Birch, Stewart, Kolasch & Birch, LLP
Resin composition for encapsulation and electronic device using the same
The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.
SUMITOMO BAKELITE CO., LTD.
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Yusuke Kenji Ken
Tanaka Yoshida Ukawa