Muncy, Geissler, Olds & Lowe, PLLC
Light-emitting diode apparatus and manufacturing method thereof
A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.
National Central University Delta Electronics, Inc.
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Cheng-Yi Chii-Chang Ching-Liang Huang-Kun Chia-Hua Horng-Jou Shih-Peng
Liu Chen Lin Chen Chan Wang Chen