Sughrue Mion, PLLC
Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig
A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.
SAMSUNG ELECTRONICS CO., LTD. Kyungpook National University Industry-Academic Cooperation Foundation
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H01L H01L A61B H01L H01L H01L H01L H01L H01L Y10T H01L B06B H01L H01L H01L H01L H01L
additional inventional inventional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional
Bae Hyung Won Seok Seung Heun Kyung Il Young Il Jong Keun Yong Rae
Kim Lee Lee Cho Kim Song Roh