Alston & Bird LLP
Fan-out antenna packaging structure and preparation method thereof
The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer comprising a first surface and an opposite second surface, wherein the plastic packaging material layer packages a periphery of the semiconductor chip; a metal connecting pole located in the plastic packaging material layer and running through the plastic packaging material layer from top to bottom; an antenna structure located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting pole; are distribution layer located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting pole; and a solder bump located on a surface, insulated from the plastic packaging material layer, of the redistribution layer, and electrically connected with the redistribution layer.
SJ Semiconductor (Jiangyin) Corporation
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Chengchung Chengtar Yenheng Jangshen Chihon
Lin Wu Chen Lin Ho