Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Semiconductor package having metal layer
A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
Siliconware Precision Industries Co., Ltd.
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Chih-Hsien Chun-Chi Chia-Yang Cho-Hsin Tsung-Hsien Hao-Ju Hsin-Lung
Chiu Ke Chen Chang Tsai Fang Chung