Muir Patent Law, PLLC
Semiconductor package and method of fabricating the same
Insulating layers of a redistribution layer of a semiconductor package may be formed as a polymer film having inorganic fillers formed therein. The inorganic fillers may trap reactive materials to inhibit and/or substantially prevent the metal conductors, such as chip pads of the semiconductor chip being packaged, from being damaged by the reactive material. As a result, the reliability and the durability of the semiconductor package may be improved.
SAMSUNG ELECTRONICS CO., LTD.
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Kyoung Lim Seokhyun
Suk Lee