Fitzpatrick, Cella, Harper & Scinto
Method of manufacturing semiconductor device using precision polishing apparatus with detecting means
 In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out of an unloading unit as products. The defective articles are classified in a discriminating device in conformity with the kinds of defects and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct. 
Canon Kabushiki Kaisha
H B B H H
H01L B24B B24B H01L H01L
inventional inventional inventional inventional inventional
Mikichi Matsuomi Kazuo
Ban Nishimura Takahashi