Brooks Kushman P.C.
Active plastic bridge chips
A system for proximity communication between semiconductor chips includes a package assembly. The package assembly includes a plurality of bridge circuits made of organic or plastic semiconductor material. A plurality of base chips are assembled to the package assembly. The package assembly positions and aligns the plurality of base chips such that the bridge circuits bridge the base chips and enable proximity communication between the base chips.
Oracle America, Inc.
H H G H H H H H H
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Ashok V.
Krishnamoorthy