McClure, Qualey & Rodack, LLP
Package structure and method for forming the same
A package structure is provided. The package structure includes a first redistribution structure and an interposer over the first redistribution structure. The package structure also includes a molding compound layer surrounding the interposer, and a second redistribution structure over the interposer. The molding compound layer is between the first redistribution structure and the second redistribution structure. The package structure further includes a first semiconductor die and a second semiconductor die over the second redistribution structure.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chin-Chuan Szu-Wei
Chang Lu