Slater Matsil, LLP
Barrier layer and structure method
A method for forming a multilayer barrier comprises forming a conductive line over a substrate, depositing a dielectric layer over the conductive line, forming a plug opening in the dielectric layer, forming a multilayer barrier through a plurality of deposition processes and corresponding plasma treatment processes.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H
H01L H01L H01L H01L H01L H01L H01L
inventional additional additional inventional additional inventional additional
Jian-Shin Tain-Shang Jung-Chih Yu-Ming Chun Che Chih-Chung
Tsai Chang Tsao Huang Lin Chang