WPAT, P.C., Intellectual Property Attorneys
Method for manufacturing semiconductor structure
A method for manufacturing a semiconductor structure includes following operations. A sacrificial layer is formed over the conductive layer, wherein the sacrificial layer includes a first sacrificial portion over the first conductive portion, and a second sacrificial portion over the second conductive portion, and a first thickness of the first sacrificial portion is larger than a second thickness of the second sacrificial portion. The first sacrificial portion and the second sacrificial portion of the sacrificial layer, and the second conductive portion of the conductive layer are removed, with at least a portion of the first conductive portion remaining over the bottom of the trench.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Yu-Hsiang Chun-Wen Chih-Wei Ya-Huei Hung-Yi Li-Wei Ching-Hwanq
Liao Nieh Chang Li Huang Chu Su