Willian Brinks Hofer Gilson & Lione
Metal film deposition apparatus and metal film deposition method
 On a semiconductor substrate, chips to be products and alignment chips located at a portion a part thereof is left out from a peripheral part of the semiconductor substrate are formed. Contact holes and alignment marks are formed at the chips to be products and the alignment chips. Covering the alignment chips with alignment mark cover parts of a substrate holder, a material for metal wiring is deposited on the semiconductor substrate to form a metal film on the substrate. A mask pattern is formed on the metal film using the alignment marks of the alignment chips on which the metal film is not formed. 
Matsushita Electric Industrial Co., Ltd.
H Y H H H H C C H
H01L Y10S H01L H01L H01L H01L C23C C23C H01L
additional additional inventional inventional inventional additional inventional inventional inventional
Kazuhiko Toyokazu Mikio Mitsuru
Hashimoto Fujii Nishio Sekiguchi