Muir Patent Law, PLLC
Method of manufacturing light emitting diode package
A method of manufacturing a light emitting diode package comprises steps of: scanning a light emitting diode chip mounted on a package substrate to acquire mounting image data; generating three dimensional (3D) image data by comparing the mounting image data with mounting reference data; and forming an optical structure including a plurality of layers on the package substrate on using the 3D image data.
SAMSUNG ELECTRONICS CO., LTD.
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Jung Hoon
Kim