Qualcomm Incorporated/Seyfarth Shaw LLP
Unified memory controller for heterogeneous memory on a multi-chip package
An enhanced multi chip package (eMCP) is provided including a unified memory controller. The UMC is configured to manage different types of memory, such as NAND flash memory and DRAM on the eMCP. The UMC provides storage memory management, DRAM management, DRAM accessibility for storage memory management, and storage memory accessibility for DRAM management. The UMC also facilitates direct data copying from DRAM to storage memory and vice versa. The direct copying may be initiated by the UMC without interaction from a host, or may be initiated by a host.
Qualcomm Incorporated
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inventional inventional inventional inventional
Jung Pill Jungwon Dexter Tamio Hyunsuk
Kim Suh Chun Shin