Oblon, McClelland, Maier & Neustadt, L.L.P.
Circuit forming method
A circuit forming method where a metal ink is ejected to a planned formation position of a first wiring at an upper face of a base material. Then, the metal ink is baked, and first wiring is formed. Further, a planned connection section of the first wiring and a second wiring is unbaked. The metal-ink is ejected over an upper face of the unbaked metal ink and a planned formation position of the second wiring at the upper face of the base material. Since the wettability of the upper face of the unbaked metal ink and the wettability of the upper face of the base material are equal to each other, the ejected metal ink ejected and the unbaked metal ink are not separated from each other, so that it is possible to properly connect the first wiring and the second wiring to each other.
FUJI CORPORATION
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Akihiro Tasuku Masato Yoshitaka Kenji Masatoshi Katsuaki
Kawajiri Takeuchi Suzuki Hashimoto Tsukada Fujita Makihara