Oliff PLC
Semiconductor manufacturing device and method of manufacturing semiconductor chip
Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.
FUJI XEROX CO., LTD.
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Hirokazu Takeshi Tatsumi Kenji Eitoku Tomoki Saori
Matsuzaki Minamiru Inomoto Yamazaki Sonoda Umezawa Nishizaki