Foley & Lardner LLP
Semiconductor device package
A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Yu-Chang Sung-Hung Hao-Chih Tun-Ching
Chen Chiang Hsieh Pi