Slater Matsil, LLP
Packaging devices and methods of manufacture thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad, a second portion of the contact pad being exposed. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to the second portion of the contact pad. A PPI pad is disposed over the passivation layer and is coupled to the PPI line. An insulating material is disposed over the PPI line, the PPI pad being exposed. The insulating material is spaced apart from an edge portion of the PPI pad by a predetermined distance.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional inventional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional
Jie Hsien-Wei
Chen Chen