Muir Patent Law, PLLC
Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the same
Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a first chuck engaged with the vacuum pumps and adsorbing a first substrate at vacuum pressure of the vacuum pumps, and a pushing unit penetrating a center of the first chuck and pushing the first substrate away from the first chuck. The first chuck comprises adsorption sectors providing different vacuum pressures in an azimuth direction to the first substrate.
SAMSUNG ELECTRONICS CO., LTD.
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Jaegeun Seokho Taeyeong SungHyup Jun Hyung
Kim Kim Kim Kim Kim