Slater & Matsil, L.L.P.
Method for fabricating microlens with lithographic process
A method of fabricating microlens devices. The method includes filling the bond pad areas and scribe lines, or other areas, to improve the topography of the semiconductor wafer surface. A microlens material is applied to the surface after the bond pad areas and scribe lines have been filled. Because of the improved topography, the thickness of the microlens material is more uniform, thereby facilitating the formation of uniformly shaped microlenses.
Taiwan Semiconductor Manufacturing Company, Ltd.
G H G G
G02B H01L G02B G02B
inventional inventional inventional inventional
Chih-Kung Te-Fu Chiung-Yuan Chin-Chen Hung-Jen Fu-Tien
Chang Tseng Chang Kuo Hsu Weng