Haynes and Boone, LLP
Method of forming a photoresist layer
A method for forming a photoresist layer on a semiconductor device is disclosed. An exemplary includes providing a wafer. The method further includes spinning the wafer during a first cycle at a first speed, while a pre-wet material is dispensed over the wafer and spinning the wafer during the first cycle at a second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer during a second cycle at the first speed, while the pre-wet material continues to be dispensed over the wafer and spinning the wafer during the second cycle at the second speed, while the pre-wet material continues to be dispensed over the wafer. The method further includes spinning the wafer at a third speed, while a photoresist material is dispensed over the wafer including the pre-wet material.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
B G H H H H G
B05D G03F H01L H01L H01L H01L G03F
additional additional inventional inventional inventional inventional inventional
Chih-Chien Wang-Pen Chun-Wei Hung-Chang
Wang Mo Chang Hsieh