Harness, Dickey & Pierce, P.L.C.
Copper electroplating solution and copper electroplating apparatus
An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.
Samsung Electronics Co., Ltd.
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Ki-Hyeon Yun-Deok Jung-Sik Myung-Beom Youn-Joung
Kim Kang Choi Park Cho