Muncy, Geissler, Olds & Lowe, P.C.
Memory devices and methods for fabricating the same
Memory devices include a first dielectric layer disposed on a substrate. Memory devices include a pair of contacts and a dielectric portion disposed in an opening of the first dielectric layer. The pair of contacts are separated from each other by the dielectric portion. Each contact includes a first conductive portion disposed on the substrate, a second conductive portion disposed over the first conductive portion and a lining layer disposed between the first conductive portion and the second conductive portion and on a sidewall of the opening. The second conductive portion has a sidewall that is in contact with the dielectric portion and the lining layer is not located thereon. The second conductive portion has a corner in connection with the sidewall and a top surface of the second conductive portion, and a protection portion is disposed on the corner.
WINBOND ELECTRONICS CORP.
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inventional inventional inventional additional
Huang-Nan Noriaki
Chen Ikeda