Chip Law Group
Solid-state imaging element, and electronic device
The present disclosure relates to a solid-state imaging element configured to inhibit an adverse effect, which is attributable to a light shielding film formed for disposing an OPB region, on the formation of a constituent other than the light shielding film of the solid-state imaging element, and an electronic device. According to a first aspect of the present disclosure, there is provided a solid-state imaging element, including: an effective pixel region in which a large number of pixels are vertically and horizontally arranged; and an OPB region formed by coating pixels around the effective pixel region with a light shielding film. Corners on at least one of an outer circumferential side and an inner circumferential side of the OPB region are formed into an arc shape. The present disclosure can be applied to, for example, a back-surface irradiation type CMOS image sensor.
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
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H01L H01L H01L H01L H04N H01L
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Takuya
Nakano