Birch, Stewart, Kolasch & Birch, LLP
Light emitting device chip, light emitting device package
Disclosed are a light emitting device chip, a light emitting device package, and a lighting system. The light emitting device chip includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer interposed between the first and second conductive semiconductor layers; a transmittive layer on the light emitting structure; and a luminescence material layer on the transmittive layer, wherein the luminescence material layer includes a pattern, which does not expose the transmittive layer, partially exposes the transmittive layer or partially exposes the transmittive layer and the light emitting structure.
LG INNOTEK CO., LTD.
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additional additional additional inventional inventional
Kyoung Woo Yu Dong
Jo Kim