WPAT, PC
Miniature image pickup module and manufacturing method thereof
A miniature image pickup module and a manufacturing method are provided. The manufacturing method includes the following steps. In a step (a), a substrate with two vertical conductor lines is provided. In a step (b), a photosensitive element is provided. The photosensitive element is fixed on the substrate. The two vertical conductor lines are penetrated through two openings of the photosensitive element. Moreover, first ends of the vertical conductor lines are located away from the substrate and partially exposed to a top surface of the photosensitive element. In a step (c), the first ends of the vertical conductor lines are electrically connected with the corresponding bonding pads. In a step (d), a lens module is fixed on the substrate to cover a top side of the photosensitive element, so that the miniature image pickup module is manufactured.
PRIMAX ELECTRONICS LTD.
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inventional inventional inventional inventional
Ching-Hui Sheng-Hsiang Yi-Hou
Chang Chiu Chen