Farjami & Farjami LLP
Multiple chip module with integrated RF capabilities
A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.
Skyworks Solutions, Inc.
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Shiaw Evan Thuy Roger Hassan Trang
Chang McCarthy Tran Forse Hashemi Trinh