McClure, Qualey & Rodack, LLP
Printed circuit board and semiconductor package structure
A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.
SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
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inventional inventional additional inventional inventional additional inventional additional inventional additional inventional additional inventional inventional additional inventional additional inventional additional inventional additional inventional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Chang-Li Yun-Han Hsiu-Wen Nai-Shung Tsai-Sheng
Tan Chen Ho Chang Chen