Brooks Kushman P.C.
Monitoring device, monitoring method, and device for cutting and grinding display substrate
The present disclosure provides a monitoring device, a monitoring method and a device for cutting a display substrate. The monitoring device includes an infrared temperature detection module configured to detect a temperature at a contacting position where a cutter wheel is in contact with the display substrate when cutting the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position; and a processing module configured to generate, based on the temperature parameter, a corresponding control parameter for controlling the process of cutting the display substrate.
HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. BOE TECHNOLOGY GROUP CO., LTD.
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Jian Xiaopan Gui Junwei Haibo Weimin Jia Yangkun
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