Muncy, Geissler, Olds & Lowe, P.C.
Semiconductor device with diced semiconductor chips and method for manufacturing the same
The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor wafer, a plurality of semiconductor chips, and a plurality of first protection dams. The semiconductor wafer has a plurality of functional regions separated by a plurality of vertical streets and a plurality of horizontal streets. The semiconductor chips are mounted on the functional regions, respectively. The first protection dams are disposed on the vertical streets and the horizontal streets and spaced from the semiconductor chips. A height of the first protection dam is not less than a height of the semiconductor chip.
NANYA TECHNOLOGY CORPORATION
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Ching-Hung Hsih-Yang
Chang Chiu