McAndrews, Hein & Malloy, Ltd.
Semiconductor package and manufacturing method thereof
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Amkor Technology Singapore Holding Pte. Ltd.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional inventional additional additional
Yung Woo Edwin J. Ludovico E. Jae Ung Robert Mi Kyeong Gi Jung Jin Seong
Lee Adlam Bancod Lee Lanzone Choi Kim Kim