Muncy, Geissler, Olds & Lowe, P.C.
Stacked electronic device and method for fabricating the same
A method for fabricating a stacked electronic device is provided. A first three-dimensional (3D) printing is performed to form a first insulating layer and a plurality of first redistribution layers (RDLs) on a first substrate. A second 3D printing is performed to form a second substrate and a plurality of through-substrate vias (TSVs) on the first insulating layer, in which the plurality of TSVs is electrically connected to the plurality of first RDLs. A third 3D printing is performed to form a second insulating layer and a plurality of second RDLs on the second substrate, in which the plurality of second RDLs is electrically connected to the plurality of TSVs. A plurality of contacts of a third substrate is bonded to the plurality of second RDLs, so that the substrate is mounted onto the second insulating layer. The disclosure also provides a stacked electronic device formed by such a method.
WINBOND ELECTRONICS CORP.
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Meng-Chang Yu-Cheng Chen-Hsi Tung-Yi Hsin-Hung Chia Hua
Chan Chiao Lin Chan Chou Ho