Westman, Champlin & Koehler, P.A.
Packaging apparatus
Embodiments of the present invention provide a packaging apparatus, which relates to a preparing field of display technology and can solve a problem of the poor bonding state between a packaging cover plate and a substrate to be packaged, improving a quality of assembled product. The packaging apparatus comprises: an upper sealing unit and a lower sealing unit which have recesses and are movable towards each other to engage and form a cavity, wherein upper suction columns for fixing a packaging cover plate is disposed inside the recess of the upper sealing unit and a bearing table for bearing a substrate to be packaged is disposed inside the recess of the lower sealing unit, and seal glue is disposed on a face of the substrate to be packaged facing the packaging cover plate; a suction mechanism for vacuumizing the cavity; a leveling mechanism for adjusting a levelness of the packaging cover plate and/or the substrate to be packaged; a displacing mechanism for driving the packaging cover plate and/or the substrate to be packaged to move towards each other so that the packaging cover plate contacts the seal glue; an inflation mechanism for filling gas into the cavity after vacuumizing.
BOE TECHNOLOGY GROUP CO., LTD. HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
H H H B B
H01L H01L H01L B29K B29C
additional inventional additional additional inventional
Junwei Yangkun
Li Jing