Park, Vaughan, Fleming & Dowler LLP
Self-assembly of micro-structures
Embodiments of a method for assembling a multi-chip module (MCM) are described. During this method, a fluid that includes coupling elements is applied to a surface of a base plate in the MCM. Then, at least some of the coupling elements are positioned into negative features on the surface of the base plate using fluidic assembly. Note that a given coupling element selects a given negative feature using chemical-based selection and/or geometry-based selection. Next, the fluid and excess coupling elements (which reside in regions outside of the negative features on the surface) are removed.
Oracle America, Inc.
H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional inventional inventional additional inventional
Ashok V. James G. John E.
Krishnamoorthy Mitchell Cunningham