Hauptman Ham, LLP
Wafer thinning apparatus having feedback control and method of using
A wafer thinning apparatus includes a first metrology tool configured to measure an initial thickness of the wafer. The wafer thinning apparatus further includes a controller connected to the first metrology tool, and configured to determine a polishing time based on the initial thickness, a predetermined thickness and a material removal rate. The wafer thinning apparatus further includes a polishing tool connected to the controller configured to polish the wafer for a period of time equal to the polishing time. The wafer thinning apparatus includes a second metrology tool connected to the controller and the polishing tool, and configured to measure a polished thickness. The controller is configured to update the material removal rate based on the polished thickness, the predetermined thickness and the polishing time.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H B H B H H B B B
H01L B24B H01L B24B H01L H01L B24B B24B B24B
inventional inventional inventional inventional inventional inventional inventional inventional inventional
Yuan-Hsuan Kuo-Hsiu Ying-Lang Kei-Wei
Chen Wei Wang Chen