Stein IP, LLC
CMP pad conditioner, and method for producing the CMP pad conditioner
This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.
EHWA DIAMOND INDUSTRIAL CO., LTD.
B B
B24B B24D
inventional inventional
Jae Phil Joo Han Seh Kwang Youn Chul Jae Kwang
Boo Lee Lee Kim Choi