Fenwick & West LLP
Testing wafer and testing method
There is provided a testing wafer that simulates heat generation of an inspection target substrate. The testing wafer includes a heater pattern, a plurality of temperature sensors, and first and second electrode pads. The heater pattern is configured to heat the testing wafer having the same shape as a shape of the inspection target substrate. The temperature sensors are configured to respectively measure temperatures of multiple locations on the testing wafer. The first electrode pads are connected to the heater pattern and the second electrode pads are connected to the temperature sensors. The first and second electrode pads are installed to be in contact with probes of a probe card.
TOKYO ELECTRON LIMITED
G G G
G01R G01R G01R
inventional inventional inventional
Yoshihito Hiroshi
Yamasaki Yamada