High density wafer production method
A gradational etching method for high density wafer production. The gradational etching method acts on a substrate having a first passivation layer and a second passivation layer on a top surface and a bottom surface, respectively, of the substrate. A first etching process is performed to simultaneously etch the substrate and the first passivation layer to remove the first passivation layer. Finally, a second etching process is performed to etch the substrate to a designated depth that is used to control the thickness of the wafer after the second etching process.
BenQ Corporation
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Tsung-Ping Chung-Cheng Wei-Lin In-Yao Hung-Sheng
Hsu Chou Chen Lee Hu