Altis Law Group, Inc.
Manufacturing method for LED package
The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.
Advanced Optoelectronic Technology, Inc.
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additional inventional additional additional
Hsin-Chiang Wen-Liang Chieh-Ling
Lin Tseng Chang