Myers Bigel Sibley & Sajovec, P.A.
Joint structures having organic preservative films
The inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures and solder joint structures including one or more preservative films. In some embodiments, the solder joint structure includes a metal bump having a preservative film disposed on the surface thereof.
Samsung Electronics Co., Ltd.
H H H H H H H H H H H H B Y H H H H H H H H H B H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H05K H01L H01L H01L H01L H01L H01L H05K H01L B23K Y02P H01L H01L H01L H01L H01L H01L H05K H01L H01L B23K H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional inventional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional
Hyung-Seok Jeong-Woo Ju-Il Ui-Hyoung Jeong-Gi
Kim Park Choi Lee Jin