Tung & Associates
Wafer centering device and method of using
 A wafer centering device which includes a wafer centering chuck and a wafer calibration disk and a method for using such device are disclosed. The wafer centering chuck can be advantageously used to replace a vacuum chuck in a processing station that utilizes a rotating wafer platform. A center locating pin provided at the center of the wafer centering chuck can then be used to calibrate a centering position for a liquid dispensing nozzle head which dispenses any type of liquid on a rotating wafer. The wafer calibration disk may be used advantageously to calibrate the motion of a robot arm wafer loader when the disk is used in place of a regular wafer. A center aperture and a calibration grid provided on the wafer calibration disk may be used advantageously to identify the deviation of the center when the calibration disk is placed on a wafer centering chuck by the robotic arm. An edge bead portion provided on a top surface of the wafer calibration disk may further be used to provide calibration for a spray nozzle head used in an edge bead rinsing process. The present invention novel wafer centering chuck and wafer calibration disk can therefore be used either individually, or in combination thereof, for the calibration of a wafer processing machine that utilizes a rotating wafer platform such that a wafer may be positioned on a properly centered vacuum chuck. The present invention novel apparatus and method can be used advantageously to replace conventional apparatus and methods which are both time and labor consuming. 
Taiwan Semiconductor Manufacturing Co. Ltd.
H
H01L
inventional
Meng Chun
Li