Haynes and Boone, LLP
Cleaning composition and method for semiconductor device fabrication
Provided is a cleaning composition and its applications. The cleaning composition comprises a mixture of a halogen-containing compound and an organic solvent. In some embodiments, the halogen-containing compound is TetraButylAmmonium Fluoride (TBAF) and the organic solvent is either propylene glycol monomethylether acetate (PGMEA) or a mixture of PGMEA and propylene glycol monomethylether (PGME). The cleaning composition is effective in removing silicon-containing material off of a surface of an apparatus. In some embodiments, the apparatus comprises a pipeline for delivering the silicon-containing material in semiconductor spin-coating processes. In some embodiments, the apparatus comprises a drain for collecting waste fluid in semiconductor spin-coating processes. In some embodiments, the apparatus comprises a patterned substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Yu Ching-Yu
Liu Chang