Blakely, Sokoloff, Taylor & Zafman LLP
Using cell voltage as a monitor for deposition coverage
A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.
Intel Corporation
H C
H01L C25D
additional inventional
Yang Yue Rajiv Jir-shyr
Cao Ma Rastogi Chen