Fish & Richardson P.C.
Physical vapor deposition with multi-point clamp
A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, a clamp configured to hold the substrate to the chuck, wherein the clamp is electrically conductive, and a plurality of conductive electrodes attached to the clamp, each electrode configured to compress when contacted by the substrate.
FUJIFILM Corporation
C H H H H H H C
C23C H01J H01J H01J H01J H01J H01J C23C
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Steve Mats G. Youming Jeffrey
Deming Ottosson Li Birkmeyer