Sonnenschein, Nath & Rosenthal
Solid-state imaging device
The object of the present invention is to provide a solid-state imaging device making it possible to downsize an imaging unit and further decrease the diameter of the front end of an electronic endoscope. A bonding pad (25) provided in the outer periphery of a solid-state imaging chip (18) and a bonding pad (26) provided in a vertical substrate (20a) combined with the back of the solid-state imaging chip (18) are connected with each other by connection means (29) constituted of a film with a wiring pattern formed, a horizontal substrate (20b) is combined with the back of the substrate (20a), electronic components (19) are mounted on the stepped surface of the substrate (20b) retreating from the substrate (20a) and a signal cable (30) is connected to a terminal portion (27) formed at an end of the stepped surface of the substrate (20b) so that the substrates (20a) and (20b) and electronic components (19) mounted on the substrate (20b), and terminal portion (27) of the signal cable are set in the projection area of the solid-state imaging chip (18).
Sony Corporation
H H A
H04N H04N A61B
inventional additional inventional
Yasuyuki Taketo Hitoshi
Suzuki Miyashita Kajinami