McAndrews, Held & Malloy, Ltd.
Semiconductor package and manufacturing method thereof
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
AMKOR TECHNOLOGY, INC.
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additional additional additional additional inventional additional additional additional additional additional inventional additional additional
Yung Woo Mi Kyeong Jae Ung Jin Seong
Lee Choi Lee Kim