WPAT, P.C., Intellectual Property Attorneys
Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a substrate including a first surface and a second surface opposite to the first surface; a dielectric layer disposed over the second surface or below the first surface; a polymeric layer disposed over or below the dielectric layer; an isolation layer surrounding and contacted with the substrate, the dielectric layer and the polymeric layer; a die disposed over the polymeric layer; a first conductive bump disposed below the first surface of the substrate; and a second conductive bump disposed between the second surface of the substrate and the die.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chih-Hao Jung Tsung Chien-Kuo Chi-Yang Kuan-Lin
Lin Cheng Chang Yu Ho