Morris, Manning & Martin, LLP
Electronic device and heat dissipation module thereof
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.
Inventec Corporation Inventec (Pudong) Technology Corporation
F H F G H
F28D H05K F28D G06F H05K
additional inventional inventional inventional inventional
Ming-Hung Wei-Hsin Chih-Kai Feng-Ku Yi-Lun Hua-Feng
Lin Wu Yang Wang Cheng Chen