Tarolli, Sundheim, Covell & Tummino LLP
Wiring substrate
A wiring substrate includes a first insulation layer, a wiring layer formed on an upper surface of the first insulation layer, a barrier film that covers the upper surface of the first insulation layer, an upper surface of the wiring layer, and side surfaces of the wiring layer, and a second insulation layer that covers an upper surface of the barrier film and side surfaces of the barrier film. The barrier film is an alumina film containing carbon atoms, and the alumina film has a carbon atom content rate that is in the range of 0.2 atomic % to 3.6 atomic %.
Shinko Electric Industries Co., Ltd.
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Kazuhiro Tomoo
Fujita Yamasaki