Adam R. Stephenson, LTD.
Press-fit power module and related methods
Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
H H H H H H H H H H
H05K H01L H01L H05K H01L H01R H01L H01L H01R H05K
additional inventional inventional additional inventional inventional inventional inventional inventional inventional
Huibin Tiburcio Keunhyuk Jie
Chen Maldo Lee Chang