Patterson & Sheridan, LLP
Apparatus and methods for spacer deposition and selective removal in an advanced patterning process
Embodiments herein provide apparatus and methods for performing a deposition and a patterning process on a spacer layer with good profile control in multiple patterning processes. In one embodiment, a method for depositing and patterning a spacer layer during a multiple patterning process includes conformally forming a spacer layer on an outer surface of a patterned structure disposed on a substrate, wherein the patterned structure has a first group of openings defined therebetween, selectively treating a first portion of the spacer layer formed on the substrate without treating a second portion of the spacer layer, and selectively removing the treated first portion of the spacer layer.
APPLIED MATERIALS, INC.
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H01L H01L
inventional inventional
Shambhu N. Chentsau Srinivas D. Jie Ellie Y. Jingjing
Roy Ying Nemani Zhou Yieh Liu