Eschweiler & Associates, LLC
Dielectric grid bottom profile for light focusing
A back side illumination (BSI) image sensor with a dielectric grid opening having a curved lower surface is provided. A pixel sensor is arranged within a semiconductor substrate. A metallic grid is arranged over the pixel sensor and defines a sidewall of a metallic grid opening. A dielectric grid is arranged over the metallic grid and defines a sidewall of the dielectric grid opening. A capping layer is arranged over the metallic grid, and defines the curved lower surface of the dielectric grid opening. A method for manufacturing the BSI image sensor is also provided.
Taiwan Semiconductor Manufacturing Co., Ltd.
H H H H H H
H01L H01L H01L H01L H01L H01L
inventional inventional inventional inventional inventional inventional
Yung-Lung Yun-Wei Kuo-Cheng Chun-Hao Chao-Hsiung Tsung-Han Horng-Huei
Hsu Cheng Lee Chou Wang Tsai Tseng