JCIPRNET
Methods of forming interconnect structures of semiconductor device
An interconnect structure includes an interconnect structure includes an etching stop layer; a dielectric layer and an insert layer on the etching stop layer, and a conductive feature in the dielectric layer, the insert layer and the etching stop layer. A material of the insert layer is different from the dielectric layer and the etching stop layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chia-Cheng Tze-Liang Chung-Chi
Chou Lee Ko