Duane Morris LLP
Cooling system for 3D IC
A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Chung-Cheng Po-Hao Jonathan Tehan
Chou Lee Chen