WPAT, P.C., Intellectual Property Attorneys
Generating probing map including touchdowns free of disabled probing site
A wafer is probed using a probe card including a plurality of probing sites following a first probing map in which touchdowns of the probe card involve the plurality of probing sites to identify faulty locations. Whether at least one faulty site exists is determined based on the faulty locations. When the at least one faulty site exists, a second probing map in which each touchdown is free of at least one disabled probing site including the at least one faulty site is obtained. The second probing map is selected when a first criterion formed using a first touchdown count (TDC) in the first probing map, a second TDC in the second probing map, a third TDC based on re-probing the faulty locations and a fourth TDC based on re-probing a portion of the faulty locations not induced by the at least one faulty site is met.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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inventional inventional inventional inventional
Feng-Cheng Ming-Shan Kai-Sheng Jing-Cheng Yu-Chih
Chiang Shih Chang Wu Lee