Craig & Antonelli
Method of treating semiconductor wafers
 A method of treating wafers, wherein a plurality of wafers are stacked and immersed in an etchant, to work, i.e., etch, the peripheral surfaces of the wafers. Sliced semiconductor wafers or metallic or ceramic wafers can be chemically chamfered in this manner. 
Hitachi, Ltd.
Y H C H H H H
Y10S H01L C30B H01L H01L H01L H01L
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Yukio Etsuo Shinichiro Masato
Takei Egashira Miyoshi Fujita