Antonelli, Terry & Wands
Electroless copper plating solution
 An electroless copper plating solution comprising cupric ions, complexing agents, a reducing agent, a pH adjustor, a polyoxyethylene series surface active agent, these being conventionally used, and (i) an inorganic compound containing at least Si or Ge, or (ii) a cationic surface active agent, or (iii) an inorganic compound containing at least Si, Ge or V and a cationic surface active agent, can give plated films with excellent mechanical properties even if operated for a long period of time with excellent stability of the plating solution. 
Hitachi, Ltd.
C
C23C
inventional
Hitoshi Akira Hiroshi
Oka Tomizawa Kikuchi