Thomas, Kayden, Horstmeyer & Risley, LLP
Electroless copper plating solutions and methods of use thereof
Electroless copper plating solutions and methods of use thereof are disclosed. A representative electroless copper plating solution includes a reducing agent that is a source of hypophosphite ions and at least one accelerator compound that accelerates the rate of copper deposition.
Georgia Tech Research Corporation
C
C23C
inventional
Jun Paul A.
Li Kohl