Myers Bigel Sibley & Sajovec, PA
Methods of forming semiconductor devices including an embedded stressor, and related apparatuses
Methods of forming semiconductor devices are provided. A method of forming a semiconductor device includes forming preliminary trenches adjacent opposing sides of an active region. The method includes forming etching selection regions in portions of the active region that are exposed after forming the preliminary trenches. The method includes forming trenches by removing the etching selection regions. Moreover, the method includes forming a stressor in the trenches. Related apparatuses are also provided.
Samsung Electronics Co., Ltd.
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Jun-Suk Kee-Moon
Kim Chun