WPAT, PC
Structure of thermal resistive layer and the method of forming the same
The prevent invention discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is easy to carry out.
Industrial Technology Research Institute
B B H Y H B H B B B B Y Y B B H Y H Y Y H B B B Y B B B B B B Y Y
B32B B32B H01L Y10T H01L B32B H01L B32B B32B B32B B32B Y10T Y10T B32B B32B H01L Y10T H01L Y10T Y10T H01L B32B B32B B32B Y10T B32B B32B B32B B32B B32B B32B Y10T Y10T
inventional additional additional additional additional additional inventional inventional inventional additional inventional additional additional inventional additional inventional additional additional additional additional inventional inventional additional inventional additional additional inventional inventional inventional inventional additional additional additional
Chien-Te Jung-Fang Yu-Hung Chin-Jen Te-Chi
Hsieh Chang Chen Huang Wong