Oliff PLC
Memory device, laminated semiconductor substrate and method of manufacturing the same
A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip.
Headway Technologies, Inc. SAE Magnetics (H.K.) Ltd.
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Atsushi Yoshitaka Hiroyuki
Iijima Sasaki Ito