Jones & Volentine, L.L.P.
Method and apparatus for the manufacture of a semiconductor integrated circuit device having discontinuous insulating regions
 A semiconductor wafer having an active surface separated into device regions with semiconductor chips formed thereon and scribe regions formed between the device regions. The wafer includes an insulating layer formed on the active surface in the device regions. The insulating layer has a first edge and a second edge oriented in a confronting relationship. The first edge and the second edge end at the scribe regions. 
Samsung Electronics Co., Ltd.
H
H01L
inventional
Seong Min
Lee