Dellett and Walters
Heat dissipation module for a BGA IC
An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
Walsin Advanced Electronics Ltd.
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Yi-Hsiang Kuo-Yuan Wen-Chun
Pan Lee Liu