JCIPRNET
Semiconductor structure
A semiconductor structure including an insulating encapsulant, a plurality of semiconductor dies separately embedded in the insulating encapsulant, and an electrical communication path is provided. The electrical communication path includes at least one turning wiring connected to a conductive terminal of one of the semiconductor dies and extending across and above the insulating encapsulant to reach another conductive terminal of another one of the semiconductor dies. A layout area of the at least one turning wiring is within a region corresponding to an edge of one of the semiconductor dies and a closest edge of the adjacent one of the semiconductor dies.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Ying-Ju Hsien-Wei Jie
Chen Chen Chen