Dinsmore & Shohl LLP
Method of forming light emitting diode with high-silica substrate
A method of making an LED device and an LED device using a high-silica, fully-sintered glass substrate is provided. The high-silica substrate is at least 99% silica and is thin, such as less than 200 μm in thickness. A phosphor containing layer is deposited on to the substrate and is laser sintered on the substrate such that a portion of the sintered phosphor layer embeds in the material of the substrate.
Corning Incorporated
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Xinghua William Judson Hisham Daniel Warren Archit Brent Karl
Li Ready, IV Menkara Hawtof Lal Wagner