Pennie & Edmonds LLP
Method of production of semiconductor device
 To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material. 
Hitachi Chemical Company, Ltd.
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Toshiaki Akira Aizou Fumio Naoyuki Kazuyoshi Tomohisa Itsuo Toshio Osamu Hiroto Kenzo Yoshiaki Masaaki Kazunori
Tanaka Nagai Kaneda Inoue Shiozawa Kojima Ohta Watanabe Yamazaki Watanabe Ohata Takemura Tsubomatsu Yasuda Yamamoto