Tung & Associates
Apparatus and method for servicing a wafer platform
 An apparatus for servicing a wafer chuck such as an electrostatic chuck that is equipped with vent holes for cooling the backside of a wafer positioned on the chuck and for clearing the vent holes is provided. The novel apparatus can be used either in replacing a gas supply conduit to the electrostatic chuck without having to break vacuum in the process chamber, or can be used in clearing the vent holes when servicing an electrostatic chuck. The apparatus consists of a three-way control valve and a high pressure gas supply line of a suitable inert gas. 
Taiwan Semiconductor Manufacturing Co., Ltd.
Y C H H C H B
Y10S C23C H01L H01L C23C H01L B08B
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Jia Rong Long Hoang
Chen Peng