Haverstock & Owens LLP
Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board
Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
C. Uyemura & Co., Ltd.
C C C C C C H
C23C C23C C23C C23C C23C C23C H05K
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Teruyuki Takahiro Tomohiro Masaharu
Hotta Ishizaki Kawase Takeuchi