Slater Matsil, LLP
Semiconductor device and method
A method and device are provided wherein a first semiconductor device and a via are encapsulated with an encapsulant. A redistribution layer connects the first semiconductor device to a second semiconductor device. In a particular embodiment the first semiconductor device is an integrated voltage regulator and the second semiconductor device is a logic device such as a central processing unit.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jeng-Shien Chen-Hua Chuei-Tang Chih-Yuan
Hsieh Yu Wang Chang