Pillsbury Madison & Sutro LLP
Semiconductor pressure sensor including sensor chip fixed to package by adhesive
 In a semiconductor pressure sensor, adhesive having a Young's modulus of equal to or less than 1.times.10.sup.4 Pa such as silicone system gel is disposed between a bottom wall of a casing and a bottom wall of a sensor chip, and a space between side walls of the sensor chip and side walls of the casing is filled with adhesive having a Young's modulus of equal to or larger than 1.times.10.sup.4 Pa, such as silicone system adhesive or epoxy system adhesive. Accordingly, temperature characteristics of the sensor chip can be improved without causing pressure leakage. 
Denso Corporation
G G
G01L G01L
inventional inventional
Yasutoshi Minekazu
Suzuki Sakai