Seed IP Law Group LLP
Compositions for use in chemical mechanical polishing
A polishing composition for a chemical mechanical polishing process includes abrasive particles, at least one chemical additive, and a non-aqueous solvent.
Taiwan Semiconductor Manufacturing Co., Ltd.
H C H B C
H01L C09G H01L B24B C09G
inventional inventional additional inventional inventional
Fang-I Hui-Chi Chih-Chieh Kei-Wei
Chih Huang Chang Chen