Finnegan, Henderson, Farabow, Garrett and Dunner
Dopant film and methods of diffusing impurity into and manufacturing a semiconductor wafer
 A dopant film contains an organic binder, an inorganic binder and a compound of an impurity element for diffusion. Both surfaces of the dopant film are coated with adhesive. Releasable sheets sandwich the dopant film. The dopant film permits automated alternate stacking with semiconductor wafers, providing an advantage of labor saving. When the alternate stacking is automated, it will become hard for the wafer breakage to occur, sharply decreasing the rate of breakage. Furthermore, since the adhesion of a semiconductor wafer improves, the variation in the diffusion depth will decrease. 
Kabushiki Kaisha Toshiba
H Y H
H01L Y02P H01L
inventional additional inventional
Hideyoshi Kenji Masaburo
Ito Unetsubo Iwabuchi