Slater Matsil, LLP
Protrusion bump pads for bond-on-trace processing
An embodiment apparatus includes a dielectric layer in a die, a conductive trace in the dielectric layer, and a protrusion bump pad on the conductive trace. The protrusion bump pad at least partially extends over the dielectric layer, and the protrusion bump pad includes a lengthwise axis and a widthwise axis. A ratio of a first dimension of the lengthwise axis to a second dimension of the widthwise axis is about 0.8 to about 1.2.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Wei Yu-Feng Yu-Min Chun-Hung Tin-Hao Chen-Shien
Lin Chen Liang Lin Kuo Chen