Antonelli, Terry, Stout & Kraus
Photo-setting resist composition, a process for producing a printed circuit board by using the composition, and a printed circuit board obtained by using the composition
 A printed circuit board has a resist layer made from a photo-setting resist composition containing: PA0 (A) a polyfunctional unsaturated compound which is solid at room temperature, PA0 (B) a polyfunctional unsaturated compound which is liquid at room temperature, PA0 (C) a photopolymerization initiator, PA0 (D) an epoxy resin, PA0 (E) at least one member selected from the group consisting of: PA1 (i) a curing agent for the epoxy resin and either melamine or the derivative thereof, and PA1 (ii) a compound having a 2,4-diamino-s-triazine ring and an imidazole ring in the molecule. 
Hitachi, Ltd.
Y C G H C
Y10S C08G G03F H05K C08F
additional inventional inventional inventional inventional
Hiroshi Reiko Shigeru Shinichiro Yukihiro Hitoshi Makio Isamu
Kikuchi Yano Fujita Imabayashi Taniguchi Oka Watanabe Tanaka