Zilka-Kotab, PC
Method of fabricating electronic component using resist structure with no undercut
A method for milling a structure. A single- or multi-layer resist having no undercut is added to a surface of a structure to be milled, the surface to be milled defining a plane. A milling process, such as ion milling, is performed. The milling process includes milling the structure at high incidence and milling the structure at razing incidence. The milling process can be performed only once, or repeated multiple times. High incidence can be defined as about 65 to about 90 degrees from the plane of the surface being milled. Razing incidence can be defined as about 0 to about 30 degrees from the plane of the surface being milled.
Hitachi Global Storage Technologies Netherlands B.V.
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Benjamin Lu Chen Frederick Hayes Hugo Alberto Emilio Jui-Lung Amanda Wipul Pemsiri Marie-Claire
Wang Dill Santini Li Baer Jayaekara Cyrille