Coudert Brothers LLP
Multilayer circuit structure build up method
Methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a generally vertical conduction pathway which passes at least partially through a multilayer circuit structure. The formed multilayer circuit structures can occupy less space than corresponding multilayer circuit structures with stacked via structures.
Fujitsu Limited
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Mark Yasuhito Michael Guang-Tzong Hunt Hang Wen-chou Vincent
McCormack Takahashi Lee Jiang Wang