Syndoca LLC
Light emitting diode and fabrication method thereof
An LED fabrication method includes forming release holes by focusing a laser at the substrate back surface, and forming stealth laser-blast areas by focusing a laser inside the substrate on positions corresponding to the release holes; communicating the release holes with the stealth laser-blast areas to release impurities generated during forming of the stealth laser-blast areas from the substrate through the release holes, thereby avoiding low external quantum efficiency resulting from adherence of the released material to the side wall of the stealth laser-blast areas. By focusing on a position with 10 μm˜40 μm inward from the substrate back side, adjusting laser energy and frequency to burn holes inside the substrate to penetrate and expose the substrate back surface, thereby effectively removing by-products, and reducing light absorption by such by-products, light extraction from a side wall of the LED can also be improved and light extraction efficiency is enhanced.
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
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Gong Chuan-gui Su-hui Kang-wei Jing-jing Jing Chia-hung Xiao-xiong Yu Sheng-hsien
Chen Liu Lin Peng Wei Huang Chang Lin Zhou Hsu