Harness, Dickey & Pierce, P.L.C.
Semiconductor module, socket for the same, and semiconductor module/socket assembly
A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.
Samsung Electronics Co., Ltd.
H
H05K
inventional
Jung-Hoon Seong-Chan Sun-Kyu Jae-Hoon Dong-Chun
Kim Han Hwang Choi Lee