Troxell Law Office, PLLC
Wafer bonding method
A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.
Industrial Technology Research Institute
H H
H01L H01L
inventional additional
Guo-Shing Chuan-Sheng Shih-Chieh Wei-Yu Chun-Hao
Huang Zhuang Liao Chen Chang