McClure, Qualey & Rodack, LLP
Back chamber volume enlargement microphone package
A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.
FORTEMEDIA, INC.
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B81B H04R H04R H04R H04R B81B B81B B81B B81B B81B H04R
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Wen-Shan Hsin-Li Jien-Ming Nai-Hao Feng-Chia
Lin Lee Chen Kuo Hsu