ScienBiziP, P.C.
Method of forming film for a component
A method of forming a film on a component includes providing a curing device. The curing device includes a grooved receiving die, a suction device, and a UV curing system. The suction device vacuum-lifts the component into the groove and a gap between the component and the groove is thus created. A vacuum is created in the gap and a UV curing glue is injected into the gap, the UV curing glue being selected from a monomer, an oligomer, and a photoinitiator. The UV curing glue is cured by the UV curing system and the component with a cured film is easily demolded.
HON HAI PRECISION INDUSTRY CO., LTD.
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B29C B29C B29C B29C B29C
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Han-Lung Feng-Yuen Hung-Lien Hung-Chun Jih-Chen Shun-Chi
Lee Dai Yeh Ma Liu Tseng