F. Chau & Associates, LLC
Semiconductor package
A semiconductor device is provided. The semiconductor includes a semiconductor chip, a package substrate, and an electromagnetic interference (EMI) shielding layer. The package substrate, arranged under the semiconductor chip, is electrically connected to the semiconductor chip. The package substrate has a receiving groove. The EMI shielding layer is arranged in the receiving groove to shield EMI propagated from a lower surface of the semiconductor chip through the package substrate.
SAMSUNG ELECTRONICS CO., LTD.
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Seok-Hyun
Lee