Dentons US LLP
Adhesive film and sealing product for organic electronic device using same
Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
LG Chem, Ltd.
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C08L H01L C08G H01L C08G C09J C08K H01L C08K C08K
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Seung Min Jung Sup Suk Ky Yoon Gyung Kyung Yul Hyun Jee
Lee Shim Chang Cho Bae Yoo