Semiconductor chip with coil element over passivation layer
A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
Megica Corporation
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Wen-Chieh Jin-Yuan Chiu-Ming Yi-Cheng Mou-Shiung Chien-Kang
Lee Lee Chou Liu Lin Chou