Vierra Magen Marcus LLP
Merged power pad for improving integrated circuit power delivery
An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided to improve integrated circuit power delivery. The integrated circuit package includes a first die having a plurality of pads formed in the first die and exposed on a top surface of the first die, at least one post on the first die, and a substrate including one or more redistribution layers. Each post in the at least one post spans at least two pads on the first die utilized for power distribution, and the first die is connected to the substrate via the at least one post.
Futurewei Technologies, Inc.
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Wangsheng Shiqun Jun Shuangfu Hong Jinghua Hongying Hongquan Liming
Xie Gu Xia Wang Liu Zhu Zhang Sun Zhao