JCIPRNET
Process control method and process control system
A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.
Powerchip Technology Corporation
G G G G Y G
G05B G05B G05B G05B Y02P G05B
inventional additional inventional additional additional additional
Shih-Tsung Chien-Chung Sheng-Hsiu Jyun-Da Huang-Wen Huang-Wei
Hsiao Chen Peng Wu Chen Wu