Harness, Dickey & Pierce
Light-emitting device packages and methods of manufacturing the same
A light-emitting device package includes a plurality of luminescent structures arranged spaced apart from each other in a horizontal direction, an intermediate layer on the plurality of luminescent structures, and wavelength conversion layers on the intermediate layer, the wavelength conversion layers vertically overlapping separate, respective luminescent structures of the plurality of luminescent structures. The intermediate layer may include a plurality of layers, the plurality of layers associated with different refractive indexes, respectively. The intermediate layer may include a plurality of sets of holes, each set of holes may include a separate plurality of holes, and each wavelength conversion layer may vertically overlap a separate set of holes on the intermediate layer.
SAMSUNG ELECTRONICS CO., LTD.
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Kyung-wook Min-gyeong Jung-sub Dong-gun Yong-il Jin-sub
Hwang Gwon Kim Lee Kim Lee