Ostrolenk Faber LLP
Wire bonder including a transducer, a bond head, and a mounting apparatus
Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.
ASM Technology Singapore Pte Ltd
H B B B B B H H H B B B H H H H H
H01L B23K B23K B23K B23K B23K H01L H01L H01L B06B B23K B23K H01L H01L H01L H01L H01L
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Ka Shing Yam Mo Hing Leung Xiang Chao
Kwan Wong Li Li