Tutunjian & Bitetto, P.C.
Surface nitridation in metal interconnects
Conductive contacts and methods of forming vias include forming a trench that penetrates a dielectric layer to expose a surface of an underlying conductor. Exposed surfaces of the dielectric layer and the exposed surface of the underlying conductor are nitridized to form a layer of nitridation at the exposed surfaces. The exposed surface of the underlying conductor is etched away to form a recessed area in the underlying conductor. A conductive via is formed in the trench and the recessed area that forms a conductive contact with the underlying conductor.
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Lawrence A. Wei Chih-Chao Terry A. Roger A.
Clevenger Wang Yang Spooner Quon