Ohlandt, Greeley, Ruggiero and Perle, LLP
Barrier ruthenium chemical mechanical polishing slurry
A slurry for polishing surfaces or substrates that at least partially comprise ruthenium and copper, wherein the slurry includes an alkali hydroxide, oxygenated halogen compound, and a halogen alkyl benzotriazole. The slurry may further include abrasive, acid(s), and, optionally, an alkoxylated alcohol. With these components, the slurry exhibits a high ruthenium to copper removal rate ratio.
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
C C B C H C H B C C C
C09G C09G B24B C09K H01L C09G H01L B24B C09K C09G C09K
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Liqing (Richard) Ting-Kai Bin David (Tawei) Yannan
Wen Huang Hu Lin Liang