Harness, Dickey & Pierce, P.L.C.
Package substrate and semiconductor package having the same
Provided is a package substrate and a semiconductor package. The package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves.
Samsung Electronics Co., Ltd.
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Y02P H01L H01L H01L H05K H05K H01L H01L H01L H05K H05K
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Heeseok Yun-Hee Chiyoung Se-Ho
Lee Lee Lee You