Adams & Wilks
Focused ion beam machining method and device thereof
 A focused ion beam machining method for etching the surface of a sample to obtain a desired profile formation portion by recurrently irradiating a focused ion beam to a desired region of the sample, wherein the recurrently scanned region is enlarged with the elapse of time during the etching and scanning of the sample with the focused ion beam is performed in parallel with the profile formation portion, and the profile formation portion is scanned after all other portions of the recurrently scanned region have been scanned. 
Seiko Instruments Inc.
H
H01J
inventional
Yasuhiko Toshiaki Toshio
Sugiyama Fujii Doi