Adhesive composition with functional filler
 An adhesive composition containing a latex binder, a latex plasticizer and a functional filler. The latex plasticizer includes a copolymer comprising (1) 0-15% by weight, based upon the weight of the copolymer, of acrylonitrile, methacrylonitrile or mixtures thereof, (ii) 80-85% by weight, based upon the weight of the copolymer, of butyl acrylate, ethyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, lauryl methacrylate, octyl acrylate, heptyl acrylate, or mixtures thereof, and (iii) 1-5% by weight, based upon the weight of the copolymer, of methacrylic acid, acrylic acid, itaconic acid, or mixtures thereof, said latex plasticizer having a T.sub.g less than that of the latex binder (a) and a decomposition temperature of at least 288.degree. C. The composition is useful for adhering polyimide films such as in the fabrication of flexible circuits. 
E. I. Du Pont de Nemours and Company
C H H C Y H C C H H Y C Y C H
C08L H05K H05K C08L Y10T H05K C09J C09J H05K H05K Y10T C08L Y10T C08L H05K
additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional inventional
Yueh-Ling
Lee