Brake Hughes Bellermann LLP
Semiconductor device assemblies including spacer with embedded semiconductor die
In a general aspect, a semiconductor device assembly can include a semiconductor die having a first surface including active circuitry, a second surface opposite the first surface, and a plurality of side surfaces. Each of the plurality of side surfaces can extend between the first surface of the semiconductor die and the second surface of the semiconductor die. The semiconductor device assembly can also include a conductive spacer having a cavity defined therein. The semiconductor die can be electrically and thermally coupled with the conductive spacer, the semiconductor die being at least partially embedded in the cavity.
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Huibin Yusheng Yong
Chen Lin Liu