Pennie & Edmonds LLP
Electronic component parts device
 In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film. 
Hitachi Chemical Company, Ltd.
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Osamu Yasushi Kazuyoshi Akira Akishi Itsuo Teiichi Kenzo Yoshiyuki Kazunori
Watanabe Shimada Kojima Nagai Nakaso Watanabe Inada Takemura Tsuru Yamamoto