Lee & Morse, P.C.
Polishing pad compound
A polishing pad compound and a polishing pad, the polishing pad compound including a pre-polymer; and a hardener, wherein the pre-polymer includes about 45 wt % to about 50 wt % of a polyol, about 5 wt % to about 25 wt % of a hardness regulator, and a balance of an isocyanate.
SAMSUNG ELECTRONICS CO., LTD.
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Jungsik Jin-Su Youngjun Bong-Su
Choi Jeong Jang Ahn