Jiang Chyun IP Office
Bumping process
A bumping process wherein a substrate is first provided with many electrical connections. Subsequently, the bumps on the bump transfer substrate are pressed onto the electrical connections of the substrate accompanying a heating process and then the bumps are transferred onto the electrical connections of the substrate because the adhesion characteristic between the bumps and the electrical connections is better than that between the bumps and the release layer.
Advanced Semiconductor Engineering, Inc.
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Min-Lung Jen-Kuang Tsung-Hua Ho-Ming Chao-Fu Su Chun-Chi Yu-Chen Ching-Huei Yung-Chi Jau-Shoung
Huang Fang Wu Tong Weng Tao Lee Chou Su Lee Chen