Wolf, Greenfield & Sacks, P.C.
Semiconductor package structure and method for forming the same
A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.
MediaTek Inc.
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Hung-Chuan Po-Hao Yi-Jou
Chen Chang Lin