Blakely Sokoloff Taylor & Zafman LLP
Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.
Applied Materials, Inc.
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Yashaswini B. Fernando M. Shane C. Duy D. Hamid Brad L. Walter R. Chetan Douglas A. Xiaoping Tina
Pattar Silveira Nevil Nguyen Tavassoli Mays Merry Mahadeswaraswamy Buchberger Zhou Tsong