WPAT, P.C.
Semiconductor package structure and method for manufacturing the same
A semiconductor package structure includes a first package including a bonding region and a periphery region surrounding the bonding region, at least one insulating structure disposed in the bonding region of the first package, a second package disposed over the first package and the insulating structure in the bonding region, and a plurality of connectors disposed between the first package and the second package. The plurality of connectors provide electrical connection between the first package and the second package. Further, the insulating structure penetrates the first package and is spaced apart from the plurality of connectors.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chien-Kuo Chih-Hao Tzu-Kai Chun-Min Hui-Ting
Chang Lin Lan Lin Lin