Mori & Ward, LLP
Lead-free solder alloy, electronic circuit substrate, and electronic device
A lead-free solder alloy includes 1% by weight or more and 4% by weight or less of Ag, 1% by weight or less of Cu, 3% by weight or more and 5% by weight or less of Sb, 0.01% by weight or more and 0.25% by weight or less of Ni, and Sn.
TAMURA CORPORATION
B C B H B C Y B B H B H H
B23K C22C B23K H05K B23K C22C Y02P B23K B23K H05K B23K H05K H05K
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Tsukasa Atsushi Masaya Yurika Takeshi
Katsuyama Hori Arai Munekawa Nakano