Method for fabricating conductive substrates for electronic and optoelectronic devices
A method for fabricating a conductive substrate for an electronic device includes the steps of providing a semiconductor substrate; forming a plurality of grooves part way through the semiconductor substrate; filling the grooves with a polymer insulating material to form a plurality of polymer filled grooves; thinning the substrate from the back side to expose the polymer filled grooves; and singulating the semiconductor substrate into a plurality of conductive substrates. An optoelectronic device includes a conductive substrate; a polymer filled groove configured to separate the conductive substrate into a first semiconductor substrate and a second semiconductor substrate; a first front side electrode on the first semiconductor substrate and a second front side electrode on the second semiconductor substrate; and a light emitting diode (LED) chip on the first semiconductor substrate in electrical communication with the first front side electrode and with the second front side electrode.
SemiLEDS OPTOELECTRONICS Co., Ltd.
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Wen-Huang Yung-Wei
Liu Chen