Cooper Legal Group, LLC
Semiconductor arrangement and formation thereof
A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling.
Taiwan Semiconductor Manufacturing Company Limited
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Mei-Yun Hsien-Cheng Shih-Wen Yun I-Wen Chao-Hsun
Wang Wang Liu Lee Wu Wang