Foley & Lardner LLP
Semiconductor packages
A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining a through hole extending from the first surface to the second surface, the through hole being further defined by a first sidewall and a second sidewall of the passivation layer; a first conductive layer on the first surface of the passivation layer and the first sidewall; a second conductive layer on the second surface of the passivation layer and the second sidewall; and a third conductive layer between the first conductive layer and the second conductive layer.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Ming-Chi Shin-Hua Yuan-Fu Hung-Sheng
Liu Chao Sung Chen