Sensing module
A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low.
Pixart Imaging Inc
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Hung-Ching Kuo-Hsiung Wei-Chung Hui-Hsuan
Lai Li Wang Chen