Slater Matsil, LLP
Conductive pad structure for hybrid bonding and methods of forming same
A representative device includes a patterned opening through a layer at a surface of a device die. A liner is disposed on sidewalls of the opening and the device die is patterned to extend the opening further into the device die. After patterning, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional inventional inventional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional inventional additional additional inventional additional additional additional additional additional
Yen-Chang Yeur-Luen Sheng-Chau Cheng-Hsien Shih Pei Chih-Hui
Chu Tu Chen Chou Chou Huang