Haynes and Boone, LLP
Method of forming contact metal
A method of fabricating a semiconductor device is disclosed. The method includes forming a source/drain feature over a substrate, forming a dielectric layer over the source/drain feature, forming a contact trench through the dielectric layer to expose the source/drain feature, depositing a titanium nitride (TiN) layer by a first atomic layer deposition (ALD) process in the contact trench and depositing a cobalt layer over the TiN layer in the contact trench.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional
Yu-Kai Hsien-Lung Wei-Jung Hong-Mao Chun-Hsien
Chen Yang Lin Lee Huang