JCIPRNET
Package structure and manufacturing method thereof
A package structure and the manufacturing method thereof are provided. The package structure includes a semiconductor die, conductive through vias, an insulating encapsulant, and a redistribution structure. The conductive through vias are electrically coupled to the semiconductor die. The insulating encapsulant laterally encapsulates the semiconductor die and the conductive through vias, wherein the insulating encapsulant has a recess ring surrounding the semiconductor die, the conductive through vias are located under the recess ring, and a vertical projection of each of the conductive through vias overlaps with a vertical projection of the recess ring. The redistribution structure is electrically connected to the semiconductor die and the conductive through vias.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional inventional additional additional inventional additional inventional additional additional additional inventional additional additional inventional inventional inventional
Szu-Wei Ping-Yin Chih-Hao Li-Hui
Lu Hsieh Chen Cheng