Ditthavong & Steiner, P.C.
Interconnection designs using sidewall image transfer (SIT)
Methodology enabling a generation of an interconnection design utilizing an SIT process is disclosed. Embodiments include: providing a hardmask on a substrate; forming a mandrel layer on the hardmask including: first and second vertical portions extending along a vertical direction and separated by a horizontal distance; and a plurality of horizontal portions extending in a horizontal direction, wherein each of the horizontal portions is positioned between the first and second vertical portions and at a different position along the vertical direction; and forming a spacer layer on outer edges of the mandrel layer.
GLOBALFOUNDRIES Inc.
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inventional additional inventional inventional
Juhan Yunfei Youngtag Jongwook Dinesh
Kim Deng Woo Kye Somasekhar