Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor device having semiconductor chips in resin and electronic circuit device with the semiconductor device
A semiconductor device includes a first semiconductor unit including a plurality of first semiconductor chips, an organic resin provided between the first semiconductor chips, a wiring layer provided above the first semiconductor chips to electrically connect the first semiconductor chips to each other, and a plurality of connecting terminals provided on an upper portion of the wiring layer and a second semiconductor unit fixed to a wiring layer side of the first semiconductor unit, the second semiconductor unit fixed to a region sandwiched between the connecting terminals, the second semiconductor unit having a second semiconductor chip, the second semiconductor unit electrically connected to the first semiconductor unit.
Kabushiki Kaisha Toshiba
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inventional inventional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Hiroshi
Yamada