Cleaning formulations
A composition and method for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes water, a water-miscible organic solvent, an amine compound, an organic acid, and a fluoride ion source. The compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials.
AIR PRODUCTS AND CHEMICALS, INC.
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Madhukar Bhaskara Yi Chia Seiji Aiping Wen Dar Gautam
Rao Lee Inaoka Wu Liu Banerjee