Stacked integrated circuit package-in-package system with recessed spacer
A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.
Stats Chippac Ltd.
H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional
DongSam Sungmin Joungin Choong Bin SeongMin Jaehyun
Park Song Yang Yim Lee Lim