Circuit elements using z-axis interconnect
Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.
3M Innovative Properties Company
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H Y Y H H H H H H H
H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L H01L H05K H05K H01L H05K H01L H05K H01L H01L H01L H01L H05K H01L H01L H05K H01L H05K H01L H01L Y10T Y10T H01L H01L H05K H01L H01L H01L H01L
additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional
Brian E. Joel A. Yu Joshua W.
Schreiber Gerber Chen Smith