Thomas, Kayden, Horstemeyer & Risley
Implementation of protection layer for bond pad protection
A method of protecting a bond pad during die-sawing comprising the following steps. A substrate having a bond pad formed thereover is provided. A bond pad protection layer is formed over the bond pad. The substrate is die-sawed and the bond pad protection layer is removed by heating.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Jan-Her Pei-Haw Cheng-Chung
Horng Tsao Chang