Wenderoth, Lind & Ponack, L.L.P.
Structure of chip on chip mounting preventing from crosstalk noise
 The present invention reduces crosstalk noise, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap. The semiconductor device includes a first semiconductor chip (1) having a first electrode pad (2) and a first wiring layer (9), and a second semiconductor chip (5) having a second electrode pad (6) and a second wiring layer (10). A bump (4) is provided for electrically coupling the first electrode pad (2) and the second electrode pad (6). An insulation layer 8 is disposed between confronting surfaces of the first semiconductor chip (1) and the second semiconductor chip (5). An electro-conductive layer (7) is disposed between the confronting surfaces of the first semiconductor chip and the second semiconductor chip. 
Matsushita Electronics Corp. Matsushita Electric Industrial Co., Ltd.
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Tadaaki Ichiro Takio Hiroaki Takayuki Takashi Yoshiaki Toshio
Mimura Yamane Yamashita Fujimoto Yoshida Otsuka Kasuga Matsuki