Haynes and Boone, LLP
Monolithic stacked integrated circuits with a redundant layer for repairing defects
Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes first circuit elements where a first portion of the first circuit elements has a defect. The second layer includes second circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second circuit elements for mitigating the defect.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional inventional inventional additional inventional additional inventional inventional inventional inventional
Ji-Jan Jung-Rung Chin-Her Wei-Pin Kuan-Yu
Chen Jiang Chien Changchien Lin