Skjerven, Morrill, MacPherson, Franklin & Friel LLP
Apparatus and method for forming leads and removing tin dust from leads
 A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container. 
Samsung Electronics Co., Ltd.
H H
H01L H05K
additional inventional
Tai Kew Gyu Han Byong Do Jun Hyuk
Choi Bae Na Choi