ScienBiziP, P.C.
Flip chip light emitting diode packaging structure
A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Chao-Hsiung Pin-Chuan Hou-Te Lung-Hsin
Chang Chen Lin Chen