Antonelli, Terry, Stout & Kraus
Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same
 A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method. 
Hitachi, Ltd.
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Hitoshi Isamu Makio Shinichiro Hiroshi
Oka Tanaka Watanabe Imabayashi Kikuchi