Litron Patent & Trademark Office
Lead frame and the method to fabricate thereof
A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.
CYNTEC CO., LTD.
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Jih-Hsu You Chang Chia Pei Lang-Yi
Yeh Tseng Chou Chiang