Fitzpatrick, Cella, Harper & Scinto
Method of manufacturing element substrate
Provided is a method of manufacturing an element substrate, including: forming first and second resists on a predetermined surface of a substrate so that part of the predetermined surface is exposed; etching the substrate with the first and second resists being used as a mask to form a first recess in the substrate; removing the second resist to expose a portion of the substrate that is different from the first recess; etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; and covering openings of the first and second recesses with an orifice forming member to form a pressure chamber by the first recess and an orifice forming member and to form a flow reducing portion by the second recess and the orifice forming member.
CANON KABUSHIKI KAISHA
B B B B B B B
B41J B41J B41J B41J B41J B41J B41J
additional inventional inventional additional inventional inventional inventional
Toshifumi Shinichiro Toru
Yoshioka Watanabe Nakakubo