Skjerven, Morrill, MacPherson, Franklin & Friel LLP
Semiconductor package having light, thin, simple and compact structure
 A semiconductor package having a light, thin, simple and compact structure including outer leads having a minimum length and a resin encapsulate having a minimum volume. The semiconductor package includes a package body, a semiconductor chip mounted on a central portion of the body, inner and outer leads bonded to a peripheral portion of an upper surface of the body by an insulating layer in such a manner that the leads are supported on the body, conductive wires or bumps for electrically connecting the inner leads to the semiconductor chip, a resin encapsulate for encapsulating the semiconductor chip, the conductive wires or bumps and the inner leads. Each outer lead has an end positioned at a level higher than an upper surface of the semiconductor chip so that a boundary portion defined between the associated outer and inner leads serves as a barrier for the resin encapsulate. The end of each outer lead is exposed outside the resin encapsulate and extending to a peripheral edge of the body. 
Amkor Electronics, Inc. Anam Industrial Co., Ltd.
H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional
Seon Goo
Lee