High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
 An interconnect structure formed of a flexible, multilayer dielectric material such as polyimide, having a support ring, connection points on the section inside the support ring for connecting one or more semiconductor chips, and connection points outside the support ring for connecting to a circuit board. Alignment templates are disclosed which align the semiconductor chip with the connection points. 
Digital Equipment Corporation
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Chung W. William C.
Ho Robinette, Jr.