Birch, Stewart, Kolasch & Birch, LLP
Method for forming semiconductor device structure
A method for forming a semiconductor device structure is provided. The method includes forming a target layer over a substrate and forming a seed layer over the target layer. The method includes forming a hard mask layer over the seed layer, and the hard mask layer includes an opening to expose a portion of the seed layer. The method includes forming a conductive layer in the opening, and the conductive layer is selectively formed on the portion of the seed layer. The method includes etching a portion of the target layer by using the conductive layer as a mask.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
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Chia-Hao Shih-Wei Wen-Cheng
Chang Wang Luo