Muncy, Geissler, Olds & Lowe, P.C.
Semiconductor device and method of manufacturing the same
The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor component, a re-routing layer, a bonding dielectric and an insulating layer. The re-routing layer is disposed over the semiconductor component and electrically coupled to the semiconductor component. The bonding dielectric is disposed over the semiconductor component to surround a top portion of the re-routing layer. The insulating layer is disposed between the semiconductor component and the bonding dielectric to surround a bottom portion of the re-routing layer.
NANYA TECHNOLOGY CORPORATION
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional inventional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional
Hsih-Yang Ching-Hung Pei-Jhen Chiang-Lin
Chiu Chang Wu Shih