Liu & Liu
Chip package and method for forming the same
A method for forming a chip package is provided. A first substrate is provided. A second substrate is attached on the first substrate, wherein the second substrate has a plurality of rectangular chip regions separated by a scribed-line region. A portion of the second substrate corresponding to the scribed-line region is removed to form a plurality of chips on the first substrate, wherein at least one bridge portion is formed between adjacent chips. A chip package formed by the method is also provided.
XINTEC INC.
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Tsang-Yu Chia-Ming Chien-Hui Chun-Wei
Liu Cheng Chen Chang