Heat sink assembly with fan-driven fluid circulation
A heat sink assembly for dissipating heat from a CPU (3) includes a computer enclosure (2), a heat sink (10), a container (20), a fan (30), and a tube (40). The container is partly filled with liquid, and is mounted on the heat sink. The fan is mounted in the container and open to a top wall (22) of the container. The enclosure encloses the heat sink the container and the fan therein. The tube is attached to the enclosure, with one end of the tube inserted through the container and engaged with a side of the fan, and an opposite end of the tube engaged with the container. In operation, liquid rises as vapor to the top wall, and condenses into droplets which drop into the fan. The droplets received in the fan are impelled to enter the tube, transfer heat to the enclosure, and return to the container.
Hon Hai Precision Ind. Co., Ltd.
H H H
H01L H01L H01L
inventional inventional additional
Yun Lung
Chen