Thomas, Kayden, Horstemeyer & Risley
Surface mounting method
An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.
Advanced Semiconductor Engineering Inc.
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Y02P H05K H05K H05K H05K
additional inventional inventional additional additional
Ming-Chia Sheng-Hong Wen-Shin Chia-Wei Kuan-Hung Pai-Chou Yu-Hsin Tsung-Chi
Hsieh Cheng Lin Chang Yeh Liu Lee Chen