Haynes and Boone, LLP
Adhesion layer for multi-layer photoresist
A method is provided including forming a first layer over a substrate and forming an adhesion layer over the first layer. The adhesion layer has a composition including an epoxy group. A photoresist layer is formed directly on the adhesion layer. A portion of the photoresist layer is exposed to a radiation source. The composition of the adhesion layer and the exposed portion of the photoresist layer cross-link using the epoxy group. Thee photoresist layer is then developed (e.g., by a negative tone developer) to form a photoresist pattern feature, which may overlie the formed cross-linked region.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Tzu-Yang Ya-Ching Chen-Yu Chin-Hsiang Ching-Yu
Lin Chang Liu Lin Chang