McClure, Qualey & Rodack, LLP
Packages with multi-thermal interface materials and methods of fabricating the same
A package includes a die on a surface of a package component. The package also includes a first die stack on the surface of the package component. The package further includes a first thermal interface material (TIM) having a first thermal conductivity and disposed on the first die stack. In addition, the package includes a second thermal interface material (TIM) having a second thermal conductivity and disposed on the die. The first thermal conductivity of the first TIM is different from the second thermal conductivity of the second TIM.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Pu-Sheng Fu-Jen Hsien-Liang Chien-Kuo Chih-Hao
Lee Li Meng Chang Lin