Mattingly, Stanger & Malur, P.C.
Semiconductor device with wiring substrate
The junction strength between the external terminals and the wiring substrate of a semiconductor device is improved without creating a large size semiconductor device. In the outer periphery of the back surface of an interposer substrate 1Bi on which a semiconductor chip constructing a CSP type semiconductor device 1 is mounted, there are arranged a plurality of bump electrodes 1BB1 whose size in the direction intersecting the sides of the interposer substrate 1B1 is larger than that in the direction along the sides of the interposer substrate 1Bi.
Hitachi, Ltd.
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Takao Kenji Yasushi Toshinori
Sonobe Hanada Takahashi Hirashima