Slater Matsil, LLP
Semiconductor packaging having warpage control and methods of forming same
An embodiment method for forming a semiconductor device package comprises bonding a first die to a package substrate and forming a molding compound over the package substrate and around the first die. A surface of the first die opposing the package substrate is exposed after forming the molding compound. The method further comprises bonding a plurality of second dies to the surface of the first die opposing the package substrate after forming the molding compound.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Chih Chen-Shien Kuei-Wei Chun-Cheng Yu-Feng
Huang Chen Huang Lin Chen