Coudert Brothers
Chip and board stress relief interposer
 An interposer structure permits a differential transverse displacement of contact pads on opposite sides of the interposer to reduce thermal stresses when the interposer is bonded to contact pads of a chip and a substrate with different thermal coefficients of expansion. The effective elasticity of the interposer between top and bottom contact pads of the interposer is facilitated by perforations which define flap-like regions. A flexible trace couples top contact pads to bottom contact pads through a via while permitting substantial transverse relative displacement of the top and bottom contact pads in flap-like regions. 
Fujitsu Limited
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Wen-chou Vincent Solomon I. Michael Guang-Tzong
Wang Beilin Lee