Park, Vaughan & Fleming LLP
Method and apparatus for facilitating proximity communication and power delivery
One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells configured to align with the etch pit wells of the first integrated circuit chip. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip. Besides aiding in alignment, the shaped structure also creates a conductive connection between the first integrated circuit chip and the second integrated circuit chip.
Sun Microsystems, Inc.
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John E. Ashok V.
Cunningham Krishnamoorthy