Sughrue, Mion, Zinn, Macpeak & Seas
Methods for connecting flexible circuit substrates to contact objects and structures thereof
 A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively. 
Nitto Denko Corporation
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Junji Kazuo Isao Masayuki Yasuhiko Hideo
Yoshida Ouchi Ohki Kaneto Yamamoto Yamashita