Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Plated copper alloy material and process for production thereof
A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.
Kobe Steel Ltd.
C Y C Y Y C Y C C Y C H
C23C Y10S C25D Y10T Y10T C25D Y10T C23C C23C Y10S C25D H05K
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Yasuhiro Ryoichi Toshihisa Masahiro Masayasu
Shintani Ozaki Hara Kawaguchi Nishimura