McCubbrey, Bartels & Ward
Method of curing thin films of organic dielectric material
 A method of curing an organic dielectric layer, such as polyimide, used in a multichip module is disclosed. The method comprises heating the uncured polyimide layer to a temperature above its glass transition temperature, and irradiating the layer with a uniform flux of electrons, as in an e-beam apparatus. The process reduces deterioration at the interface between the dielectric films and the metal layers which when high temperature thermal curing is utilized, and reduces the stress of the resulting film. Multiple dielectric layers can be applied in this manner. 
Fujitsu Limited
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William T. Solomon I. Wen-chou V.
Chou Beilin Wang