Sheppard Mullin Richter & Hampton LLP
MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.
Indium Corporation
C B Y C B
C22C B23K Y10T C22C B23K
inventional inventional additional inventional inventional
Weiping Ning-Cheng
Liu Lee