Cushman, Darby & Cushman
Semiconductor element sealing structure
 A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate. 
Nippondenso Co., Ltd.
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Toshio Junji Junji Osamu Hitoshi Ryoichi
Sonobe Ishikawa Sugiura Takenaka Ito Narita