Rabin & Berdo, P.C.
Mold
A mold (1) according to an embodiment of the present invention is a mold which is formed by additive manufacturing. The mold includes: a heat medium channel (10) for a heat medium to flow through, the heat medium channel being provided inside the mold; a medium introduction port (4) at which the heat medium is to be introduced into the mold; a medium discharge port (5) at which the heat medium is to be discharged out of the mold; and a buffer layer (20) located between a mold surface (1a) and the heat medium channel. The buffer layer includes a low-melting percentage portion (21) having a lower melting percentage than does any portion inside the mold other than the buffer layer.
YAMAHA HATSUDOKI KABUSHIKI KAISHA
B F B B B B B F Y B B B B
B22F F02F B22C B22F B22F B33Y B22F F02F Y02P B22C B22F B22C B22F
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Ryodai Akihiro Yasumi Masahiro Shimpei
Ito Suzuki Yamamura Sano Takeda