Mannava & Kang, P.C.
Apparatus and method for inspecting a semiconductor package
There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.
SAEDGE VISION SOLUTIONS PTE. LTD.
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Victor Soon Wei Choong Fatt Ah Kow
Vertoprakhov Wong Ho Chin