Haynes and Boone, L.L.P.
Pin soldering enhancement and method
 A multi-layer circuit board includes several metallic layers. Each metallic layer includes a metallic ring surrounding a component pin hole formed through each layer of the board. The ring is isolated from its respective metallic layer by a concentric gap formed of non-metallic material. A plurality of metallic traces interconnect each ring with its respective metallic layer. The traces extend radially outwardly from the ring and segment the gap. Each trace has a width of about 0.010 mils and a length of about 0.050 mils. 
Dell USA, L.P.
H H H H H H H H
H05K H05K H05K H05K H05K H05K H05K H05K
inventional inventional additional additional additional additional additional additional
Patricia David Scott
Herman Green