The Farrell Law Firm, P.C.
Embedded circuit board and manufacturing method thereof
An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates.
Samsung Electronics Co., Ltd
Y H H H
Y10T H05K H05K H05K
additional inventional inventional inventional
Byung-Jik Seok-Myong Yu-Su Ji-Hyun Shi-Yun Youn-Ho Ho-Seong Kyung-Wan
Kim Kang Kim Jung Cho Choi Seo Park