Jianq Chyun IP Office
Solder joint with a multilayer intermetallic compound structure
A solder joint with a multilayer IMC structure is provided. The solder joint includes a Cu pad, a Sn-based solder, a first, a second, and a third IMC layer. The Cu pad is disposed opposite to the Sn-based solder. The first IMC layer is disposed between the Cu pad and the Sn-based solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-based solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-based solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, y2 is in the range between 0 and 0.02, and x2>x1.
Yuan Ze University
B Y B B
B23K Y10T B23K B23K
inventional additional inventional inventional
Cheng-En Shih-Ju Yu-Hui
Ho Wang Wu