Sughrue, Mion, Zinn, Macpeak & Seas
Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
 A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed. PA1 The wiring substrate comprises: PA0 a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support; PA0 at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support; PA0 a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; and PA0 a bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support. 
Nitto Denko Corporation
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inventional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional
Masakazu Kazuo Shoji Atsushi Munekazu Tetsuya Kazuto Amane Takanori Mikio Yoshinari
Sugimoto Ouchi Morita Hino Tanaka Terada Shinozaki Mochizuki Miyoshi Aizawa Takayama