Blakely, Sokoloff, Taylor & Zafman LLP
Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package
A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented. In some embodiments, the package-on-package (PoP) pads of the BBUL integrated circuit package has a surface finish that can be palladium, nickel-palladium, nickel-gold, nickel-palladium-gold, or palladium-nickel-palladium-gold. In some embodiments, the PoP pad surface finish can be formed using either an electroless or electrolytic process.
Intel Corporation
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Mark S. Charavana K. Qinglei Tao
Hlad Gurumurthy Zhang Wu