WPAT, P.C., Intellectual Property Attorneys
Semiconductor structure and manufacturing method thereof
A semiconductor structure is disclosed. The semiconductor structure includes: a substrate having a first side and a second side opposite to the first side; an interconnect structure disposed on the first side, the interconnect structure including a dielectric layer, and a first conductive member and a second conductive member within the dielectric layer; a waveguide disposed between the first conductive member and the second conductive member within the dielectric layer, the waveguide including a first waveguide layer, a second waveguide layer and an adhesive layer between the first waveguide layer and the second waveguide layer; a first die disposed at the first side and over the interconnect structure and electrically connected to the first conductive member; and a second die disposed at the first side and over the interconnect structure and electrically connected to the second conductive member. An associated method for fabricating the same is also disclosed.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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inventional inventional additional additional additional additional inventional inventional inventional inventional additional inventional additional inventional inventional inventional additional additional inventional
Huan-Neng Wen-Shiang
Chen Liao