Wire bond wires for interference shielding
Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.
Invensas Corporation
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additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional inventional inventional inventional additional inventional inventional additional additional inventional inventional additional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional
Wael Abiola Willmar Zhuowen Ashok S.
Zohni Awujoola Subido Sun Prabhu