Bacon & Thomas, PLLC
Molding apparatus with a molding flowability sensor for packaging semiconductor device
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.
Advanced Semiconductor Engineering, Inc.
B B B B B
B29C B29C B29C B29C B29C
inventional additional additional additional additional
Kuang-Lin Yun-Lung Wei-Chih
Lo Chang Wang