Anova Law Group PLLC
Panel-level chip device and packaging method thereof
A panel-level chip device and a packaging method for forming the panel-level chip device are provided. The panel-level chip device includes a plurality of first bare chips disposed on a supporting base, and a plurality of first connection pillars. The panel-level chip device also includes a first encapsulation layer, and a first redistribution layer. The first redistribution layer includes a plurality of first redistribution elements and a plurality of second redistribution elements. Further, the panel-level chip device includes a solder ball group including a plurality of first solder balls. First connection pillars having a same electrical signal are electrically connected to each other by a first redistribution element. Each of remaining first connection pillars is electrically connected to one second redistribution element. The one second redistribution element is further electrically connected to a first solder ball of the plurality of first solder balls.
SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
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Tingting Kerui Jine Xiaohe Feng
Cui Xi Liu Li Qin