David and Raymond Patent Firm
Camera module and manufacturing method thereof
A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
NINGBO SUNNY OPOTECH CO., LTD.
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H04N B29L H01L B29C H01L H04N H04N B29L
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Jiawei Li Zhewen Qimin Zongchun Bojie Zhen Chenxiang
Chen Liu Mei Mei Yang Zhao Huang Xu