Bacon & Thomas, PLLC
Light-emitting device manufacturing method
A method for manufacturing a light-emitting device, comprises steps of: providing an as-cut wafer having an irregularly uneven surface comprising surface roughness greater than 0.5 μm; and forming a light-emitting stack on the irregularly uneven surface of the as-cut wafer by an epitaxial growth method, and the light-emitting stack comprises an upper surface having surface roughness less than 0.2 nm; wherein there is no patterning or roughing process after the step of providing the as-cut wafer and before the step of forming the light-emitting stack on the irregularly uneven surface of the as-cut wafer.
Epistar Corporation
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inventional additional inventional
Chi-Hung Chi-Ling Yi-Lin Wei-Han Hui-Tang Hung-Chih Chen
Wu Lee Guo Wang Shen Yang Ou