Foley & Lardner LLP
Wirebonded semiconductor package
In a method of manufacturing a semiconductor package including a wire binding process, a first end of the bonding wire is bonded to a first pad so as to form a first bond portion. A second end of the bonding wire is bonded to a second pad, wherein an interface surface between the bonding wire and the second pad has a first connecting area. The bonded second end of the bonding wire is scrubbed so as to form a second bond portion, wherein a new interface surface between the bonding wire and the second pad has a second connecting area larger than the first connecting area. A remainder of the bonding wire is separated from the second bond portion.
Advanced Semiconductor Engineering, Inc.
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Chih Cheng Wen Pin Cheng Tsung Yu Chi Cheng Lan
Hung Huang Hsu Chen Tseng