Bonding method and bonded body
A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
Seiko Epson Corporation
C C Y Y
C09J C09J Y10T Y10T
inventional additional additional additional
Shintaro Takatoshi Yoshiaki Mitsuru Kazuhiro
Asuke Yamamoto Mori Sato Gomi