Duane Morris LLP
Semiconductor fin device and method for forming the same using high tilt angle implant
An angled implantation process is used in implanting semiconductor fins of a semiconductor device and provides for covering some but not necessarily all of semiconductor fins of a first type with patterned photoresist, and implanting using an implant angle such that all semiconductor fins of a second type are implanted and none of the semiconductor fins of the first type, are implanted. A higher tilt or implant angle is achieved due to the reduced portions of patterned photoresist, that are used.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Shao-Ming Chang-Yun
Yu Chang