Posz & Bethards, PLC
Pressure sensor
A pressure sensor includes a sensor element, and a resin package member that holds the sensor element. The sensor element is constructed by a semiconductor, and is capable of externally outputting an electric signal in accordance with strain generated when force is applied thereto. The sensor element is directly adhered to the package member via an adhesive layer that has Young's modulus in a range between 2.45×103 Pa and 2.06×104 Pa. Further the adhesive layer has a thickness equal to or more than 110 μm. Accordingly, the pressure sensor effectively restricts a variation in a sensor characteristic due to a thermal change.
Denso Corporation
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Yasutoshi Seiichiro
Suzuki Ishio