Wolf, Greenfield & Sacks, P.C.
Semiconductor devices and methods for enhancing signal integrity of an interface provided by a semiconductor device
A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
MediaTek Inc.
H H H H H H G H H H
H01L H05K H01L H01L H05K H01L G06F H01L H05K H01L
additional inventional additional inventional inventional inventional inventional additional additional inventional
Shang-Pin Hung-Chuan Duen-Yi
Chen Chen Ho