Muir Patent Law, PLLC
Alignment mark, method of measuring wafer alignment, and method of manufacturing a semiconductor device using the method of measuring wafer alignment
A method for measuring wafer alignment is provided. The method includes providing a plurality of first mark patterns extending in a first direction on a wafer, providing at least one second mark pattern on the first mark patterns such that it overlaps and intersects the first mark patterns, irradiating an optical signal onto the first mark patterns and the second mark pattern and obtaining coordinates of the second mark pattern by detecting signals from the second mark pattern.
SAMSUNG ELECTRONICS CO., LTD.
G G H G
G03F G01B H01L G01B
inventional inventional additional inventional
Chan Jeong Jin Seung Yoon
Hwang Lee Lee