Cooper Legal Group, LLC
Thickening phase for spin coating process
Among other things, one or more techniques and systems for performing a spin coating process associated with a wafer and for controlling thickness of a photoresist during the spin coating process are provided. In particular, a thickening phase is performed during the spin coating process in order to increase a thickness of the photoresist. For example, air temperature of down flow air, flow speed of the down flow air, and heat temperature of heat supplied towards the wafer are increased during the thickening phase. The increase in down flow air and heat increase a vaporization factor of the photoresist, which results in an increase in viscosity and thickness of the photoresist. In this way, the wafer can be rotated at relatively lower speeds, while still attaining a desired thickness. Lowering rotational speed of wafers allows for relatively larger wafers to be stably rotated.
Taiwan Semiconductor Manufacturing Company Limited
H B G G
H01L B05D G03F G03F
inventional additional inventional inventional
Chia-Chieh Wang-Pen Chun-Wei Chih-Chien Hung-Chang
Lin Mo Chang Wang Hsieh