Slater Matsil, LLP
Devices employing thermal and mechanical enhanced layers and methods of forming same
A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Hsien-Wei An-Jhih Ying-Ju Der-Chyang Tsung-Shu Wei-Cheng Wei-Yu Chin-Chuan Chi-Hsi Li-Hsien
Yu Chen Su Chen Yeh Lin Wu Chen Chang Wu Huang