Packaged integrated circuit having stacked die and method for therefor
A packaged integrated circuit (IC) device includes a first IC die with a first inductor, a first layer of adhesive on a first major surface of the first IC die, an isolation layer over the first layer of adhesive, a second layer of adhesive on the isolation layer, a second IC die on the second layer of adhesive, and a second inductor in the second IC die aligned to communicate with the first inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die.
NXP USA, Inc.
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additional additional inventional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional additional inventional inventional inventional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional
Jinzhong Jianhong Burton Jesse Xingshou Jinmei Yadong Leo M. Fred T. Mariano Layson
Yao Wang Carpenter Pang Liu Wei Higgins, III Brauchler Ching, Jr.