Steptoe & Johnson LLP
Semiconductor device and method of manufacturing the same
The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.
Panasonic Corporation
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additional additional additional additional inventional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional
Takahiro Hikari Yoshihiro Seiji Hideki
Nakano Sano Tomita Fujiwara Takehara