McDermott Will & Emery LLP
Method of bonding with silver paste
A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of silver particles and a plurality of bismuth particles. The method further includes disposing the semiconductor on the substrate and forming a bonding layer by heating the silver paste, wherein the semiconductor and the substrate are bonded to each other by the bonding layer.
HYUNDAI MOTOR COMPANY
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Hyun Woo Dae Hwan Kyoung-Kook Jong Seok Su Bin Youngkyun
Noh Chun Hong Lee Kang Jung