Duane Morris LLP
Slurry system for semiconductor fabrication
A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.
Taiwan Semiconductor Manufacturing Co., Ltd.
B Y G Y Y B Y Y
B24B Y10T G01F Y10T Y10T B24B Y10T Y10T
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Yung-Long Yi-Wen Liang-Chieh Chih-Chiang
Chen Huang Huang Tseng