Foley & Lardner LLP
Semiconductor package device having glass transition temperature greater than binding layer temperature
A micro-electromechanical systems (MEMS) package structure includes: (1) a circuit layer; (2) a MEMS die with an active surface, wherein the active surface faces the circuit layer; (3) a conductive pillar adjacent to the MEMS die; and (4) a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Kuang-Hsiung Yu-Hsuan Wun-Jheng Sheng-Ming Yu-Ying
Chen Tsai Syu Wang Lee