WPAT, P.C. Intellectual Property Attorneys
Optical semiconductor package and method for manufacturing the same
A semiconductor package includes an interconnect structure having a first surface and a second surface opposite to the first surface, an insulating layer contacting the second surface of the interconnect structure wherein the insulating layer has a third surface facing the second surface of the interconnect structure and a fourth surface opposite to the third surface, at least one optical chip over the fourth surface of the insulating layer and electrically coupled to the interconnect structure, and a molding compound over the first surface of the interconnect structure.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chih-Yuan Chen-Hua Chuei-Tang Hsing-Kuo Jeng-Shien Yu-Kuang Chih-Chieh
Chang Yu Wang Hsia Hsieh Liao Chang