McDermott Will & Emery LLP
Method of selectively removing silicon nitride and single wafer etching apparatus thereof
A method of selectively removing silicon nitride is provided. The method includes: providing a wafer having silicon nitride on a surface of the wafer; providing a mixture of phosphoric acid and a silicon-containing material; and delivering the mixture to the surface of the wafer to remove the silicon nitride. Single wafer etching apparatuses of selectively removing silicon nitride are also provided.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H H
H01L H01L
inventional inventional
Ying-Hsueh Yu-Ming Chi-Ming
Changchien Lee Yang