Banner & Witcoff, Ltd.
Manufacturing method of via hole, display substrate, and manufacturing method thereof
A manufacturing method of a via hole, a display substrate and a manufacturing method thereof are provided. The manufacturing method of a via hole includes: forming a first via hole penetrating the passivation protection layer, the first via hole being defined by a first side wall of the passivation protection layer; forming an organic insulating layer on the passivation protection layer; and forming a second via hole penetrating the organic insulating layer, the second via hole being defined by a second side wall of the organic insulating layer; wherein in a sectional view, a bottom of the second via hole is located in the first via hole and is in direct contact with the conductive layer, and the second side wall of the organic insulating layer is separated from the first side wall of the passivation protection layer.
BOE Technology Group Co., Ltd. Hefei Xinsheng Optoelectronics Technology Co., Ltd.
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Chengshao Yunhai Ke Wenlong
Yang Wan Cao Wang