Myers Bigel Sibley & Sajovec PA
Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same
A semiconductor device is provided including a printed circuit board and first, second and third rows of power and/or signal pads on the printed circuit board. A plurality of input and output buffers are also provided. Ones of the plurality of input and output buffers are provided between the first and second rows and others of the plurality of input and output buffers are provided between the second and third rows. Related methods of fabricating semiconductor devices are also provided.
Samsung Electronics Co. ,Ltd.
Y H G H H
Y10T H01L G11C H01L H01L
additional additional additional additional inventional
Jung-hwan Dae-Woon
Choi Kang