ScienBiziP, P.C.
Cooling plate and method for manufacturing thereof
A cooling plate of a first embodiment of the present disclosure is configured with a electronic device for heat dissipation. The cooling plate of the first embodiment disclosure includes a first plate, a second plate opposite to the first plate, a bonding line connected with the first plate and the second plate, a plurality of supporting columns, and a cooling liquid received between the first plate and the second plate. The first plate, the second plate, and the bonding line together define a cavity, the plurality of supporting columns and the cooling liquid are received in the cavity. The plurality of supporting columns connects perpendicularly with the first plate and the second plate. The cooling liquid communicates between the plurality of the supporting columns.
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. Avary Holding (Shenzhen) Co., Limited
H H G H G H
H05K H05K G06F H01L G06F H01L
inventional inventional inventional inventional additional inventional
Xian-Qin Fu-Yun Hsiao-Ting Ming-Jaan
Hu Shen Hsu Ho