Barley Snyder
Aluminum based solderable contact
A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
TE Connectivity Germany GmbH TE Connectivity Corporation Tyco Electronics (Shanghai) Co. Ltd.
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Gokce Yiliang Xiao Felix Helge Soenke Shallu
Gulsoy Wu Zhou Greiner Schmidt Sachs Soneja