Oliff & Berridge, PLC
Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them
A semiconductor chip having a vertical current conduction structure of a high aspect ratio and high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30).
Seiko Epson Corporation
B H H H B H H H H H B B B H H
B23K H01L H01L H01L B23K H01L H01L H01L H01L H01L B23K B23K B23K H01L H01L
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Jun Katsuji Shinichi Kazushige
Amako Arakawa Yotsuya Umetsu