J.C. Patents
Light emitting diode package structure
The present invention relates to a method for forming a package structure for a light emitting diode (LED) and the LED package structure thereof. By employing the same sawing process to cut through the trenches of the leadframe, the package units are singulated and different lead portions are simultaneously separated from each other in each package unit. Therefore, the overflow issues of the encapsulant can be avoided without using extra taping process.
Advanced Semiconductor Engineering, Inc.
H H H H H
H01L H01L H01L H01L H01L
additional additional additional inventional inventional
Hyunil Ryungshik Seongoo Hyunsoo
Lee Park Lee Jeong