Harness, Dickey & Pierce, P.L.C.
Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
A printed circuit board (PCB) reducing a thickness of a semiconductor package and improving reliability of the semiconductor package, a semiconductor package including the PCB, and a method of manufacturing the PCB may be provided. The PCB may include a substrate base having at least one base layer, and a plurality of wiring layers disposed on a top surface and a bottom surface of the at least one base layer, the plurality of wiring layers defining a plurality of wiring patterns, respectively may be provided. An elastic modulus of a conductive material of one wiring pattern of at least one wiring layer from among the plurality of wiring layers may be less than a conductive material of another wiring pattern.
Samsung Electronics Co., Ltd.
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inventional inventional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional
Yu-duk Shle-ge Dong-suk Kyong-soon
Kim Lee Kim Cho