Drinker Biddle & Reath LLP
Semiconductor device and manufacturing method thereof
A semiconductor device has a semiconductor chip and through electrodes formed passing through the semiconductor chip. A ground layer connected to the through electrode and a patch antenna connected to the through electrode are provided through an inorganic insulating layer formed of SiO2 or SiN on a second face opposite to a first face (main face) of the semiconductor chip.
Shinko Electric Industries Co., Ltd.
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Tomoharu
Fujii