Method for forming a metal structure
A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.
United Microelectronics Corp.
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Ping-Chang Hui-Ling Jui-Meng Ching-Li Kai-Kuang Chien-Li
Wu Chen Jao Yang Ho Kuo