Oblon, McClelland, Maier & Neustadt, L.L.P.
Gas supply member, plasma processing apparatus, and method for forming coating film
A gas supply member according to an embodiment includes: a base material that has a gas flow path capable of flowing a gas from an upstream side to a downstream side, a main surface arranged on the downstream side of the gas flow path in a direction intersecting an extending direction of the gas flow path, and a discharge port connecting the gas flow path and the main surface; and a film that contains at least one of yttria, yttrium oxyfluoride, yttrium fluoride, alumina, and aluminum nitride and covers the main surface and a surface of the discharge port of the base material. The film covers the main surface and the surface of the discharge port such that a surface of the film does not have a surface orientation portion of which a normal intersects a normal of the main surface at 45° to 75°.
Toshiba Memory Corporation
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C23C H01J C23C H01J H01J
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Hisashi Tetsuyuki Makoto
Hashiguchi Matsumoto Saito