McClure, Qualey & Rodack, LLP
Semiconductor package assembly, semiconductor package and forming method thereof
A semiconductor package includes a cover, a substrate, at least one semiconductor device and at least one corner stiffener. The cover has at least one corner portion. The substrate is in force communication with the cover. The substrate has at least one corner portion. The semiconductor device is present between the cover and the substrate. The corner stiffener is present on at least one of the corner portion of the cover and the corner portion of the substrate.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ming-Chih Kuang-Chun Yu-Huan Po-Yao Shin-Puu Cheng-Lin Wen-Yi Chin-Hua Shu-Shen Shyue-Ter
Yew Lee Chen Lin Jeng Huang Lin Wang Yeh Leu