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Method of reducing floating body effect of SOI MOS device via a large tilt ion implantation
The present invention discloses a method of reducing floating body effect of SOI MOS device via a large tilt ion implantation including a step of: (a) implanting ions in an inclined direction into an NMOS with a buried insulation layer forming a highly doped P region under a source region of the NMOS and above the buried insulation layer, wherein the angle between a longitudinal line of the NMOS and the inclined direction is ranging from 15 to 45 degrees. Through this method, the highly doped P region under the source region and a highly doped N region form a tunnel junction so as to reduce the floating body effect. Furthermore, the chip area will not be increased, manufacturing process is simple and the method is compatible with conventional CMOS process.
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
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additional inventional inventional
Xi Jiexin Qingqing Xiaolu Jing
Wang Luo Wu Huang Chen