Finnegan, Henderson, Farabow, Garrett & Dunner
Semiconductor device
 A semiconductor device includes a rectangular semiconductor chip, first to fourth memory cell arrays formed on the semiconductor chip, and first to fourth bonding pads formed on the peripheral part of the semiconductor chip. In this semiconductor device in particular, first bonding pads are disposed along a first long side of the semiconductor chip while second bonding pads are disposed along a second long side of the chip. The first and second memory cell arrays are disposed between the first bonding pads and the second long side while the third and fourth memory cell arrays are disposed between the first long side and the second pads. 
Kabushiki Kaisha Toshiba
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Fumio Shigeyoshi Mitsugi
Horiguchi Watanabe Oguara