Townsend & Banta
Mounting method and mounting apparatus for electronic part
A mounting method and a mounting apparatus of an electronic part onto a substrate are provided, which enable inspection of a bond formed between an electronic part and a substrate when flip-chip bonding is executed by an ultrasonic wave and thermocompression bonding connecting method. The semiconductor chip has bumps which, when are compressed and subjected to ultrasonic vibration, enable formation of a connection between the semiconductor chip and a substrate conductor. The mounting apparatus is constructed so that the amount of compression of the bumps (sinking amounts of bumps) when a predetermined weight R and an ultrasonic vibration US are applied to the bumps for a predetermined time are monitored by the laser displacement meter, a judgment is made as to whether or not the sinking amounts respectively fall within desired ranges, and then a judgment is made as to whether the joint formed by the ultrasonic wave and thermocompression bonding connection utilizing the flip-chip bonding system is defective or non-defective.
Taiyo Yuden Co., Ltd.
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Tomonori Kazutaka
Fujii Suzuki