Faegre Drinker Biddle & Reath LLP
Thermal interface material including crosslinker and multiple fillers
A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Honeywell International Inc.
H H H H H H H C H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L C09K H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional inventional additional additional inventional inventional inventional additional additional additional additional inventional additional
Wei Jun Hong Min Liqiang Ya Qun
Wang Huang Zhang Liu