Lee & Morse, P.C.
CMP slurry composition for polishing copper and polishing method using the same
Disclosed herein is a CMP slurry composition for polishing copper. The CMP slurry composition includes: polishing particles; and deionized water, wherein the polishing particles include inorganic particles and organic particles, and both the inorganic particles and the organic particles have a positive zeta potential. A polishing method comprising polishing a copper wire using the CMP slurry composition also be provided.
SAMSUNG SDI CO., LTD.
C H C C C B C
C09K H01L C09K C09K C23F B24B C09G
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Chang Ki Dong Hun Tae Wan Jeong Hwan Young Chul Jong Il
Hong Kang Kim Jeong Jung Noh