Keating & Bennett, LLP
Wireless IC device
A wireless IC device includes a radiation plate, a feeding circuit substrate on which a feeding circuit including a resonant circuit including an inductance element is provided, the feeding circuit being electromagnetically coupled to the radiation plate, and a wireless IC chip including a connection electrode, the wireless IC chip being disposed on the feeding circuit substrate. A mounting electrode is provided on the feeding circuit substrate. The frequency of signals sent and received using the radiation plate substantially corresponds to the resonant frequency of the resonant circuit. The wireless IC chip is electromagnetically coupled to the mounting electrode.
Murata Manufacturing Co., Ltd.
H G H H G
H01L G06K H01Q H01Q G06K
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Noboru Yuya Nobuo
Kato Dokai Ikemoto