Smith, Gambrell & Russell, LLP
Semiconductor device and method for manufacturing semiconductor device
A semiconductor device (100) comprises a first resin substrate (101) on which a first semiconductor chip (125) is mounted a surface thereof; a second resin substrate (111) on which a second semiconductor chip (131) is mounted on a surface thereof; and a resin base material (109), joined to a front surface of the first resin substrate (101) and to a back surface of the second resin substrate (111), so that these surfaces are electrically connected. The resin base material (109) is disposed in a circumference of the first resin substrate (101) in the surface of the first resin substrate (101). Further, the first semiconductor chip (125) is disposed in a space section provided among the first resin substrate (101), the second resin substrate (111) and the resin base material (109) in the surface of the first resin substrate (101).
Sumitomo Bakelite Company, Ltd.
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Tomoe Mitsuo Tetsuya Satoru Hiroyuki
Yamashiro Sugino Miyamoto Katsurayama Yamashita