Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
Method of planarization of semiconductor devices
A method of planarizing a semiconductor device includes the steps of providing a semiconductor substrate, forming a semiconductor component over the semiconductor substrate, depositing a doped silicate glass layer over the semiconductor component using a high density plasma chemical vapor deposition, the doped silicate glass layer forming a protrusion directly over the semiconductor component, and planarizing the doped silicate glass layer by a chemical mechanical polishing process to remove the protrusion.
Winbond Electronics Corporation
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H01L H01L
inventional inventional
Chih-Fan Shao-Yu Jack
Wang Ting Liang