Eschweiler & Potashnik, LLC
Rough layer for better anti-stiction deposition
A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.
Taiwan Semiconductor Manufacturing Company, Ltd.
B B B B B
B81C B81C B81B B81B B81B
additional additional additional inventional inventional
I-Shi Jen-Hao Chih-Hang
Wang Liu Chang