Roberts Mlotkowski Safran, Cole & Calderon, P.C.
Electrical and optical via connections on a same chip
The present disclosure relates to semiconductor structures and, more particularly, to electrical and optical via connections on a same chip and methods of manufacture. The structure includes an optical through substrate via (TSV) comprising an optical material filling the TSV. The structure further includes an electrical TSV which includes a liner of the optical material and a conductive material filling remaining portions of the electrical TSV.
GLOBALFOUNDRIES INC.
G G H G H G G H H
G02B G02B H01L G02B H01L G02B G02B H01L H01L
inventional inventional inventional additional inventional additional inventional inventional inventional
Joseph Kangguo Chengwen Geng Juntao
Ervin Cheng Pei Wang Li