Charge damage protection on an interposer for a stacked die assembly
An apparatus relating generally to an interposer is disclosed. In such an apparatus, the interposer has a plurality of conductors and a plurality of charge attracting structures. The plurality of charge attracting structures are to protect at least one integrated circuit die to be coupled to the interposer to provide a stacked die. The plurality of conductors include a plurality of through-substrate vias.
XILINX, INC.
H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional inventional inventional inventional additional inventional inventional inventional inventional inventional inventional inventional
Qi Xiao-Yu Cinti X. Glenn
Xiang Li Chen O'Rourke