Muir Patent Law, PLLC
Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same
A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.
SAMSUNG ELECTRONICS CO., LTD.
H B H H H H B H H H
H01L B24B H01L H01L H01L H01L B24B H01L H01L H01L
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Hyosan Sol Tae-Hong Jung-Min Yungjun Ingi Boun Chae Lyoung
Lee Han Kim Oh Kim Kim Yoon Kim