Burr & Brown
Bonding structure and semiconductor device manufacturing apparatus
A bonding structure according to the present invention includes: a ceramic member including a hole; a terminal embedded in the ceramic member and including an exposed surface exposed to a bottom portion of the hole; a brazed bond layer formed in contact with the exposed surface of the terminal; and a connecting member inserted in the hole, and bonded to the terminal via the brazed bond layer. An inner diameter of the hole is larger than an outer diameter of the connecting member. A clearance is formed between the hole and the connecting member when the connecting member is inserted in the hole. A braze pool space is formed in a surface of the hole and has a substantially semicircular shape in a cross-sectional plane. The braze pool space is partially filled with a braze material.
NGK Insulators, Ltd.
Y H H
Y10T H01L H01L
additional inventional inventional
Tomoyuki Taichi Hiroshi
Fujii Nakamura Takebayashi