Slater Matsil, LLP
Package structure and method of forming the same
An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional inventional additional inventional inventional inventional additional additional additional additional additional additional additional inventional inventional additional additional additional inventional inventional additional additional additional inventional additional additional inventional inventional additional additional additional
Ching Fu Hsi-Kuei Chih-Kang Hsin-Chieh
Chang Cheng Han Huang