Slater Matsil, LLP
Fingerprint sensor pixel array and methods of forming same
A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Yu-Chih Chih-Hsuan Hao-Yi Chung-Shi Yu-Jen Chih-Hua Yu-Feng
Yu Huang Tai Tsai Liu Cheng Chen Chen