Foley & Lardner LLP
Semiconductor package device having glass transition temperature greater than binding layer temperature
In one or more embodiments, a micro-electromechanical systems (MEMS) package structure comprises a MEMS die, a conductive pillar adjacent to the MEMS die, a package body and a binding layer on the package body. The package body encapsulates the MEMS die and the conductive pillar, and exposes a top surface of the conductive pillar. A glass transition temperature (Tg) of the package body is greater than a temperature for forming the binding layer (Tc).
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Sheng-Ming Yu-Ying Yu-Hsuan Kuang-Hsiung Wun-Jheng
Wang Lee Tsai Chen Syu