Rabin & Berdo, P.C.
Semiconductor device and method for manufacturing
A semiconductor device and method has trenches for raising reliability. An electrode pad, with a protective film and an interlayer film which form an opening on top, are on a substrate. A rewiring pattern in contact with the electrode pad at this opening is on top of the interlayer film. A trench is etched outside the rewiring pattern. A bump is formed on top of the rewiring pattern. The rewiring pattern and the trench are covered by a sealing film that that exposes the upper end of the bump. An external terminal is formed on top of the bump. The trenches increase contact area and adhesion between the covering film and the sealing film. The rougher the surface of the trench the better the adhesion, which makes the sealing film stick better and the semiconductor device more reliable.
OKI Semiconductor Co., Ltd.
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Hidekazu
Kikuchi