Koda and Androlia
Carrier receiving device for bonding machines
 Supplying and receiving devices for carriers, which carry substrates for semiconductors thereon, including a pair of carrier guides with an open space; carrier holding claws pivotally provided on the carrier guides so that the claws can hold a carrier; a carrier lifter which moves up and down between the carrier guides; and claw opening pieces provided on the carrier lifter. In the carrier supplying device, the carrier lifter moves up and when the claw opening pieces come into contact with the claws and open the claws. The lowermost carrier accommodated in the carrier guides is then released from the claws and placed on the carrier lifter so that the carrier is taken out of the carrier guides and the carrier immediately above the released carrier is held by the claws. In the receiving device, the claw opening pieces move upward along with the carrier lifter with a carrier thereon and when the claw opening pieces come into contact with the claws, the claws are opened and the carrier on the lifter is held by the claws so that the carrier is placed in the carrier guides. 
Kabushiki Kaisha Shinkawa
B H
B65G H01L
inventional inventional
Yasunobu Iwao
Suzuki Takahashi