Material to improve CMOS image sensor yield during wafer sawing
A new method is provided of treating the wafer prior to the process of singulating the wafer into individual die. A surface of the wafer over which CMOS image sensor devices have been created is coated with a layer of material that is non-soluble in water. The wafer is singulated by sawing through the layer of material that has been coated over the surface of the wafer and by then sawing through the wafer. The singulated die is then further processed by applying steps of die mount, wire bonding, surrounding the die in a mold compound and marking the package.
Taiwan Semiconductor Manufacturing Company
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inventional inventional inventional
Chih-Kung Sheng-Liang Yu-Kung Hung-Jen
Chang Pan Hsiao Hsu