Blakley, Sokoloff, Taylor & Zafman LLP
Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.
APPLIED MATERIALS, INC.
H B H B B H Y
H05H B23B H01L B23B B23Q H01L Y10T
inventional inventional inventional additional inventional inventional additional
Surajit Kallol Douglas A. Xiaoping Shane C. Hamid
Kumar Bera Buchberger, Jr. Zhou Nevil Tavassoli