Brinks Hofer Gilson & Lione
Cutting method for substrate
A cutting method for substrates includes: preparing a substrate having a predetermined circular cut line which is set thereon; chucking the substrate on a surface of a chuck table which is rotatably provided; and cutting the substrate along the predetermined circular cut line of the substrate by rotating a disc-shaped cutting blade. In the cutting, the cutting blade is disposed beforehand laterally away from a side of the substrate in a surface direction of the substrate and is disposed beforehand at a position in a thickness direction of the substrate, the position corresponding to a cut depth by the cutting blade to the substrate. Next, the cutting blade is moved relatively from the above condition toward the substrate in a tangential direction of the substrate so as to enter from an edge of the substrate to a cutting start point of the substrate. Next, the substrate is rotated together with the chuck table and the cutting blade cuts the substrate along the predetermined circular cut line, so that the cutting is performed on the substrate.
Disco Corporation
H
H01L
inventional
Shinya
Watanabe