Li & Cai Intellectual Property (USA) Office
LED package structure
An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. LITE-ON TECHNOLOGY CORPORATION
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Han-Hsing Hung-Jui Kuo-Ming Meng-Sung
Peng Chen Chiu Chou