Keating & Bennett, LLP
Resin molded body with RFIC package incorporated therein and method for manufacturing same
A resin molded body with an RFIC package incorporated therein is insert-molded incorporating therein a metal core material and an RFIC element connected to the metal core material. The RFIC element includes a ceramic multi-layer substrate that incorporates therein a coil conductor, and an RFIC chip mounted on a mounting surface of the multi-layer substrate. The RFIC chip is connected to the coil conductor by nano-particle bonding or ultrasonic bonding. The coil conductor is coupled with the core material in a magnetic field coupling scheme.
MURATA MANUFACTURING CO., LTD.
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Noboru Hiroyuki
Kato Imanishi