Harness, Dickey & Pierce, P.L.C.
Semiconductor package with electromagnetic shielding member
A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.
Samsung Electronics Co., Ltd.
H H H H H H H H H H H H H H H H H H H H
H01L H01L H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional
Young-doo Byoung-rim Woon-bae
Jung Seo Kim