Oliff & Berridge, PLC
Heat resistant film and metal laminate thereof
A heat resistant film comprising total 100 parts by weight of a resin composition comprising at least (A-1) a polyetherimide resin having repeating units of the structural formula (1), (A-2) a polyetherimide resin having repeating units of the structural formula (2), and (B) a polyarylketone resin having a melting peak temperature of 260 degrees C. or higher, and 5 to 50 parts by weight of a filler, wherein a weight ratio of the resin components, [(A-1)+(A-2)]/(B)], ranges from 70/30 to 30/70 and a weight ratio, (A-1)/(A-2), ranges from 70/30 to 30/70.
Mitsubishi Platics, Inc.
C B B C B Y H C H C C C B H B Y H Y C H B H C B B B H
C08L B32B B32B C08J B32B Y10T H05K C08J H05K C08J C08L C08L B32B H05K B32B Y10T H05K Y10T C08L H05K B32B H05K C08L B32B B32B B32B H05K
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Kouichirou
Taniguchi