Foley & Lardner LLP
Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same
A copper foil 1 comprises a roughened plating layer 2, a Ni—Co alloy plating layer 3, a zinc galvanized (underlying) layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layer 5 is formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.
Hitachi Cable, Ltd.
Y C H C Y C H C H C Y H C Y Y C C C C C Y H Y C
Y10T C23C H05K C25D Y10T C25D H05K C23C H05K C23C Y10T H05K C23C Y10T Y10T C23C C25D C25D C23C C23C Y10T H05K Y10T C23C
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Gen Katsumi Shingo Yasuyuki Muneo
Sasaki Nomura Watanabe Ito Kodaira