High density wire bond BGA
 A new method is provided for creating high-density packages for wire bonded chips. The invention uses a combination of BUM technology and thin film deposition techniques to create the required interface between the contact points of the BGA device and the contact balls of the BGA substrate. Cavities are created on the metal panel substrates for IC chip insertion. 
Thin Film Module, Inc.
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Anna Chung W.
Litza Ho