Buchanan Ingersoll & Rooney PC
Holding structure of an electronic component and a method for holding the same
A holding structure of an electronic component includes a first resin mold formed by resin insert molding with a terminal. The first resin mold possesses a positioning portion for positioning the electronic component to be electrically connected to the terminal. The holding structure includes a second resin mold formed by resin insert molding with the terminal and surrounding the first resin mold and the electronic component. The electronic component has been positioned by the first resin mold and has been electrically connected to the terminal.
Toyota Jidosha Kabushiki Kaisha Aisin Seiki Kabushiki Kaisha
H
H05K
inventional
Masahiro Keiji Hidetoshi Hisayoshi Masayuki Naoki Hiroyoshi
Kimura Yasuda Yata Okuya Nishiguchi Mizuno Ito