Muncy, Geissler, Olds & Lowe, PLLC
Method of manufacturing a multilayer printed circuit board with a built-in electronic device
A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
Unitech Printed Circuit Board Corp.
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Kun-Chi Cheng-Hsien Shun-Yueh Hung-Min
Chen Chou Hsu Chen