Wayne & Ken, LLC
Method for synchronous electroplating filling of differential vias and electroplating device implementing same
A method for synchronous electroplating filling of differential vias and an electroplating device. Laser irradiation is adopted as an external energy field to assist synchronous electroplating filling of differential vias. A mask or digital maskless technology is used to precisely heat the vias with different positions and different sizes. The filling rate of different regions varies with the temperature difference, thereby realizing the synchronous electroplating filling of differential vias in one step. In the processes of immersion pre-wetting by the electroplating liquid and electroplating filling copper, the laser is used for preheating the wafer processed with vias. In these two steps, the laser needs to locally and precisely heat upper surfaces of the micro vias on the wafer through the mask corresponding to the micro vias on the wafer.
Guangdong University of Technology
C C C H C C H C H C C
C25D C25D C25D H01L C25D C25D H01L C25D H01L C25D C25D
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Jian Chengqiang Yun Xun Qiang Dachuang Xin
Gao Cui Chen Chen Liu Shi Chen