Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Semiconductor device
 A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip. 
Kabushiki Kaisha Toshiba
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Takashi Yasushi Kunio Yuji Hiroshi
Togasaki Shizuki Yoshihara Iseki Yamada