Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
A projection system, a spatial light modulator, and a method for forming a MEMS device is disclosed. The spatial light modulator can have two substrates bonded together with one of the substrates comprising a micromirror array. The two substrates can be bonded at the wafer level after depositing a getter material andlor solid or liquid lubricant on one or both of the wafers. The wafers can be bonded together hermetically if desired, and the pressure between the two substrates can be below atmosphere.
Texas Instruments Incorporated
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Dietrich Anthony Peter W. Hongqin Andrew G. Thomas J. Hung Nan Robert M. Satayadev R. Steve
Dehlinger Sun Richards Shi Huibers Grobelny Chen Duboc Patel Chiang