CKC & Partners Co., LLC
Method for manufacturing circuit board
The present disclosure relates to a method for manufacturing a circuit board. The method for manufacturing the circuit board includes forming a patterned first dielectric layer on a substrate; forming an adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the adhesive layer; and patterning the second dielectric layer and the adhesive layer.
UNIMICRON TECHNOLOGY CORP.
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Wen-Fang Po-Hsuan
Liu Liao