Wolf, Greenfield & Sacks, P.C.
Semiconductor package with coated bonding wires and fabrication method thereof
A semiconductor package includes a carrier substrate having a top surface, a semiconductor die mounted on the top surface, a plurality of bonding wires connecting the semiconductor die to the carrier substrate, an insulating material coated on the bonding wires, and a molding compound covering the top surface and encapsulating the semiconductor die, the plurality of bonding wires, and the insulating material.
MediaTek Inc.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional additional inventional inventional inventional additional additional additional inventional additional additional additional additional inventional inventional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional
Chin-Chiang Hsueh-Te Shiann-Tsong
Chang Wang Tsai