Re-workable moisture curable hot melt adhesive composition, methods of using the same, and articles including the same
Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.
H.B. Fuller Company
B H C C B C H C B C C C C C C B C C
B32B H05K C08G C08G B32B C08G H05K C09J B32B C08G C08G C08G C08G C09J C08G B32B C08G C08G
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Sudipto Anthony J. Henry P.
Das Ostlund Meyer