F. Chau & Associates, LLC
Substrate bonding apparatus and bonding method using the same
A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.
SAMSUNG ELECTRONICS CO., LTD.
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inventional inventional inventional
Hoonjoo Taeyeong Minsoo Jun Hyung Kwangjin
Na Kim Han Kim Moon