Sughrue Mion, PLLC
Semiconductor package and method of manufacturing the same
A semiconductor package may include a semiconductor chip; a molding portion configured to surround at least a side surface of the semiconductor chip; a passivation layer including a contact plug connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, below the semiconductor chip; and a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer. The redistribution layer portion may include: an upper pad connected to the contact plug and a fine pattern positioned at a same level as the upper pad in an upper part of the redistribution layer portion; a redistribution layer and a via plug, which has a widening width further away from the semiconductor chip in the vertical direction, in a body part of the redistribution layer portion; and a lower pad connected to the external connection terminal and exposed to an outside of the semiconductor package in a lower part of the redistribution layer portion.
SAMSUNG ELECTRONICS CO., LTD.
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Kyoung-lim Seok-won Seok-hyun Youn-ji Jong-youn
Suk Lee Lee Min Kim