JCIPRNET
Package structure
A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.
IBIS Innotech Inc.
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additional additional additional additional inventional additional additional additional inventional additional inventional additional additional inventional inventional additional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional inventional inventional additional additional additional inventional additional inventional additional additional additional additional inventional additional inventional additional
Wen-Chun Wei-Jen
Liu Lai