Jianq Chyun IP Office
Pad structure, circuit carrier and integrated circuit chip
A pad structure is suitable for a circuit carrier or an integrated circuit chip. The pad structure includes an inner pad, a conductive via and an outer pad. The conductive via connects the inner pad. The outer pad connects the conductive via and further connects a conductive ball or a conductive bump. The outer diameter of the outer pad is greater than the outer diameter of the inner pad.
VIA Technologies, Inc.
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Yu-Kai Yeh-Chi
Chen Hsu