Myers Bigel Sibley & Sajovec
Integrated circuit memory devices including rows of pads extending parallel to the short sides of the integrated circuit
 Integrated circuit memory devices include a rectangular integrated circuit memory device substrate that includes a pair of short sides, a pair of long sides and a pair of opposing faces. The substrate also includes an array of memory cells and peripheral circuits therein. A plurality of spaced apart rows of input/output pads on one of the faces extend parallel to the short sides. The face is free of (i.e. does not include) a row of input/output pads that extends parallel to the long sides. The input/output pads are preferably arranged on the integrated circuit memory device substrate, relative to the circuits in the integrated circuit memory device substrate. More specifically, the integrated circuit memory device includes a plurality of memory cell array blocks, first decoder blocks and second decoder blocks in the substrate. A respective first decoder block extends parallel to the short sides adjacent a respective memory cell array block and opposite a short side. A respective second decoder block extends parallel to the long sides, between adjacent memory cell array blocks. The plurality of input/output pads are included between the short sides and the memory cell array blocks adjacent thereto and between the first decoder blocks. 
Samsung Electronics Co., Ltd.
G
G11C
inventional
Yun-sang Jun-young
Lee Jeon