Mills & Onello, LLP
Connection structures capable of reducing distortion of signal
Provided is a connection structure capable of reducing the distortion of a signal. The connection structure includes a first interconnection layer including a plurality of signal lines configured to transmit an operating signal generated by a driver to a receiver; a second interconnection layer including at least one ground line configured to connect the driver and ground terminals of the receiver; and an insulating layer interposed between the first and second interconnection layers to electrically insulate the signal lines from the ground line.
Samsung Electronics Co., Ltd.
H H H H H H H G H H
H05K H01R H05K H05K H05K H01R H05K G02F H01R H05K
additional additional additional additional inventional additional additional inventional additional additional
Jung-Man Se-ll Seung-Bae
Lim Kim Lee