Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Contact probe pin for semiconductor test apparatus
It is an object to provide a contact probe pin for a semiconductor test apparatus, including an amorphous carbon type conductive film formed on the probe pin base material surface. The conductive film is excellent in tin adhesion resistance of preventing tin which is the main component of solder from adhering to the contact part of the probe pin during contact between the probe pin and solder. The contact probe pin for a semiconductor test apparatus, includes an amorphous carbon type conductive film formed on the conductive base material surface. The amorphous carbon type conductive film has an outer surface with a surface roughness (Ra) of 6.0 nm or less, a root square slope (RΔq) of 0.28 or less, and a mean value (R) of curvature radii of concave part tips of the surface form of 180 nm or more, in a 4-μm2 scan range by an atomic force microscope.
Kobe Steel, Ltd.
G G H
G01R G01R H01R
inventional inventional additional
Kenji Hirotaka
Yamamoto Ito