Bell & Manning, LLC
Method for embedding thin film sensor in a material
An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process or through a dynamic bonding process. The embedded sensor or other desired device is provided on a substrate through any known or later-developed method. A cover is then bonded to the substrate using a solid-state bonding process or a dynamic bonding process. The solid-state bonding process may include providing heat and pressure to the substrate and the cover to bond the substrate and the cover together. The dynamic bonding process may include heating a bonding agent and distributing the heated bonding agent between the substrate and cover to bond the substrate and the cover together.
Wisconsin Alumni Research Foundation
Y B Y B B G B Y B B Y B B
Y10T B26D Y10T B26D B26D G01L B23B Y10T B26D B26F Y10T B23B B23B
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Xudong Xiaochun Arindom
Cheng Li Datta