Vierra Magen Marcus LLP
Semiconductor device including corner recess
A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.
SanDisk Semiconductor (Shanghai) Co. Ltd.
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Junrong Hang Weili Xin Chong Un Chee Keong Kim Lee
Yan Zhang Wang Tian Tan Chin Bock