Lando & Anastasi, LLP
Reflow oven and methods of treating surfaces of the reflow oven
A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.
ILLINOIS TOOL WORKS INC.
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Joo Yong Roberto P. Steven Dwade Douglas Wen-Feng
Tay Loera Cook Ngai Liu