Patent Capital Group
Integrated circuit components with substrate cavities
Disclosed herein are integrated circuit (IC) components with substrate cavities, as well as related techniques and assemblies. In some embodiments, an IC component may include a substrate, a device layer on the substrate, a plurality of interconnect layers on the device layer, and a cavity in the substrate.
Intel Corporation
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inventional inventional inventional inventional inventional additional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional
Sansaptak Paul B. Ibrahim Han Wui Kevin L. Marko
Dasgupta Fischer Ban Then Lin Radosavljevic