ScienBiziP, P.C.
Resin composition, adhesive layer, and circuit board utilizing same
A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.
Avary Holding (Shenzhen) Co., Limited. QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
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C08K C08F H05K C08K C09J C08K C08F C08F C08L H05K C08K H05K C09J C08F
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Fu-Yun Hsiao-Ting Cong Ming-Jaan
Shen Hsu Lei Ho