Jaffery Watson Mendonsa & Hamilton LLP
Interconnect fabric link width reduction to reduce instantaneous power consumption
Described herein are various embodiments of reducing dynamic power consumption within a processor device. One embodiment provides a technique for dynamic link width reduction based on the instantaneous throughput demand for client of an interconnect fabric. One embodiment provides for a parallel processor comprising an interconnect fabric including a dynamic bus module to configure a bus width for a client of the interconnect fabric based on throughput demand from the client.
Intel Corporation
G G Y G G G G G
G06F G06F Y02D G06F G06F G06F G06F G06F
inventional inventional additional inventional inventional inventional inventional inventional
Ankur N. Altug Jonathan Abhishek R. Travis T. Kiran C. Joydeep Mohammed
Shah Koker Kennedy Appu Schluessler Veernapu Ray Tameem