Muir Patent Consulting, PLLC
Semiconductor package transferring apparatus and method of manufacturing semiconductor device using the same
A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.
Samsung Electronics Co., Ltd.
H
H01L
inventional
Hyeck-Jin Yong-Ki Yong-Jin Heul-Seog
Jeong Park Jung Kim