Faegre Baker Daniels LLP
High performance thermal interface materials with low thermal impedance
A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
Honeywell International Inc.
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C09K C09K H01L H01L H01L H01L C09K
inventional inventional additional additional additional inventional inventional
Ya Qun Hong Min Wei Jun Ling Liqiang Hui
Liu Huang Wang Shen Zhang Wang