Hauptman Ham, LLP
Method and system for manufacturing a semiconductor device
A method of making a three-dimensional (3D) integrated circuit (IC) includes performing a series of simulations of operations of a first die of the 3DIC in response to a corresponding series of input vectors and at least one environment temperature. The method also includes adjusting, for at least one simulation in the series of simulations, the at least one environment temperature based on an operational temperature profile of a second die of the 3DIC.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Yi-Kan Chi-Wen Ya Yun Hui Yu Jui-Feng
Cheng Chang Liu Lee Kuan