Myers Bigel, P.A.
Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
A tin plating solution and a method for fabricating a semiconductor device are provided. The tin plating solution comprises tin ions supplied from a soluble tin electrode, an aliphatic sulfonic acid having a carbon number of 1 to 10, an anti-oxidant, a wetting agent, and a grain refiner that is an aromatic carbonyl compound.
Samsung Electronics Co., Ltd.
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additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional
Baik-Soon Jin-Hee Jung-Sik Myung-Beom
Choi Lee Choi Park