Ostrolenk, Faber, Gerb & Soffen, LLP
Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
 There is disclosed a paste composition including (A) an organic binder comprising acidic functional groups; (B) an inorganic powder containing multivalent metal compounds; and (C) a mono-ol compound having a boiling point of about 178.degree. C. or more. The paste composition enables various fine patterns such as via-holes with high precision, by suppressing gelation caused by mixing an organic binder having acidic functional groups and a compound containing multivalent metals. 
Murata Manufacturing Co., Ltd.
C C H C C C H B C C G C C C C H H C H H
C04B C04B H05K C04B C04B C04B H01L B32B C04B C04B G03F C04B C03C C04B C04B H01L H05K C04B H01L H01L
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Shizuharu Michiaki Masahiro
Watanabe Iha Kubota