Haynes and Boone, LLP
System and method for lithography exposure with correction of overlay shift induced by mask heating
A method of exposing a wafer substrate includes receiving an integrated circuit (IC) design layout defining a pattern; determining a temperature profile of a mask based on the IC design layout, the pattern being formed on the mask; calculating a pre-corrected overlay shift for the mask based on the calculated temperature profile; and exposing a resist layer coated on a substrate using the mask with overlay compensation based on the pre-corrected overlay shift.
Taiwan Semiconductor Manufacturing Company, Ltd.
G G G G G
G03F G03F G03F G03F G03F
inventional inventional inventional inventional inventional
Chun-Jen Ming-Ho Jim Yung-Hsiang Jun-Hua Dong-Hsu
Chen Tsai Liang Chen Chen Cheng