Sutro LLP Cushman Darby & Cushman Intellectual Property Group of Pillsbury Madison &
Method for manufacturing a semiconductor package
 A method for manufacturing a semiconductor package, including providing a lead frame in which die pad and side rail areas of the lead frame are mechanically interconnected to, and electrically isolated from each other so that the exposed bottom surface of the die pad does not become coated with a metal plating film during surface treatment for coating outer leads of the lead frame. 
Samsung Electronics Co., Ltd.
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Jeong Woo Wan Gyun Young Jae
Seo Choi Song