ScienBiziP, P.C.
Ultrathin heat dissipation structure
An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.
GARUDA TECHNOLOGY CO., LTD. HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. Avary Holding (Shenzhen) Co., Limited.
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H01L H05K B21D H01L H01L H01L H01L H05K
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Ming-Jaan Ning Biao Cong
Ho Hou Li Lei