F. Chau & Associates, LLC
Semiconductor chips having guard rings and methods of fabricating the same
Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.
Samsung Electronics Co., Ltd.
H H H H
H01L H01L H01L H01L
inventional inventional inventional additional
Su-min Jaesik Hohyeuk Jung-Do Jongkook Seok Won
Park Lee Im Lee Kim Lee