Sughrue Mion, PLLC
Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
A semiconductor device can include a substrate that has a surface. A via structure can extend through the substrate toward the surface of the substrate, where the via structure includes an upper surface. A pad structure can be on the surface of the substrate, where the pad structure can include a lower surface having at least one protrusion that is configured to protrude toward the upper surface of the via structure.
SAMSUNG ELECTRONICS CO., LTD.
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Atsushi Byung-Lyul Kwang-Jin Jin-Ho Ju-Il
Fujisaki Park Moon An Choi