Schmeiser, Olsen & Watts, LLP
Microelectronic 3D packaging structure and method of manufacturing the same
A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
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Louis Lu-Chen Kuo-Yang Shao-Chung Pen-Shan Wei-Ching Ling-Yueh Kun-Feng
Hsu Horng Hu Chao Liu Yang Chen