Slater Matsil, LLP
Protective layer for contact pads in fan-out interconnect structure and method of forming same
In accordance with a method embodiment includes providing a die having a contact pad on a top surface and forming a conductive protective layer over the die and covering the contact pad. A molding compound is formed over the die and the conductive protective layer. The conductive protective layer is exposed using a laser drilling process. A redistribution layer (RDL) is formed over the die. The RDL is electrically connected to the contact pad through the conductive protective layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional
Chin-Chuan Jing-Cheng Tsei-Chung
Chang Lin Fu