Dentons US LLP
Encapsulation film
The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided.
LG CHEM, LTD.
B B B B B H B H B Y H H H H B B B B B Y B B C B H B B Y B Y H Y B C
B32B B32B B32B B32B B32B H01L B32B H01L B32B Y10T H01L H05B H01L H01L B32B B32B B32B B32B B32B Y10T B32B B32B C09D B32B H01L B32B B32B Y10T B32B Y10T H01L Y10T B32B C09D
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Yoon Gyung Seung Min Jung Sup Suk Ky Hyun Jee
Cho Lee Shim Chang Yoo