Ishimaru & Associates LLP
Integrated circuit package stacking system with redistribution and method of manufacture thereof
A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.
STATS ChipPAC Ltd.
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SeongMin Jong-Woo Sungmin
Lee Ha Song