Haynes and Boone, LLP
System and method for removing particles in semiconductor manufacturing
A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H B B
H01L H01L H01L B08B B08B
inventional additional inventional inventional inventional
Chin-Hsiang Chi-Lun Ching-Yu Chen-Yuan Wen-Chuan Shih-Ming Yen-Bin Chang-Cheng
Lin Lu Chang Hsia Wang Chang Huang Hung