Smith, Gambrell & Russell, LLP
Determining method of thermal processing condition
The invention is a method of determining a set temperature profile for a method of controlling respective substrate temperatures of a plurality of groups in accordance with respective corresponding set temperature profiles, in a method of heat processing a plurality of substrates that are classified into the plurality of groups. The invention includes a first heat processing step of controlling respective substrate temperatures of a plurality of groups in accordance with respective predetermined provisional set temperature profiles for first-batch substrates that are classified into the plurality of groups, and of introducing a process gas to conduct a heat process to form films on the substrates; a first film-thickness measuring step of measuring a thickness of the films formed on the substrates; and a first set-temperature-profile amending step of respectively amending the provisional set temperature profiles based on the measured thickness, in such a manner that a thickness of films formed during a heat process is substantially the same between the plurality of groups. In the first heat processing step, the provisional set temperature profiles are profiles whose set temperatures change as time passes.
Tokyo Electron Limited
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H01L Y10S Y10S H01L H01L Y10S
inventional additional additional inventional additional additional
Wenling Fujio Moyuru Koichi
Wang Suzuki Yasuhara Sakamoto