Through silicon via process
A through silicon via process includes the following steps. A substrate having a front side and a back side is provided. A passivation layer is formed on the back side of the substrate. An oxide layer is formed on the passivation layer.
United Microelectronics Corp.
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additional inventional inventional
Tsun-Min Chien-Li Huei-Ru Szu-Hao Chi-Mao Tsai-Yu Jia-Jia Ching-Li Ching-Wei
Cheng Kuo Tsai Lai Hsu Wen Chen Yang Hsu