Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor package having a cap unit with concave portion and method of manufacturing the same
A semiconductor package of an embodiment includes: a semiconductor chip having a signal input terminal and a signal output terminal; and a cap unit that is formed on the semiconductor chip. The cap unit includes a concave portion forming a hollow structure between the semiconductor chip and the cap unit, a first through electrode electrically connected to the signal input terminal, and a second through electrode electrically connected to the signal output terminal. Of the inner side surfaces of the concave portion, a first inner side surface and a second inner side surface facing each other are not parallel to each other.
Kabushiki Kaisha Toshiba
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional inventional inventional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional inventional additional additional
Taihei Kazuhiko Kazuhide Hiroshi Toshihiko Tadahiro
Nakada Itaya Abe Yamada Nagano Sasaki