Chen Yoshimura LLP
Package support structure and light emitting device including same
The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing. The package support structure provided in the present invention achieves the effect of reducing an upper piece error and the purpose of effectively removing the heat energy.
Everlight Electronics Co., Ltd.
G H G G H H H H H H
G02B H01L G02B G02B H01L H01L H01L H01L H01L H01L
additional inventional inventional inventional additional additional additional inventional additional inventional
Yu-Da Chien-Nan Hao-Yu Chieh-Yu Teng-Wei
Lee Liu Yang Kang Chen