Renner, Otto, Boisselle & Sklar
Semiconductor device and method for fabricating the same, memory core chip and memory peripheral circuit chip
 The semiconductor device of the invention includes a plurality of circuit blocks including a first circuit block and a second circuit block, a block parameter of the first circuit block being different from a block parameter of the second circuit block. In the semiconductor device, the first circuit block is formed on a first semiconductor chip, and the second circuit block is formed on a second semiconductor chip and is electrically connected with the first circuit block. 
Matsushita Electric Industrial Co.
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Tsutomu Ichiro Toshiki Reiji
Fujita Nakao Mori Segawa