Alston & Bird LLP
Packaging device for integrated power supply system and packaging method thereof
The present disclosure provides a packaging device for an integrated power supply system and a packaging method thereof. The packaging device comprises: a power consumption system die and a power supply system die below the power consumption system die; the power supply system die comprises an active module, a passive module and a rewiring layer, wherein the active module and the reactive module are molded, and the rewiring layer is located above the molded active module and passive module, to connect the active module and the passive module, and a plurality of power supply tracks are disposed in the rewiring layer to abut the power consumption system die; the power consumption system die is abutted with the plurality of power supply tracks; and an external power source supplies power to the power consumption system die through the power supply system die.
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
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inventional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional inventional additional inventional additional additional inventional inventional additional additional inventional inventional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional
Chengchung Jangshen Chihhung Qifeng
Lin Lin Ho Cai