Rothwell, Figg, Ernest & Manbeck, P.C.
Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film
The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of −10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.
LG CHEM, LTD.
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Hee Jung Seung Hee Jung Ho Jung Hak Young Kook Kwang Joo Se Ra
Kim Nam Jo Kim Kim Lee Kim