J.C. Patents
Package of a chip with beveled edges
A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered onto the surface of the die pad by the adhesive material.
Advanced Semiconductor Engineering, Inc.
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Jian-Cheng Wei-Min
Chen Hsiao