Haynes and Boone, LLP
Pattern fidelity enhancement with directional patterning technology
A method for semiconductor manufacturing includes providing a substrate, forming a patterning layer over the substrate, and patterning the patterning layer to form a hole in the patterning layer. The method also includes applying a first directional etching to two inner sidewalls of the hole to expand the hole along a first direction and applying a second directional etching to another two inner sidewalls of the hole to expand the hole along a second direction that is different from the first direction.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ching-Yu Ya Hui Chih-Yuan Wei-Liang Yuan-Hsiang Ru-Gun Yung-Sung Chin-Hsiang Chi-Cheng Chien-Wei Yen-Ming Yu-Tien Kuei-Shun
Chang Chang Ting Lin Lung Liu Yen Lin Hung Wang Chen Shen Chen