Thompson Hine LLP
Method and device for reducing contamination for reliable bond pads
The present disclosure generally relates to methods for cleaning the backside of a wafer. A wet cleaning method may be used by stripping off the uppermost spacer layers on the backside of the wafer using a cleaning solution. In one embodiment, hydrogen fluoride (HF) solution may be employed to remove the nitride/oxide spacer layer. In another embodiment, a dry cleaning method may be employed to etch the wafer at the bevel region. Residues are completely removed from the wafer backside. This method improves the yield and storage life of the semiconductor wafers.
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
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Honghui Liang Alex Xiaodong Yun Ling
Mou Li See Li Tan