Touch sensing device and a method of fabricating the same using bonding marks on non-bonding surface of FPCB
The present disclosure provides a touch sensing device and a method for fabricating the same. The touch sensing device comprises a touch panel and a flexible printed circuit board, wherein the touch panel comprises a first bonding mark and the flexible printed circuit board has a bonding surface bonded to the touch panel and has a non-bonding surface. The flexible printed circuit board comprises a second bonding mark disposed on the non-bonding surface. The second bonding mark and the first bonding mark have a relationship of contraposition.
TPK Touch Solutions (Xiamen) Inc.
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Yau-Chen Jiadong Jianxing Pingping
Jiang Chen Luo Huang