Haynes and Boone, LLP
Material composition and methods thereof
Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments, the resist layer includes a metal complex including a radical generator, an organic core, and an organic solvent. By way of example, the organic core includes at least one cross-linker site. In some embodiments, an exposure process is performed to the resist layer. After performing the exposure process, the exposed resist layer is developed to form a patterned resist layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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An-Ren Ching-Yu Joy
Zi Chang Cheng