Morgan Lewis & Bockius LLP
Fan-out semiconductor package
A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.
SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Doo Hwan Dae Kyu Ju Hyeon Sung Won
Lee Ahn Kim Jeong