Slater Matsil, LLP
Contact test structure and method
A system and method for testing electrical connections is provided. In an embodiment one or more floating pads may be manufactured in electrical connection with an underbump metallization structure. A test may then be performed to measure the electrical characteristics of the underbump metallization structure through the floating pad in order to test for defects. Alternatively, a conductive connection may be formed on the underbump metallization and the test may be performed on the conductive connection and the underbump metallization together.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Tsung-Yuan Jie Ying-Ju Hsien-Wei
Yu Chen Chen Chen