WPAT, P.C., Intellectual Property Attorneys
Semiconductor device
A semiconductor device includes a substrate, a plurality of pads disposed over the substrate, and a solder mask disposed over the substrate. The substrate includes a pair of first edges parallel to each other, a pair of second edges orthogonal to the pair of first edges, and a center point. The solder mask includes four recess portions exposing an entire top surface and sidewalls of four of the pads in four corners of the regular array, and a plurality of second recess portions exposing a portion of a top surface of other pads in the regular array. A pad size of the four pads in the four corners of the regular array exposed through the first recess portions and a pad size of the other pads exposed through the second recess portions are the same.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Hsien-Wei Ying-Ju Jie Tsung-Yuan
Chen Chen Chen Yu