Brazing or soldering material and production method thereof
 The present invention provides a joining, brazing or soldering material wherein solderability is effectively improved without using a flux, and a production method thereof. In production of a joining material, a halogen compound is mixed, a film is formed on the surface of a solder molding or the surface of a solder molding is halogenated. In production of a joining material, a halogen compound is added to a solder melt, a film of a halogen compound is formed on the surface of a processed joining material, or the surface layer of the processed joining material is converted to a halogen compound layer by halogenation. Film formation or surface treatment may be carried out either a dry or wet method. 
Seiko Epson Corporation
B B Y C Y C B B
B32B B23K Y10T C23C Y10T C22C B23K B23K
inventional inventional additional inventional additional inventional additional additional
Yoshiaki Takuya Katsuhiro
Mori Miyakawa Takahashi