Li & Cai Intellectual Property (USA) Office
Method of manufacturing a semiconductor unit
A semiconductor assembly manufacturing method includes: providing a substrate including a first conductive circuit; disposing a first electronic component on a side of the substrate; forming a first plastic seal layer covering the substrate and the first electronic component; setting up a plurality of grooves in the first plastic seal layer, the groove exposes at least a portion of the first conductive circuit of the substrate; and filling a conductive material in each of the grooves by vacuum printing so as to form a second conductive circuit electrically connected to the first conductive circuit of the substrate, and a second electronic component pad position thereof in the first plastic seal layer.
UNIVERSAL GLOBAL TECHNOLOGY (SHANGHAI) CO., LTD
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Chia-Cheng Xiao-Lei
Liu Zhou