WPAT, P.C., Intellectual Property Attorneys
Semiconductor manufacturing apparatus and method thereof
A semiconductor manufacturing method includes several operations. One operation is catching an image of a predetermined location on a surface of a pad installed in a chemical mechanical polishing (CMP) apparatus by a surface detector. One operation is transferring the image of the predetermined location to a processor. One operation is calculating a surface roughness value of the predetermined location from the image. One operation is comparing the surface roughness value with a threshold value by the processor to determine if the surface roughness condition at the predetermined location is smaller than the threshold value, and the surface is configured for polishing a to-be-polished surface of a wafer.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
H B H B G B
H01L B24B H01L B24B G01B B24B
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Sheng-Chen Feng-Inn Jia-Jhen
Wang Wu Chen