Pillsbury Winthrop LLP
Device and method for manufacturing semiconductor
A heat exchange section (72) is provided in the middle of a circulation water path (58, 59) connecting between a temperature-controlled water tank (71) and a semiconductor manufacturing apparatus body (4) so as to perform a heat exchange with air of a clean room (3). The heat exchange section (72) is installed near an exit of an air circulation path (32) above a fan-filter unit (34) of the clean room as a temperature stabilized area off an atmosphere of the clean room (3). Additionally, as another method, a temperature of a chemical fluid from a chemical fluid tank (6) is controlled to be a temperature of the air in the clean room by a heat exchange section (61) provided in a location the same as above without using the temperature-controlled water so as to supply the chemical fluid to the semiconductor manufacturing apparatus body (4).
Taisei Corporation Tokyo Electron Limited
H F H H F
H01L F24F H01L H01L F24F
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Naoki Sadao Makoto Hiromu Osamu
Mori Kobayashi Yamamoto Ito Suenaga