Kamrath IP Lawfirm, P.A.
Semiconductor construction, semiconductor unit, and manufacturing method thereof
A semiconductor structure and its manufacturing method including multiple steps are provided. First, a patterned circuit board having a substrate and a patterned circuit layer is provided. The substrate includes a first surface, a second surface, at least one connecting channel, and at least one conductive through hole, wherein patterned circuit layer is disposed on the first surface, a second surface, and the inside wall of the conductive through hole. Then, the patterned circuit board is disposed on a carrier, and the patterned circuit layer disposed on one of the first surface and the second surface is touched with the carrier. Then, a filling process is applied. A filling material flows to the conductive through hole via the first surface or the second surface from the connecting channel. Then, a package material is provided to produce a semiconductor structure.
Unistars
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H01L H01L H01L H01L H01L
additional additional additional additional inventional
Tien-hao Yi-chun Shang-Yi
Huang Wu Wu