Myers Bigel Sibley & Sajovec, P.A.
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.
Samsung Electronics Co., Ltd.
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additional additional additional additional inventional additional additional inventional additional inventional additional additional inventional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional inventional additional inventional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional
Ju-Il Hyun-Soo Dong-Ho Seong-Deok Seung-Kwan
Choi Chung Lee Hwang Ryu