Seyfarth Shaw LLP
Integrated circuit chips with fine-line metal and over-passivation metal
An integrated circuit chip includes a semiconductor substrate, a first circuit in or coupled to the semiconductor substrate, a second circuit device in or coupled the semiconductor substrate, a dielectric structure coupled the semiconductor substrate, a first interconnecting structure in the dielectric structure, a first pad connected to the first node of the voltage regulator through the first interconnecting structure, a second interconnecting structure in the dielectric structure, a second pad connected to the first node of the analog circuit through the second interconnecting structure, a passivation layer coupled the dielectric structure, wherein multiple openings in the passivation layer exposes the first and second pads, and a third interconnecting structure coupled the passivation layer and coupled the first and second pads.
Megit Acquisition Corp.
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Jin-Yuan Chien-Kang Mou-Shiung
Lee Chou Lin