Sughrue Mion, PLLC
Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same
The present invention relates to a resin composition for forming an insulating resin layer for optical semiconductor element housing package having a concave portion in which a metal lead frame and an optical semiconductor element mounted thereon are housed, in which the resin composition includes the following ingredients (A) to (D), and the ingredients (C) and (D) are contained in a blend ratio (C)/(D) of 0.3 to 3.0 as a weight ratio thereof: (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a white pigment; and (D) an inorganic filler.
Nitto Denko Corporation
H H C C H H C
H01L H01L C08G C08G H01L H01L C08L
additional additional inventional inventional additional additional inventional
Hisataka Takashi Takamitsu
Ito Taniguchi Ota