Muncy, Geissler, Olds & Lowe, P.C.
Method for directly attaching dielectric to circuit board with embedded electronic devices
A method for directly attaching dielectric to a circuit board with embedded electronic devices is provided. That is, a plurality of through holes are produced before embedding an electronic device, wherein plural through holes are corresponding to a plurality of electrodes of the electronic device. So that the plural electrodes of the electronic device is accurately positioned with the through holes if the electronic device is being embedded. On the other hand, since the first dielectric layer is adhesive, the electronic device is directly stuck on the first dielectric layer in order to save cost of adhesive material or metal conductive paste in prior arts.
UNITECH PRINTED CIRCUIT BOARD CORP.
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Shun Yueh Kun Chi Hung Min Ming Yi
Hsu Chen Chen Yeh