Leydig, Voit & Mayer
Lead frame for semiconductor device
 A lead frame for semiconductor devices which does not require tie bar cutting in the manufacture of semiconductor devices includes a base lead frame having no tie bars and a dummy lead frame having dummy leads filling gaps between outer lead portions of the leads when the dummy lead frame is mounted on the base lead frame. Instead of tie bars, the dummy leads reinforce the leads and also stop molten sealing resin from flowing into the gaps between the outer lead portions during resin molding. 
Mitsubishi Denki Kabushiki Kaisha
H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional inventional additional additional additional additional additional inventional additional additional additional
Kazunari Yasuhito
Michii Suzuki