Duane Morris LLP
Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
A method for bonding integrated circuit chips and other devices to a liquid crystal display panel. The method involves using a single anisotropic conductive film that is sized to bond at least one integrated circuit chip and at least one other device, such as a flexible printed circuit board, a tape carrier package and a chip-on-film, to the liquid crystal display panel.
AU Optronics Corporation
H H H H H H H H G H H H H H H
H01L H05K H01L H01L H05K H01L H01L H01L G02F H01L H01L H01L H05K H01L H01L
additional additional additional additional inventional inventional additional additional inventional additional additional inventional additional additional additional
Ping-Chin Hui-Chang
Cheng Chen