Miles & Stockbridge PC
Manufacturing method of electronic circuit including multilayer circuit board
The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.
Hitachi, Ltd. Hitachi Chemical Co., Ltd.
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Yasushi Masanori Hiroshi Kazuhisa Hiroyuki Yoshitaka Eriko Kazunori Hirozi
Shimada Yamaguchi Okabe Otsuka Kuriya Hirata Takeda Yamamoto Yamada