Viering, Jentschura & Partner mbB
Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.
Infineon Technologies AG
C H H H C C C C C C H H H
C09D H01L H01L H01L C09D C08K C08G C09D C09D C09D H01L H01L H01L
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Poh Cheng Jagen Swee Kah Soon Lock Chew Theng Peh Hean Yik Yee Joachim
Lim Krishnan Lee Goh Tai Teh Tan Mahler