Sughrue Mion, PLLC
Redistribution substrate, method of fabricating the same, and semiconductor package including the same
A redistribution subtrate, a method of fabricating the same, and a semiconductor package are provided. The method including forming a first conductive pattern; forming a first photosensitive layer on the first conductive pattern, the first photosensitive layer having a first through hole exposing a first portion of the first conductive pattern; forming a first via in the first through hole; removing the first photosensitive layer; forming a first dielectric layer that encapsulates the first conductive pattern and the first via, the first dielectric layer exposing a top surface of the first via; and forming a second conductive pattern on the top surface of the first via.
SAMSUNG ELECTRONICS CO., LTD.
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Minjun Jongyoun Seokhyun
Bae Kim Lee