Fitzpatrick, Cella, Harper & Scinto
Recording device board having a plurality of bumps for connecting an electrode pad and an electrode lead, liquid ejection head, and manufacturing method for the same
The invention is intended to suppress failures of connected portions between electrode pads and bumps. A liquid ejection head comprises a recording device board including an energy generating device disposed thereon to generate energy for ejecting a liquid through an ejection orifice, and an electrode pad which is disposed in a recess formed in the recording device board and is electrically communicated with the energy generating device. The liquid ejection head further comprises an electrode lead for supplying power to the electrode pad externally of the recording device board, a bump for connecting the electrode pad and the electrode lead to establish electrical communication therebetween, and a sealing resin material filled in the recess to surround an electrically connected portion between the electrode pad and the bump without covering the bump.
Canon Kabushiki Kaisha
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B41J B41J B41J B41J B41J B41J
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Toshihiro
Mori