Coudert Brothers LLP
Modules with pins and methods for making modules with pins
Device modules with pins and methods for making device modules with pins are disclosed. One embodiment is directed to a method including forming a polymeric circuit structure having a first side and a second side on a substrate. The formed first side is adjacent to the substrate. A pin is bonded to the second side of the polymeric circuit structure. At least a portion of the substrate is removed to expose at least a portion of the first side of the polymeric circuit structure, and a device is mounted on the first side of the polymeric circuit structure.
Fujitsu Limited
H H H H H H H H H H H H H H H H H
H01L H01L H05K H01L H05K H01L H01L H05K H01L H01L H01L H01L H05K H01L H01L H05K H01L
inventional inventional inventional additional additional additional inventional additional additional additional additional additional additional additional inventional inventional additional
Lei Thomas J. Yasuhito Wen-chou Vincent
Zhang Massingill Takahashi Wang