Duane Morris LLP
Wet cleaning method to eliminate copper corrosion
A method for cleaning semiconductor substrates includes a DI water clean operation that uses a spin speed no greater than 350 rpm. The cleaning method may include additional cleaning operations such as an organic clean, an aqueous chemical clean or a DI water/ozone clean. The cleaning method may be used to clean substrates after the conclusion of an etching procedure which exposes a single film between a Cu-containing conductive material and the environment. The spin speed of the DI water clean operation prevents copper corrosion due to breakdown of the film that separates the Cu-containing conductive material from the environment.
Taiwan Semiconductor Manufacturing Company
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additional inventional inventional
Yih-Ann Chao-Cheng Chun-Li Hun-Jan Yi-Chen
Lin Chen Chou Tao Huang