Integrated circuit including NCEM-Enabled, tip-to-tip gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of tip-to-tip shorts and/or leakages.
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Vyacheslav Sheng-Che Conor Timothy Hans Tomasz Kimon Carl John Kelvin Simone Andrzej Stephen Larg Marci Christopher Dennis Hideki Nobuharu Jeremy Marcin Indranil Rakesh Markus Jonathan Sherry
Rovner Lin O'Sullivan Fiscus Eisenmann Brozek Michaels Taylor Kibarian Doong Comensoli Strojwas Lam Weiland Liao Hess Ciplickas Matsuhashi Yokoyama Cheng Strojwas De Vallishayee Rauscher Haigh Lee