GlobalFoundries Singapore Pte.
Bond pads of semiconductor devices
A semiconductor device is provided that includes a dielectric layer, a bond pad, a passivation layer and a planar barrier. The bond pad is positioned in the dielectric layer. The passivation layer is positioned over the dielectric layer and has an opening over the bond pad. The planar barrier is positioned on the bond pad.
GLOBALFOUNDRIES Singapore Pte. Ltd.
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Juan Boon Xuesong Ranjan Xiaodong Ramasamy Chee Kong
Tan Rao Rajoo Li Chockalingam Leong