Slater Matsil, LLP
Ball height control in bonding process
A package includes a first package component, a second package component over the first package component, and a solder region bonding the first package component to the second package component. At least one ball-height control stud separates the first package component and the second package component from each other, and defines a standoff distance between the first package component and the second package component.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Tsung-Yuan Hsien-Wei Jie
Yu Chen Chen