Oblon, Spivak, McClelland, Maier & Neustadt
Room temperature curing composition
 The present room temperature curing composition comprises an organopolysilethylenesiloxane represented by the following general formula: ##STR1## wherein R.sup.1 to R.sup.4 each represent an alkyl having up to 8 carbon atoms or a phenyl group and n is an integer of 10 or above, and an organosilane or an organosiloxane having two or more hydrolyzable groups such as alkoxy groups in the molecule. The composition can form a cured product high in rubber strength and excellent in chemical resistance. 
Shin-Etsu Chemical Co., Ltd.
B C B B C B B Y B B
B01D C08K B01D B01D C08L B01D B01D Y10S B01D B01D
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Hirofumi Shinichi Koichi Takashi Hiroshi Hitoshi Toshio Hirokazu
Kishita Sato Yamaguchi Matsuda Inomata Kinami Takago Yamada