Eschweiler & Potashnik, LLC
Integrated antenna on interposer substrate
Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Bo-Jr Yun-Han Chin-Her Chin-Chou William Wu
Huang Lee Chien Liu Shen