Heat dissipation module adapted to an electronic device and electronic device therewith
A heat dissipation module includes a fan and a thermal fin portion. The fan includes a fan body, a plurality of blade units and a plurality of blade extensions. The blade units are connected to the fan body. The blade extensions protrude from the blade units, respectively. A first surface is formed on a side of each of the blade extensions. A distance between the first surface and an axis of the fan body is increasing along an inflow direction. The thermal fin portion includes a plurality of fin units and a plurality of fin extensions respectively protruding from the fin units. A second surface is formed on a side facing the fan extension of each of the fin extension. An identical gap is formed between at least one portion of the first surface and at least one portion of the second surface.
Wistron Corporation
F H G F
F28D H05K G06F F28D
additional inventional inventional inventional
Meng-Ting Wei-Hsing Yao-Lung Chieu-Tu
Chiang Wang Tsai Cheng