Composite plating apparatus
 A composite plating apparatus includes a plating tank for receiving therein a composite plating solution containing water-insoluble particles or fibers and a reservoir disposed adjacent the plating tank through an overflow weir, preferably in a common housing, the plating solution flowing into the reservoir in an overflow manner. A pump is disposed within the reservoir having a suction port for drawing the solution in the reservoir and a discharge port for pumping the solution. A conduit connected to the pump discharge port extends therefrom over the bottom of the plating tank through the overflow weir and includes a plurality of orifices. The plating solution is circulated by causing the solution to flow over the weir from the plating tank to the reservoir, pumping the solution to the conduit, and injecting the solution into the tank through the orifices to uniformly agitate the solution. 
C. Uyemura & Co., Ltd.
C C C
C23C C23C C25D
inventional inventional inventional
Tadashi Sowjun Masahiro Takayuki
Chiba Matsumura Saito Nakamura