Haynes and Boone, LLP
Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same
A semiconductor device including a device substrate having a front side and a back side. The semiconductor device further includes an interconnect structure disposed on the front side of the device substrate, the interconnect structure having a n-number of metal layers. The semiconductor device also includes a bonding pad disposed on the back side of the device substrate, the bonding pad extending through the interconnect structure and directly contacting the nth metal layer of the n-number of metal layers.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jen-Cheng Jeng-Shyan Dun-Nian Shuang-Ji Yueh-Chiou Wen-De
Liu Lin Yaung Tsai Lin Wang