Integrated circuit testing device and a method of use therefor
The present invention provides an integrated circuit testing device 200 and a method of using the same. In one particular embodiment, the integrated circuit testing device may include a first circuit layer 220 located over a semiconductor substrate 210, wherein the first circuit layer 220 has a second circuit layer 230 located thereover. The integrated circuit testing device 200 of the same embodiment may further include a signal bond pad 240 selectively connectable to each of the first and second circuit layers 220, 230 to test at least one device on each of the first and second circuit layers 220, 230. 
Texas Instruments Incorporated
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inventional inventional
Jin
Liu