Winstead Sechrest & Minick P.C.
Method and system for backside device analysis on a ball grid array package
A method and system for preparing a device for analysis is disclosed. In the present invention, the device to be prepared includes a semiconductor die coupled to a first surface of a package substrate. The first surface of the package substrate includes an interconnect pattern for electrically coupling the semiconductor die to a plurality of solder ball connectors disposed on a second surface of the package substrate. The method and system for preparing the device for backside analysis comprises removing the plurality of solder ball connectors, exposing the interconnect pattern, and then exposing a backside of the semiconductor die. The method further includes preparing the backside of the semiconductor die for diagnostic testing. Electrical contact with the semiconductor die is established via the exposed interconnect pattern.
Advanced Micro Devices, Inc.
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