Rothwell, Figg, Ernst & Manbeck, P.C.
Composition for forming adhesive layer of dicing film, and dicing film
There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.
LG CHEM, LTD.
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Seung Hee Young Kook Hee Jung Kwang Joo Se Ra Jung Hak Jung Ho
Nam Kim Kim Lee Kim Kim Jo