Fish & Richardson P.C.
Physical vapor deposition with impedance matching network
A method of physical vapor deposition includes applying a radio frequency signal to a cathode in a physical vapor deposition apparatus, wherein the cathode includes a sputtering target, electrically connecting a chuck in the physical vapor deposition apparatus to an impedance matching network, wherein the chuck supports a substrate, and wherein the impedance matching network includes at least one capacitor, and depositing material from the sputtering target onto the substrate.
FUJIFILM Corporation
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Takayuki Youming Takamichi Yoshikazu Jeffrey
Naono Li Fujii Hishinuma Birkmeyer