Fish & Richardson P.C.
Power module
A power module includes a substrate having first and second main substrate surfaces; a semiconductor device disposed on the first main substrate surface, and having a first main surface on which a first main electrode is formed, and a second main surface on which a second main electrode in contact with the first main substrate surface is formed; a heat conduction portion disposed on the first main substrate surface in a residual region of a region on which the semiconductor device is disposed; and an upper cooling portion disposed on the heat conduction portion.
Rohm Co., Ltd.
H H H
H01L H01L H01L
inventional additional additional
Takukazu Keiji Masao
Otsuka Okumura Saito