Foley & Lardner LLP
Semiconductor substrate and manufacturing method thereof
A semiconductor substrate includes an insulating layer and a conductive circuit layer embedded at a surface of the insulating layer. The conductive circuit layer includes a first portion and a second portion. The first portion includes a bonding pad and one portion of a conductive trace, and the second portion includes another portion of the conductive trace. An upper surface of the first portion is not coplanar with an upper surface of the second portion. A semiconductor packaging structure includes the semiconductor substrate.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Yu-Ying Sheng-Ming Tien-Szu Chun-Che Kuang-Hsiung
Lee Wang Chen Lee Chen