Sughrue Mion, PLLC
Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer.
SAMSUNG ELECTRONICS CO., LTD.
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Bona Jongkook Yoonha Kyoungsei Heeseok
Baek Kim Jung Choi Lee