Slater Matsil, LLP
Interconnect structure and method
A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional additional additional additional inventional additional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional inventional additional inventional inventional
Chen-Yuan Jun-Yi Chih-Chien Po-Cheng Tze-Liang Chia-Cheng Kai-Shiang Yao-Jen Chung-Chi
Kao Ruan Chi Shih Lee Chou Kuo Chang Ko