Patterson & Sheridan, LLP
Apparatus and method for controlling edge performance in an inductively coupled plasma chamber
The present invention generally provides methods and apparatus for controlling edge performance during process. One embodiment of the present invention provides an apparatus comprising a chamber body defining a process volume, a gas inlet configured to flow a process gas into the process volume, and a supporting pedestal disposed in the process volume. The supporting pedestal comprises a top plate having a substrate supporting surface configured to receive and support the substrate on a backside, and an edge surface configured to circumscribe the substrate along an outer edge of the substrate, and a height difference between a top surface of the substrate and the edge surface is used to control exposure of an edge region of the substrate to the process gas.
Applied Materials, Inc.
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Philip A. Johanes F. Michael J. Wei Son T. Hanh D. Roger
Bottini Swenberg Mark Liu Nguyen Nguyen Curtis