Foley & Lardner LLP
Semiconductor device package and method for manufacturing the same
A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Chun Chen Cheng-Lin Chih-Cheng Yuanhao
Chen Ho Lee Yu