Slater Matsil, LLP
Semiconductor device and method of forming same
A semiconductor package includes a first die having a first substrate, an interconnect structure overlying the first substrate and having multiple metal layers with vias connecting the multiple metal layers, a seal ring structure overlying the first substrate and along a periphery of the first substrate, the seal ring structure having multiple metal layers with vias connecting the multiple metal layers, the seal ring structure having a topmost metal layer, the topmost metal layer being the metal layer of the seal ring structure that is furthest from the first substrate, the topmost metal layer of the seal ring structure having an inner metal structure and an outer metal structure, and a polymer layer over the seal ring structure, the polymer layer having an outermost edge that is over and aligned with a top surface of the outer metal structure of the seal ring structure.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional inventional additional additional additional inventional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional inventional
Hong-Seng Ming-Hong Wen-Hsiung Kuo-Ching Cheng Jen Chao-Yi Mirng-Ji Ming-Da Chih-Hsiang Yu-Feng
Shue Cha Lu Hsu Lin Wang Lii Cheng Tseng Chen