Duane Morris LLP
Method of cutting conductive patterns
A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Huang-Yu Wen-Hao Chin-Hsiung Tsong-Hua
Chen Chen Hsu Ou