IPUSA, PLLC
Wiring board and manufacturing method thereof
A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided NiCu alloy is within a range from 1 atoms % to 5 atoms %.
Shinko Electric Industries Co., Ltd.
Y H H H
Y10T H05K H05K H05K
additional additional inventional additional
Tomoo
Yamasaki