Slater & Matsil, L.L.P.
Package on package devices and methods of packaging semiconductor dies
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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De-Yuan Yu-Feng Ming-Che Chun-Lei Chung-Shi
Lu Chen Ho Hsu Liu