Lee & Morse, P.C.
Method of manufacturing light emitting device package
A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.
SAMSUNG ELECTRONICS CO., LTD.
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Yong Min Jung Jin Min Ki
Kwon Kim Kim