Slater Matsil, LLP
Vacuum carrier module, method of using and process of making the same
A vacuum carrier module includes a substrate having at least one hole and an edge region. There is at least one support on a top surface of the substrate. Further, a gel film is adhered to the edge region of the substrate. The at least one hole fluidly connects a reservoir located above the top surface of the substrate. A method of using a vacuum carrier module includes planarizing a gel film by passing an alignment material through a hole in a substrate to contact a first surface of the gel film, positioning at least one chip on a second surface of the gel film opposite the first surface. The method further includes encasing the at least one chip in a molding material and applying a vacuum to the first surface of the gel film.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Kuo-Chung Chun-Hao Ying-Hao Tien-Yu
Yee Tseng Kuo Huang