Hauptman Ham, LLP
Interposers of 3-dimensional integrated circuit package systems and methods of designing the same
An interposer of a package system includes a first probe pad disposed adjacent to a first surface of the interposer. A second probe pad is disposed adjacent to the first surface of the interposer. A first bump of a first dimension is disposed adjacent to the first surface of the interposer. The first bump is electrically coupled with the first probe pad. A second bump of the first dimension is disposed adjacent to the first surface of the interposer. The second bump is electrically coupled with the second probe pad. The second bump is electrically coupled with the first bump through a redistribution layer (RDL) of the interposer.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional additional additional additional additional additional additional
Chao-Yang Tom Yun-Han Chin-Chou Chung-Sheng Mill-Jer Sandeep Kumar
Yeh Chen Lee Liu Yuan Wang Goel