Muir Patent Law, PLLC
Stacked die package, system including the same, and method of manufacturing the same
A stacked die package includes a package substrate, a first die mounted on the package substrate and electrically connected to the package substrate, a second die electrically connected to the package substrate, and an interposer mounted on the package substrate and including a plurality of vertical electrical connection means electrically connecting the package substrate to the second die. At least part of the first die is disposed between the second die and the package substrate in a vertical direction.
SAMSUNG ELECTRONICS CO., LTD.
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Jeong Kyoum Jung Hwan
Kim Choi