Saile Ackerman LLC
Process of manufacturing a seed/AFM combination for a CPP GMR device
An improved seed/AFM structure is formed by first depositing a layer of tantalum on the lower shield. A NiCr layer is then deposited on the Ta followed by a layer of IrMn. The latter functions effectively as an AFM for thicknesses in the 40-80 Angstrom range, enabling a reduced shield-to-shield spacing.
Headway Technologies, Inc.
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Cherng Chyi Yue Min Yu-Hsia Ru-Ying Cheng T.
Han Liu Li Chen Tong Horng