Sughrue Mion, PLLC
On-chip balun and transceiver using the same and method for fabricating on-chip balun
Provided are an on-chip balun, a transceiver using the on-chip balun, and a method for fabricating the on-chip balun. The on-chip balun includes: a first metal winding including a port grounded and a port to which an unbalanced signal is input; a second winding outputting an induced current generated by the first metal winding as two signals having about equal intensity and a phase difference of about 180°; and a ground shield positioned between the first and second metal windings and having a symmetric structure so as to generate a symmetric parasitic capacitance between the ground shield and the second metal winding. The ground shield can be inserted between the first and second metal windings to remove an asymmetrical parasitic capacitance so as to reduce a phase imbalance and a gain imbalance of an output value of the second metal winding. As a result, a highly balanced on-chip balun can be fabricated.
Samsung Electronics Co., Ltd.
H H
H01F H01F
inventional additional
Jae-sup Seong-soo Dong-hyun
Lee Lee Lee