Birch, Stewart, Kolasch & Birch, LLP
Package structure with dummy feature in passivation layer
Package structures are provided. The package structure includes an integrated circuit die. The package structure also includes a package layer surrounding the integrated circuit die. There is an interface between the integrated circuit die and the package layer. The package structure further includes a redistribution structure below the integrated circuit die and the package layer. The redistribution structure includes active conductive lines electrically connected to the integrated circuit die. The redistribution structure also includes a dummy conductive line between the active conductive lines. The dummy conductive line extends across the interface.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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additional inventional additional additional additional inventional additional inventional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional
Hsien-Wei Jie
Chen Chen