Hamre, Schumann, Mueller & Larson, P.C.
Process for making a fingerprint sensor package module and the fingerprint sensor package module made thereby
A method for making a fingerprint sensor package module includes the steps of: providing a substrate, disposing a fingerprint sensor chip over a mounting region of the substrate, forming a masking layer on a sensing region of the fingerprint sensor chip, electrically connecting the substrate to the fingerprint sensor chip, molding an encapsulation structure, and removing the masking layer to expose the sensing region of the fingerprint sensor chip.
TONG HSING ELECTRONIC INDUSTRIES, LTD.
H H G H H H G H H G H H H
H01L H01L G06V H01L H01L H01L G06V H01L H01L G06V H01L H01L H01L
inventional inventional inventional additional additional additional inventional additional additional inventional inventional additional inventional
Chia-Shuai
Chang