Slater Matsil, LLP
Fingerprint sensor device and method
A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional inventional additional additional inventional inventional additional additional additional additional inventional additional additional additional additional inventional inventional additional inventional additional inventional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional
Hao-Yi Yu-Feng Chung-Shi Chih-Hua Chen-Hua
Tsai Chen Liu Chen Yu