Bacon & Thomas, PLLC
Wire-bonding method for wire-bonding apparatus
A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.
Advanced Semiconductor Engineering, Inc.
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Kao-Ming Teck-Chong Chih-Nan Chia-Jung Song-Fu Chian-Chi Ho-Ming Chao-Fu
Su Lee Wei Tsai Yang Lin Tong Weng