Vople and Koenig, P.C.
Substrate processing apparatus, method for manufacturing semiconductor device, and recording medium
A substrate processing apparatus is disclosed. The substrate processing apparatus includes a process chamber configured to accommodate a substrate; a gas supply unit configured to supply a process gas into the process chamber; a lid member configured to block an end portion opening of the process chamber; an end portion heating unit installed around a side wall of an end portion of the process chamber; and a thermal conductor installed on a surface of the lid member in an inner side of the process chamber, and configured to be heated by the end portion heating unit.
HITACHI KOKUSAI ELECTRIC INC.
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Hideto Takurou Hiroshi Yuichi Iwao Keishin Manabu
Tateno Ushida Ashihara Wada Nakamura Yamazaki Izumi