Semiconductor chip with passivation layer comprising metal interconnect and contact pads
The invention provides a semiconductor chip comprising a semiconductor substrate comprising a MOS device, an interconnecting structure over said semiconductor substrate, and a metal bump over said MOS device, wherein said metal bump has more than 50 percent by weight of gold and has a height of between 8 and 50 microns.
Megica Corporation
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Ching-San Mou-Shiung Chiu-Ming Chien-Kang
Lin Lin Chou Chou