ScienBiziP, P.C.
Clamping device for soldering operations
A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.
HON HAI PRECISION INDUSTRY CO., LTD. HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.
H H B B H H H H Y B
H05K H05K B23K B23K H05K H05K H05K H05K Y02P B23K
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Qing-Lei Wei Shi-Li Bing Yuan Xi-Hang
Pan Wu Zhang Liu Gao Li