Norton Rose Fulbright US LLP
Fin stack for processor cooling
A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.
Dell Products L.P.
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F28F H01L F28F G06F F28F F28F G06F H01L H01L F28F H01L G06F
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Tse-An Ting-Chiang
Chu Huang