William Park & Associates Ltd.
Semiconductor package including stacked semiconductor chips
Disclosed is a semiconductor package. The semiconductor package includes a substrate including an opening, a first semiconductor chip, disposed on the substrate, including a plurality of first chip pads exposed through the opening, a second semiconductor chip, disposed on the first semiconductor chip to partially overlap with the first semiconductor chip, including a plurality of second chip pads, aligned with the opening, and a redistribution layer formed on a surface on which the second chip pads of the second semiconductor chip are disposed. One or more of the second chip pads overlaps with the first semiconductor chip and is covered by the first semiconductor chip and with the remaining pads of the second chip pads being exposed through the opening. The redistribution layer includes redistribution pads, exposed through the opening, and includes redistribution lines, configured to connect the one or more of the second chip pads to the redistribution pads.
SK hynix Inc.
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inventional inventional inventional additional additional inventional inventional additional additional inventional inventional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional
Hyun-Chul Jun-Sik
Seo Kim