Dentons US LLP
Adhesive composition
Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.
LG CHEM, LTD.
C C C C C C Y H Y C C Y
C08L C08L C08L C09J C09J C08L Y10T H01L Y10T C08L C08L Y10T
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So Young Seung Min Se Woo Jung Sup
Kim Lee Yang Shim