Troxell Law Office PLLC
Semiconductor package with metal pads
A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface has an interval with the plane of forming the metal pads by means of selectively self-etching the leads or stamping to bend the leads in order to avoid forming a cutting sharp edge in the brim of the metal pad after cutting.
Walsin Advanced Electronics Ltd
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Chao-Chia Chien-Hung Yu-Hsien Ming-Hui Chun-Jen Chien-Tsun
Chang Lai Su Tseng Su Lin