Slater Matsil, LLP
Package-on-package structure
A device comprises a bottom package mounted on a printed circuit board, wherein the bottom package comprises a plurality of first bumps formed between the bottom package and the printed circuit board, a first underfill layer formed between the printed circuit board and the bottom package, a semiconductor die mounted on the bottom package and a top package bonded on the bottom package, wherein the top package comprises a plurality of second bumps and the top package and the bottom package form a ladder shaped structure. The device further comprises a second underfill layer formed between the bottom package and the top package, wherein the second underfill layer is formed of a same material as the first underfill layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Ming-Da Han-Ping Chun-Hung Kai-Chiang Chun-Cheng Yu-Feng
Cheng Pu Lin Wu Lin Chen