Morgan, Lewis & Bockius LLP
Electronic component and manufacturing method thereof
An electronic component and a manufacturing method thereof are disclosed. An electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, and at least one dummy electrode pattern disposed to be spaced apart from the first electrode pattern and the second electrode pattern and disposed on the substrate. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
SAMSUNG ELECTRO-MECHANICS CO LTD
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Doo Ho Jung Il Hyun Jun Hyung Seok Ichiro Hyung Gon Jong Pil
Yoo Kim Choi Roh Tanaka Kim Lee