Harness, Dickey & Pierce, P.L.C.
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same
A semiconductor package including a redistribution substrate, and a semiconductor chip mounted on the redistribution substrate, the semiconductor chip having a conductive pad on one surface thereof may be provided. The redistribution substrate may include a first passivation pattern on the conductive pad, the first passivation pattern exposing a portion of the conductive pad, and a redistribution pattern covering the portion of the conductive pad exposed by the first passivation pattern and surrounding the first passivation pattern.
Samsung Electronics Co., Ltd.
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Jongyoun Seokhyun
Kim Lee