Sughrue Mion, PLLC
Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin.
Nitto Denko Corporation
C H H
C08K H01L H01L
inventional additional additional
Shinjiro Hisataka Shinya Kazuhiro
Uenishi Ito Ota Fuke