Ostrolenk, Faber, Gerb & Soffen, LLP
Conductive paste and circuit substrate formed by use of the paste
 A conductive paste including an organic binder having an acidic functional group; an inorganic powder containing glass and/or ceramic; a conductive metallic powder; and a mono-ol compound having a boiling point of about 178.degree. C. or higher. At least one of the inorganic powder and the conductive metallic powder contains a multivalent metal. The paste is useful in the formation of a fine and minute thick-film conductive pattern having strong adhesion to a substrate. 
Murata Manufacturing Co., Ltd.
H H
H01B H05K
inventional inventional
Shizuharu Michiaki Masahiro
Watanabe Iha Kubota