Muncy, Geissler, Olds & Lowe, P.C.
Chemical-mechanical polishing abrasive pad conditioner and method for manufacturing same
The present invention provides a CMP abrasive pad conditioner, comprising a bottom substrate; an intermediate layer located on the bottom substrate, the intermediate layer including a hollow portion and an annular portion surrounding the hollow portion, the annular portion being provided with a plurality of bumps; and a diamond film located on the intermediate layer, and forming a plurality of abrasive projections corresponding to the bumps of the intermediate layer; in this case, a top surface of the abrasive projections is formed with a patterned configuration and the top surface is provided with a center line average roughness (Ra) between 2 and 20.
KINIK COMPANY LTD.
B B B
B24D B24B B24D
inventional inventional additional
Chin-Chung Hsin-Chun Yu-Chau Jui-Lin Chung-Yi
Chou Wang Hung Chou Cheng