Sughrue Mion, PLLC
Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same
An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.
Nitto Denko Corporation
H H C C C H H H H C
H01L H01L C08K C08K C08G H01L H01L H01L H01L C08K
additional additional additional additional inventional additional additional inventional additional additional
Takahiro Hisataka Katsumi Kazuhiro Takuya Shinya Tsutomu
Uchida Ito Shimada Ikemura Eto Akizuki Nishioka