Patterson + Sheridan LLP
Polishing system with local area rate control and oscillation mode
A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
APPLIED MATERIALS, INC.
B B H B H
B24B B24B H01L B24B H01L
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Hui Eric Chih Chung Jeonghoon Edwin C. Garrett Ho Yee Charles C. King Yi
Chen Lau Chou Oh Suarez Sin Garretson Heung