JCIPRNET
Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same
A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a metallization layer and a dielectric layer disposed on the metallization layer. The metallization layer has conductive patterns, where each of the conductive patterns includes crystal grains, the crystal grains each are in a column shape and include a plurality of first banded structures having copper atoms oriented on a (220) lattice plane.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chiang-Hao Hung-Jui Ming-Che Yu-Ming
Lee Kuo Ho Lee