Kenyon & Kenyon LLP
Integrated device
An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
KABUSHIKI KAISHA TOYOTA CHUO-KENKYUSHO TOHOKU UNIVERSITY TOYOTA JIDOSHA KABUSHIKI KAISHA
H H H H H H H B H B H H H H H H H B H H H H
H01L H01L H01L H01L H01L H01L H01L B81C H01L B81C H01L H01L H01L H01L H01L H01L H01L B81B H01L H01L H01L H01L
inventional inventional additional inventional additional additional inventional additional additional inventional additional inventional inventional additional inventional additional inventional inventional inventional inventional additional inventional
Ui Masayoshi Takahiro Hirofumi Mitsutoshi Shuji Yoshiyuki Hitoshi Yutaka Masanori
Yamaguchi Esashi Nakayama Funabashi Makihata Tanaka Hata Yamada Nonomura Muroyama