McDermott Will & Emery LLP
Wire bonding method for preventing polymer cracking
This invention provides a wire bonding method, comprising providing an integrated circuit (IC) die having thereon a passivation layer and a plurality of first bonding pads exposed by respective openings in the passivation layer; forming a polymer layer on the passivation layer; forming an adhesive/barrier layer on the polymer layer; forming a metal pad layer on the adhesive/barrier layer; bonding a wire onto the metal pad layer to form a ball bond thereon; and after forming the ball bond on the metal pad layer, running the wire so as to contact the wire with a second bonding pad and forming a wedge bond thereto.
Megica Corporation
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Shih-Hsiung Chiu-Ming Mou-Shiung Hsin-Jung
Lin Chou Lin Lo