Sawyer Law Group LLP
Method and system for providing a package for decapsulating a chip-scale package
 A system and method for decapsulating a chip-scale package having a first width are disclosed. The method and system include coupling the chip-scale package to a substantially rigid receptacle. The receptacle has a second width and a periphery. The second width is larger than the first width. The chip-scale package does not extend to the periphery of the receptacle. The method and system further include holding the receptacle in proximity to the periphery and decapsulating the chip-scale package. 
Advanced Micro Devices, Inc.
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inventional inventional additional additional additional
Ranjit Xia
Gannamani Li