Howrey Simon Arnold & White, LLP
Positive photoresist layer and a method for using the same
A method for preparing a positive photoresist layer is provided. In this method, a photoresist composition is drop-wise applied on an insulator layer or a conductive metal layer formed on a substrate. The photoresist composition includes a polymer resin, a sensitizer for changing solubility of the photoresist layer when exposed and a solvent. The coated substrate is rotated at the speed of 1,250 to 1,350 rpm for 4.2 to 4.8 seconds. The coated substrate is then dried and the dried substrate is exposed to some form of radiation. Next, the exposed portion is removed by using an alkaline developing solution. The solvent preferably includes 3-methoxybutyl acetate and 4-butyrolactone, or includes 3-methoxybutyl acetate, 2-heptanone, and 4-butyrolactone.
Samsung Electronics Co., Ltd.
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G03F G03F G03F
inventional inventional inventional
Jin-Ho Yu-Kyung Yun-Jung Ki-Soo Hong-Sik Sung-Chul
Ju Lee Nah Kim Park Kang