Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor device having a wiring line with an end portion having rounded side surfaces and manufacturing method thereof
A semiconductor device includes a first to a third wiring-line. The first wiring-line is provided on a first layer in a first direction. The second wiring-line is provided on the first layer in the first direction. A first side surface of the second wiring-line faces the first wiring-line. A second side surface of the second wiring-line is opposite to the first side surface. The third wiring-line is provided on the first layer in the first direction, and faces the second side surface of the second wiring-line. An end portion of the first wiring-line projects further from an end portion of the second wiring-line in the first direction. The end portion of the second wiring-line projects further from an end portion of the third wiring-line in the first direction, and curves toward the third wiring-line. Alternatively, the end portion of the second wiring-line increases in width toward its edge portion.
TOSHIBA MEMORY CORPORATION
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Weiting Fumiharu Ryota
Wang Nakajima Aburada