Lee & Morse, P.C.
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1:wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
Cheil Industries Inc.
H C C C H C
H01L C09D C08L C08G H01L C09J
inventional inventional inventional inventional additional inventional
Ju Mi Sung Su Eun Jung Seung
Kim Park Lee Han