Hamre, Schumann, Mueller & Larson, P.C.
Semiconductor device and fabrication method of the semiconductor device
A semiconductor device includes: a semiconductor chip; and an Ag fired cap formed so as to cover a source pad electrode formed on the semiconductor chip. The semiconductor chip is disposed on a first substrate electrode, and one end of a Cu wire is bonded onto the Ag fired cap by means of an ultrasonic wave. There is provided a semiconductor device capable of improving a power cycle capability, and a fabrication method of such a semiconductor device.
ROHM CO., LTD.
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Takukazu
Otsuka