Burr & Brown, PLLC
Bonding material and semiconductor supporting device
The bonding material is formed of a cured sheet composed of an addition curable silicone adhesive agent, and the addition curable silicone adhesive agent contains an organopolysiloxane containing two or more vinyl groups per molecule; an organopolysiloxane resin containing a unit (hereinafter, “M”) represented by R3SiO1/2 (R is a monovalent hydrocarbon group having 1 to 6 carbon atoms and containing no aliphatic unsaturated bond) and a unit (hereinafter, “Q”) represented by SiO4/2 in a molar ratio (M/Q ratio) equal to or more than 0.6 to equal to or less than 0.6 to 1.6; an organohydrogenpolysiloxane containing a silicon atom-bonding hydrogen atom; a platinum catalyst; and a heat conductive filler whose content falls within the range equal to or more than 20 vol % to equal to or less than to 50 vol %.
NGK Insulators, Ltd. Shin-Etsu Chemical Co., Ltd.
C Y Y C C Y C C C
C09J Y10T Y10T C08G C08G Y10T C08K C08L C08L
inventional additional additional additional additional additional additional inventional additional
Akio Tomoyuki
Suzuki Fujii