Hauptman Ham, LLP
Polishing system
A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H H B H H H H
H01L H01L B24B H01L H01L H01L H01L
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Kun-Tai Min Hao Chen-Ming You-Hua Chih-Tsung Chih-Yuan Shih-Chi Soon-Kang Chin-Hsiang Chih-Jen
Wu Hong Huang Chou Lee Yang Lin Huang Chang Wu