Rimon P.C.
Method for manufacturing and/or packaging a chip
In one aspect, disclosed herein are methods for packaging biochips, including microfluidic chips. The method can comprise bonding a substrate and a cover slide, packaging the bonded chip, creating a vacuum in the package, and applying a pressure on the packaged chip. The method is particularly useful for minimizing bubble formation during low-cost and mass production of microfluidic chips.
CAPITALBIO CORPORATION
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B01L B81B B01L B01L B81C B01L B01L B81B
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Xinying Li Juan Jinhai Mingxian Lei
Zhou Ma Xin Feng Lin Wang