Slater Matsil, LLP
Package with tilted interface between device die and encapsulating material
A method includes forming a polymer layer covering a metal via in a wafer, grooving the wafer to form a trench, wherein the trench extends from a top surface of the polymer layer into the wafer, and performing a die-saw on the wafer to separate the wafer into a plurality of device dies. A kerf passes through the trench. One of the device dies is placed over a carrier. An encapsulating material is dispensed over and around the device die. The method further includes pressing and curing the encapsulating material. After the encapsulating material is cured, a sidewall of the polymer layer is tilted. A planarization is performed on the encapsulating material until the polymer layer and the metal via are exposed. A redistribution line is formed over and electrically coupled to the metal via.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional additional additional inventional additional additional additional inventional inventional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional inventional additional additional additional inventional inventional inventional additional additional
Hsin-Chieh Ching Fu Ming-Yen
Huang Chang Chiu