Dentons US LLP
Encapsulation composition (as amended)
An encapsulation composition, an encapsulation film including the same, an encapsulation product for organic electronic devices, and a method of manufacturing an organic electronic device are provided. The encapsulation composition can be useful in effectively preventing moisture or oxygen from flowing into the organic electronic device from external environments while realizing transparency when the organic electronic device is encapsulated by the encapsulation composition. Also, the encapsulation film formed of the encapsulation composition can be useful in ensuring mechanical properties such as handling properties and processability, and the organic electronic device whose encapsulation structure is formed by means of the encapsulation film may have improved lifespan and durability, thereby providing an encapsulation product for organic electronic devices showing high reliability.
LG Chem, Ltd.
C C C C C C C C H C H C H C H
C08L C08L C08L C09J C09J C08L C08L C08L H01L C08L H01L C08L H01L C08F H01L
additional additional inventional inventional inventional inventional additional additional inventional inventional inventional inventional additional inventional inventional
Seung Min Suk Ky Hyun Jee Min Soo Yoon Gyung Hyun Suk Jung Ok Jung Sup Kyung Yul
Lee Chang Yoo Park Cho Kim Moon Shim Bae