Myers Bigel & Sibley, P.A.
Liquid compositions and methods of fabricating a semiconductor device using the same
The present inventive concepts provide a liquid composition for etching a metal containing copper. The liquid composition may include hydrogen peroxide in a range of about 0.1 wt % to about 10 wt % and a buffer solution in a range of about 0.1 wt % to about 10 wt %. The buffer solution may include citrate. The liquid composition may have a pH in a range of about 4.0 to about 7.0.
Mitsubishi Gas Chemical Company, Inc. Samsung Electronics Co., Ltd. Samyoung Pure Chemicals Co., Ltd.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H C H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L C23F H01L H01L
additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional additional
Jeong Ingoo Jung-ig Hyungjun Dong-Min Jungsik Akira Tomoko Young Taek
Kwon Kang Jeon Jeon Kang Choi Hosomi Suzuki Hong