McAndrews, Held & Malloy, Ltd.
Electronic device package and fabricating method thereof
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
Amkor Technology, Inc.
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Sung Kyu No Sun Jin Young Yoon Joo Seung Jae Ju Hoon Se Woong
Kim Park Kim Kim Lee Yoon Cha