Dentons US LLP
Adhesive film and sealing method for organic electronic device using same
Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same.
LG Chem, Ltd.
Y C C C Y H C H C Y H H H H
Y10T C09J C09J C09J Y10T H05B C09J H01L C09J Y10T H01L H01L H01L H05B
additional inventional additional additional additional inventional additional inventional additional additional additional inventional additional inventional
Jung Sup Suk Ky Hyun Jee Yoon Gyung Kyung Yul Seung Min
Shim Chang Yoo Cho Bae Lee