Muir Patent Law, PLLC
Semiconductor device including three-dimensional crack detection structure
A semiconductor device includes a semiconductor die, a semiconductor integrated circuit and a three-dimensional crack detection structure. The semiconductor die includes a central region and a peripheral region surrounding the central region. The semiconductor integrated circuit is formed in the central region. The three-dimensional crack detection structure is formed in a ring shape in the peripheral region to surround the central region. The three-dimensional crack detection structure is expanded in a vertical direction. Using the three-dimensional crack detection structure, the crack penetration of various types may be detected thoroughly.
SAMSUNG ELECTRONICS CO., LTD.
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Bo-Tak Seung-Seob Hyuk-Joon
Lim Lee Kwon