Foley & Lardner LLP
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same
A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting layer are formed on a surface of the first and second carrier boards respectively. At least one first semiconductor component and at least one second semiconductor component are disposed on the first and second protecting layers and accommodated in the first and second through holes respectively. A dielectric layer is laminated between the surfaces of the first and second carrier boards without the protecting layers formed thereon. Thus, a modularized package structure with reduced space waste is formed.
Phoenix Precision Technology Corporation
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Lin-Yin Chia-Wei Chung-Cheng Zao-Kuo
Wong Chang Lien Lai