Burns, Doane, Swecker & Mathis, LLP
Wedge bonding head
The present invention provides a bonding head for a wedge wire bonding apparatus in which the bonding force of the transducer assembly, and also the clamping force of the wire clamping assembly are provided by permanent magnet motors including a coil formed as part of the transducer assembly and the wire clamping assembly respectively and with the coils located between magnets fixed to a bond head bracket member. The use of permanent magnet motors to provide the bonding and clamping forces results in apparatus in which the bonding and clamping forces can be controlled with high accuracy and reliability.
ASM Assembly Automation Ltd.
H B H H H H H H B B H H H H B H
H01L B23K H01L H01L H01L H01L H01L H01L B23K B23K H01L H01L H01L H01L B23K H01L
additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional inventional inventional
Chun Ho Gary Peter Chi Chung Siu Yan Wing Cheung
Ho Widdowson Mok Ho Ho