Banner & Witcoff, Ltd.
Chemical mechanical polishing apparatus and a polishing cloth for a chemical mechanical polishing apparatus
 The present invention provides a CMP apparatus for minimizing the deterioration of the polishing performance and allows easy detection of the its useful operational limit. The CMP apparatus for polishing of the semiconductor substrate is provided with a dresser for removing abrasive grains which have fallen onto the polishing cloth. A particle remover is provided for easily removing abrasive grains at approximately the same time or at a different time as the dressing process. The polishing cloth includes a use limit indicator formed in a concavity of the cloth. Upon the exposure of the use limit indicator, the limit of the polishing cloth can be easily detected. 
Kabushiki Kaisha Toshiba
B B
B24B B24B
inventional inventional
Nobuhiro Tomoharu Satoshi
Kato Watanabe Murakami