Fay Sharpe LLP
Bare die integration with printed components on flexible substrate without laser cut
Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed. By these operations, the electronic circuit component is held in a secure attachment by the fixed or cured bonding material, and circuit connections may be made.
PALO ALTO RESEARCH CENTER INCORPORATED
H H H H H H H H H H H H H H H H H H H H Y H H H H
H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K H05K H01L H05K H01L Y10T H01L H01L H01L H01L
additional inventional inventional additional additional inventional inventional additional inventional additional inventional additional additional additional additional inventional inventional inventional inventional additional additional additional additional inventional additional
Steven E. Tse Nga Brent S. Ping Gregory L. Janos
Ready Ng Krusor Mei Whiting Veres