Eschweiler & Potashnik, LLC
Semiconductor image sensor
The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip has an image sensor within a substrate. A first dielectric has an upper surface that extends over a first side of the substrate and over one or more trenches within the first side of the substrate. The one or more trenches laterally surround the image sensor. An internal reflection structure arranged over the upper surface of the first dielectric. The internal reflection structure is configured to reflect radiation exiting from the substrate back into the substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Kazuaki Chih-Kung Cheng Yu Keng-Yu Jhy-Jyi Wen-Hau Wei-Chieh Chun-Hao Chien-Hsien
Hashimoto Chang Huang Chou Sze Wu Chiang Chuang Tseng