Oliff PLC
Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
The electronic device includes a terminal structure and a printed circuit board including the terminal structure. The terminal structure includes a solder-joint conductor region placed on a wiring conductor, an intermediate layer contacting with the conductor region, and a solder region contacting with the intermediate layer. The intermediate layer includes an intermetallic compound including tin and at least one of copper and nickel as principal components. When the indentation elastic modulus of the conductor region is E1 and the indentation elastic modulus of the intermediate layer is E2, the ratio of E1 to E2 is equal to or more than 0.8 and equal to or less than 1.5.
TDK Corporation
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H01R H05K Y10T H05K H01R H05K H05K Y02P H05K H05K
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Hideyuki Shin Kenichi Makoto Yuhei Hisayuki
Seike Fujita Yoshida Orikasa Horikawa Abe