IP & T Group LLP
Semiconductor device having a plurality of repair fuse units
A semiconductor device includes a plurality of stacked semiconductor chips; and a plurality of through-silicon vias (TSVs) including first TSVs and redundant TSVs and configured to commonly transfer a signal to the plurality of stacked semiconductor chips. At least one of the semiconductor chips includes a plurality of repair fuse units configured to store defect information as to at least one defect of the TSVs; and a plurality of latch units allocated to the respective TSVs and configured to store a plurality of signals indicating at least one TSV defect and outputted from the plurality of repair fuse units.
Hynix Semiconductor Inc.
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Jeong-Woo Sang-Hoon Hyung-Dong Hyang-Hwa
Lee Shin Lee Choi