McClure, Qualey & Rodack, LLP
Method for manufacturing a semiconductor device
A method for manufacturing a semiconductor device includes forming a gate stack over a substrate; forming an interlayer dielectric over the substrate to cover the gate stack; forming an opening in the interlayer dielectric to expose to the gate stack; forming a glue layer over the interlayer dielectric and in the opening; partially removing the glue layer, in which a portion of the glue layer remain in the opening; and tuning a profile of the remained portion of the glue layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Min-Yann Kuo-Hua Hua-Feng Wen-Che
Hsieh Pan Chen Tsai