Slater Matsil, LLP
Pad design for reliability enhancement in packages
A package includes a corner, a device die having a front side and a backside, and a molding material molding the device die therein. A plurality of redistribution lines is on the backside of the device die. The plurality of redistribution lines includes a plurality of metal pads. A polymer layer contacts the plurality of metal pads. A plurality of openings is formed in the polymer layer, with the plurality of metal pads aligned to and exposed to the plurality of openings. The plurality of openings includes a corner opening that is elongated and an additional opening farther away from the corner than the corner opening. The additional opening is non-elongated.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional
Jie Hsien-Wei
Chen Chen