Muir Patent Law PLLC
Semiconductor package
A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.
SAMSUNG ELECTRONICS CO., LTD.
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Kyoung Sei Jung Woo Jin Gyu Tae Hun
Choi Kim Kim Kim