Lee & Morse, P.C.
Anisotropic conductive film forming composition
Disclosed herein is an anisotropic conductive film forming composition, including at least one polymer comprising a polymer containing a silane group; at least one polymerizable compound; and a plurality of conductive particles. The at least one polymer may include an elastomeric polymer and a filler polymer, at least one of which contains a silane group. The at least one polymerizable compound may include a cross-linking agent and/or a polymerization reaction enhancer. The cross-linking agent may also have a silane group. In addition, the film forming composition may include a solvent. The film forming composition is advantageous in that the resulting anisotropic conductive film exhibits enhanced peel and adhesive strength and low electrical contact resistance.
Cheil Industries, Inc.
H C
H05K C08K
additional inventional
Hyoun Young Ki Sung Jung Sik Tu Won Jeong Ku Jong Hwa
Kim Jung Choi Chang Kang Lee