WPAT, P.C., Intellectual Property Attorneys
Conduction layer for stacked CIS charging prevention
A semiconductor device includes a first semiconductor chip comprising a first metallic structure and a second semiconductor chip comprising a second metallic structure. The second semiconductor chip is bonded with the first semiconductor chip by a first conductive plug. A second conductive plug extends from the first metallic structure and into a substrate of the first semiconductor chip. The first conductive plug connects the first metallic structure and the second metallic structure, wherein a conductive liner is along a sidewall of the first conductive plug or the second conductive plug.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Kun-Huei Yung-Lung Kuo-Cheng Cheng-Yuan Chun-Hao
Lin Hsu Lee Li Chou