Michael Best & Friedrich LLP
Light emitting chip and method of producing the same
A light emitting chip includes a first-type semiconductor layer, a light emitting layer, and a second-type semiconductor layer which are disposed in such order, a passivation layer, and a current spreading layer. The second-type semiconductor layer and the light emitting layer cooperate to form a mesa structure which partially exposes the first-type semiconductor layer. The mesa structure has a lateral surface over which the passivation layer is disposed. The current spreading layer is disposed in contact with the second-type semiconductor layer. A distance between peripheries of a contact surface of the current spreading layer and a top surface of the second-type semiconductor layer is not greater than 5 μm. A method for producing the chip is also disclosed.
Xiamen San'an Optoelectronics Co., Ltd.
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Shuo Yu-Tsai Shutian Chung-Ying Yan
Yang Teng Qiu Chang Feng