H.C. Park & Associates, PLC
Test structure and method of manufacturing structure including the same
A test structure for manufacturing a semiconductor device includes a test element, a first pad connected to the test element, and a second pad connected to the test element. A first wire is connected to the test element, and the first wire and the test element are part of a first layer disposed on a semiconductor substrate. A second wire is connected to the first wire, and is part of a second layer disposed on the semiconductor substrate, and the second layer is different from the first layer.
Samsung Electronics Co., Ltd.
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Jeong HOON Junjung Shaofeng
Ahn Kim Ding