JCIPRNET
Conductive pattern and integrated fan-out package having the same
A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped portion through the connection portion, and a width of the connection portion decreases along an extending direction from the teardrop shaped portion to the routing line. Furthermore, an integrated fan-out package including the above-mentioned conductive pattern is also provided.
Taiwan Semiconductor Manufacturing Co., Ltd.
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inventional additional additional additional additional additional additional additional inventional inventional additional inventional inventional additional inventional inventional additional additional inventional additional inventional additional additional additional inventional additional additional inventional inventional additional additional
Pei-Ti Tsung-Shu Ching-Fu Chien-Chia Ming-Yen Hsin-Chieh
Yu Lin Chang Chiu Chiu Huang