Slater Matsil, LLP
Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of contact pads disposed over the substrate. The contact pads may be arranged in a ball grid array (BGA), and the may include a plurality of corners. A metal dam is disposed around each of the plurality of corners, such as corners of the BGA.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional additional additional additional inventional additional additional inventional inventional inventional inventional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional inventional additional inventional additional inventional inventional additional inventional additional additional inventional inventional inventional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional inventional additional additional inventional inventional additional additional inventional inventional additional additional additional additional inventional inventional inventional additional additional inventional inventional additional inventional additional inventional inventional additional additional inventional additional inventional inventional additional inventional additional inventional additional additional additional additional inventional
Hung-Jui Kai-Chiang Chun-Lin Yu-Feng
Kou Wu Lu Chen