Oblon, Spivak, McClelland, Maier & Neustadt
Modified phenolic resin, epoxy resin and curing agent molding material
 A molding material useful in the fabrication of an electrical or electronic part comprises a modified phenolic resin (A), an epoxy resin (B) and a curing agent (C), said modified phenolic resin prepared by heating heavy oil or pitch and a formaldehyde in a molar ratio of formaldehyde: (oil or pitch) of from 1-15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol: (oil or pitch) of from 0.5-5:1 to form a modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon and (ii) an extraction with an aromatic hydrocarbon solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst. 
Kashima Oil Co., Ltd.
H C C C C C
H01B C08G C08L C08L C08G C08G
inventional inventional additional inventional inventional inventional
Masao Tomoaki Hiromi Masahiro Haruhiko
Tashima Fujii Miyasita Tsumura Takeda