Leydig, Voit & Mayer
Semiconductor sealing epoxy resin composition
 A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus. 
Mitsubishi Denki Kabushiki Kaisha
C C C C
C08L C08L C08G C08G
inventional inventional inventional inventional
Kazuo Ichiro Kou Hiromi Goro
Okahashi Takahashi Shimomura Ito Okamoto