Morgan, Lewis & Bockius, LLP
Weld joint with constant overlap area
A packaged semiconductor device has a plurality of leads. A respective lead is to be welded to an electrical coupling that has a substantially rectangular end section. The end section has a width that is greater than a width of the respective lead. The respective lead is aligned within the width of the end section, such that the respective lead extends in a direction substantially perpendicular to the width of the end section. With the respective lead and the end section aligned, the respective lead is welded to the end section.
GALATECH, INC.
B H H B H B H H B B B H Y B H B
B23K H02M H01L B23K H01L B23K H01L H01L B23K B23K B23K H01L Y02B B23K H02M B23K
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Robert James Wenjun
Ramm Liu