Staas & Halsey LLP
Resin moldings and conductive resin composition
A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).
Asahi Kasei Chemicals Corporation
C C B C C C C C
C08L C08L B82Y C08L C08L C08L C08L C08L
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Mitsuhiro Yuuji Kazuya Takaaki
Horio Yoshinaga Noda Miyoshi