Slater Matsil, LLP
Packaging device having plural microstructures disposed proximate to die mounting region
An example packaging device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of microstructures are disposed proximate a side of the integrated circuit die mounting region. The plurality of microstructures each include an outer insulating layer over a conductive material. An example packaged semiconductor device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of columnar microstructures are disposed on the substrate perpendicular to a major surface of the substrate and proximate a side of the integrated circuit die mounting region. An underfill material is disposed between the substrate and the integrated circuit die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Shien Kuo Lung Yu-Feng
Chen Pan Chen