Onello & Mello, LLP
Apparatus for stacked semiconductor chips
Stacked semiconductor chips include a bonding-wire-free interconnection electrically connecting the semiconductor chips to each. An opening in an adhesion layer between the semiconductor chips may provide a path for the interconnection from a bonding pad on one semiconductor chip, along a sidewall insulation layer of the semiconductor chip, along a sidewall insulation layer of another semiconductor chip to a bonding pad on the other semiconductor chip.
Samsung Electronics Co., Ltd.
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Jin-Woo Taesung SeokHyun
Park Park Lee