Slater Matsil, LLP
Conductive pad structure for hybrid bonding and methods of forming same
A method embodiment includes patterning an opening through a layer at a surface of a device die. The method further includes forming a liner on sidewalls of the opening, patterning the device die to extend the opening further into the device die. After patterning the device die, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional inventional additional inventional inventional additional inventional inventional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional
Sheng-Chau Cheng-Hsien Chih-Hui Shih Pei Yen-Chang Yeur-Luen
Chen Chou Huang Chou Chu Tu