Rothwell, Figg, Ernst & Manbeck, P.C.
Dicing film and dicing die-bonding film
The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
LG CHEM, LTD.
H C H H H H H C C C C C H H H C H H H H H
H01L C09D H01L H01L H01L H01L H01L C09J C09J C09J C08L C09J H01L H01L H01L C09J H01L H01L H01L H01L H01L
additional inventional additional inventional additional additional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional
Kwang Joo Jung Hak Hee Jung Se Ra Jung Ho Seung Hee Young Kook
Lee Kim Kim Kim Jo Nam Kim