Ishimaru & Associates LLP
Integrated circuit packaging system with interposer
An integrated circuit packaging system comprising: a base package substrate; a first integrated circuit die attached over the base package substrate; and an interposer having a recessed edge and a corner that extends to a singulation edge, the interposer mounted over the first integrated circuit die, the interposer having a recess gap between the recessed edge and the singulation edge.
Stats Chippac Ltd.
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SeongMin WonJun Sungmin
Lee Ko Song