McClure, Qualey & Rodack, LLP
Circuit board and electronic assembly
A circuit board including a first patterned conductive layer and a second patterned conductive layer isolated from the first patterned conductive layer is provided. The first patterned conductive layer has first signal traces and first ground traces. The second patterned conductive layer has second signal traces and second ground traces. An orthogonal projection of the second ground trace on the first patterned conductive layer partially overlaps at least one of the first signal traces. An orthogonal projection of the first ground trace on the second patterned conductive layer partially overlaps at least one of the second signal traces. An electronic assembly including the afore-described circuit board and a chip package connected thereto is also provided.
VIA ALLIANCE SEMICONDUCTOR CO., LTD.
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Yun-Han Tsai-Sheng Chun-Yen Nai-Shung
Chen Chen Kang Chang