Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.
Invensas Corporation
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additional additional additional inventional inventional additional inventional additional inventional additional additional additional inventional additional inventional additional inventional inventional inventional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional inventional inventional additional
Abiola Christopher W. Ashok S. Javier A. Zhuowen
Awujoola Lattin Prabhu DeLaCruz Sun