Schwabe, Williamson & Wyatt, P.C.
Guard ring structures and their methods of fabrication
A guard ring structure includes a ring of semiconductor material disposed on a substrate. A conductive ring is disposed on the ring of semiconductor material. The conductive ring is interconnected by intervening vias. The guard ring structure may include a plurality of individual rings of the semiconductor material formed concentrically and in close proximity to one another on the substrate. A Guard ring structure is generally disposed around a periphery of a die containing integrated circuits that include transistors RF amplifiers and memory devices to reduce the impact of stresses arising from die sawing to separate individual die in a wafer.
Intel Corporation
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Sansaptak Paul B. Han Wui Marko
Dasgupta Fischer Then Radosavljevic