Haynes and Boone, LLP
System and method for removing particles in semiconductor manufacturing
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
Taiwan Semiconductor Manufacturing Company, Ltd.
H B H B H
H01L B08B H01L B08B H01L
inventional inventional additional inventional inventional
Wen-Chuan Yen-Bin Chang-Cheng Chen-Yuan Chi-Lun Chin-Hsiang Ching-Yu Shih-Ming
Wang Huang Hung Hsia Lu Lin Chang Chang