Foley & Lardner LLP
Substrate having a conductive structure within photo-sensitive resin
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate structure includes a conductive structure, a dielectric structure and a metal bump. The conductive structure has a first conductive surface and a second conductive surface. The dielectric structure has a first dielectric surface and a second dielectric surface. The first conductive surface does not protrude from the first dielectric surface. The second conductive surface is recessed from the second dielectric surface. The metal bump is disposed in a dielectric opening of the dielectric structure, and is physically and electrically connected to the second conductive surface. The metal bump has a concave surface.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Chih-Cheng Tien-Szu Yu-Ying Li-Chuan Sheng-Ming Kuang-Hsiung
Lee Chen Lee Tsai Wang Chen