Harness, Dickey & Pierce, PLC
Methods of forming wirings in electronic devices
A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.
SAMSUNG ELECTRONICS CO., LTD.
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Young-ki Sung-gyu Jae-woo Seung-ho Joong-hyuk
Hong Kang Chung Lee Kim