Hodgson Russ LLP
Design-assisted inspection for DRAM and 3D NAND devices
With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
KLA CORPORATION
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Sangbong Hucheng Xiaochun Junqing
Park Lee Li Huang