Lee & Morse, P.C.
Semiconductor package
Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower structure under the semiconductor chip, the lower structure having a second thermal expansion coefficient of less than or equal to the first thermal expansion coefficient.
SAMSUNG ELECTRONICS CO., LTD.
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Seok-Won Bo-Na Kyoung-Sei Dong-Han Sa-Yoon Eun-Seok
Lee Baek Choi Kim Kang Cho