Reactive hot melt adhesive
 The present invention relates to solvent free, moisture-curable, reactive hot melt adhesive compositions that are solid at room temperature, methods of making the compositions, and laminates prepared using the compostions. The compositions are a mixture comprising an isocyanate terminated prepolymer and a thermoplastic vinyl chloride copolymer. 
Ashland Inc.
B Y C Y Y C C C C B B C Y C Y C Y
B32B Y10T C08L Y10T Y10T C09J C08G C08G C08G B32B B32B C08L Y10T C08L Y10T C09J Y10T
inventional additional additional additional additional inventional additional inventional inventional inventional additional additional additional additional additional inventional additional
Gary J. Chung-Ying
Walsworth Chang