Novak Druce Connolly Bove + Quigg LLP
LED with thin package struture and method for manufacturing the same
A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fastening area and electrically connected to the wire fixing areas by wires. An encapsulant is formed to cover and connect the chip fastening area and the wire fixing areas. Portions of the metal substrate except the chip fastening area and the wire fixing areas are removed.
Advanced Optoelectronic Technology, Inc.
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inventional additional additional inventional additional additional inventional additional inventional additional
Chao-Hsiung Hsin-Chiang Pin-Chuan
Chang Lin Chen