Paul & Paul
Photosensitive composition
The invention relates to photosensitive compositions, which can be developed positively. Traditional compositions have either inadequate photosensitivity or they are not appropriate for use on the copper surfaces, for example of circuit boards, since the exposed coating sections of the composition cannot be completely removed during developing, which results in problems in subsequent plating or etching. In the photosensitive compositions according to the invention, these disadvantages cannot be observed. Various compositions are described, which contain photo acid generators and a polymer resin with side groups, which can split acid, said polymer resin being formed by polymerizing at least three different acrylate- or methacrylate-monomers.
Atotech Deutschland GmbH
G Y G
G03F Y10S G03F
inventional additional inventional
Rosangela Gilles Heinrich Francis Gonzalo Urrutia
Pirri Meunier Meyer Verzaro Desmasion