Turocy & Watson, LLP
Semiconductor apparatus and method for manufacturing the same
It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips.
Kabushiki Kaisha Toshiba
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Hideyuki Yutaka Kazuhiko Hiroshi
Funaki Onozuka Itaya Yamada