Duane Morris LLP
Semiconductor device and method for manufacturing the same
A semiconductor device includes: first, second, and third tiers formed on a substrate, wherein the first tier is formed over the substrate, the second tier is formed over the first tier, and the third tier is formed over the second tier, wherein the second tier comprises a first interconnection line that is configured to transmit a signal, and wherein a portion of the first tier disposed directly under the first interconnection line of the second tier lacks any interconnection lines and a portion of the third tier disposed directly above the first interconnection line of the second tier lacks any interconnection lines.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Chao-Yuan Tien-Chien
Cheng Huang