Nixon Peabody LLP
Method of making current sensors
The invention relates to a method for the production of current sensors which comprise a plastic housing made in an IC technology. The key steps are to mount on a leadframe and wire bond semiconductor chips having Hall sensors, to place the leadframe in an injection mold, to close the injection mold with a first mold insert and to inject plastic material, wherein each semiconductor chip is packed into an intermediate casing including a flat surface having alignment structures. Then the injection mold is opened and a current conductor section is placed on the flat surface of each intermediate casing, the current conductor section having counter structures matching the alignment structures so that it is automatically aligned and held. Then the injection mold is closed with a second mold insert and plastic material injected to form the final housing of the current sensors. It is also possible to use two different injection molds.
Melexis Technologies SA
H H B H G G H H H B H H H H H H
H01L H01L B29C H01L G01R G01R H01L H01L H01L B29C H01L H01L H01L H01L H01L H01L
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Robert Jian
Racz Chen