Antonelli, Terry, Stout & Kraus, LLP.
Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
Hitachi Chemical Company, Ltd.
Y B B B Y H B B C B Y C H B H Y H B C B Y B B C C B B B
Y10T B32B B32B B32B Y10S H05K B32B B32B C08G B32B Y10T C08G H05K B32B H05K Y10T H05K B32B C09J B32B Y10T B32B B32B C08G C08G B32B B32B B32B
additional additional additional additional additional additional additional additional inventional inventional additional inventional inventional additional additional additional additional inventional inventional additional additional inventional inventional inventional inventional inventional additional inventional
Katsuyuki Kenichi Takako Masaki
Masuda Tomioka Ejiri Takeuchi