Eschweiler & Potashnik, LLC
Image sensor scheme for optical and electrical improvement
The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes an image sensing element arranged within a substrate. One or more isolation structures are arranged within one or more trenches disposed on opposing sides of the image sensing element. The one or more isolation structures extend from a first surface of the substrate to within the substrate. The one or more isolation structures respectively include a reflective element configured to reflect electromagnetic radiation.
Taiwan Semiconductor Manufacturing Co., Ltd.
H H
H01L H01L
inventional inventional
Keng-Yu Cheng-Yuan Yeur-Luen Sheng-Chan Cheng-Hsien
Chou Tsai Tu Li Chou