Haynes and Boone, LLP
Pattern fidelity enhancement with directional patterning technology
A method for semiconductor manufacturing includes providing a substrate and a patterning layer over the substrate; forming a hole in the patterning layer; applying a first directional etching along a first direction to inner sidewalls of the hole; and applying a second directional etching along a second direction to the inner sidewalls of the hole, wherein the second direction is different from the first direction.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Yen-Ming Kuei-Shun Yuan-Hsiang Chien-Wei Chi-Cheng Wei-Liang Ching-Yu Ya Hui Chih-Yuan Ru-Gun Yu-Tien Chin-Hsiang Yung-Sung
Chen Chen Lung Wang Hung Lin Chang Chang Ting Liu Shen Lin Yen