Oliff & Berridge, PLC
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof.
Sae Magnetics (H.K.) Ltd. Headway Technologies, Inc.
H H H H H
H01L H01L H01L H01L H01L
inventional additional inventional inventional inventional
Yoshitaka Atsushi Hiroyuki
Sasaki Iijima Ito