Hauptman Ham, LLP
Method of manufacturing a semiconductor device
A method of making a semiconductor device includes forming a first opening in an insulating layer, forming a second opening in the insulating layer, forming a third opening in the insulating layer and filling the first opening, the second opening and the third opening with a conductive material. The first opening has a width and a length. The second opening has a width less than the length of the first opening, and is electrically connected to the first opening. The third opening has a width less than the width of the second opening, and is electrically connected to the second opening.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Jian-Hong Chwei-Ching Shiou-Fan Hsin-Chun Yung-Huei
Lin Chiu Chen Chang Lee