McClure, Qualey & Rodack, LLP
Chip package structure and method for forming the same
A method for forming a chip package structure is provided. The method includes providing a wiring substrate. The method includes sequentially forming a nickel-containing layer and a gold-containing layer over the first pad. The method includes forming a conductive protection layer covering the gold-containing layer over the nickel-containing layer. The method includes bonding a chip to the wiring substrate through a conductive bump and a flux layer surrounding the conductive bump. The conductive bump is between the second pad and the chip. The method includes removing the flux layer while the conductive protection layer covers the nickel-containing layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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inventional inventional inventional additional additional additional inventional inventional additional inventional additional additional additional inventional inventional additional additional inventional additional additional additional additional inventional inventional additional additional additional additional additional additional additional inventional additional additional additional inventional additional inventional inventional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional additional inventional additional inventional
Yu-Huan Chen-Shien Kuo-Ching
Chen Chen Hsu