Oliff & Berridge, PLC
Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions having a semiconductor device formed therein and insulated from each other, and a plurality of wiring electrodes connected to the semiconductor devices respectively formed in the plurality of device regions and extending from the device regions into the inside of the scribe-groove parts. The plurality of wiring electrodes are arranged in a partial arrangement pattern in which the wiring electrodes are arranged along only a part of four boundary sides, corresponding to boundaries between each of the device regions and the scribe-groove parts. Further, the plurality of wiring electrodes extend into the scribe-groove part from only one of two device regions adjacent to each other with the scribe-groove part therebetween.
Sae Magnetics (H.K.) Ltd. Headway Technologies, Inc.
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Shigeki Hiroyuki Kazuki Atsushi Yoshitaka
Tanemura Ito Sato Iijima Sasaki