Method for concurrently forming holes for interconnection between different conductive layers and a substrate element or circuit element close to the substrate surface
 In a semiconductor device having conductive paths for electrically coupling a substrate surface with a second conductive/wiring layer, the substrate and the second conductive layer having a first conductive layer therebetween, a second insulating layer separating the first and the second conductive/wiring layers is replaced by a process for forming a protective covering over the patterned and etched first conductive layer. The second conductive layer will provide an electrical contact with the exposed conducting material in the contact holes without the critical patterning and etching process steps typically required when the second insulating layer is formed. 
Texas Instruments Inc.
H
H01L
inventional
Yoichi Hiroyuki
Miyai Kurino