Lee IP Law, P.C.
Wafer bonding apparatus and wafer bonding system using the same
A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.
SAMSUNG ELECTRONICS CO., LTD.
B B B H H B B B H B H H B B H B H
B29C B29C B29C H01L H01L B29C B29C B29C H01L B29C H01L H01L B29C B32B H01L B32B H01L
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Tae-yeong Sung-hyup Jun-hyung
Kim Kim Kim