Ladas & Parry LLP
Precursor solution for polyimide/silica composite material, its manufacture method, and polyimide/silica composite material having low volume shrinkage
A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)4-x to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9 and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.
Eternal Chemical Co., Ltd
Y C C
Y10T C08K C09D
additional additional inventional
Chung-Hao Min-Chi Hsin-Wei Cheng-Tyng Chung-Jen Shu-Wan Meng-Yen Wen-Chang Chin-Chang Chung-Hung Kuo-Huang Chin-Min Yu-Wen
Wu Wang Huang Yen Wu Lu Chou Chen Chuang Chang Hsieh An Wang