Slater Matsil, LLP
Bumps for chip scale packaging including under bump metal structures with different diameters
A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die. A second bump having a second diameter and a second height is formed on an inner region of the semiconductor die. The second diameter is greater than the first diameter while the second height is the same as the first height. By changing the shape of the bump, the stress and strain can be redistributed through the bump. As a result, the thermal cycling reliability of the chip scale semiconductor device is improved.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chun-Hung Han-Ping Yu-Feng Hsien-Wei Tsung-Shu
Lin Pu Chen Chen Lin