Sughrue Mion, PLLC
Ultrasonic probe
Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.
SAMSUNG ELECTRONICS CO., LTD.
A A A
A61B A61B A61B
inventional inventional inventional
Youngil Baehyung Kyungil Jong Keun Seungheun
Kim Kim Cho Song Lee