JCIPRNET
Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.
JSR CORPORATION
C C C C C H H C H C C C H
C09J C08G C08G C09J C08G H01L H01L C09J H01L C09J C08G C08G H01L
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Takashi Hikaru
Mori Mizuno