Hauptman Ham, LLP
Mechanisms for forming connectors with a molding compound for package on package
The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Chun-Hung Ming-Da Kai-Chiang Yu-Feng Han-Ping
Lin Cheng Wu Chen Pu