Oliff & Berridge, PLC.
Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
Scribe lines are formed in advance at cutting locations on both surfaces of a panel formed by bonding an upper substrate and a lower substrate to each other via a sealing material, and a laser beam is applied to each of the scribe lines on both surfaces, by which a liquid crystal panel having a product size is obtained.
Seiko Epson Corporation
B B C C G B
B23K B23K C03B C03B G02F B23K
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Shoichi Kazuto Kenji Hidehiro
Terada Yoshimura Masuda Ito