Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Polishing composition
To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure.A polishing composition comprising abrasive grains, a processing accelerator, a nonionic surfactant represented by R-POE (I) (wherein R is a C10-16 alkyl group having a branched structure, and POE is a polyoxyethylene chain) and having an HLB of from 7 to 12, an anionic surfactant, a protective film-forming agent, an oxidizing agent, and water.
Fujimi Incorporated
C C H
C09K C09G H01L
inventional inventional inventional
Akihito Yasuyuki Tatsuhiko Hiroshi
Yasui Yamato Hirano Mizuno