JCIPRNET
Integrated circuit package and method of fabricating the same
An integrated circuit package including at least one integrated circuit component, at least one electromagnetic interference shielding layer and an insulating encapsulation is provided. The at least one integrated circuit component includes an active surface, a plurality of sidewalls connected to the active surface and a plurality of conductive pillars protruding from the active surface. The at least one electromagnetic interference shielding layer covers the sidewalls of the at least one integrated circuit component, and the at least one electromagnetic interference shielding layer is electrically grounded. The insulating encapsulation encapsulates the at least one integrated circuit component and the at least one electromagnetic interference shielding layer, and the conductive pillars of the at least one integrated circuit component are accessibly exposed by the insulating encapsulation. Methods of fabricating the integrated circuit package are also provided.
Taiwan Semiconductor Manufacturing Co., Ltd.
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additional inventional inventional additional inventional additional inventional additional additional inventional inventional inventional additional additional additional additional additional inventional additional additional additional inventional inventional additional inventional additional inventional additional additional inventional inventional additional additional additional additional additional additional inventional inventional additional additional inventional inventional additional additional
Jie Hsien-Wei
Chen Chen