Westerman, Hattori, Daniels & Adrian, LLP.
Method of manufacturing ferroelectric semiconductor device
An Ir film, an IrOx film, a Pt film, a PtO film and a Pt film are formed, and thereafter a PLZT film is formed. Then, heat treatment at 600° C. or lower is performed by the RTA method in an atmosphere containing Ar and O2 to thereby crystallize the PLZT film. Subsequently, an IrOx film and an IrO2 film are formed. Then, these films are patterned at once. Thereafter, an alumina film is formed as a protective film. Subsequently, heat treatment at 650° C. for 60 minutes in an oxygen atmosphere is performed as recovery annealing. Note that no heat treatment is performed from the crystallization of the PLZT film to the recovery annealing.
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