Wilson & Ham
Apparatus and method for cleaning surfaces of semiconductor wafers using ozone
An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.
Y B B
Y10S B08B B08B
additional additional inventional
Jungyup In Kwon Yong Bae
Kim Jeong Kim