF THE INVENTION BSTX On the other hand, there is a need for making it possible to mount electronic circuit components, which have been supplied from a component supplying device via a component supply position, onto the circuit board and to provide the circuit board with information related to electrical property values of the mounted components, even where the electrical property values of the components and/or the component supply position are not predetermined. The present invention was made in the light of the background as described above, and an object of the invention is to provide an improved electronic-circuit assembling process and an improved electronic-circuit assembling system, which satisfy the above need. BSTX This object may be achieved by an electronic-circuit assembling process which is to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting a plurality of electronic circuit components supplied from at least one component supplier of a component supplying device, onto a circuit board supported by a board supporting device, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, the electronic-circuit assembling process including: (I) a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a) a property-related information that enables recognition of the electrical property of the at least one of the different-property components which is supplied from at least one of the at least one component supplier and (b) a different-property-component supply position that is a position of the at least one of the at least one component supplier supplying the at least one of the different-property components, such that the different-property-component-related information is obtained by detecting at least one of the property-related information and the different-property-component supply position; (II) a mounting step of mounting, based on at least information related to the different-property-component supply position obtained in the different-property-component-related information obtaining step, the plurality of electronic circuit components including the at least one of the different-property components, onto the circuit board; and (III) a property-related information providing step of providing the circuit board with the property-related information of the at least one of the different-property components which is mounted on the circuit board in the mounting step. BSTX The phrase that "the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board" may be interpreted to mean that, even if there are configurational and/or dimensional differences between the components, the degree of the difference is within a tolerable range such that the components can be handled as being components that are the same as each other, in a case where a control is performed to merely control mounting of the component onto the circuit board. For example, in the component mounting operation, in general, after each component has been supplied from a component supplier to a component holder, an image of the component held by the component holder is taken by an component-image taking device, for carrying out various checks such as (i) judgment as to whether the component currently held by the component holder is a correct component and (ii) detection of an error of positioning of the component currently held by the component holder. The above phrase may be interpreted to mean that each of these checks can be carried out for the different-property components by using a same reference data common to the different-property components, namely, by comparing the detected data with the same common reference data, so that the different-property components can be handled as if it were the same components in the control performed to merely control mounting of the component onto the circuit board. It is noted that the phrase "the electrical properties of at least two of the different-property components are different from each other" may be interpreted to also mean that the electrical properties of the different-property components are of a plurality of different levels, i.e., are of at least two different levels. BSTX In general, an electronic circuit component is expected to exhibit a function performance that is inherent to a kind of the electronic circuit component, and a degree of the functional performance varies depending on the electrical property of each electronic circuit component. There is a case where such a variation of the degree of functional performance is not ignorable. The electrical property value represents the degree of functional performance whose variation could be unignorable. BSTX The property-related information may be either the electrical property value as such or information that enables recognition of the electrical property value. BSTX The provision of the property-related information on the circuit board may be made in various manners such as printing of the information by a printing device, labeling of tape with description of the information, or writing of the information into an IC (integrated circuit) chip (e.g., tag chip) having an antenna. The property-related information, which is provided by the printing or tape labeling, may be represented by, for example, a barcode, two-dimensional code or other code easily readable by a device, or characters, numbers, signs, figures or any combination thereof BSTX All of the plurality of electronic circuit components may be the plurality of different-property components, or one or ones of the plurality of electronic circuit components may be the at least one of the different-property components. In the latter case, the plurality of electronic circuit components may include a non-different-property component or components such as a chip component (e.g., capacitor chip, resistor chip), a lead component (e.g., QFP (quad flat package)) having leads and a connector. Where the plurality of different-property components are to be mounted onto a single circuit board, the different-property components may be mounted together with each other onto a predetermined local area within the circuit board or may be mounted onto respective positions which are located on an entirety of the circuit board and which are distant from each other. BSTX The property-related information may be provided either on a different-property component mount surface (i.e., a surface of the circuit board onto which the at least one of the different-property components is to be mounted) or on a surface opposite to the different-property component mount surface. BSTX Where an electronic circuit is to be manufactured by mounting the plurality of electronic circuit components including the at least one of the different-property components, onto the circuit board, it is possible to increase a degree of freedom in operation carried out in an assembling workshop for assembling the electronic circuit, without predetermining at least one of the electrical property value and the component supply position of the at least one of the different-property components, namely, by allowing the at least one of the electrical property value and the component supply position to be determined in the assembling workshop. The increase of the degree of freedom in the operation in the assembling workshop makes it advantageously possible to perform the manufacturing of the electronic circuit in a manner satisfying limiting conditions that are likely to be required in the assembling workshop. BSTX The present electronic-circuit assembling process was developed for the above-described advantage. Although the "different-property-component-related information obtaining step" may be implemented in a manner as described below, this step may be implemented in any other manner as long as the property-related information (that permits recognition of the electrical property value of the at least one of the different-property components) and/or the component supply position is obtainable by implementation of the this step. Even where at least one of the electrical property value and the component supply position is not predetermined and is unknown to the electronic-circuit assembling system, it is possible to mount the electronic circuit components onto the circuit board and to provide the circuit board with the information related to the electrical property value of the electronic circuit components (mounted onto the circuit board) in the electronic-circuit assembling system, because both of the electrical property value and the component supply position can become known to the electronic-circuit assembling system through implementation of the different-property-component-related information obtaining step, by determining the above-described at least one of the electrical property value and the component supply position in the assembling workshop and causing the determined at least one of the electrical property value and the component supply position to be detectable by the electronic-circuit assembling system. It is noted that "mounting the electronic circuit components onto the circuit board and providing the circuit board with the information related to the electrical property value of the mounted electronic circuit components" will be simply referred to as "assembling the electronic circuit" where appropriate. BSTX For example, where the electrical property value of the at least one of the different-property components is predetermined so as to be already known to the electronic-circuit assembling system while the component supply position of the at least one of the different-property components is not yet known, it is possible to assemble the electronic circuit, by causing both of the electrical property value and the component supply position to become known in the electronic-circuit assembling system, through two manners, one of which is that the component supply position is detected by the electronic-circuit assembling system through an automatic detection of an install position in which the component supplier storing therein the different-property component (whose electrical property value is already known) is installed by an operator in the electronic-circuit assembling system, and the other of which is that the component supply position is detected by the electronic-circuit assembling system through a reception (i.e., detection) of information which is related to the install position and which is manually inputted by the operator. In the former case, for example, when storing the different-property component in the component supplier, the operator may input an identification-related information related to identification of the component supplier, into the electronic-circuit assembling system, so that the install position can be automatically detected by automatically determining that the identification-related information of the component supplier installed in an install position matches with the manually inputted identification-related information of the component supplier. BSTX Further, where the component supply position of the at least one of the different-property components is predetermined so as to be already known to the electronic-circuit assembling system while the electrical property value of the at least one of the different-property components is not yet known, both of the electrical property value and the component supply position can become known in electronic-circuit assembling system, because it is possible to detect the electrical property value directly or via the identification-related information of the component supplier, by manually inputting the electrical property value per se of the different-property component into the electronic-circuit assembling system by the operator when the different-property component is stored in the component supplier by the operator, or by manually inputting a correlation between the identification-related information and the electrical property value of the component supplier, into the electronic-circuit assembling system by the operator when the different-property component is stored in the component supplier by the operator. BSTX Where neither the electrical property value nor the component supply position is predetermined so as to be already known to the electronic-circuit assembling system, both of the electrical property value and the component supply position can be detected, for example, in a manner as described below. BSTX It is noted that, in the present description, the "obtaining" of the property-related information of the different-property component and the "obtaining" of the supply position of the different-property component in the different-property-component-related information obtaining step or in the different-property-component-related information obtaining portion, should be interpreted to encompass not only a case where the property-related information or the information related to the supply position (that has been unknown to the electronic-circuit assembling system) is detected automatically in the electronic-circuit assembling system but also a case where the property-related information or the information related to the supply position (that has been prestored in a memory of the electronic-circuit assembling system) is read out in the electronic-circuit assembling system. BSTX The above object may be achieved also by another electronic-circuit assembling process which is to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting a plurality of electronic circuit components supplied from at least one component supplier of a component supplying device, onto a circuit board supported by a board supporting device, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, the electronic-circuit assembling process including: (I) a correlation-related information storing step of storing, in a memory, a component-supplier/different-property-component correlation-related information related to a correlation between a component-supplier-identification-related information and a property-related information, the component-supplier-identification-related information being related to an identification of at least one of the at least one component supplier that is to supply the at least one of the different-property components, the property-related information enabling recognition of the electrical property of the at least one of the different-property components which is supplied from the at least one of the at least one component supplier; (II) a component-supplier-identification-related-information detecting step of detecting the component-supplier-identification-related information of each of the at least one component supplier installed on the electronic-circuit assembling system, such that the detected component-supplier-identification-related information is correlated with a component supply position that is a position of the installation of the each of the at least one component supplier; (III) a different-property-component-related information detecting step of detecting a different-property-component-related information including (a) a different-property-component supply position from which the at least one of the different-property components is supplied by the component supplying device and (b) the property-related information of the at least one of the different-property components which is supplied by the component supplying device, based on the component-supplier-identification-related information and the component supply position of the each of the at least one component supplier detected in the component-supplier-identification-related-information detecting step, and based on the component-supplier/different-property-component correlation-related information stored in the memory; (IV) a mounting step of mounting the plurality of electronic circuit components onto the circuit board, by supplying, based on at least information related to the different-property-component supply position obtained in the different-property-component-related information detecting step, the plurality of electronic circuit components including the at least one of the different-property components, from the at least one component supplier of the component supplying device; and (V) a property-related information providing step of providing the circuit board onto which the at least one of the different-property components has been mounted in the mounting step, with the property-related information of the at least one of the different-property components which has been detected in the different-property-component-related information detecting step. BSTX The above object may be achieved also by an electronic-circuit assembling system for assembling an electronic circuit, by mounting a plurality of electronic circuit components onto a circuit board, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, the electronic-circuit assembling system including: (a) a board supporting device configured to support the circuit board; (b) a component supplying device including (b-1) a plurality of component suppliers each of which is configured to store therein ones of the plurality of electronic circuit components that are categorized as one kind of electronic circuit components, and each of which is configured to sequentially supply the categorized ones of the plurality of electronic circuit components and (b-2) a component-supplier holder having a plurality of holding portions holding the component suppliers; and (c) an electronic-circuit-component mounter including a mounting device configured to receive the plurality of electronic circuit components supplied from the component supplying device and to mount the electronic circuit components onto the circuit board supported by the board supporting device; the electronic-circuit assembling system further including: (A) a different-property-component-related information obtaining portion configured to automatically detect a different-property-component-related information including (i) a property-related information that enables recognition of the electrical property of at least one of the at least one of the different-property components which is stored in at least one of the plurality of component suppliers and (ii) a holding-portion position that is a position of one of the plurality of holding portions which holds the at least one of the plurality of component suppliers, such that the different-property-component-related information is obtained by detecting at least the property-related information; (B) a mounting controlling portion configured, based on information of the holding-portion position obtained by the different-property-component-related information obtaining portion, to cause the mounting device to receive the plurality of electronic circuit components including the at least one of the different-property components, from the component supplying device, and to cause the mounting device to mount the plurality of electronic circuit components onto the circuit board supported by the board supporting device; and (C) a property-related information providing portion configured to provide the circuit board onto which the at least one of the different-property component has been mounted by operation of the mounting controlling portion, with the property-related information which has been obtained by the different-property-component-related information obtaining portion. BSTX The above-described "one of the plurality of holding portions" may be either a randomly selected one of the plurality of holding portions or a predetermined one of the plurality of holding portions. In the former case, the different-property-component-related information obtaining portion includes a portion configured to automatically detect which one of the plurality of holding portions holds the component supplier storing therein a different-property component having an randomly selected, electrical property value. BSTX In the electronic-circuit assembling process according to the present invention, even if at least one of the electrical property value and the supply position of the different-property component is unknown (unclear), the different-property-component-related information is obtained in the different-property-component-related information obtaining step, so that the different-property component can be mounted onto the circuit board and the property-related information can be given to the circuit board. Therefore, the operator of the electronic-circuit assembling system can cause the system to assemble the electric circuit, by arbitrarily determining at least one of the electrical property and the supply position of the different-property component, thereby making it possible to increase the degree of freedom in operations carried out in an assembling workshop for assembling the electronic circuit. BSTX For example, where the different-property-component supply position is already known (namely, is predetermined and information related to the predetermined component supply position is stored in the memory of the electronic-circuit assembling system) while the electrical property value of the different-property component is unknown, the detection of the electrical property value makes it possible to provide the circuit board with the property-related information. The electrical property value can be utilized, for example, also in preparation of information related to record of mounting of the different-property components onto the circuit board. Where a plurality of kinds of different-property components that are different from each other with respect to the electrical property value are supplied from a plurality of component suppliers, it is possible to select the kind of different-property components that are to be mounted onto the circuit board, on the basis of the electrical property value. Where a single kind of different-property components whose electrical property value is unknown are supplied from a single component supplier, the detection of the electrical property value makes it possible to provide the circuit board with the property-related information. BSTX Further, where the electrical property value of the different-property component is already known while the different-property-component supply position is unknown, the detection of the component supply position makes it possible to take the different-property component from the component supplier and to mount the different-property component onto the circuit board. BSTX Further, where both of the electrical property value and the component supply position of the different-property component are unknown, the detections of the electrical property value and the different-property-component supply position make it possible to obtain advantages provided by those detections. BSTX In any one of the above cases, the provision of the property-related information on the circuit board makes it possible to obtain the electrical property value of the different-property component, from the circuit board as such. Since the provision of the property-related information on the circuit hoard is carried out as a procedure following the mounting of the different-property component on the circuit board, it is possible to reduce a possibility of mismatching of the electrical property value of the different-property component actually mounted on the circuit board, with the electrical property value recognized through the property-related information. Therefore, it is possible to reduce errors in a procedure for determining an electronic circuit component (associated component) that is to be associated with the different-property component, a procedure for sorting the circuit board upon assembling or packing for associating the circuit board with another element based on the electrical property value of the mounted different-property component, or other procedure carried out for the circuit board based on the electrical property value. BSTX Further, in the above-described another electronic-circuit assembling process according to the present invention, the detection of the different-property-component-related information is made based on the detections of the component-supplier-identification-related information and the component supply position and the memorization of the component-supplier/different-property-component correlation-related information. Therefore, even if both of the electrical property value and the supply position of the supplied different-property component are unknown, it is possible to obtain both of them, thereby obtaining advantages provided in such as case where both of them are unknown. BSTX Further, in the electronic-circuit assembling system according to the present invention, even where the electrical property value of the different-property component is unknown, the mounting of the different-property component onto the circuit board and the provision of the property-related information onto the circuit board can be made. BSTX Various Modes of the Invention BSTX There will be described various modes of the invention deemed to contain claimable features for which protection is sought. Hereinafter, the invention deemed to contain the claimable features will be referred to as "claimable invention" where appropriate. The claimable invention includes at least "the present invention" or "the invention of the present application" which is an invention described in claims, and could include also specific concept of the invention of the present application, generic concept of the invention of the present application and other concept of the invention of the present application. Each of these modes of the invention is numbered like the appended claims and depends from the other mode or modes, where appropriate, for easier understanding of the technical features disclosed in the present specification. It is to be understood that the claimable invention is not limited to the technical features or any combinations thereof which will be described in each of these modes. That is, the scope of the claimable invention should be interpreted in the light of the following descriptions accompanying the various modes and preferred embodiments of the invention. In a limit in accordance with such an interpretation, a mode of the claimable invention can be constituted by not only each one of these modes but also either a mode provided by any one of these modes and additional components incorporated therein or a mode provided by any one of these modes without some of components recited therein. BSTX (1) An electronic-circuit assembling process which is to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting a plurality of electronic circuit components supplied from at least one component supplier of a component supplying device, onto a circuit board supported by a board supporting device, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, BSTX the electronic-circuit assembling process including: BSTX a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a) a property-related information that enables recognition of the electrical property of the at least one of the different-property components which is supplied from at least one of the at least one component supplier and (b) a different-property-component supply position that is a position of the at least one of the at least one component supplier supplying the at least one of the different-property components, such that the different-property-component-related information is obtained by detecting at least one of the property-related information and the different-property-component supply position; BSTX a mounting step of mounting, based on at least information related to the different-property-component supply position obtained in the different-property-component-related information obtaining step, the plurality of electronic circuit components including the at least one of the different-property components, onto the circuit board; and BSTX a property-related information providing step of providing the circuit board with the property-related information of the at least one of the different-property components which is mounted on the circuit board in the mounting step. BSTX (2) An electronic-circuit assembling process according to mode (1), wherein the different-property-component-related information obtaining step includes a step of obtaining the different-property-component-related information by detecting at least one of the property-related information and the different-property-component supply position. BSTX (3) An electronic-circuit assembling process which is to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting a plurality of electronic circuit components supplied from at least one component supplier of a component supplying device, onto a circuit board supported by a board supporting device, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, BSTX the electronic-circuit assembling process comprising: BSTX a correlation-related information storing step of storing, in a memory, a component-supplier/different-property-component correlation-related information related to a correlation between a component-supplier-identification-related information and a property-related information, the component-supplier-identification-related information being related to an identification of at least one of the at least one component supplier that is to supply the at least one of the different-property components, the property-related information enabling recognition of the electrical property of the at least one of the different-property components which is supplied from the at least one of the at least one component supplier; BSTX a component-supplier-identification-related-information detecting step of detecting the component-supplier-identification-related information of each of the at least one component supplier installed on the electronic-circuit assembling system, such that the detected component-supplier-identification-related information is correlated with a component supply position that is a position of the installation of the each of the at least one component supplier; BSTX a different-property-component-related information detecting step of detecting a different-property-component-related information including (a) a different-property-component supply position from which the at least one of the different-property components is supplied by the component supplying device and (b) the property-related information of the at least one of the different-property components which is supplied by the component supplying device, based on the component-supplier-identification-related information and the component supply position of the each of the at least one component supplier detected in the component-supplier-identification-related-information detecting step, and based on the component-supplier/different-property-component correlation-related information stored in the memory; BSTX a mounting step of mounting the plurality of electronic circuit components onto the circuit board, by supplying, based on at least information related to the different-property-component supply position obtained in the different-property-component-related information detecting step, the plurality of electronic circuit components inducing the at least one of the different-property components, from the at least one component supplier of the component supplying device; and BSTX a property-related information providing step of providing the circuit board onto which the at least one of the different-property components has been mounted in the mounting step, with the property-related information of the at least one of the different-property components which has been detected in the different-property-component-related information detecting step. BSTX A property-related-information providing device, which is configured to provide the property-related information, may be provided in an electronic-circuit-component mounter capable of automatically obtaining the different-property-component-related information, or may be provided apart from the electronic-circuit-component mounter. In the latter case, the property-related-information providing device may be provided in another electronic-circuit-component mounter or may be provided on an apparatus which is other than the electronic-circuit-component mounters. Were the property-related-information providing device is provided in the apparatus other than the component mounters, this apparatus may be either an apparatus assigned to perform an operation other than the mounting operation or an apparatus (hereinafter referred to as "property-related information provider" where appropriate) assigned to perform exclusively the operation for providing the circuit board with the property-related-information. BSTX (4) The electronic-circuit assembling process according to any one of modes (1)-(3), including: BSTX using, as the electronic-circuit assembling system, a system including an electronic-circuit-component mounter having a mounting device that is configured to mount the electronic circuit components onto the circuit board after taking the electronic circuit components from the component supplying device; BSTX using, as the component supplying device, a device including (i) a plurality of component suppliers as the at least one component supplier each of which is configured to store therein the plurality of electronic circuit components and to sequentially supply the plurality of electronic circuit components to the mounting device and (ii) a component-supplier holder having a plurality of holding portions configured to detachably hold the plurality of component suppliers; BSTX causing at least one of the plurality of component suppliers to store therein the at least one of the different-property components; BSTX causing at least one of the plurality of holding portions to bold the at least one of the plurality of component suppliers storing therein the at least one of the different-property components; and BSTX causing the electronic-circuit-component mounter to automatically obtain (.alpha.) a position of the at least one of the plurality of holding portions holding the at least one of the plurality of component suppliers and (.beta.) the property-related information of the at least one of the different-property components which is supplied from the at least one of the plurality of component suppliers. BSTX As the component supplier, there are a component feeder (e.g., tape feeder, bulk feeder, stick feeder) and a tray having a multiplicity of recesses which are formed to lie on a plane and which are configured to accommodate therein the components. The electronic circuit components are held by a component holding member such as tape, component storage casing and stick. The tape is held by a tape holding member such as a reel (on which tape is wound) and a tape storage casing (which stores the tape therein). The tray serves as the component supplier and also as the component holding member. The component supplying device may be constituted by the component feeder and/or the tray, so as to supply the electronic circuit components. BSTX The position of the holding portion (in which the component supplier is to be held by the holding portion), i.e., the install position (in which the component supplier is to be installed on the component-supplier bolder) or the component supply position (in which the different-property component is to be supplied from the component-supplier holder) does not have to be located in a limited position but may be located in a desired position suitable for facilitating the operator to carry out an operation for installing the component supplier onto the component-supplier holder. Further, where the position of the holding portion (in which the component supplier is to be held by the holding portion) has been predetermined, even if the component supplier is actually held by the holding portion in a position different from the predetermined position, it is possible to know the different position in which the holding portion actually holds the component supplier, and accordingly to mount the different-property component supplied from component supplier, onto the circuit board. BSTX (5) The electronic-circuit assembling process according to any one of modes (1)-(4), including: BSTX using, as the electronic-circuit assembling system, a system including a mounter line constituted by a plurality of electronic circuit-component mounters that are arranged in a line, with each adjacent two of the arranged electronic-circuit-component mounters being close to each other without a gap which allows the circuit board to be taken out through the gap; BSTX causing at least one of the arranged electronic-circuit-component mounters to mount at least one of the at least one of the different-property components onto the circuit board; and BSTX causing at least one of the arranged electronic-circuit-component mounters to provide the circuit board with the property-related information of the at least one of the at least one of the different-property components. BSTX The property-related information may be provided on the circuit board by either the electronic-circuit-component mounter assigned to mount the different-property component onto the circuit board, or another electronic-circuit-component mounter that is other than the electronic-circuit-component mounter assigned to mount the different-property component onto the circuit board. In the latter case, the mounting of the different-property component and the provision of the property-related information are made by respective two of the plurality of electronic-circuit-component mounters. In either of the former and latter cases, there is no risk that the circuit board would be taken out by the operator or another circuit board would be introduced by the operator, at a stage between the mounting of the different-property component and the provision of the property-related information (i.e., after the mounting of the different-property component before the provision of the property-related information, or after the provision of the property-related information before the mounting of the different-property component), so that the property-related information can be reliably given or provided on the circuit board on which the different-property component has been mounted or is to be mounted. BSTX It is noted that, for establishing a state in which "each adjacent two of the arranged electronic-circuit-component mounters being close to each other without a gap which allows the circuit board to be taken out therethrough", the gap between each adjacent two of the arranged electronic-circuit-component mounters may be adapted to be smaller than a dimension of the circuit board as measured in a direction in which the plurality of electronic-circuit-component mounters are arranged. Specifically, this gap may be adapted to be not larger than 200 mm, 100 mm or 50 mm, for example. BSTX (6) The electronic-circuit assembling process according to any one of modes (1)-(5), including: BSTX using, as the electronic-circuit assembling system, a system including a mounter line constituted by a plurality of electronic-circuit-component mounters that are arranged in a line, with each adjacent two of the arranged electronic-circuit-component mounters being close to each other without a gap which allows the circuit board to be taken out through the gap; BSTX causing at least one of the arranged electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and BSTX causing at least one of the arranged electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the at least one of the different-property components, on the basis of the recognition of the property-related information. BSTX The associated component (i.e., the electronic circuit component, which is determined to be associated with the different-property component) may be mounted onto the circuit board by either the electronic-circuit-component mounter assigned to recognize the property-related information, or another electronic-circuit-component mounter that is other than the electronic-circuit-component mounter assigned to recognize the property-related information. In either of the former and latter cases, there is no risk that the circuit board is taken out by the operator or another circuit board is introduced by the operator, at a stage between the recognition of the property-related information and the mounting of the associated component (i.e., after the recognition of the property-related information before the mounting of the associated component), so that the associated component, which suitably corresponds to the recognized property-related information, namely, which is to be associated with the different-property component whose electrical property is represented by the recognized property-related information, can be reliably mounted on the circuit board. The different-property component and the associated component may be mounted on the same side surface of the circuit board or on respective opposite side surfaces of the circuit board. BSTX It is noted that, in the electronic-circuit assembling system, there may be provided a recognizing device that is to be used exclusively to recognize the property-related information, or there may be provided a property-related-information recognizer that is constituted by an apparatus configured to perform an operation other than the operation for mounting the electronic circuit components onto the circuit board. The recognizing device may be provided either in the mounter line or outside the mounter line. The property-related-information recognizer may be configured to recognize not only the property-related information but also other information other than the property-related information. BSTX (7) The electronic-circuit assembling process according to any one of modes (1)-(6), including: BSTX using, as the electronic-circuit assembling system, a system including a plurality of electronic-circuit-component mounters; BSTX causing at least a part of the electronic-circuit-component mounters to mount at least one of the at least one of the different-property components onto the circuit board; BSTX causing at least a part of the electronic-circuit-component mounters to provide the circuit board with the property-related information; BSTX causing at least a part of the electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and BSTX causing at least a part of the electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the at least one of the different-property components, on the basis of the recognition of the property-related information. BSTX The plurality of electronic-circuit-component mounters may be constituted by either mounters cooperating with each other to form a mounter line or mounters do not form the mounter line. Further, the mounting of the different-property component, provision of the property-related information, recognition of the property-related information and mounting of the associated component may be made by respective different ones of the electronic-circuit-component mounters, or alternatively, at least two of the these operations or works may be made by a same one of the electronic-circuit-component mounters. BSTX (8) The electronic-circuit assembling process according to any one of modes (1)-(7), including: BSTX using, as the electronic-circuit assembling system, a system including a plurality of electronic-circuit-component mounters; BSTX causing one of the electronic-circuit-component mounters to mount at least one of the at least one of the different-property components onto the circuit board; BSTX causing the one of the electronic-circuit-component mounters to provide the circuit board with the property-related information of the at least one of the at least one of the different-property components; BSTX causing another one of the electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and BSTX causing the another one of the electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the at least one of the different-property components, on the bags of the recognition of the property-related information. BSTX In the electronic-circuit assembling process according to this mode (8), the mounting of the different-property component onto the circuit board and the mounting of the associated component onto the circuit board can be carried out in parallel with each other or concurrently with each other. The provision of the property-related information on the circuit board and the recognition of the property-related information provided on the circuit board make it possible to mount, onto the circuit board, the associated component that is to be associated with the different-property component actually mounted on the circuit board. Since the mounting of the different-property component and the provision of the property-related information are both made by a same one of the electronic-circuit-component mounters, while the recognition of the property-related information and the mounting of the associated component are both made by a same one of the electronic-circuit-component mounters. Therefore, there is very little possibility that the circuit board would be taken out from the electronic-circuit-component mounter or another circuit board would be introduced into the electronic-circuit-component mounter at a stage after the mounting of the different-property component before the provision of the property-related information and also at a stage after the recognition of the property-related information before the mounting of the associated component, so that, as a consequence, it is possible to remarkably reduce a risk that a wrong component would be mounted erroneously as the associated component onto the circuit board. Besides, where the above-described one of the electronic-circuit-component mounters and the above-described another one of the electronic-circuit-component mounters cooperate with each other to form a mounter line as recited in the above mode (5) or (6), the risk of the erroneous mounting of a wrong component as the associated component can be further reduced. BSTX (9) The electronic-circuit assembling process according to any one of modes (1)-(8), including: BSTX using, as the electronic-circuit assembling system, a system including a mounter line constituted by a plurality of electronic-circuit-component mounters each having a mounting device; BSTX causing the mounting device of one of the plurality of electronic-circuit-component mounters, to hold, in place of a mounting head configured to mount the electronic circuit components on the circuit board, a property-related-information providing head configured to provide the circuit board with the property-related information; and BSTX causing the one of the plurality of electronic-circuit-component mounters to provide the circuit board with the property-related information. BSTX The above-described one of the electronic-circuit-component mounters in which the property-related-information providing head, in place of the mounting head, is held by the mounting device may be either an intermediate one or a final one (i.e., downstream most one) of the mounters in the mounter line. In the former case, the mounting of the different-property component is made by a part of the mounters, and the provision of the property-related information is made by the above-described intermediate one of the mounters which is located on a downstream side of a final one among the part of the mounters. The change of the mounting head into the property-related-information providing head may be made automatically or manually by the operator. The automatic head change can be made by, for example, an arrangement, as disclosed in JP-2006-261825A, in which the head is selectively clamped and undamped by selectively supplying a vacuum pressure to a head holder (holding the head) and stopping the supply of the vacuum pressure to the head holder. BSTX It might be possible to employ a property-related information providing device which does not have a component mounting function and which is to be used exclusively to provide the property-related information such that the property-related information providing device is disposed in an intermediate position or a final position within the mounter line. On the other hand, in the process according to this mode (9), the one of the electronic-circuit-component mounters can be used also as the above-described property-related information provider, thereby making it possible to provide the property-related information while avoiding an increase of required length of the mounter line and an increase of cost required for the system. Thus, saving of the space required for the system and saving of the cost required for system can be both realized. Further, in a case where the electronic circuit components not including any one of the different-property components are to be mounted onto a circuit board, or in a case where the different-property component or components not requiring provision of the property-related information are to be mounted onto a circuit board, the components can be mounted onto the circuit board by causing the mounting device to hold the mounting head without causing the mounting device to hold the property-related-information providing head. Thus, in the process according to this mode (9), it is possible to assemble various kinds of electronic circuits. BSTX (10) The electronic-circuit assembling process according to any one of modes (1)-(9), including: BSTX using, as the electronic-circuit assembling system, a system including at least one electronic-circuit-component mounter each having a plurality of mounting devices; BSTX causing one of the mounting devices to hold, in place of a mounting head configured to mount the electronic circuit components on the circuit board, a property-related-information providing head configured to provide the circuit board with the property-related information; BSTX causing the at least one electronic-circuit-component mounter to mount at least one of the at least one of the different-property components onto the circuit board; and BSTX causing the at least one electronic-circuit-component mounter to provide the circuit board with the property-related information. BSTX in the electronic-circuit assembling process according to this mode (10), the mounting of the different-property component and the provision of the property-related information can be both made in the single electronic-circuit-component mounter. Until all the operations having been scheduled to be carried out in the single electronic-circuit-component mounter are completed, the circuit board is unlikely to be taken out from the same electronic-circuit-component mounter, thereby more satisfactorily assuring matching of the electrical property value of the different-property component actually mounted on the circuit board, with the electrical property value recognized through the property-related information. BSTX It is noted that, the method of providing the circuit board with the property-related information by causing the mounting device to hold the property-related-information providing head in place of the mounting head, as described in the above mode (9) or (10), can be employed in a case where the circuit board is to be provided with a circuit-board identifier that identifies the circuit board. The provision of the circuit-board identifier on the circuit board makes it possible to identify each circuit board and to utilize the identification of each circuit board, for example, in preparation of a record of operations carried out for assembling the electronic circuits. The features recited in the above mode (9) or (10) may be employed independently of any one of the features recited in the above-modes (1)-(8). BSTX (11) The electronic-circuit assembling process according to any one of modes (1)-(10), wherein the property-related information providing step is carried out by causing a printing head to print the property-related information onto the circuit board. BSTX The printing head may be substantially identical in construction with either a printing head of an inkjet printer or a printing head of a printing mechanism of a laser printer. As the printing mechanism using a laser beam, a laser marker may be employed, for example. As disclosed in JP-H11-87805A and JP-H06-143689A, for example, the laser marker is constructed to include a laser beam source configured to irradiate the laser beam, a focusing lens and a mirror, and is configured to record characters or the like on a surface of a print object by applying heat onto the surface of the print object. BSTX (12) The electronic-circuit assembling process according to any one of modes (1)-(11), including: BSTX using, as the electronic-circuit assembling system, a system including an electronic-circuit-component mounter having a mounting device; BSTX installing a plurality of component suppliers on the electronic-circuit-component mounter; BSTX causing the plurality of component suppliers to supply, as the at least one of the different-property components, a plurality of kinds of different-property components which are different with respect to level of the electrical property, value, such that each one of the kinds of different-property components are to be supplied from a corresponding one of the component suppliers; and BSTX causing the electronic-circuit-component mounter to mount the plurality of kinds of different-property components supplied from the component suppliers, onto the circuit board supported by the board supporting device. BSTX Even where the different-property components of a single kind are to be mounted on a single circuit board, if the different-property components of the single kind becomes zero or insufficient for completing mounting of a required number of different-property components of the single kind, the different-property components of the same kind may be changed to the different-property components of another kind so that the different-property components of a plurality kinds are mounted onto the single circuit board. BSTX By obtaining the different-property-component-related information, the level of the electrical property value of the different-property component (that is to be supplied) and the supply position of the electrical property value can be known, thereby making it possible to mount, onto the circuit board, the different-property component having a required level of the electrical property value and to replace the kind of the different-property component, to be mounted onto the circuit board, with another kind of the different-property component. BSTX (13) The electronic-circuit assembling process according to mode (12), wherein each one of the plurality of kinds of different-property components, which are to be mounted onto the circuit board, consist of a plurality of different-property components. BSTX (14) The electronic-circuit assembling process according to mode (13), including: BSTX determining a plurality of mount-position groups such that each one of determined plurality of mount-position groups is constituted by a plurality of mount positions in which the plurality of different-property components are to be mounted onto the circuit board; and BSTX mounting the different-property components which are the same as each other with respect to the electrical property value, onto the respective mount positions of each one of the plurality of mount-position groups, BSTX wherein the property-related information providing step is implemented by providing the circuit board with the property-related information such that the provided property-related information is correlated with each one of the plurality of mount-position groups. BSTX The "different-property components which are the same as each other with respect to the electrical property value" may be interpreted to encompass "different-property components which are the same as each other with respect to a nominal value of the electrical property value and an error level (i.e., the different-property components which are the same as each other with respect to the nominal value of the electrical property value and the level of a difference between the nominal value and an actual value of the electrical property value)" and "different-property components which are the same as each other with respect to level of the electrical property value (i.e., the different-property components having the respective electrical property values that belong to the same one of a plurality of different levels of the electrical property value). BSTX Since the different-property components, which are to be mounted into the respective mount positions of each one of the plurality of mount-position groups, are the same as each other with respect to the electrical property, the property-related information does not have to be provided in correlation with each one of the different-property components mounted in the respective mount positions of each one of the mount-position groups, as long as the property-related information is provided in correlation with each one of the plurality of mount-position groups. BSTX (15) The electronic-circuit assembling process according to any one of modes (1)-(14), including: BSTX mounting a plurality of light emitting diodes as the at least one of the different-property components, onto the circuit board; BSTX providing the circuit board with, as the property-related information, a brightness-level-related information that enables recognition of a brightness level as the electrical property value of the light emitting diodes; and BSTX mounting, onto the circuit board, at least one resistor as at least one of the electronic circuit components, which has a resistance value determined based on the bright level, and which is determined to be associated with the light emitting diodes, on the basis of the recognition of the bright level. BSTX In recent years, there is a need for a technique for mounting a multiplicity of electronic circuit components that are identical with one another or the same as each other, onto a single circuit board. As an example of such a technique, there is known a technique for mounting a multiplicity of light emitting diodes (hereinafter simply referred to as "LEDs") onto a single circuit board, for thereby manufacturing light sources such as a television display, a computer display, a backlight for a vehicle's instrument panel indicator, vehicle's backlight and frontlight and a general purpose luminaire. BSTX LED has many advantages such as high energy efficiency, long service life and low cost. However, in today's manufacturing technology, it is still difficult to manufacture LED such that the manufactured LED is provided with a highly accurate and constant brightness. The backlight or the like is required to have brightness that is uniform over an entirety of its light emitting surface. The LED is sensibly influenced by factors such as change of environment (e.g., temperature and humidity) in process of manufacture of the LED. For example, its property, particularly, its brightness exhibited upon supply of a rated current to the LED is likely to be variable depending on variation of the manufacture environment. That is the LED corresponds to a property-variable component which has an electrical property value that is variable at a plurality of levels and which could be, for example, handled as if being a property-non-variable component (i.e., electronic circuit component whose electrical property is not variable at a plurality of levels) in a case where a control is performed to merely control mounting of the component onto the circuit board. In other words, the LEDs correspond to the above-described different-property components which have respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and which can be handled as if being components that are same as each other, in a control for controlling mounting of the components onto the circuit board. In view of this, the LEDs are sorted into a plurality of groups of respective different brightness levels, and the LEDs sorted into the same group and having the same brightness levels are mounted onto a single circuit board or onto each one of a plurality of areas within the single circuit board, so that it is considered that the brightness could be made uniform over n entirety of the light emitting surface, by controlling an electric current (that is supplied to each of the LEDs) by at least one resistor. In the electronic-circuit assembling process according to this mode (15), owing to the provision of the brightness-level-related information onto the circuit board together with the mounting of the LEDs onto the circuit board, it is possible to mount, onto the circuit board, the at least one resistor suitable for the brightness of the LEDs that have been actually mounted onto the circuit board. For example, even in a case where the LED actually mounted on the circuit board has a brightness level that mismatches with a predetermined brightness level for some reason, the property-related information that is provided after the mounting of the LEDs onto the circuit board makes it possible to reliably mount, onto the circuit board, the at least one resistor which is suitable for the brightness of the LEDs having been actually mounted onto the circuit board, namely, which is to be associated with the actually mounted LEDs. BSTX Where the plurality of LEDs are mounted onto the circuit board, the at least one resistor as the associated component may be mounted so as to be associated with each one of the LEDs, or mounted commonly for two or more of the LEDs so as to be associated with the two or more of the LEDs. The LEDs, each of which are to be associated by the at least one resistor, may correspond to either all the LEDs mounted on the circuit board or a part of the LEDs mounted on the circuit board. Similarly, the LEDs, whose brightness level is represented by the brightness-level-related information, may correspond to either all the LEDs mounted on the circuit board or a part of the LEDs mounted on the circuit board. BSTX It is noted that the brightness-level-related information may include not only the brightness level as such but also another information having one-to-one correspondence with the brightness level. BSTX (20) An electronic-circuit assembling system for assembling an electronic circuit, by supplying a plurality of electronic circuit components from at least one component supplier of a component supplying device, and mounting the plurality of electronic circuit components onto a circuit board, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, BSTX the electronic-circuit assembling system including: BSTX a different-property-component-related information obtaining portion configured to obtain a different-property-component-related information including (i) a property-related information that enables recognition of the electrical property of the at least one of the different-property components which is supplied from at least one of the at least one component supplier and (ii) a different-property-component supply position that is a position of the at least one of the at least one component supplier supplying the at least one of the different-property components, BSTX a mounting controlling portion configured, based on information of the different-property-component supply position obtained by the different-property-component-related information obtaining portion, to cause the at least one of the different-property components to be mounted onto the circuit board; and BSTX a property-related information providing portion configured to provide the circuit board with the property-related information which has been obtained by the different-property-component-related information obtaining portion. BSTX The property-related information providing portion may be provided in the electronic-circuit-component mounter having the different-property-component-related information obtaining portion or may be provided apart from the electronic-circuit-component mounter having the information obtaining portion. BSTX It is noted that the technical features described, in any one of above modes (2)-(15) are applicable to the electronic-circuit assembling system to this mode (20). BSTX (21) An electronic-circuit assembling system for assembling an electronic circuit, by mounting a plurality of electronic circuit components onto a circuit board, wherein the plurality of electronic circuit components includes at least one of different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and wherein the different-property components can be handled as being components that are same as each other, in a control for controlling mounting of the components onto the circuit board, BSTX the electronic-circuit assembling system comprising: BSTX (a) a board supporting device configured to support the circuit board; BSTX (b) a component supplying device including (b-1) a plurality of component suppliers each of which is configured to store therein ones of the plurality of electronic circuit components that are categorized as one kind of electronic circuit components, and each of which is configured to sequentially supply the categorized ones of the plurality of electronic circuit components and (b-2) a component-supplier holder having a plurality of holding portions holding the component suppliers; and BSTX (c) an electronic-circuit-component mounter including a mounting device configured to receive the plurality of electronic circuit components supplied from the component supplying device and to mount the electronic circuit components onto the circuit board supported by the board supporting device; BSTX the electronic-circuit assembling system further comprising: BSTX a different-property-component-related information obtaining portion configured to automatically detect a different-property-component-related information including (i) a property-related information that enables recognition of the electrical property of at least one of the at least one of the different-property components which is stored in at least one of the plurality of component suppliers and (ii) a holding-portion position that is a position of one of the plurality of holding portions which holds the at least one of the plurality of component suppliers, such that the different-property-component-related information is obtained by detecting at least the property-related information; BSTX a mounting controlling portion configured, based on information of the holding-portion position obtained by the different-property-component-related information obtaining portion, to cause the mounting device to receive the plurality of electronic circuit components including the at least one of the different-property components, from the component supplying device, and to cause the mounting device to mount the plurality of electronic circuit components onto the circuit board supported by the board supporting device; and BSTX a property-related information providing portion configured to provide the circuit board onto which the at least one of the different-property components has been mounted by operation of the mounting controlling portion, with the property-related information which has been obtained by the different-property-component-related information obtaining portion. BSTX It is noted that the technical features described in any one of above modes (2)-(15) are applicable to the electronic-circuit assembling system to this mode (21). DETX BRIEF DESCRIPTION OF THE DRAWINGS DETX The above and other objects, features, advantages and technical and industrial significance of the present invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings, in which: DETX FIG. 1 is a front view showing an external appearance of an electronic-circuit assembling system that is to be used for carrying out an electronic-circuit assembling process according to an embodiment of the claimable invention; DETX FIG. 2 is a perspective view showing a construction of a mounting module as a component of the electronic-circuit assembling system of FIG. 1, with an outside cover of the mounting module being partially cut away to illustrate an internal construction of the mounting module; DETX FIG. 3 is a plan view schematically showing a component supplier device of the mounting module of FIG. 2; DETX FIG. 4 is a perspective view schematically showing a component mounter of the mounting module of FIG. 2; DETX FIGS. 5A and 5B are a set of view showing two examples of a mounting head that is a part of the mounter of the mounting module of FIG. 2; DETX FIG. 6 is a perspective view showing an internal construction of the example of the mounting head shown in FIG. 5B; DETX FIG. 7 is a perspective view showing a printing head that is to be used as a substitution of the mounting head; DETX FIG. 8 is a block diagram showing a part of a control system in the mounting module of FIG. 2; DETX FIG. 9 is a view showing a surface of a backlight as an example of an electronic circuit that is to be assembled in the electronic-circuit assembling process; DETX FIGS. 10A, 10B, 10C, 10D are set of views each schematically showing a diagram of a resistor circuit and also an arrangement of resistors for establishing the resistor circuit; DETX FIG. 11 is a flow chart showing an operation flow according to the electronic-circuit assembling process; DETX FIG. 12 is a view showing a part of a mount data created by execution of a part of the operation flow of FIG. 11; DETX FIG. 13 is a view showing another part of the mounting data; DETX FIG. 14 is a view showing, by way of example, a substrate-piece/brightness-level correlation table that is obtained as a result of mounting of LEDs onto a multi-piece substrate by execution of the operation flow; DETX FIG. 15 is a flow chart showing a part of a mounting program that is to be stored in a module controller, for executing another part of the operation flow; and DETX FIG. 16 is a view showing an external appearance of an electronic-circuit assembling system according to another embodiment of the invention. DETX DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS DETX There will be described embodiments of the claimable invention, by reference to the accompanying drawings. It is to be understood that the claimable invention is not limited to the embodiments, and may be otherwise embodied with various changes and modifications, such as those described in the foregoing "VARIOUS MODES OF THE INVENTION", which may occur to those skilled in the art. DETX FIG. 1 shows an electronic-circuit assembling system (hereinafter simply referred to as "assembling system") that is to be used for carrying out an electronic-circuit assembling process. This assembling system includes a substrate ID reading unit 1, a solder printer 3, another substrate ID reading unit 4, a mounter line 5 and a reflow furnace 6 that are arranged in a single line in this order of description, such that the substrate ID reading unit 1 is located in an upstream end position while the reflow furnace 6 is located in a downstream end position. Each of the substrate ID reading units 1, 4 is configured to read a circuit-board identifier (hereinafter simply referred to "substrate ID") that is given or provided on a circuit board. The substrate ID may be represented by a barcode, for example. Each of the substrate ID reading units 1, 4 may be constituted by a barcode reader, for example. The solder printer 3 includes a controller that is constituted principally by a computer, and is configured to print a cream solder onto the circuit board, so that the printed cream solder serves to temporarily attach electronic circuit components onto the circuit board. The solder printer 3 may be constituted by a screen printer, for example. The mounter line 5 is constituted by a plurality of mounting modules 10 fixed to a plurality of bases 12 that are arranged side-by-side. Each adjacent four of the mounting modules 10 are arranged side-by-side, and are fixed to a corresponding one of the bases 12 which is common to the adjacent four mounting modules 10. The mounting modules 10 may be referred also to as electronic-circuit-component mounters, and are configured to mount the electronic circuit components onto the circuit board. The mounting modules 10 are assigned to perform respective assigned works in operations for mounting the electronic circuit components onto the circuit board, in parallel with each other, so that it is possible to reduce a cycle time required to mount the electronic circuit components onto the circuit board, as compared with a case in which the mounting operations are carried out by a single electronic-circuit-component mounter. The reflow furnace 6 is provided to fuse the cream solder by heating the cream solder and then to solder the electronic circuit components onto a printed circuit of the circuit board. The substrate ID reading units 1, 4, solder printer 3, mounting modules 10 and reflow furnace 6 will be hereinafter referred to as "component apparatuses" of the assembling system, which are generic terms of the ID reading units 1, 4, solder printer 3, mounting modules 10 and reflow furnace 6. DETX Each of the mounting modules 10 has a construction which is described in detail, for example, in JP-2004-104075A, so that its parts not related to the claimable invention will not be described in detail. DETX As shown in FIG. 2, each of the mounting modules 10 includes a module main body 18 as a main body frame, a circuit-board conveying device 20, a circuit-board holding device 22, a fiducial-mark-image taking device 28 (see FIG. 4), a component-image taking device 30 and an electric controlling device 32. DETX As shown in FIG. 2, the module main body 18 includes: a bed 36 that is elongated in a front-rear direction (i.e., Y-axis direction) of the mounting module 10; two front columns 38 that extend upwardly from a front end portion of the bed 36; two rear columns 40 that extend upwardly from a rear end portion of the bed 36; and a crown 42 that is supported by the four columns 88, 40. The crown 42 is constituted by a beam 44 as a reinforcing member and a cover 46 covering an upper side surface of the beam 44. DETX As shown in FIG. 2, the circuit-board conveying device 20 includes two circuit-board conveyors 54, 56, and is configured to convey each circuit board 57 (positioned in a central portion of the bed 86 in the front-rear direction of the mounting module 10), in a horizontal direction that is parallel to a direction in which the plurality of mounting modules 10 are arranged. The conveyance of each circuit board 57 is performed by at least one of the circuit-board conveyors 54, 56. The mounting modules 10, which cooperate with one another to form the mounter line 5, are arranged with each adjacent two of the arranged mounting modules 10 being close to each other without a gap which allows the circuit board 58 to be taken out through the gap. The transfer of the circuit board 57 between each adjacent two of the arranged mounting modules 10 is performed directly by cooperation of one of the circuit-board conveyors 54, 56 of one of the adjacent two mounting modules 10 and a corresponding to the circuit-board conveyors 54, 56 of the other of the adjacent two mounting modules 10. The gap between each adjacent two of the mounting modules 10 is adapted to be smaller than a dimension of a smallest kind of circuit boards 57 as measured in a circuit-board conveyance direction (in which the circuit boards 57 are to be conveyed), wherein the dimension of the smallest kind of circuit boards 57 is the smallest among those of all the kinds of circuit boards 57 onto which the electronic circuit components are to be mounted. In the present embodiment, this gap is 80 mm. Each of upstream-most one and downstream-most one of the plurality of mounting modules 10 forming the mounter line 5 is provided with an openable and closable cover, for opening and closing an opening (that is not what is provided for allowing loading/unloading of the circuit board) which is located on a side remote from another one of the mounting modules 10 that is adjacent to the upstream-most one or downstream-most one of the mounting modules 10. With this openable and closable cover being closed, an operator is not allowed to introduce his hand into the mounting module 10. DETX The circuit-board holding device 22 is provided in each of the two circuit-board conveyors 54, 56, and includes a board supporting device 48 and clamping members (not shown), such that the circuit board 57 takes a posture that causes its mount surface (onto which the electronic circuit components are to be mounted) to be held in parallel to a horizontal plane while the circuit board 57 is being held by the board supporting device 48. The board supporting device 48 includes: a plurality of supporting members (not shown) that are to support the circuit board 57 from the lower side; and a supporting base 50 supporting the supporting members. Each of the circuit-board conveyors 54, 56 is provided in a pair of side frames, and the clamping members are provided on the pair of side frames. The clamping members cooperate with pressing portions of the respective side frames, so as to grip opposite end portions of the circuit board 57 (which are parallel to the circuit-board conveyance direction) from the upper and lower sides of the board 57. In the following descriptions regarding the present embodiment, the circuit-board conveyance direction is referred to as X-axis direction while a direction orthogonal to the X-axis direction (on a horizontal plane, i.e., a plane parallel to the mount surface of the circuit board 57 held by the circuit-board holding device 22) is referred to as Y-axis direction. DETX As shown in FIG. 2, the component supplying device 24 is provided on a front side of the mounting module 10, i.e., on one of opposite sides, in the Y-axis direction, of the bed 36, which is remote from the circuit-board conveying device 20. The component supplying device 24 is configured to supply the electronic circuit components, for example, by means of tape feeders (hereinafter simply referred to as "feeders") 58. The component supplying device 24 includes, in addition to the plurality of feeders 58, a feeder holding base 160 (see FIG. 3) (hereinafter simply referred to as "holding base 150") serving as a component-supplier holder in the form of a feeder holder that holds the feeders 58. Each of the feeders 58 includes a feeding device 59 (see FIG. 8) that is configured to intermittently feed a component holding tape holding the multiplicity of electronic circuit components that are identical with one another, such that the component holding tap is fed by a constant distance (that corresponds to a pitch between each adjacent two of the electronic circuit components held by the component holding tap) in each one of the successive feed motions. DETX In the present embodiment, the holding base 150 is fixed onto the bed 36, and has a plurality of slots 152 (e.g., T slots) which extend in the Y-axis direction and which are equally spaced apart from each other in the X-axis direction, a shown in FIG. 3. The holding base 150 includes a vertically extending wall portion 154 that extends upwardly from a rear end portion (i.e., one of opposite end portions which is located on the side of the circuit-board conveying device 20) of the holding base 150. The vertically extending wall portion 154 has positioning holes and connectors (not shown) such that each pair of the positioning holes and each of the connectors are provided in a portion of the wall portion 154 which corresponds to a corresponding one of the slots 152. Each of the slots 152 cooperates with the corresponding portion in which the corresponding pair of positioning holes and the corresponding connector are provided, to constitute a holding portion 156. Thus, the holding base 150 has the plurality of holding portions 156. DETX Each of the feeders 58 is fitted, at a rail (not shown) provided on its lower surface, in a corresponding one of the slots 158. Each feeder 58 is positioned, in a predetermined position relative to the holding base 150, with a pair of positioning protrusions provided on a front surface of the feeder 58, being fitted in the above-described pair of positioning holes. Further, by manually operating an engaging device (not shown) by the operator, the plurality of feeders 58 as component suppliers are detachably fixed onto the holding base 150 such that the fixed feeders 58 are arranged in the X-axis direction. The plurality of holding portions 156 of the holding base 150 are located in respective holding-portion positions which define install positions in which the feeders 58 is installed to be held by the respective holding portions 156. Each of the install positions serves also as a component supply position in which the electronic circuit components are to be supplied from the corresponding feeder 58 held by the corresponding holding portion 156. The above-described connector of each of the holding portions 156 has a communicating portion 112 (see FIG. 8) and an electric power supplying portion (not shown), while a connector provided on the above-described front surface of each of the feeders 58 has a communicating portion 114 (see FIG. 8) and an electric-power receiving portion (not shown). Therefore, when each feeder 58 is installed on the corresponding holding portions 156, the connectors are connected to each other, so that the communicating portions 112, 114 become communicable with each other while an electric power can be supplied to the power receiving portion via the power supplying portion. DETX As shown in FIGS. 2 and 4, the mounting device 26 has a mounting head 60 (60a, 60b) and a head moving device 62 configured to move the mounting head 60 (60a, 60b). As shown in FIG. 4, the head moving device 62 has a X-axis direction moving device 64 and a Y-axis direction moving device 66. The Y-axis direction moving device 66 has a linear motor 70 which is provided in the crown 42 of the module main body 18 and which extends so as to bridge over a component supplying portion of the component supplying device 24 and the two circuit-board holding devices 22, so that a Y-axis slide 72 as a movable unit is movable to be positioned in a desired position by operation of the linear motor 70. In the present embodiment, the X-axis direction Moving device 64 is disposed on the Y-axis elide 72, and has first and second X-axis slides 74, 76 and two X-axis slide moving devices 78. The first and second X-axis slides 74, 76 are movable relative to the Y-axis slide 72 in the X-axis direction, and each of the X-axle slides 74, 76 is movable relative to the other of the X-axis slides 74, 76 in the X-axis direction. The two X-axis slide moving devices 78 are configured to moved the respective first and second X-axis slides 74, 76 in the X-axis direction. (In FIG. 4, only one of the two X-axis slide moving devices 78 which is configured to move the second X-axis slide 76 is shown.) Each of the two X-axis slide moving devices 78 includes, for example, a drive source in the form of an electric rotary motor (e.g., servo motor with rotary encoder) and a feed screw mechanism constituted by a ball screw and a nut, and is configured to move a corresponding one of the X-axis slides 74, 76 to a desired position. In the present embodiment, the drive source of each of the two X-axis slide moving devices 78 is constituted by the electric rotary motor in the form of a servo motor whose angular position is accurately controllable. DETX The mounting head 60 is detachably attached to the second X-axis slide 76, and is to be moved, by the head moving device 62, to be positioned in a desired position within a movement area, i.e., a mounting operation area that bridges over the component supplying portions of the component suppliers 24 and the two circuit-board holding device 22. The mounting head 60 is detachably attached to the second X-axis slide 76 by means of an attachment mechanism that has substantially the same construction as an attachment mechanism, for example, which is disclosed in JP-2004-221518A, so that the attachment mechanism will not be described and shown in the drawings. The mounting head 60 configured to hold the electronic circuit components through suction nozzles 86 (86a, 86b) as a kind of component holders. In the present embodiment, there are available various kinds of mounting heads 60 which are different from each other with respect to the number of nozzle holders as examples of component-holder holding portions each holding the suction nozzle 86, so that a selected one of the mounting heads 60, which is selected depending on kind of the circuit board 57 (onto which the electronic circuit components are to be mounted), is attached to the second X-axle slide 76. DETX For example, a mounting head 60a as shown in FIG. 5A has a single nozzle holder 88a that holds one suction nozzle 86a, while a mounting head 60b as shown in FIG. 5B has a total of twelve nozzle holders 88b, so as to be capable of holding twelve suction nozzles 86b as a maximum number of suction nozzles 86b. The number of the nozzle holders 88b does not necessarily have to be twelve but may be any number not smaller than two, preferably, not smaller than three. Each of the suction nozzles 86 includes a suction tube 90 and a background defining plate 92. In the present embodiment, there are available various kinds of suction nozzles 86 which are different in at least one of a diameter of the suction tube 90 (as measured at its suction surface) and a diameter of the background defining plate 92 (that has a circular shape in its, plan view), so that one of the suction nozzles 86 is selected depending on the electronic circuit components (that are to be sucked) so as to be used. The suction surface and the background defining plate 92a of the suction nozzle 86a have respective diameters larger than those of the suction surface and the background defining plate 92b of the suction nozzle 88b. The suction nozzle 86a is used to mount large-sized electronic circuit components. DETX In the mounting head 60a, the nozzle holder 88a is vertically movable and rotatable by a movement device (not shown) that is provided in a main body of the mounting head 60a. The movement device serves as an elevating device and a rotating device, and is axially or vertically movable and rotatable about its axis relative to the main body of the mounting head 60a. As shown in FIG. 6, the mounting head 60b is a rotary-type mounting head having has a main body 96, a rotary body 100 which is attached to the main body 96 and which is rotatable about a vertical axis, and a rotating device 102 configured to rotate the rotary body 100 in forward or reverse direction by a desired degree of angle. The twelve nozzle holders 88b are disposed on respective portions of the rotary body 100 that are located in respective twelve positions which lie on a circle (whose center corresponds to the above-described vertical axial) and which are circumferentially spaced apart from each other by a suitable interval. In the present embodiment, the twelve positions are equi-angularly spaced apart from each other in a circumferential direction. Each of the twelve nozzle holders 88b is rotatable about its axis, and is movable in parallel to the above-described vertical axis relative to the rotary body 100. Each of the suction nozzles 86b is detachably held by a distal end portion of a corresponding one of the nozzle holders 88b, namely, by a lower end portion of the corresponding nozzle holder 88b in a state in which the mounting head 60b is attached to the second X-axis slide 76. DETX The twelve nozzle holders 88b (each of which is rotatable about its axis, as described above) are rotated about the above-described vertical axis by rotation of the rotary body 100 about the vertical axis, so as to be sequentially positioned in a component suction position (i.e., a component picking position) that corresponds to a predetermined one of twelve stop positions. When each of the nozzle holders 88b is positioned in the component suction position, the nozzle holder 88b is vertically moved by a movement device in the form of an elevating device 104 disposed in a portion of the main body 96 of the mounting head 60b, which portion positionally corresponds to the component suction position. Further, the nozzle holder 88b is rotated about its axis by a holder rotating device 106 that is provided in the main body 96. As shown in FIG. 3, the fiducial-mark-image taking device 28 is mounted on the second X-axis slide 76, and is movable together with the mounting head 60 by the head moving device 62. DETX To the second X-axis elide 76, as shown in FIG. 7, a printing head 170 as a property-related-information providing head can be attached in place of the mounting head 60. In the present embodiment, like a printing head of an inkjet printer, the printing head 170 is configured to eject ink droplets onto a recording object so as to print characters, numbers, signs, figures or the like on the recording object. To this end, the printing head 170 includes a printer 172 vertically movably disposed on a head main body (not shown) and a printer elevating device (not shown) configured to vertically move the printer 172. The printer 172 includes an ink tank 174, an ink ejecting portion 176 and an actuator mechanism 178 that is configured to eject ink droplets formed of ink stored in the ink tank 174, through nozzles provided in the ink ejecting portion 176, for example, by deformation of piezoelectric elements. The nozzles having respective ejection openings are arranged in a single nozzle row or a plurality of nozzle rows. When the printing head 170 is being attached to the second X-axis slide 76, the nozzle row or rows are parallel to the Y-axis direction while the ejection openings of the respective nozzles face downwardly. DETX The printing head 170 is provided with a barcode reader 180 as an information reading device that is a kind of an information recognizing device, and serves also as an information reading head as an information recognizing head. When the printing head 170 is being attached to the second X-axis slide 76, a reading portion 182 of the barcode reader 180 faces downwardly and is elongated in the X-axis direction. Further, with the printing head 170 being attached to the second X-axis slide 76, the reading portion 182 is positionable in a height position that permits the reading portion 182 to read the barcode printed on the circuit board 57 without interfering with any other components of the mounting module 10. The printing head 170 is detachably attached to the second X-axis slide 76 through an attachment mechanism having the same construction as the above-described attachment mechanism through which the mounting head 60 is attached to the second X-axis slide 76. The mounting module 10 in which the printing head 170 is attached serves as a printing module 10 as a printer that is a kind of property-related information provider, and serves also as an information reading module 10 as an information reader that is kind of a property related information recognizer. DETX Each mounting module 10 is provided with a module controller 108 as a part of the above-described electric controlling device 32. As shown in FIG. 8, the module controller 108 is configured to control the circuit-board conveying device 20, circuit-board holding device 22, mounting device 26, fiducial-mark-image taking device 28 and component-image taking device 30. Meanwhile, each feeder 58 is provided with a feeder controller 110 that is configured to control the feeding device 59, as shown in FIG. 8. The module controller 108 and the feeder controller 110 are constituted principally by respective computers, and are held in communication with each other via the above-described communicating portion 112 provided in the holding portion 156 of the holding base 150 and the above-described communicating portion 114 provided in the feeder 58, so that various informations can be supplied from one of the two controllers 108, 110 to the other of the two controllers 108, 110. Where the printing head 170 is being attached to the second X-axis slide 76, the printing head 170 is controlled by the module controller 108 to print and read the barcode. DETX In the present embodiment, a backlight for personal computer display is assembled by mounting a multiplicity of light emitting diodes (hereinafter referred to as "LEDs") 122 as a kind of different-property components onto a multi-piece substrate 120 as shown in FIG. 9, by operations of the assembling system constructed as described above. The multi-piece substrate 120 is constituted by a total of M pieces of elongated substrate pieces 124 that are connected to one another via a frame portion 126. Onto a surface of each substrate piece 124, a total of N pieces of LEDs 122 having the same brightness level are to be mounted to be arranged in a single row. That is, on an entirety of the multi-piece substrate 120, the LEDs 122 are arranged in M rows and N lines at a constant pitch in both of the row and line directions, such that the LEDs 122 arranged in each of the M rows are required to have the same brightness level. After the LEDs 122 have been mounted onto the multi-piece substrate 120, the multi-piece substrate 120 are divided into M pieces of LED bars by cutting off the frame portion 126. The brightness level of the LEDs 122 in any one of the LED bars have to be constant or uniform over an entirety of the LED bar, although the brightness level of the LEDs 122 in any one of the LED bars may be different from that of the LEDs 122 in the others of the LED bars. DETX The brightness of the LED 122 upon supply of a rated current thereto is inevitably variable depending on a condition of environment (e.g., temperature and humidity) at which the LED 122 is manufactured. In view of this, after having been manufactured, the LEDs 122 are sorted into a plurality of groups of respective different brightness levels (e.g., 100 levels), so that the LEDs 122 sorted into the same group and having the same brightness level are stored in a single carrier tape. The carrier tape storing the LEDs 122 of the same brightness level is wound on a single reel 140 (see FIG. 2), and is a product that is to be distributed to a market. In the present embodiment, the reel 140 is provided with a barcode 142 representing information including the type and brightness level of the LEDs 122 stored in the carrier tape that is wound on the same reel 140. Further, in the present embodiment, the information represented by the barcode 142 includes also a reel identifier in the form of a reel ID of the reel 140 and a number of the LEDs 122 stored in the carrier tape as a new carrier tape. The feeder 58 is provided with a barcode 144 representing information including at least a feeder identifier in the form of a feeder ID of the feeder 58. The reel ID corresponds to a component-holding-member-identification-related information, while the feeder ID corresponds to a component-supplier-identification-relate information. DETX As described above, all the LEDs as the electronic circuit components mounted onto the multi-piece substrate 120 are the same in kind and type but are different in brightness level at a plurality of levels. Since the brightness of the backlight has to be constant or uniform over its entire surface, the LEDs 122 of the same brightness level are mounted onto each of the substrate pieces 124, and the electric currents supplied to the LEDs 122 are controlled through resistors, so that the brightness values of the LEDs 122 constituting the entirety of the backlight can be equal to one another. In general, a backlight manufacturer is required to manufacture a backlight by using the LEDs 122 which are available to the manufacturer and which are likely to be different in the brightness value at a plurality of different levels. There will be described a case with conditions that (1) the number of the available LEDs 122 is larger than a number of LEDs 122 required for a certain number of the backlights that are projected to be manufactured, (2) the available LEDs 122 are different in the brightness level at a plurality of different levels, (3) the available LEDs 122 are sorted into a plurality of groups depending on the brightness level, and the LEDs 122 having the same brightness level and sorted into the same group are stored together with one another, and (4) the number of the LEDs 122 of each group is known. DETX In the present embodiment, as shown in FIG. 9, the LEDs 122 are mounted onto the surface of each of the M pieces of substrate pieces 124 of the multi-piece substrates 120, and at least one resistor 190 (see FIG. 10) as at least one associated component, which is to be associated with the mounted LEDs 122, is also mounted on the surface of the substrate piece 124. In addition, a barcode representing information related to the substrate piece 124 is printed on the surface of the substrate piece 124. In the present embodiment, the LEDs 122 are mounted in an area within each of the substrate pieces 124, wherein this area corresponds to a LED mount area 192 as a predetermined different-property-component mount area onto which the different-property components having the same electrical property value are to be mounted. Thus, the number of the LED mount areas 192 provided on the multi-piece substrate 120 as a single circuit board is M. In the present embodiment, the surface of each substrate piece 124 is sectioned into the LED mount area 192, a resistor mount area 194 and a barcode print area 196 which are constituted by respective portions of the surface of the substrate piece 124. The resistor mount area 194 serves as an associated-component mount area in which the resistor or resistors 190 are to be mounted. The barcode print area 196 serves as a barcode provision area as a kind of an information record area or a property-related information provision area. The information related to each substrate piece 124 includes at least the brightness level of the LEDs 122 mounted onto the same substrate piece 124. In the present embodiment, the brightness level corresponds to the electrical property value, and the brightness level as such serves as a property-related information by which the electrical property value or level of the LEDs 122 are recognizable. The barcode printed in the barcode print area 196 represents particular informations, so that the substrate piece 124 is provided with the brightness level of the LEDs 122, by printing of the barcode in the barcode print area 196. It is noted that the property-related information may be include, in addition to the information related to the brightness level, information representing an identification number of the substrate piece 124, for example. DETX In the resistor mount area 194 of each of the M pieces of substrate pieces 124, there is formed a resistor circuit 200 (in which the resistors 190 are to be provided), as partially shown in (a2) of FIG. 10A. The resistor circuit 200 has a plurality of connection terminals 202 which are arranged such that the provided resistors 190 can be connected in series and/or parallel with one another. DETX The resistors 190 consist of a plurality of kinds of resistors that different from one another in resistance value at a plurality of levels. Therefore, similarly with the LEDs 122, the resistors 190 are sorted into a plurality of groups of respective different resistant values, so that the resistors 190 sorted into the same group and having the same resistance value are stored in a single carrier tape. The carrier tape storing the resistors 190 of the same resistance value is wound on the single reel 140. Each reel 140 is provided with the barcode 142 representing information including the type and resistance value of the resistors 190 stored in the carrier tape that is wound on the same reel 140. Further, in the present embodiment, the information represented by the barcode 142 includes also a reel identifier in the form of a reel ID of the reel 140. The resistance value corresponds to the electrical property value of the associated component, and serves as the property-related information by which the electrical property value of the resistors 190 are recognizable. DETX In the present embodiment, the printing of the barcode and the mounting of the resistors 190 onto the substrate piece 124 are carried out, following the mounting of the LEDs 122 onto the substrate piece 124, in the mounter liner 5. To this end, in the present embodiment, among a plurality of mounting modules 10 (e.g., eight mounting modules 10) constituting the mounter line 5, the downstream-most mounting module 10 is assigned to mount the mount the resistors 190 onto the substrate piece 124, the mounting module 10 adjacent to the downstream-most mounting module 10 is assigned to serve as the printing module 10, and the other six mounting modules 10 are all, assigned to mount the LEDs 122 onto the substrate piece 124. DETX In a stage in which the LEDs 122 are mounted onto each substrate piece 124 of the multi-piece substrate 120, it may be considered that the multi-piece substrate 120 is an ordinary substrate rather than a multi-piece substrate and that the LEDs 122 of M rows and N lines are mounted onto the substrate. However, in this stage, there is a requirement that the LEDs 122 arranged in each of the M rows have to be the same to each other with respect to the brightness level. Further, in order to enable the mounting work, which are shared by the plurality of mounting modules 10, to be carried out in a minimum cycle time with maximum throughputs, it is desirable that the mounting modules 10 are assigned to work for the same number of rows, and that, if the number M of the rows is a number indivisible by the number of the mounting modules 10, one of the mounting modules 10 is assigned to work for a smaller number of rows, which is smaller than a number of rows assigned by each of the other mounting modules 10. DETX Where there are a large number of LEDs 122 having the same brightness level, it is desirable that the LEDs 122 of the same brightness level are mounted by the same mounting module 10 as many as possible, in order to reduce the number of change of the brightness level, as described below. Further, it is desirable that, if all the LEDs 122 having the same brightness level cannot be mounted by the same mounting module 10, the LEDs 122 are mounted by the mounting modules 10 adjacent to each other. Moreover, in such a case, it is desirable that some of the LEDs 122 are mounted by an upstream one of the adjacent mounting modules 10 and then the other LEDs 122 are mounted by a downstream one of the adjacent mounting modules 10. DETX Further, since only one feeder 58 rather than two or more feeders 58 is operable to supply the LEDs 122 at the same stage in each one of the mounting modules 10, it might be considered that a plurality of feeders 58 do not have to be constantly installed on each mounting module 10 as long as only one feeder 58 is constantly installed on the mounting module 10. However, a plurality of feeders 58 may be installed on the mounting module 10, for enabling switching from one of the feeders 58 into another of the feeders 58, for example, when the number of the LEDs 122 remaining in the one of the feeders 58 becomes smaller than the number of the LEDs 122 that are required to be mounted on a single row. This arrangement is desirable for reducing the number of times at which the operator is required to perform a manual operation for installation of the feeders 58 onto the mounting module 10. DETX Further, in order to increase efficiency of the mounting work by the mounting module 10, it is desirable that the plurality of feeders 58 are installed in respective holding-portion positions that minimize a distance by which each LED 122 is to be carried by the mounting head 60, and it is desirable to employ, as the mounting head 60, the mounting head 60b holding the plurality of suction nozzles 86b (e.g., twelve suction nozzles 86b). DETX In the following description, the attachment of the reel 140, on which the carrier tape holding the LEDs 122 (or resistors 190) as the electronic circuit components is wound, to the feeder 58 will be referred to as "mounting", while the attachment of the feeder 58 onto the holding base 150 holding portion 156) of the component supplying device 24 will be referred to as "installation". Further, in the following description, there will be used also an abbreviated expression that "the LEDs 122 (or resistors 190) are installed on the holding base 150, component supplying device 24 or mounting module 10", where appropriate. DETX In the present embodiment, the operator mounts the reel 140 holding the LEDs 122, onto the feeder 58, and then installs the feeder 58 onto a randomly selected one of the holding portions 156 of the holding base 150 of a randomly selected one of the mounting module 10. After the manual operations have been thus carried out by the operator, the backlight is assembled in a manner dependent on the LEDs 122 actually installed on the mounting module 10. There will be described a process of assembling the backlight, by way of example, with reference to FIGS. 11-15. FIG. 11 is a flow chart showing an operation flow carried out for principally setting up an arrangement required for assembling the backlight. In FIG. 11, steps indicated by broken lines are steps that are to be implemented manually by the operator or implemented by the assembling system in accordance with commands supplied from the operator, while steps indicated by solid lines are steps that are to be implemented automatically by the assembling system. DETX The operation flow of FIG. 11 is initiated with step S41 that is implemented to carry out a previous preparation, by using a personal computer 7, for creating a part of a sequence table that is to be used for mounting the LEDs 122 of M rows and N lines onto the multi-piece substrate 120. DETX The module controller 108 of each mounting module 10 stores therein a standard mounting program that is to be used commonly for all kinds of electronic circuit assembling works, namely, that is to be used for perform standard controls of the mounting module 10, so as to receive the electronic circuit components from the component supplying device 24 and mount the components onto the circuit board held by the circuit-board holding device 22. In most cases, this standard mounting program is used in combination with a mount data (described below) so as to serve as a particular mounting program for controlling assembling of a particular electronic circuit. In the present embodiment, a backlight assembling routine designed for mounting the LEDs 122 onto the multi-piece substrate 120 is added to the standard mounting program, so as to constitute a basic backlight-assembling control program, and this basic backlight-assembling control program is used in combination with the mount data and correlation data (described below), so as to serve a particular backlight-assembling control program. To this end, various kinds of data are created for each mounting module 10. The mount data includes the sequence table shown in FIG. 12 and a device table shown in FIG. 13. The backlight assembling routine may be created by an user. However, in the present embodiment, the backlight assembling routine is created by the manufacturer and is stored in a control device. DETX FIG. 12 shows, by way of example, the sequence table shows a series of mounting operations that are to be sequentially executed. In the sequence table in which the mounting operations are listed in order of the execution, "SUBSTRATE PIECE NUMBER" represents a number of the substrate piece as a kind of name of the mount area in which the component is to be mounted by each mounting operation, "COORDINATE" represents a mount position (X, Y coordinate) in which the component is to be mounted, and "SLOT NUMBER" represents the install position or component supply position. The sequence table correlates between each substrate piece (each mount area) and the corresponding mount-position group that is constituted by a plurality of mount positions within the substrate piece. In the present embodiment, a plurality of mount-position groups are set on the circuit board. Further, in the present embodiment, each one of the mounting modules 10 is assigned to mount the LEDs 122 onto a corresponding one of the substrate pieces of each multi-piece substrate 120. In the present embodiment, since the feeder 58 on which the reel 140 is mounted is a randomly selected one of the holding portion 156 of the holding base 150, the install position is not yet determined in the stage of the previous preparation, so that, as a part of the sequence table, a date representing a correlation among the "SUBSTRATE PIECE NUMBER", "SEQUENCE NUMBER" and "COORDINATE" is created. In this stage, the device table is not created. This data representing the correlation among the "SUBSTRATE PIECE NUMBER", "SEQUENCE NUMBER" and "COORDINATE" is created as a common data that is common to all the multi-piece substrates 120 onto which the LEDs 122 are to be mounted in the mounting modules 10. DETX Thereafter, in step S42, the sequence table is transmitted to the host computer 8, and is then transmitted from the host computer 8 to the mounting modules 10 and optionally to the other component apparatuses that cooperate with the module line 5 to constitute the assembling system. Next, in step S43, the operator mounts the reel 140 storing the LEDs 122, on a randomly selected one of the feeders 58. In this instance, the operator causes the barcodes 142, 144 provided on the respective reel 140 and feeder 58, to be read by a barcode reader 210 (see FIG. 1). This barcode reader 210 is connected to the personal computer 7, the host computer 8 or another computer, so that the connected computer creates a feeder/LED correlation table that correlates between the brightness level of the LEDs 122 stored by the reel 140 and the feeder ID of the feeder 58. The created feeder/LED correlation table is transmitted to the module controller 108 of each mounting module 10 that is assigned to mount the LEDs 122 onto the corresponding substrate piece. The transmitted feeder/LED correlation table is stored in a memory of the computer of the module controller 108. The information obtained by the feeder/LED correlation table is a component-supplier/different-property-component correlation-related information. DETX Further, the above-described connected computer (to which the barcode reader 210 is connected) creates also a reel/feeder correlation table that correlates between the reel ID and the feeder ID. The created reel/feeder correlation table is also transmitted to the module controller 108. DETX Next, in step S44, the operator installs the above-described feeder 58 in a randomly selected one of the holding portions 156 of a randomly selected one of the mounting modules 10. Step S44 is followed by step S45 in which the module controller 108 of the randomly selected mounting module 10 detects the install position in which the LEDs 122 have been installed and also the brightness level of the installed LEDs 122. Since the module controller 108 of the randomly selected mounting module 10 obtains the feeder ID of each feeder 58 through the communication between the above-described communicating portions 112, 114, the module controller 108 of the randomly selected mounting module 10 can determine which one of the feeders 58 has been installed in which one of the install positions. Thus, based on information related to this determination, the above-described feeder/LED correlation table (previously obtained and stored in the memory) and the obtained feeder ID, it is possible to detect or automatically obtain a different-property-component-related information including the brightness level of the LEDs 122 and the install position of the feeder 58 that is to supply the LEDs 122 (i.e., the different-property-component supply position from which the LEDs 122 is to be supplied). The thus obtained different-property-component-related information is stored in memory means in the form of the memory of the computer. Further, the module controller 108 teaches the feeder controller 110 an initial component amount that is the number of the LEDs 122 initially stored in the feeder 58, via the communication between the communicating portions 112, 114, and the feeder controller 110 stores therein the initial component amount as a remaining component amount at an initial stage. When the carrier tape is a new one, the number of the LEDs 122 stored in the carrier tape corresponds to the initial component amount, i.e., the remaining component amount at an initial stage. DETX As described above, the module controller 108 of the randomly selected mounting module 10 can determine the install position from which the LEDs 122 are to be supplied and also the brightness level of the supplied LEDs 122, so that the operator can install the feeder 58 into a randomly selected one of the install position. However, it is desirable that the operator takes account of matters that are inherent to the mounting of the LEDs 122, when mounting the reel 140 onto the feeder 58 and installing the feeder 58 onto the mounting module 10. In the present embodiment, it is not essential that the feeder 58 is installed in accordance with a specific manufacturing plan prepared in advance, so that the backlight can be manufactured advantageously in a manner flexible and variable depending on situation changes. DETX Where there are a plurality of feeders that are arranged to supply the LEDs 122 of the same brightness level, such plurality of feeders may be installed in respective install positions. In the present embodiment, the regions for installation of the feeders 58 are predetermined such that the predetermined install regions are suitable for increasing efficiency of the mounting work by the mounting module 10. Further, in order to facilitate determination of a first one of the feeders 58 from which the LEDs 122 are to be taken in each mounting module 10 upon initiation of the assembly of backlights of each manufacturing lot, the first one of the feeders 58 is installed in a predetermined one of the install position. The other feeders 58 which are to supply the same LEDs 122 are installed in the other install positions that are adjacent to the install position of the first feeder 58. DETX With the above rule relating to the installation of the feeders 58, the LEDs 122 of a randomly selected one of the brightness levels are installed on a randomly selected one of the holding portions 156. In the present embodiment, the plurality of feeders 58 arranged to supply the LEDs 122 are installed on each of the mounting modules 10, and all of the LEDs 122 supplied from the plurality of feeders 58 have the same brightness level in some of the mounting modules 10 while all of the LEDs 122 supplied from the plurality of feeders 58 do not have the same brightness level in the other of the mounting modules 10. DETX The mount data is created by automatically adding data of "SLOT NUMBER" into the sequence table of FIG. 12 and creating the device table of FIG. 13, based on results of detection of the different-property-component-related information (install positions) of the LEDs 122. The device table of FIG. 13 correlates between each "SLOT NUMBER" and the corresponding "LED" as a "COMPONENT NAME". The "COMPONENT NAME" is represented actually by a model number, and data indicative of shape and dimensions of each LED 122 as data defining contour of each electronic circuit component is read out from the database stored in the host computer 8, based on the model number. The read data indicative of shape and dimensions of the LED 122 is used when the image of the LED 122 is taken by the component-image taking device 30 and when an error of position of the LED 122 held by the suction nozzle 86 is obtained. Thus, the data indicative of the "COMPONENT NAME" corresponds to the data defining the contour of the LED 122, and the "COMPONENT NAMES" of the LEDs 122 are the same to one another, irrespective of whether the brightness levels of the respective LEDs 122 are the same to one another or different from one another. DETX Onto the mounting module 10 assigned to mount the resistors 190 onto the substrate piece 124, the resistor 190 are installed by the operator. The installation of the resistors 190 is made in the same manner as the installation of the LEDs 122 onto the mounting modules 10. The operator operates the barcode reader 210 to read the barcode 142 provided on a randomly selected one of the reels 140 storing the resistors 190 and also the barcode 144 provided on a randomly selected one of the feeders 58, and then mounts the randomly selected reel 140 onto the randomly selected feeder 58. Upon mounting of the randomly selected reel 140 onto the randomly selected feeder 58, the personal computer 7, host computer 8 or another computer creates a feeder/resistor correlation table that correlates between the resistance value of the resistors 190 stored by the reel 140 and the feeder ID of the feeder 58. The created feeder/resistor correlation table is transmitted to the module controller 108 of the downstream-most one of the mounting modules 10, and is then stored in the memory of the computer of the module controller 108. The information obtained from the feeder/resistor correlation table is a component-supplier/associated-component correlation-information. Then, the operator installs the feeder 58 (on which the reel 140 is mounted) onto a randomly selected one of the holding portions 156 of the holding base 150 of the downstream-most mounting modules 10. Upon installation of the feeder 58 onto the randomly selected one of the holding portion 156, the module controller 108 of the downstream-most mounting modules 10 detects which one of the install positions the resistors 109 have been installed into and also which one of the resistance values the installed resistors 109 have, so that the module controller 108 obtains an associated-component-related information including the supply position and resistance value of the resistors 109. DETX The operator estimates or calculates, based on the brightness level of the LED 122 on hand, the resistance value required for controlling the electric current that is to be supplied to the LED 122, and then install the resistors 190 having the required resistance value, onto the holding base 150. The resistance value required for establishing uniformity in the brightness of the LEDs 122 can be obtained by a single resistor 190 in some case, and can be obtained by a combination of a plurality of resistors 190 in other case. Therefore, the operator installs the resistors 190 of a plurality of kinds (which are expected to be used) onto the holding base 150. In this instance, it is desirable to install, onto the holding base 150, a plurality of feeders 58 holding the resistors 190 of at least one kind, a large amount of which are expected to be used. Further, although each feeder 58 holding the resistors 190 may be installed, basically, onto a randomly selected one of the holding portions 156, it is desirable to install each feeder 58 in such a position that maximizes efficiency of the mounting work by the mounting module 10. To this end, for example, the feeder or feeders 58 supplying the resistors 190 of the kind that is to be used more frequently than the resistors 190 of the other kinds, are mounted preferably in a position or positions close to the resistor mount area 194 within the substrate piece 124 of the multi-piece substrate 120 held by the circuit-board holding device 22, namely, in the position or positions substantially aligned with the resistor mount area 194 in a direction parallel to in the circuit-board conveyance direction. DETX After the set-up works have been completed as described, the mount works for mounting the multiplicity of LEDs 122 onto the multi-piece substrate 120 are carried out by the mounter line 5. In the present embodiment, the multi-piece substrate 120 has a size that permits the substrate 120 to be held by each one of the mounting module 10 and to be subjected to the mount work carried out by the same mounting module 10, and is to be conveyed while taking such a posture that causes a longitudinal direction of the substrate piece 124 to be parallel to the conveyance direction. In step S46, the operator inputs the multi-piece substrate 120 provided with the substrate ID, into the substrate ID reading unit 1. Then, in step S47, the substrate ID of the substrate 120 is read by the substrate ID reading unit 1, and the cream solder is printed onto the substrate 120, with a pattern in accordance with the read substrate ID, by operation of the solder printer 3. In the present embodiment, the transmission of the substrate ID from the substrate ID reading unit 1 to a controller of the solder printer 3 is made via the host computer 8, although it can be made directly from the reading unit 1 to the controller of the solder printer 3. The other information transmission between the other component apparatuses also may be made either directly therebetween or indirectly via the host computer 8. DETX After the cream solder has been printed onto the multi-piece substrate 120, the substrate 120 is conveyed to the substrate ID reading unit 4 so that the substrate ID is read again by the substrate ID reading unit 4. Although the substrate ID obtained by the substrate ID reading unit 1 can be used in the mounter line 5, the substrate ID is read again in the present embodiment, because the multi-piece substrate 120 could be taken out from the component apparatuses such as the substrate ID reading unit 1 and solder printer 33 after the substrate ID has been read by the substrate ID reading unit 1. After the substrate ID has been read by the substrate ID reading unit 4, step S48 is implemented to mount the LEDs 122 rate the multi-piece substrate 120, based on the above-described basic backlight-assembling control program and the mount data created in step S45. DETX For carrying out the mounting work, the basic backlight-assembling control program is used. FIG. 15 is a flow chart of a part of the basic backlight-assembling control program, which is related to supply of the electronic circuit components and which is constituted principally by the above-described backlight assembling routine. During assembly of the backlight, prior to mounting of the LEDs 122 onto each substrate piece 124, step S51 is implemented to judge whether the mounting of the LEDs 122 onto the entirety of the single substrate piece 124 can be completed by the LEDs 122 remaining in the feeder 58 that is currently supplying the LEDs 122. If a positive judgment (YES) is obtained in step S51, the control flow goes to step S52 in which the mounting of the LEDs 122 is carried out with supply of the LEDs 122 from the same feeder 58, and a data correlating between the number of the substrate piece 124 and the brightness level as a part of a manufacturing record information is stored in memory means in the form of the memory of the computer of the module controller 108. The data correlating between the number of the substrate piece 124 and the brightness level may be, for example, indicative of correlation among the name of the basic backlight-assembling control program, the substrate (multi-piece substrate) ID, the brightness level and the number of the substrate piece 124. The mounting is carried out in accordance with the sequence data, and the mounting head 60 is moved to one of the holding portions 156 which is specified by the "SLOT NUMBER", so as to take the LED 122 from the feeder 58 and mount the feeder 58 into a given position within the substrate piece 124. It is noted that the brightness level included in the manufacturing record information is obtained from the different-property-component-related information stored in the memory. DETX The above-described data (indicative of correlation between the number of each substrate piece 124 and the brightness level), which is included in the manufacturing record information, is a data correlating between each mount-position group (constituted by the plurality of mount positions) and the brightness level of the different-property components, which are to be correlated with the mount-position group, namely, which are to be mounted in the mount-position group, and constitutes a substrate-piece/brightness-level correlation data for each circuit board. Further, the above-described data is obtained in correlation with the substrate ID for each circuit board. The substrate-piece/brightness-level correlation data may be constituted by a substrate-piece/brightness-level correlation table, as shown by way of example in FIG. 14, which is created for a substrate identification code (substrate ID) of each multi-piece substrate 120, and which correlates between the number n ("SUBSTRATE PIECE NUMBER") of each substrate piece 124 and the brightness level ("BRIGHTNESS LEVEL") of the LEDs 122 mounted on the same substrate piece 124. Thus, through the "SUBSTRATE PIECE NUMBER", a correlation between the mount-position group of each substrate piece 124 in the sequence table and the brightness level in the substrate-piece/brightness-level correlation data is established. The substrate-piece/brightness-level correlation table of FIG. 14 shows a case where the LEDs 122 to be mounted onto a single multi-piece substrate 120 have two brightness levels. However, there is a case where all the LEDs 122 to be mounted onto a single multi-piece substrate 120 have the same brightness level, and also there is a case where the LEDs 122 to be mounted onto a single multi-piece substrate 120 have three or more brightness levels. DETX It is noted that the substrate-piece/brightness-level correlation data as a mount-position-group/property-related-information correlation data may be created apart from the manufacturing record information, for example, upon installation of each feeder onto the holding base 150. Since the brightness level of the LEDs 122 supplied by the feeder can be obtained upon installation of the feeder onto the holding base 150, it is possible to create, in advance, a correlation table correlating between the number of each substrate piece and the brightness level, so that the "SLOT NUMBER" in the sequence table is determined based on this correlation table created in advance. When an actual brightness level of the LEDs 122 actually mounted on the substrate piece is different from the brightness level of this correlation table, the brightness level of this correlation table is changed or updated to the actual brightness level. DETX When each one of the LEDs 122 is mounted onto the multi-piece substrate 120, the number of the remaining components memorized in the feeder controller 110 is reduced by one. This number of the remaining components is supplied from the feeder controller 110 to the module controller 108, and the above-described judgment of step S51 is made based on the supplied number of the remaining components. Upon completion of the component mounting work carried out for the circuit board 57, the number of the remaining components is supplied from the feeder controller 110 to the module controller 108, and is stored as a data correlated to the reel ID. By correlating the number of the, remaining components with the reel ID, the number of remaining components (i.e., the number of the LEDs 122 remaining in the feeder 58) is given as the initial component amount to the feeder controller 110 that is configured to the feeder 58 installed on the holding base 150. DETX In the present embodiment, in the event of failure in mounting of one of the LEDs 122 by the suction nozzle 86b of the mounting head 60b, a recovery operation is executed for compensating the failure, so that another one of the LEDs 122 is additionally consumed each time the recovery operation is executed. Therefore, the number of the remaining components is reduced by one, upon execution of the recovery operation. DETX The above-described judgment of step S51 (as to whether the mounting of the LEDs 122 onto the entirety of a single substrate piece 124 can be completed by the LEDs 122 remaining in the feeder 58) can be made, in principle, by comparing the required number N of the LEDs 122 (that are to be required to be mounted onto the single substrate piece 124) with the number of the remaining components. However, in the present embodiment in which the above-described recovery operation is executed, a positive judgment (YES) is obtained in step S51, when the number of the remaining components is larger than a sum of the required number N and an additional number that is determined depending on a possible frequency of execution of the above-described recovery operation. DETX When a negative judgment (NO) is obtained in step S51, the control flow goes to step S58 that is implemented to judge whether or not there is another feeder 58 that is installed on the holding base 150, namely, judge whether or not there is installed another feeder 58, which is ready for supplying the LEDs 122, as a feeder succeeding the currently operated feeder 58 in which the number of the remaining LEDs 122 becomes insufficient for completing the mounting of the LEDs 122 onto the single substrate piece 124. When a positive judgment (YES) is obtained in step S53, step S54 is implemented to judge whether or not the brightness level of the LEDs 122 that to be supplied by the succeeding feeder 58 is the same as that of the LEDs 122 supplied by the currently operated feeder 58. In the present embodiment, the operator is scheduled to mount the LEDs 122 into a vacant install position at a randomly selected stage, so that the brightness level of the LEDs 122 that is to be supplied by the succeeding feeder 58 is not necessarily the same as that of the LEDs 122 supplied by the currently operated feeder 58, where the plurality of feeders 58 are installed on the mounting module 10. Like in the above-described set-up work, in the installation of the feeder 58 carried out at the randomly selected stage, the feeder/LED correlation table is created and is then transmitted to the module controller 108, so that the different-property-component-related informations of the LEDs 122 (that are to be supplied from the succeeding feeder 58) are detected together with determination of the install position in which the succeeding feeder 58 is installed and determination as to which one of the feeders 58 is installed as the succeeding feeder 58. The determination of step S54 is made based on all of the detected different-property-component-related informations. Further, each time when the feeder 58 is mounted onto the mounting module 10 by the operator, the above-described device table of FIG. 13 is updated. DETX When a positive judgment (YES) is obtained in step S54, namely, when the feeder 58 is installed on the same mounting module 10 with the installed feeder 58 being to supply the LEDs 122 whose brightness level is the same as the currently supplied LEDs 122, the control flow goes to steps S55-S59 that are implemented to preliminarily notice shortage of the components, mount the LEDs 122 (having the same brightness level and supplied from the two feeders 58) onto the multi-piece substrate 120, and store data related to record the manufacturing record. Specifically described, step S55 is implemented to judge whether a total number p of the LEDs 122 having the same brightness level and stored in all the feeders 58 installed on the mounting module 10 is equal to or larger than a predetermined number P. When a negative determination (NO) is obtained in step S55, the control flow goes to step S56 to preliminarily notice the component shortage. When a positive determination (YES) is obtained in step S55, the control flow goes to step S57 to cancel the notice of the component shortage. That is, even when the component shortage has been once noticed as a result of the negative judgment (NO) in step S55, the positive judgment (YES) can be obtained in step S55 if the feeder 58 is replenished with the LEDs 122 having the same brightness level as the LEDs 122 whose shortage has been noticed, so that the notice of the component shortage is canceled in step S57. DETX Step S56 or S57 is followed by step S58 in which all the LEDs 122 remaining in the currently supplying feeder 58 are mounted onto the substrate piece 124. Then, after all the LEDs 122 remaining in the feeder 58 have been mounted onto the substrate piece 124, step S59 is implemented. In this step S59, the LEDs 122 are taken from the succeeding feeder 58 (In this instance, "SLOT NUMBER" is changed in the sequence table of FIG. 12.), so as to be mounted onto the substrate piece 124, and the manufacturing record correlating between the number of the substrate piece 124 and the brightness level is stored. By implementation of step S58, even in case of the negative judgment (NO) in step S51, it is possible to avoid the feeder 58 from being uninstalled from the mounting module 10, with the LEDs 122 (whose number is smaller than the above-described sum of the required number N and the additional number) being left in the feeder 58. That is, it is possible to waste the LEDs 122. On the other hand, when a negative judgment (NO) is obtained in step S54, the control flow goes to step S60. In this step S60, the LEDs 122, whose brightness level is different from the previously installed LEDs 122, are mounted onto the substrate piece 124, and the manufacturing record is stored. In this step S59, too, the "SLOT NUMBER" is changed in the sequence table. DETX Further, when a negative judgment (NO) is obtained in step S53, namely, when there is not another feeder 58 (other than the currently operated feeder 58) installed on the mounting module 10 and operable to supply the LEDs 122, step S61 is implemented to inform that the mounting module 10 should be replenished with new LEDs 122, namely, to inform that a new feeder 58 should be installed onto the mounting module 10. In the present embodiment, this information is provided on a display of the host computer 8 and also on a display of the mounting module 10 that is to be replenished with new LEDs 122. The display of each of the host computer 8 and the mounting module 10 serves as an indicator as an informing device. When new LEDs 122 have been installed onto the mounting module 10 in conformity with the information, a positive judgment (YES) is obtained in step S62, and then step S63 is implemented to judge whether or not the newly installed LEDs 122 have the same brightness level as that of the previously installed LEDs 122. When a positive judgment (YES) is obtained in step S63, the control flow goes to steps S64 and S65 that are implemented in the same manner as the above-described steps S58 and S59. Specifically described, in step S64, all the LEDs 122 remaining in the currently supplying feeder 58 are mounted onto the substrate piece 124. Then, in step S65, the LEDs 122 are taken from the succeeding feeder 56 so as to be mounted onto the substrate piece 124, and the manufacturing record correlating between the number of the substrate piece 124 and the brightness level is stared. On the other hand, when a negative judgment (NO) is obtained in step S63, the control flow goes to step S60 in which the LEDs 122 supplied from the succeeding feeder 56 are mounted, onto the substrate piece 124, and the manufacturing record is stored. The replenishment of the mounting module 10 with the LEDs 122 is detectable by detection of the installment of the feeder 58 into a vacant one of the holding portions 156. In this instance, the different-property-component-related information of the newly installed LEDs 122 is detected, and the detected different-property-component-related information is used for changing the "SLOT NUMBER" of the sequence table. It is noted that the install position of the empty feeder 58 (in which no LED 122 remains) may be informed, so that the empty feeder 58 can be removed from the install position and the succeeding feeder 58 can be installed in the install position, in a response to the information. DETX Where the LEDs 122 supplied from the plurality of feeders 58 installed on the mounting module 10 (that is assigned to mount the LEDs 122 onto a plurality of substrate pieces 124) do not have the same brightness level, each of the LEDs 122 is mounted onto a selected one of the plurality of substrate pieces 124, which is selected depending on the brightness level of the mounted LED 122. In the present embodiment, the brightness level is changed when the "SLOT NUMBER" is added into the sequence table, so that the LEDs 122 of the plurality of kinds supplied from the plurality of feeders 58 can be mounted onto the multi-piece substrate 120 in the mounting module 10 as a single electronic-circuit-component mounter. DETX After step S52, S59, S60 or S65 has been implemented, step S66 is implemented to judge whether the mounting work that is to be carried out in the mounting module 10 has been completed or not. When a negative judgment (NO) is obtained in step S66, the control flow goes back to step S51. When a positive judgment (YES) is obtained in step S66, the control flow goes to step S67 that is implemented to supply the manufacturing record information to the host computer 8. The supplied manufacturing record information corresponds to a combination of the data stored in steps S52, S59, S60, S65 and correlating between the number of each substrate piece 124 and the corresponding brightness level, and other data indicative of, for example, identification codes of the suction nozzle 86b and feeder 58 having committed failure in the component mounting. DETX Thereafter, in step S68, it is judged whether the scheduled manufacturing has been completed or not. When the scheduled manufacturing has not yet been completed, the control flow goes to step S69 that is implemented to carry out procedures such as loading and unloading of the multi-piece substrate 120, so as to prepare for the next mounting work. Then, the control flow goes back to step S51. When the scheduled manufacturing has been completed, the control flow goes to step S70 that is implemented to shut down the process whereby the execution of the program is terminated. DETX When the mounting of the LEDs 122 onto the multi-piece substrate 120 as a single circuit board has been completely performed by operations of the plurality of mounting modules 10, a substrate-piece information including the brightness level is printed by the printing module 10 in step S49 in the flow of FIG. 11. The multi-piece substrate 120 transferred into the printing module 10 is held by the circuit-board holding device 22 in the same manner as when the electronic circuit components have been mounted onto the substrate 120 in the mounting work. The printing head 170 is moved by the head moving device 62 so as to be positioned sequentially in a plurality of positions which are located on a horizontal plane and which are opposed to the respective barcode print areas 196 of the respective substrate pieces 124, so as to print the barcodes in the respective barcode print areas 196, whereby the brightness levels (as the property-related information) are provided to be correlated with the respective mount-position groups within the circuit board. The printing head 170 is first moved to an initial position which is aligned with an end portion, in the X-axis direction, of the barcode print area 196, and which is so close to an upper surface of the substrate piece 124 that the barcode can be printed on the upper surface by ejection of ink droplets from the printing head 170. Then, the printing head 170 is moved relative to the substrate piece 124 in the X-axis direction while being operated to eject the ink droplets toward the barcode print area 196, so as to print the barcode (representing the substrate-piece information) onto the barcode print area 196. The substrate-piece information includes at least the brightness level of the LEDs 122, and can be obtained from the manufacturing record information which is stored in steps S52, S59, S60, S65 and which includes data correlating between the number of each substrate piece 124 and the brightness level of the LEDs 122 mounted on the substrate piece 124. In the present embodiment, the manufacturing record information is supplied to the host computer 8 from the module controller 108 of the mounting module 10 that is assigned to mount the LEDs 122 onto the substrate piece 124, and is then supplied from the host computer 8 to the module controller 108 of the printing module 10. DETX After the barcodes have been printed onto the barcode print areas 196 of all the substrate pieces, the barcode reader 180 provided in the printing head 170 is moved sequentially to positions above the printed barcodes and is operated to read the informations recorded in the barcodes. Then, each of the read informations, i.e., informations actually recorded on the respective barcode print areas 196, is compared with the information supplied from the host computer 8, so as to confirm if the barcodes have been printed in conformity with the supplied information. This confirmation makes it possible to reliably avoid the subsequent procedures from being carried out for the substrate piece 124 onto which the information different from the supplied information has been recorded. However, the confirmation does not necessarily have to be done by reading the printed barcodes. When the recorded information matches with the supplied information, the recorded information is transmitted from the module controller 108 of the printing module 10 to the module controller 108 of the downstream-most mounting module 10 via the host computer 8 or without via the host computer 8. When the recorded information mismatches with the supplied information, this fact is indicated on the displays of the printing module 10 and the host computer 8 whereby the operator is informed of occurrence of the failure. In this case, the multi-piece substrate 120 is not transferred to the downstream-most mounting module 10, and the operator is awaited to take the multi-piece substrate 120 out from the printing module 10, in a response to the failure information. DETX In the downstream-most mounting module 10, at least one of the resistors 190 is mounted onto each of M pieces of the substrate pieces 124 of the multi-piece substrate 120 having barcodes printed thereon. In the host computer 8, the resistance value for each of the substrate pieces 124 is calculated based on the manufacturing record information, i.e., the brightness level of the LEDs 122 mounted on the substrate piece 124, such that the brightnesses of the M pieces of the substrate pieces 124 are equal to one another. Then, the host computer 8 calculates a resistor mounting data for obtaining the calculated resistance value in each of the substrate pieces 124. The resistor mounting data represents a required construction of the resistor circuit 200 in each of the substrate pieces 124, such as the number and kind of the resistors 190 (that are to be provided in the resistor circuit 200) and mount (i.e., connection) positions of the resistors 190 (in which the resistors 190 are to be positioned in the resistor circuit 200). Where any one of the available resistors 190 does not have a resistance value equal to the calculated or required resistance value, the resistor circuit 200 may be constructed to include at last one series-circuit section (in which the resistors 190 are connected in series with each other) and/or at least one parallel-circuit section (in which the resistors 190 are connected in parallel with each other), so that it is possible to obtain the required resistance value in the resistor circuit 200 as a whole, which is different from the resistance value inherent to each resistor 190. In this sense, the resistor mounting data may be interpreted to represent a combination of the resistors 190 (such as least one series-circuit section, at least one parallel-circuit section and a combination thereof) that is to be established in the resistor circuit 200. It is therefore possible to establish any one of various resistance values in the resistor circuit 200, even if a few kinds of resistors 190 are available to the user. The created resistor mounting data is transmitted from the host computer 8 to the module controller 108 of the mounting module 10 that is assigned to mount the resistors 190 onto the multi-piece substrate 120. It is noted that the resistor mounting data does not have to be created necessarily in the host computer 8 but may be created in the module controller 108. Further, the resistor mounting data may be created in a computer other than the host computer 8 and the module controller 108, such that the created resistor mounting data is transmitted to the module controller 108. DETX In the mounting module 10 assigned to mount onto the resistors 190 onto the multi-piece substrate 120, in general, the feeders 58 holding the resistors 190 projected to be mount onto the multi-piece substrate 120, are installed on the holding base 150, so that the resistors 190 are mounted onto the multi-piece substrate 120, in accordance with the resistor mounting data supplied from the host computer 8. Prior to the mounting of the resistors 190 onto the multi-piece substrate 120, it is checked whether or not the feeders 58 holding the resistors 190 of the required kinds are installed on the holding base 150. If some of the feeders 58 is not installed on the holding base 150, the operator is informed of shortage of the resistors 190 and kind of the resistors 190 in shortage. Then, the mounting of the resistors 190 is started after the installation of the feeders 58 (i.e., the installation of the resistors 190) has been completed. It may be checked, upon preparation of the resistor mounting data, whether or not the resistors 190 required for obtaining the desired resistance value are installed on the holding base 150, so that the required resistors 190 can be assuredly installed on the holding base 150, by informing, in case in which the required resistors 190 are not yet installed on the holding base 150, the operator of this fact. DETX In the resistor circuit 200, there is mounted at least one resistor 190 that is dependent on the brightness level of the substrate piece 124. For example, in case of FIG. 10A for establishing the resistor circuit 200 in the form of a circuit (see (a1) of FIG. 10A) including a parallel-circuit section and a series-circuit section, the resistors 190 are disposed as shown in (a2) of FIG. 10A. In case of FIG. 10B for establishing the resistor circuit 200 in the form of a circuit (see (b1) of FIG. 10B) including only a series-circuit section, the resistors 190 are disposed as shown in (b2) of FIG. 10B. In case of FIG. 10C for establishing the resistor circuit 200 in the form of a circuit (see (c1) of FIG. 10C) including two parallel-circuit sections, the resistors 190 are disposed as shown in (c2) of FIG. 10C. In case of FIG. 10D for establishing the resistor circuit 200 in the form of a circuit (see (d1) of FIG. 10D) including one parallel-circuit section, a jumper 220 as well as the resistors 190 is disposed as shown in (d2) of FIG. 10D, such that the jumper 220 establishes connection between connection terminals between which the resistor 190 is not disposed. After the resistors 190 have been mounted onto all the substrate pieces 124, the circuit board 57 (i.e., multi-piece substrate 120) i transferred to the reflow furnace 6. DETX As is clear from the above descriptions, in the present embodiment, among the eight mounting modules 10 cooperating with one another to constitute the mounter line 5, six mounting modules 10 are assigned to mount the LEDs 122 onto the multi-piece substrate 120. A portion of the module controller 108 of each of the six mounting modules 10, which is assigned to implement step S45, constitutes a different-property-component-related information detecting portion as a different-property-component-related information obtaining portion. A portion of the module controller 108 of each of the six mounting modules 10, which is assigned to implement step S48 for mounting the LEDs 122 onto the multi-piece substrate 120, constitutes a mounting controlling portion. The memory of the computer of the controller 108 of each of the six mounting modules 10, which is assigned to store therein the feeder/LED correlation table, constitutes memory means. Among the eight mounting modules 10, one mounting module 10 is assigned to print the barcodes onto the multi-piece substrate 120, and a portion of the module controller 108 of the mounting module 10 assigned to print the barcodes, which is assigned to implement step S49, constitutes a property-related information providing portion. Among the eight mounting modules 10, one mounting module 10 is assigned to read the barcodes, and a portion of the module controller 108 of the mounting module 10 assigned to read the barcodes, which is assigned to read the barcodes, constitutes a property-related information reading portion as a property-related information recognizing portion. Among the eight mounting modules 10, one mounting module 10 is assigned to mount the resistors 190 onto the multi-piece substrate 120, and a portion of the module controller 108 of the mounting module 10 assigned to mount the resistors 190, which is assigned to implement step S50, constitutes an associated component mounting controlling portion. DETX The printing of the barcodes (each representing the information including the brightness level of the LEDs 122 mounted on the substrate piece 124) and the mounting of the resistors 190 (carried out in view of the brightness level) are also parts of the electronic-circuit assembling process. The manufacturing record information cooperates with the basic backlight-assembling control program to constitute the particular backlight assembling control program. It is also possible to interpret that the manufacturing record information includes a correlation table correlating among the substrate ID, substrate piece number and brightness level, and that a combination of this correlation table cooperates and the basic backlight-assembling control program is used in assembly of the electronic circuit. DETX The electronic-circuit assembling system may be a system including at least one electronic-circuit-component mounter that has a plurality of mounting devices. FIG. 16 shows an embodiment of such an electronic-circuit assembling system. DETX Although the electronic-circuit-component mounter included in, the system according to this embodiment is not yet publically disclosed, this electronic-circuit-component mounter will be described since it has a construction similar to that of an electronic-circuit-component mounter described in description of JP-2009-010319A, the assignee of which is the same assignee of the present application. In the following descriptions, the electronic-circuit-component mounter will be described, and the other component apparatuses will not be described since having substantially the same constructions as those of the electronic-circuit assembling system of the above-described embodiment. DETX The electronic-circuit-component mounter has a mounter main body 250 and a pair of component mounting portions 252, 254, as shown in FIG. 16. In the present embodiment, the component mounting portions 252, 254 are arranged in a circuit-board conveyance direction in which circuit boards 258 are to be conveyed by a circuit-board conveying device 256 on a horizontal plane. The component mounting portions 252, 254 are symmetrical to each other with respect to a direction perpendicular to the circuit-board conveyance direction. The circuit-board conveying device 256 is constituted by, for example, a belt conveyor as a kind of conveyor, and is disposed on a base 260 of the mounter main body 250, so as to bridge between the component mounting portions 252, 254. DETX The component mounting portions 252, 254 are identical in contraction with each other, so that the component mounting portion 254, which is one of the mounting portions 252, 254 that is located on a downstream side of the other of the mounting portions 252, 254, will be described as a representative one of the mounting portions 252, 254. DETX The component mounting portion 254 includes a pair of component supplying devices 264, 266, a circuit-board holding device 268, a pair of mounting heads 270, 272, a pair of head moving devices 274, 276, a pair of component-image taking devices 278, 279 and a pair of fiducial-mark-image taking device (not shown). The component supplying devices 264, 266 are disposed on respective opposite sides of the circuit-board conveying device 256 in the Y-axis direction. Since each of the component supplying devices 264, 266 has a construction similar to that of the above-described component supplying device 24, the same reference signs as used in the above-described embodiment will be used to identify the functionally corresponding elements, and redundant description of these elements is not provided. Further, since the circuit-board holding device 268 has a construction similar to that of the above-described circuit-board holding device 22, description of the holding device 268 is not provided. DETX The mounting heads 270, 272 and the head moving devices 274, 276 will be described. DETX Each of the head moving devices 274, 276 has a corresponding one of X-axis direction moving devices 280, 282 and a corresponding one of Y-axis direction moving devices 284, 286. Each of the Y-axis direction moving devices 284, 286 has a movable member in the form of a corresponding one of Y-axis slides 288, 290 and a movable-member moving device in the form of a corresponding one of linear motors 292, 294. Each of the Y-axis slides 288, 290 has a shape elongated in the X-direction, and is guided at its longitudinally opposite end portions by respective guide rails 300, 302 of a guiding device 298, so as to be movable and positionable in a randomly selected position in the Y-axis direction. DETX Each of the X-axis direction moving devices 280, 282 is disposed on a corresponding one of the Y-axis slides 288, 290, and includes a movable member in the form of a corresponding one of X-axis slides 310, 312 and an X-axis-slide moving device (not shown). The X-axis-slide moving device includes a servo motor as a drive source and also a ball-screw mechanism (not shown). Each of the X-axis slides 310, 312 is guided by a corresponding one of guiding devices 318, 320 that include respective pairs of guide rails 314, 316. Each of the pairs of guide rails 314, 316 consists of upper and lower guide rails. In FIG. 16, the upper guide rail is shown while the lower guide rail is not shown. Each of the X-axis slides 310, 312 guided by a corresponding one of the guiding devices 318, 320 is movable and positionable in a randomly selected position in the X-axis direction on a corresponding one of the Y-axis slides 288, 290. DETX Each of the mounting heads 270, 272 is disposed on a corresponding one of the X-axis slides 310, 312, and is movable on a horizontal plane so as to be positionable in a randomly selected position within an area between the circuit-board holding device 268 and a corresponding one of the two component supplying devices 264, 266 which is located on the side of the mounting head 270 or 272. In the present embodiment, each of the mounting head 270, 272 is detachably attached to a corresponding one of the X-axis slides 310, 312, by means of an attachment mechanism that has substantially the same construction as the above-described attachment mechanism by which the above-described mounting head 60 is detachably attached to the second X-axis slide 76. Each of the mounting heads 270, 272 has substantially the same construction as the mounting head 60, and may be of various kinds different from each other with respect to number of nozzle holders. Further, the fiducial-mark-image taking devices (not shown) are disposed on the respective X-axis slides 310, 312. DETX Each of the mounting heads 270, 272 cooperates with a corresponding one of the head moving devices 274, 276 to constitute a corresponding one of mounting devices mounting devices 330, 332. Thus, the electronic-circuit-component mounter has a total of four mounting devices, such that two of the four mounting devices are provided in the component mounting portion 252 while other two of the four mounting devices are provided in the component mounting portion 254. In the present embodiment, LEDs are mounted onto substrate pieces by the mounting device 330 as one of the mounting devices 330, 332 of the component mounting portion 252 that is located on an upstream side of the component mounting portion 254, the feeders 58 holding the LEDs are installed on a feeder holding base in the component supplying device 264 of the component mounting portion 252, and the barcodes are printed onto the substrate pieces by the printing head which is, in place of the mounting head 272, held by the X-axis slide 312 of the mounting device 332 as the other of the mounting devices 330, 332 of the component mounting portion 252. The printing head has substantially the same construction as the above-described printing head 170, but does not have a barcode reader unlike the printing head 170. Further, in the present embodiment, the barcodes printed on the substrate pieces are read by a reading head which is, in place of the mounting head 270, held by the X-axis slide 312 of the mounting device 330 as one of the mounting devices 330, 332 of the component mounting portion 254 that is located on a downstream side of the component mounting portion 256, the feeders 58 holding the resistors are installed on a feeder holding base in the component supplying device 266 of the component mounting portion 254, and the resistors are mounted onto the substrate pieces by the mounting device 332 as the other of the mounting devices 330, 332 of the component mounting portion 254. The reading head has a head main body and a barcode reader. DETX The mounting devices 330, 332 of the component mounting portion 252 and the mounting devices 330, 332 of the component mounting portion 254 are controllable by respective four computers constituting control devices (not shown) that are connected to the host computer. DETX In the electronic-circuit assembling system including the electronic-circuit-component mounter having the pair of component mounting portions 252, 254, too, the operation flow as shown in FIG. 11 is carried out, whereby the LEDs and the resistors are installed onto the component mounting portions 252, 254, and LEDs and the resistors are mounted onto the substrate pieces. The LEDs are mounted onto all the substrate pieces of a single multi-piece substrate by operation of the mounting device 330 of the component mounting portion 252, and then the barcodes are printed onto the substrate pieces by operation of the printing head moved by the head moving device 276. In the present embodiment, the information (such as the brightness level of the LEDs), which are to be printed onto the substrate pieces, are obtained from the manufacturing record information supplied to the computer configured to control the mounting head 272 serving as the printing head from the computer configured to control the mounting head 270. DETX After printing of the barcodes onto the substrate pieces, the multi-piece substrate is transferred to the component mounting portion 254 that is located on the downstream side of the component mounting portion 252, and is held by the circuit-board holding device 268 of the component mounting portion 254. Then, in the component mounting portion 254, the reading head is moved by the head moving device 272, such that the barcodes printed on the substrate pieces are read by the barcode reader of the reading head. The resistor mounting data is created based on the brightness level of the LEDs that has been obtained from the read barcodes. Then, in the component mounting portion 254, the mounting head 272 of the mounting device 332 is moved, so as to take resistors from the component supplying device 266 and mount the resistors onto the substrate pieces. The resistor mounting data may be created either in the computer configured to control the mounting head 270 of the component mounting portions 254 or in the computer configured to control the reading head (i.e., mounting head 272) of the component mounting portions 254. In the former case, the resistor mounting data created by the computer configured to control the mounting head 270 is transmitted to the computer configured to control the reading head. In the latter case, the information obtained from the read barcodes is transmitted to the computer configured to control the reading head so that the resistor mounting data can be created therein. DETX The two component mounting portions 252, 254 shown in FIG. 16 may be interpreted to constitute the respective electronic-circuit-component mounters. According to this interpretation, one of the plurality of electronic-circuit-component mounters of the electronic-circuit assembling system is assigned to mount the different-property components onto the circuit board and to provide the circuit board with the property-related information, while another one of the plurality of electronic-circuit-component mounters is assigned to recognize the property-related information and to mount the associated components onto the circuit board. Further, it is possible to interpret that the plurality of electronic-circuit-component mounters each having the plurality of mounting devices constitute the mounter line. DETX in the above-described embodiments, the multi-piece substrate is conveyed in the electronic-circuit-component mounter while taking the posture that causes the longitudinal direction of the substrate pieces to be parallel to the conveyance direction. However, the multi-piece substrate may be conveyed while taking the posture that causes the longitudinal direction of the substrate pieces to be perpendicular to the conveyance direction. DETX Further, where each one of the plurality of electronic-circuit-component mounters, which cooperate with each other to constitute the mounter line, is assigned to a corresponding part of the mounting work for the different-property components onto a single multi-piece substrate, each one of the electronic-circuit-component mounters does not necessarily have to be assigned to mount the different-property components onto an entirety of one of the substrate pieces of the single multi-piece substrate, but may be assigned to mount the different-property components onto at least a part of one of the substrate pieces. DETX In the mounter line 5 of the electronic-circuit assembling system according to the embodiment shown in FIGS. 1-15, it is possible to mount the different-property components onto a large-sized circuit board whose size as measured in the conveyance direction is larger than a size of each one of the mounting modules 10 as measured in the conveyance direction. In this case, the large-sized circuit board may be positioned over two or more of the mounting modules 10 so as to held by the circuit-board holding devices 22 of the respective two or more mounting modules 10. The different-property components can be mounted onto a portion of the circuit board which is located at a boundary between two adjacent mounting modules 10, by enabling the mounting head 80 to be reach this portion of the circuit board, with movement of the second X-axis slide 76 on the first X-axis slide 74 in the X-axis direction. DETX Further, in the mounter line, the property-related information may be provided on a back surface of the circuit board which is opposite to the mount surface of the circuit board onto which the different-property components are mounted. In this case, for example, the property-related-information providing head may be positioned on a side of the back surface so as to provide the back surface of the circuit board with the property-related information. Alternatively, a board inverting device may be incorporated into the mounter line, so as to be disposed on a downstream side of the electronic-circuit-component mounters that are assigned to mount the different-property components onto the circuit board. In this alternative arrangement, the circuit board is inverted by the board inverting device so as to cause the back surface as an information receiving surface to be face upwardly, and the inverted circuit board is transferred to the property-related information provider that is constituted by one of the electronic-circuit-component mounters which is located on a downstream side of the board inverting device, such that the property-related information is provided on the upwardly facing back surface of the inverted circuit board by operation of the property-related-information providing head. Moreover, as another alternative means, a property-related information provider, which is capable of providing the property-related information onto the back surface of the circuit board without necessity of inverting the circuit board, may be disposed on a downstream side of the electronic-circuit-component mounters that are assigned to mount the components onto the circuit board. Where the associated components are to be mounted onto the back surface of the circuit board, too, the board inverting device may be disposed in midway of the mounter line, such that the circuit board is inverted by the board inverting device after the different-property components have been mounted onto the circuit board, and the associated components are mounted onto the back surface of the circuit board within the mounter line. DETX Further, in the mounter line, the mounting of the different-property component onto the circuit board and the provision of the property-related information onto the circuit board may be carried out therein, while the recognition of the information provided on the circuit board and the mounting of the associated components onto the circuit board may be carried out by a single electronic-circuit-component mounter or two electronic-circuit-component mounters that are provided apart from the mounter line, or a property-related information recognizes and an electronic-circuit-component mounter that are provided apart from the mounter line. Further, alternatively, after having been provided with the information, the circuit board may be inputted again into the mounter line. Where the recognition of the information and the mounting of the associated components are carried out in a single working apparatus provided apart from the mounter line, a control device, which is provided for controlling the mounting of the associated components, may be configured to recognize the property-related information provided on the circuit board and then to mount, onto the circuit board, the associated components that are selected based on the recognized property-related information. DETX Further, as a part of the previous preparation, registration of the LEDs that are to be used for the manufacturing may be carried out. Specifically, the registration of the LEDs can be made by registering the initial component amount that is the number of the LEDs initially stored in each of the reels (that are to be used) and also the correlation between the reel identification code of each reel and the brightness level of the LEDs stored in the reel. Data indicative of the registered LEDs may be transmitted from a personal computer to the host computer, or may be inputted directly into the host computer. Further, the data indicative of the registered LEDs may be transmitted from the host computer to each of the component apparatuses of the assembling system. DETX Further, where ICs as well as the different-property components are disposed on a surface of the circuit board so that the surface does not have a space available for the provision of the property-related information, for example, the property-related information may be provided or printed onto an upper surface of IC disposed on the circuit board. This arrangement makes it possible to provide the circuit board with the property-related information without having to unnecessarily increase the size of the circuit board. Further, the property-related information may be provided on an upper surface of a chip of the IC. DETX The control device of the electronic-circuit-component mounter may be constructed to include a single computer or a plurality of computers that are connected to each other. DETX In the above-described embodiments, only the LEDs 122 having the same brightness level are mounted onto each one of the substrate piece 124. However, the brightness of the substrate piece 124 can be uniform over its entirety, also by an arrangement in which the LEDs 122 of first group and the LEDs 122 of second group are arranged alternately to each other (such that each adjacent two LEDs 122 consist of one of the LEDs 122 of the first group and one of the LEDs 122 of the second group), wherein the LEDs 122 of first group have the respective brightness levels which are the same to each other and which are different from the brightness levels of the LEDs 122 of the second group. DETX In the electronic-circuit assembling system according to the embodiment shown in FIGS. 1-15, when the amount of the components (i.e., amount of the LEDs 122 having the same brightness level) stored in all the feeders 58 installed on the mounting module 10 (as a single electronic-circuit-component mounter) becomes smaller than the above-described predetermined number P, the shortage of the components is pre-noticed, for thereby advantageously avoiding operation of the mounting module 10 from being obligatorily stopped upon occurrence of actual shortage of the components. This arrangement may be modified such that, each time when supply of the LEDs 122 from each feeder 58 is completed, this completion may be informed to the operator, in addition to or in place of the pre-notice of the possible shortage of the components, so that the vacant feeder 58 can be quickly replaced with a new feeder 58 by the operator. DETX Further, only one feeder 58 rather than a plurality of feeders 58 may be constantly installed on the mounting module 10 (as a single electronic-circuit-component mounter), with an arrangement causing the feeder 58 to be replaced with a new feeder 58 each time when the amount of the LEDs 122 remaining in the installed feeder 58 becomes smaller than a required number for completing the mounting of the LEDs 122 onto the entirety of the substrate piece 124. DETX It is noted that the above modifications may be applied to the embodiment shown in FIG. 16. DETX In the embodiment shown in FIGS. 1-15, when it becomes impossible to complete the mounting of the components onto the entirety of the substrate piece 124, by supply of only the LEDs 122 remaining in the currently supplying feeder 58, it is judged whether there is another feeder 58 which is already installed on the same mounting module 10 and which is ready for supplying the LEDs 122 having the same brightness level as the currently supplied LEDs 122. However, this arrangement may be modified such that it is judged whether there is another feeder 58 which is already installed on not only the same mounting module 10 but also another mounting module 10 and which is ready for supplying the LEDs 122 having the unchanged brightness level. In this modified arrangement, after the LEDs 122 supplied from the feeder 58 installed on the same mounting module 10 have been mounted onto the substrate piece 124, the LEDs 122 supplied from the feeder 58 installed on the other mounting module 10 may be mounted onto the substrate piece 124, for completing the mounting of the components onto the entirety of the substrate piece 124. DETX Further, in each of the above-described embodiments, the single substrate ID is provided onto the entirety of the multi-piece substrate 120. However, where the manufacturing record is used even after the multi-piece substrate 120 has been divided into the substrate pieces 124, for example, it is desirable that the substrate ID is provided onto each one of the substrate pieces 124. DETX Still further, in each of the above-described embodiments, the brightness level of the LEDs 122 is made uniform over the entirety of each one of the substrate pieces 124. However, the brightness level of the LEDs 122 may be made uniform over the entirety of the multi-piece substrate 120 or entirety of an ordinary substrate (that is other than a multi-piece substrate). In this case, the mounting work may be carried out, with the multi-piece substrate 120 or the ordinary substrate being handled as if being each one of the substrate pieces 124. In this modified arrangement, too, the electronic circuit components of the same kind may be installed on two or more of the mounting modules 10 constituting the mounter line 5 of the electronic-circuit assembling system, so that the two or more mounting modules 10 cooperate with each other to mount the electronic circuit components of the same kind onto the entirety of the multi-piece substrate 120 or entirety of the ordinary substrate. CLST What is claimed is: CLPR 1. An electronic-circuit assembling process for assembling an electronic circuit using an electronic-circuit assembling system, a plurality of electronic circuit components supplied from at least one component supplier of a component supplying device being mounted onto a circuit board supported by a board supporting device, the plurality of electronic circuit components includes different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and the different-property components being handled as if they had the same electrical properties in a control for controlling mounting of the electronic circuit components onto the circuit board, said electronic-circuit assembling process comprising: determining a plurality of mount-position groups such that each one of the determined plurality of mount-position groups is constituted by a plurality of mount positions in which the different-property components are to mounted onto the circuit board; obtaining a different-property-component-related information that includes: (a) a property-related information that enables recognition of the electrical property of each of the different-property components which is supplied from a corresponding one of the at least one component supplier, and (b) a different-property-component supply position that is a position of the corresponding one of the at least one component supplier which supplies the each of the different-property components, such that the different-property-component-related information is obtained by detecting at least one of the property-related information and the different-property-component supply position; mounting, based on at least information related to the obtained different-property-component supply position, the plurality of electronic circuit components including the different-property components, onto the circuit board, such that the different-property components that are the same as each other with respect to electrical property value are mounted onto the respective mount position of each one of the plurality of mount-position groups; and providing the circuit board with the obtained property-related information of each of the different-property components that is mounted on the circuit board, such that the provided property-related information of each of the different-property components is correlated with a corresponding one of the plurality of mount-position groups. CLPR 2. The electronic-circuit assembling process according to claim 1, the electronic-circuit assembling system including an electronic-circuit-component mounter having a mounting device that is configured to mount the electronic circuit components onto the circuit board after taking the electronic circuit components from the component supplying device, and the component supplying device including: (i) a plurality of component suppliers as the at least one component supplier each of which is configured to store therein the plurality of electronic circuit components and to sequentially supply the plurality of electronic circuit components to the mounting device and (ii) a component-supplier holder having a plurality of holding portions configured to detachably hold the plurality of component suppliers, said electronic-circuit assembling process comprising: causing at least one of the plurality of component suppliers to store therein the different-property components; causing at least one of the plurality of holding portions to hold the at least one of the plurality of component suppliers storing therein the different-property components; and causing the electronic-circuit-component mounter to automatically obtain (.alpha.) a position of the at least one of the plurality of holding portions holding the at least one of the plurality of component suppliers and (.beta.) the property-related information of each of the different-property components that are supplied from the at least one of the plurality of component suppliers. CLPR 3. The electronic-circuit assembling process according to claim 1, wherein the electronic-circuit assembling system including a mounter line formed of a plurality of electronic-circuit-component mounters that are arranged in a line, with each adjacent two of the arranged electronic-circuit-component mounters being close to each other without a gap that enables the circuit board to be taken out through the gap, said electronic-circuit assembling process comprising: causing at least one of the arranged electronic-circuit-component mounters to mount the at least one of the different-property components onto the circuit board; causing at least one of the arranged electronic-circuit-component mounters to provide the circuit board with the property-related information of each of the at least one of the different-property components; causing at least one of the arranged electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and causing at least one of the arranged electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the different-property components, on the basis of the recognition of the property-related information. CLPR 4. The electronic-circuit assembling process according to claim 1, wherein the electronic-circuit assembling system including a plurality of electronic-circuit-component mounters, said electronic-circuit assembling process comprising: causing one of the electronic-circuit-component mounters to mount the at least one of the different-property components onto the circuit board; causing the one of the electronic-circuit-component mounters to provide the circuit board with the property-related information of each of the at least one of the different-property components; causing another one of the electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and causing the another one of the electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the different-property components, on the basis of the recognition of the property-related information. CLPR 5. The electronic-circuit assembling process according to claim 1, wherein the electronic-circuit assembling system including a mounter line formed of a plurality of electronic-circuit-component mounters each having a mounting device, said electronic-circuit assembling process comprising: causing the mounting device of one of the plurality of electronic-circuit-component mounters to hold a property-related-information providing head configured to provide the circuit board with the property-related information, in place of a mounting head configured to mount the electronic circuit components on the circuit board,; and causing the one of the plurality of electronic-circuit-component mounters to provide the circuit board with the property-related information. CLPR 6. The electronic-circuit assembling process according to claim 1, wherein the electronic-circuit assembling system includes a mounting device having a mounting head that is configured to mount the electronic circuit components onto the circuit board after carrying the electronic circuit components from the component supplying device, and the different-property components are handled as being components that are similar to each other, at least in a detection of an error of positioning each of the different-property components when each of the different-property components are carried by a component holder of the mounting head, such that the detection of the error is made by taking an image of the carried different-property component and comparing the taken image with similar reference data that is common to the different-property components. CLPR 7. The electronic-circuit assembling process according to claim 1, wherein the property-related information is provided on the circuit board, by providing, on the circuit board, a machine-readable representative indicative of the property-related information of each of the different-property components, so as to provide the circuit board with the property-related information of the each of different-property components. CLPR 8. The electronic-circuit assembling process according to claim 1, wherein the circuit board is a multi-piece substrate that is formed by a plurality of substrates that are connected to each other, wherein the plurality of mount positions of each one of the mount-position groups are located in a corresponding one of the substrates, and wherein the multi-piece substrate as the circuit board is cut to separate the substrates from each other, after the plurality of electronic circuit components have been mounted onto the multi-piece substrate. CLPR 9. An electronic-circuit assembling process for assembling an electronic circuit by an electronic-circuit assembling system, a plurality of electronic circuit components supplied from at least one component supplier of a component supplying device being mounted onto a circuit board supported by a board supporting device, the plurality of electronic circuit components includes different-property components having respective electrical properties such that the electrical properties of at least two of the different-property components are different from each other, and the different-property components being handled as if they had the same electrical properties in a control for controlling mounting of the electronic circuit components onto the circuit board, said electronic-circuit assembling process comprising: determining a plurality of mount-position groups such that each one of the determined plurality of mount-position groups is constituted by a plurality of mount positions in which the different-property components are to mounted onto the circuit board; storing, in a memory, a component-supplier/different-property-component correlation-related information related to a correlation between a component-supplier-identification-related information and a property-related information, the component-supplier-identification-related information being related to an identification of each of the at least one component supplier which supplies at least one of the different-property components, the property-related information enabling recognition of the electrical property of each of the different-property components which is supplied from a corresponding one of the at least one component supplier; detecting the component-supplier-identification-related information of each of the at least one component supplier installed on the electronic-circuit assembling system, such that the detected component-supplier-identification-related information is correlated with a component supply position that is a position of the installation of each of the at least one component supplier; detecting a different-property-component-related information that includes: (a) a different-property-component supply position from which each of the different-property components is supplied by said component supplying device and (b) the property-related information of the each of the different-property components which is supplied by said component supplying device, based on the detected component-supplier-identification-related information and the component supply position of a corresponding one of the at least one component supplier, and based on the component-supplier/different-property-component correlation-related information stored in the memory; mounting the plurality of electronic circuit components onto the circuit board, by supplying, based on at least information related to the different-property-component supply position obtained by detecting the different-property-component-related information, the plurality of electronic circuit components including the different-property components, from the at least one component supplier of the component supplying device, such that the different-property components that are the same as each other with respect to electrical property value are mounted onto the respective mount position of each one of the plurality of mount-position groups; and providing the circuit board with the obtained property-related information of each of the different-property components that are mounted on the circuit board, such that the provided property-related information of each of the different-property components is correlated with a corresponding one of the plurality of mount-position groups. CLPR 10. The electronic-circuit assembling process according to claim 9, wherein the electronic-circuit assembling system including an electronic-circuit-component mounter having a mounting device that is configured to mount the electronic circuit components onto the circuit board after taking the electronic circuit components from the component supplying device, and wherein the component supplying device includes: (i) the plurality of component suppliers as the at least one component supplier each of which is configured to store therein the plurality of electronic circuit components and to sequentially supply the plurality of electronic circuit components to the mounting device and (ii) a component-supplier holder having a plurality of holding portions configured to detachably hold the plurality of component suppliers, said electronic-circuit assembling process comprising: causing at least one of the plurality of component suppliers to store therein the different-property components; causing at least one of the plurality of holding portions to hold the at least one of the plurality of component suppliers storing therein the different-property components; and causing the electronic-circuit-component mounter to automatically obtain (.alpha.) a position of the at least one of the plurality of holding portions holding the at least one of the plurality of component suppliers and (.beta.) the property-related information of each of the different-property components that are supplied from the at least one of the plurality of component suppliers. CLPR 11. The electronic-circuit assembling process according to claim 9, wherein the electronic-circuit assembling system including a mounter line formed by a plurality of electronic-circuit-component mounters that are arranged in a line, with each adjacent two of the arranged electronic-circuit-component mounters being close to each other without a gap that enables the circuit board to be taken out through the gap, said electronic-circuit assembling process comprising: causing at least one of the arranged electronic-circuit-component mounters to mount the at least one of the different-property components onto the circuit board; causing at least one of the arranged electronic-circuit-component mounters to provide the circuit board with the property-related information of each of the at least one of the different-property components; causing at least one of the arranged electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and causing at least one of the arranged electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the different-property components, on the basis of the recognition of the property-related information. CLPR 12. The electronic-circuit assembling process according to claim 9, wherein the electronic-circuit assembling system including a plurality of electronic-circuit-component mounters, said electronic-circuit assembling process comprising: causing one of the electronic-circuit-component mounters to mount the at least one of the different-property components onto the circuit board; causing the one of the electronic-circuit-component mounters to provide the circuit board with the property-related information of each of the at least one of the different-property components; causing another one of the electronic-circuit-component mounters to recognize the property-related information provided in the circuit board; and causing the another one of the electronic-circuit-component mounters to mount, onto the circuit board, at least one of the electronic circuit components, which is determined to be associated with the at least one of the different-property components, on the basis of the recognition of the property-related information. CLPR 13. The electronic-circuit assembling process according to claim 9, wherein the electronic-circuit assembling system including a mounter line formed of a plurality of electronic-circuit-component mounters each having a mounting device, said electronic-circuit assembling process comprising: causing the mounting device of one of the plurality of electronic-circuit-component mounters, to hold, in place of a mounting head configured to mount the electronic circuit components on the circuit board, a property-related-information providing head configured to provide the circuit board with the property-related information; and causing the one of the plurality of electronic-circuit-component mounters to provide the circuit board with the property-related information. CLPR 14. The electronic-circuit assembling process according to claim 9, wherein the electronic-circuit assembling system includes a mounting device having a mounting head that is configured to mount the electronic circuit components onto the circuit board after carrying the electronic circuit components from the component supplying device, the different-property components being handled as components that are similar to each other, at least in a detection of an error of positioning each of the different-property components when each of the different-property components are carried by a component holder of the mounting head, such that the detection of the error is made by taking an image of the carried different-property component and comparing the taken image with similar reference data that is common to the different-property components. CLPR 15. The electronic-circuit assembling process according to claim 9, wherein the property-related information is provided on the circuit board, by providing, on the circuit board, a machine-readable representative indicative of the property-related information of each of the different-property components, so as to provide the circuit board with the property-related information of the each of different-property components. CLPR 16. The electronic-circuit assembling process according to claim 9, wherein the circuit board is a multi-piece substrate that is formed by a plurality of substrates that are connected to each other, wherein the plurality of mount positions of each one of the mount-position groups are located in a corresponding one of the substrates, and wherein the multi-piece substrate as the circuit board is cut to separate the substrates from each other, after the plurality of electronic circuit components have been mounted onto the multi-piece substrate. ICUS Y DSRC US