Rothwell, Figg, Ernst & Manbeck, P.C.
Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors
The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C.; and a phenol resin having a softening point of more than 105° C., wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.
LG CHEM, LTD.
H C H C C C H H H H H C C H H H H H H H C H C C C C C C C H H C H H H C H C H C H C H C
H01L C08L H01L C09J C09J C09J H01L H01L H01L H01L H01L C09J C09J H01L H01L H01L H01L H01L H01L H01L C09J H01L C09J C08L C09J C08L C08L C09J C09J H01L H01L C09J H01L H01L H01L C08L H01L C09J H01L C08L H01L C08L H01L C09J
additional additional additional inventional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional inventional inventional additional inventional inventional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional
Hee Jung Kwang Joo Se Ra Jung Hak
Kim Lee Kim Kim