Slater & Matsil, L.L.P.
Looped interconnect structure
Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.
Taiwan Semiconductor Manufacturing Company, Ltd.
H Y H H H H H H H Y H H H H
H05K Y10T H01L H01L H01L H01L H01L H01L H05K Y10T H05K H01L H01L H05K
additional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Ming-Chung Chien-Hsun Chih-Hang Yung Ching Da-Yuan Hsin-An
Sung Lee Tung Chen Shih Shen