McDermott Will & Emery LLP
Semiconductor chip and process for forming the same
A semiconductor chip comprises a first MOS device, a second MOS device, a first metallization structure connected to said first MOS device, a second metallization structure connected to said second MOS device, a passivation layer over said first and second MOS devices and over said first and second metallization structures, and a third metallization structure connecting said first and second metallization structures.
Megica Corporation
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Mou-Shiung Chien-Kang Hsin-Jung
Lin Chou Lo