Duane Morris LLP
Image sensor fabrication method and structure
A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Fu-Tien Te-Fu Hung-Jen Chin Chen Chih-Kung
Weng Tseng Hsu Kuo Chang