Cooley Godward Kronish LLP
Semiconductor device package and manufacturing method
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The electromagnetic interference shielding layer is a plated metal layer in contact with the package body, and the plated metal layer is connected to a ground trace extending on the upper surface of the substrate.
Advanced Semiconductor Engineering, Inc.
H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional additional inventional additional additional additional inventional inventional additional additional additional inventional additional additional additional additional inventional additional additional additional additional
Jun Young You Ock You Pil
Yang Joo Jung