Lewis Roca Rothgerber Christie LLP
Photosensitive resin composition, film prepared by using the photosensitive resin composition, and organic light-emitting display device including the film
A photosensitive resin composition includes a first binder resin represented by Formula 1. The photosensitive resin composition may be cured at a low temperature (e.g., about 0° C. to about 100° C., about 40° C. to about 100° C., or about 70° C. to about 100° C.). A film may be formed from the photosensitive resin composition. An organic light-emitting display (OLED) device may include the film prepared from the photosensitive resin composition.
Samsung Display Co., Ltd.
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G03F G03F G03F G03F G03F G03F G03F G03F G03F H01L
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Kyungah Gilrae Daebeom SungChul Yuiku Dongjin Dongki Hyoengki Junghwan
Kim Kim Shin Kim Lee Kim Lee Kim Park