Screening process for manufacturing a Z-directed component for a printed circuit board
A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.
Lexmark International, Inc.
H H H H H H B H H C
H05K H05K H05K H05K H05K H05K B28B H05K H05K C04B
additional inventional additional additional additional additional additional inventional additional inventional
Keith Bryan Zachary Charles Nathan Paul Kevin Qing
Hardin Kratzer Hall Zhang