Westerman, Hattori, Daniels & Adrian, LLP
Wiring substrate having conductive bumps with resin sealing between bumps and method of making
A wiring substrate may include: a base having a predetermined thickness; a plurality of electrode portions formed to protrude on one surface in a thickness direction of the base; a wiring provided in the base and electrically connected to the electrode portions; and a resin layer formed on the base to fill between the plurality of electrode portions. An upper surface of the resin layer may be formed in a concave shape lower than a maximum height of the electrode portion, and an upper surface of the electrode portion and the upper surface of the resin layer form a continuous curved surface.
OLYMPUS CORPORATION
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Yoshitaka Chihiro Hiroshi Yoshiaki
Tadaki Migita Kikuchi Takemoto