Method for CMP cleaning improvement
 Using an APM solution to clean both the front and backside of a semiconductor wafer significantly reduces the residue from chemical mechanical polishing. A low residue count holds the wafer more securely to the electrostatic chuck, thus improving processing, reducing wear on the electrostatic chuck, and increasing its lifetime. 
Taiwan Semiconductor Manufacturing Company, Ltd.
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So Wein Tsu Chung-Long
Kuo Shih Chang