Sughrue Mion, PLLC
Semiconductor package
A semiconductor package is provided. The semiconductor package includes: a mounting substrate including at least one bonding pad; a first semiconductor chip disposed on the mounting substrate, and including a first protrusion on one side of the first semiconductor chip; a first spacer ball electrically connected to the first semiconductor chip; a first bump ball electrically connected to the first spacer ball; and a first wire which electrically connects the first bump ball and the bonding pad without contacting the first protrusion, wherein the first wire includes a first portion extending in a direction away from the bonding pad, and a second portion extending in a direction approaching the bonding pad.
SAMSUNG ELECTRONICS CO., LTD.
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You Kyung Saet Byeol Ho Soo Won Gil Seung Lo
Son Lee Han Han Lee