Jianq Chyun IP Office
Shell structure and manufacturing method for shell structure of electronic device
A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
Compal Electronics, Inc.
Y B B B B B B B B B B Y B H Y B B B H B B B Y B
Y10T B32B B32B B32B B32B B32B B32B B32B B32B B29C B29C Y10T B32B H01L Y10T B32B B32B B32B H01L B29C B32B B32B Y10T B32B
additional inventional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional additional inventional inventional inventional inventional inventional additional additional inventional
Chien-Min Chih-Wen Han-Ching Po-An Kuo-Nan Jung-Chin
Chang Chiang Huang Lin Ling Wu