JCIPRNET
Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.
Taiwan Semiconductor Manufacturing Co., Ltd.
H H H H H H H H H H H H H H H H H H H H H B H H H H H H H H H H B H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L B24D H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L B24D H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional inventional additional inventional additional additional inventional additional additional additional inventional additional inventional inventional inventional additional additional inventional additional inventional additional inventional additional inventional inventional additional inventional additional inventional additional additional inventional inventional additional inventional inventional additional additional additional additional inventional inventional
Jing-Cheng Wen-Hua Yi-Chao Chin-Chuan
Lin Chang Mao Chang