William Park & Associates LTD.
Conductive bump, semiconductor chip and stacked semiconductor package using the same
A conductive bump includes a step member formed to form a step on a portion of a connection pad; and a conductive member formed on the connection pad and the step member and having an inclined surface which is inclined with respect to the connection pad.
SK hynix Inc.
H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional inventional additional inventional inventional additional additional additional additional inventional additional additional additional additional additional
Hyeong Seok
Choi