Sheppard Mullin Richter & Hampton LLP
Method of fabricating a substrate with a via connection
A method of fabricating a multilayer interconnected substrate is disclosed. In one embodiment, the method includes providing a structure having a dielectric substrate having a first substantially planar surface and an opposing second substantially planar surface. A first conductive layer is disposed on the first substantially planar surface of the dielectric substrate, and an interface is present between the first conductive layer and the dielectric substrate. A blind via site is formed in the structure, and through the dielectric substrate to the interface between the first conductive layer and the dielectric substrate. The blind via site is filled with a conductive material by an electrolytic plating process.
Fujitsu Limited
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Michael G. Solomon Wen-chou Vincent Michael G. William T.
Lee Beilin Wang Peters Chou