Rankin, Hill & Clark LLP
Wiring board and semiconductor apparatus
An inverse F type antenna is provided and includes first wiring portions provided on an upper face of a board, second wiring portions provided on a lower face of the board, connecting portions electrically connecting the first wiring portions and the second wiring portions, in which the connecting portions are provided at a side face of the board.
Shinko Electric Industries Co., Ltd.
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H01L H01L H01Q H05K H01L H05K H01Q H01L
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Tomoharu
Fujii