Hauptman Ham, LLP
Semiconductor device package including embedded conductive elements
A semiconductor device includes a first semiconductor die package. The first semiconductor package includes a molding compound, and a conductive element in the molding compound, wherein a top surface of the conductive element is above or co-planar with a top-most surface of the molding compound. The semiconductor device further includes a second semiconductor die package. The second semiconductor package includes a plurality of copper-containing contacts on a single metal pad, wherein each of the plurality of copper-containing contacts is bonded to the conductive element.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional
Chun-Hung Han-Ping Kai-Chiang Yu-Feng Ming-Da
Lin Pu Wu Chen Cheng