Ladas & Parry LLP
Method for preparing patterned coverlay on substrate
The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.
ETERNAL MATERIALS CO., LTD.
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Chang-Hong Shun-Jen Chung-Jen Meng-Yen Po-Yu Chung-Kai
Ho Chiang Wu Chou Huang Cheng