Package board and method for manufacturing thereof
A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.
Samsung Electro-Mechanics Co., Ltd.
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Seon-Goo Min-Sang Je-Gwang Suk-Hyeon Han-Seo
Lee Lee Yoo Cho Cho