ONE LLP
Methods of manufacturing microdevices in laminates, lead frames, packages, and printed circuit boards
Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.
The Regents of the University of California
Y B B B B B Y
Y10T B32B B81B B81B B81C B81C Y10T
additional inventional additional additional inventional inventional additional
Guann-Pyng Mark
Li Bachman