McAndrews, Held & Malloy, Ltd.
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a bottom surface, and side surfaces between the top and bottom surfaces of the electronic device. An encapsulant may encapsulate the side surfaces of the electronic device, a contact pad may be on the top surface of the electronic device, and a redistribution structure may be coupled to the contact pad. The redistribution structure may include a linear portion and a bump pad, and a conductive bump on the bump pad may include a main bump and a protruding part extending toward the linear portion, where the protruding part may be smaller than the main bump.
AMKOR TECHNOLOGY, INC.
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Doo Hyun Jin Young SeungJae Jin Han Se Woong YoonJoo Jong Sik Dong Jin Jae Hun SungKyu
Park Kim Lee Kim Cha Kim Paek Kim Bae Kim