Burr & Brown
Semiconductor mounting system
An object of the present invention is to provide a novel semiconductor mounting system having a semiconductor mounting member, a metal member and a joining layer joining the mounting and metal members, to improve the flatness of a mounting surface and to control the temperature on the surface of a semiconductor. A semiconductor mounting system 12 has a semiconductor mounting member 1, a metal member 7 and a joining layer 27 joining the mounting member 1 and metal member 7. The metal member 1 has a surface mounting a semiconductor. The adhesive sheet 4 has a resin matrix 11 and a filler 10 dispersed in the resin matrix 11. 
NGK Insulators, Ltd.
H H
H01L H01L
inventional inventional
Tomoyuki
Fujii