Integrated circuit with metal silicide regions
A method for forming a metal silicide region in a silicon region of a semiconductor substrate. The method comprises forming a metal layer over the silicon region, then in succession forming a titanium and a titanium nitride layer thereover. As the substrate is heated to form the silicide, the titanium getters silicon dioxide on the surface of the silicon region and the titanium nitride promotes the formation of a smooth surface at the interface between the silicide layer and the underlying silicon region.
Agere Systems Inc.
H H
H01L H01L
inventional inventional
William M. Maxwell Walthour Yuanning
Moller Lippitt, III Chen