William Park & Associates Patent Ltd.
Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines
A semiconductor device includes a semiconductor chip and an inner interconnection structure. The semiconductor chip includes a front surface that exposes first connection terminals and a rear surface that is opposite to the front surface and exposes second connection terminals separated from the first connection terminals. The inner interconnection structure includes horizontal buried conductive lines and vertical connection lines disposed to pierce the semiconductor chip to connect the first connection terminals and the second connection terminals.
SK Hynix Inc.
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Seung Yeop Hyun Chul
Lee Seo