Cantor Colburn LLP
Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device
The laminated high melting point soldering layer includes: a laminated structure which laminated a plurality of three-layered structures, the respective three-layered structures including a low melting point metal thin film layer and a high melting point metal thin film layers disposed on a surface and a back side surface of the low melting point metal thin film layer; a first high melting point metal layer disposed on the surface of the laminated structure; and a second high melting point metal layer disposed on the back side surface of the laminated structure. The low melting point metal thin film layer and the high melting point metal thin film layer are mutually alloyed by TLP, and the laminated structure, and the first high melting point metal layer and the second high melting point metal layer are mutually alloyed by the TLP bonding.
Rohm Co., Ltd.
B B H H H B H H H H H B H H H H H H H B H H H Y B H C H H H H B B Y B H H B
B23K B32B H01L H01L H01L B23K H01L H01L H01L H01L H01L B23K H01L H01L H01L H01L H01L H01L H01L B23K H01L H01L H01L Y10T B23K H01L C22C H01L H01L H01L H01L B23K B23K Y10T B23K H01L H01L B23K
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Keiji Takukazu
Okumura Otsuka