Dentons US LLP
Encapsulation film and method for encapsulating organic electronic device using same
Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.
LG Chem, Ltd.
H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional inventional inventional additional inventional inventional inventional additional inventional additional
Hyun Suk Hyun Jee Jung Ok Suk Ky Seung Min
Kim Yoo Moon Chang Lee