JCIPRNET
Method for setting conditions for heating semiconductor chip during bonding, method for measuring viscosity of non-conductive film, and bonding apparatus
Provided is a method for setting the conditions for heating a semiconductor chip during bonding of the semiconductor chip using an NCF, wherein a heating start temperature and a rate of temperature increase are set on the basis of a viscosity characteristic map that indicates changes in viscosity with respect to temperature of the NCF at various rates of temperature increase and a heating start temperature characteristic map that indicates changes in viscosity with respect to temperature of the NCF when the heating start temperature is changed at the same rate of temperature increase.
SHINKAWA LTD.
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Toru Yoshihiro Osamu Satoru Tomonori
Maeda Saeki Watanabe Nagai Nakamura