Maschoff Brennan
MEMS structure, cap substrate and method of fabricating the same
A micro electro mechanical system (MEMS) structure is provided, which includes a first substrate, a second substrate, a MEMS device and a hydrophobic semiconductor layer. The first substrate has a first portion. The second substrate is substantially parallel to the first substrate and has a second portion substantially aligned with the first portion. The MEMS device is between the first portion and the second portion. The hydrophobic semiconductor layer is made of germanium (Ge), silicon (Si) or a combination thereof on the first portion, the second portion or the first portion and the second portion and faces toward the MEMS device. A cap substrate for a MEMS device and a method of fabricating the same are also provided.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
B B B B B B
B81B B81C B81C B81C B81C B81B
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I-Shi Ren-Dou Yu-Jui Ting-Ying Jen-Hao
Wang Lee Chen Chien Liu