McDermott Will & Emery LLP
Connection between a semiconductor chip and a circuit component with a large contact area
A semiconductor chip or wafer includes a passivation layer, a pad and a bump. The pad is exposed by an opening in the passivation layer. The bump is connected to the pad, wherein the area of the connection between the pad and the bump is larger than 30,000 μm2.
Megica Corporation
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Chiu-Ming Mou-Shiung Chien-Kang
Chou Lin Chou