Haynes and Boone, LLP
Photolithography process and materials
One of the broader forms of the present disclosure relates to a method of making a semiconductor device. The method includes exposing a photoresist layer to a radiation source and applying a hardening agent to the photoresist layer. Therefore after applying the hardening agent a first portion of the photoresist layer has a higher glass transition temperature, higher mechanical strength, than a second portion of the photoresist layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Ching-Yu Ya-Ling Yen-Hao Chien-Wei
Chang Cheng Chen Wang