Harness, Dickey & Pierce, P.L.C.
Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the same
A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.
Samsung Electronics Co., Ltd.
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Sang-Kyun Dong-Jin Yu-Ri Chung-Kyung Yong-Sik Young-Chul Ahn-Ho Go-Un Jung-Min Dong-Min Dong-Hun
Kim Kim Jung Jung Yoo Jung Lee Kim Choi Kang Kang