Slater & Matsil, LLP
Interconnect structure for CIS flip-chip bonding and methods for forming the same
A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Mirng-Ji Yung Ching Chien-Hsun
Yu Lii Chen Lee