Haynes and Boone, LLP
Image sensor and method of fabricating same
Provided is a method of fabricating an image sensor device. The method includes providing a device substrate having a front side and a back side. The method includes forming first and second radiation-sensing regions in the device substrate, the first and second radiation-sensing regions being separated by an isolation structure. The method also includes forming a transparent layer over the back side of the device substrate. The method further includes forming an opening in the transparent layer, the opening being aligned with the isolation structure. The method also includes filling the opening with an opaque material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jeng-Shyan Jen-Cheng Dun-Nian Chun-Chieh Wen-De
Lin Liu Yaung Chuang Wang