Harness, Dickey & Pierce, P.L.C.
Integrated circuit device and method of manufacturing the same
An integrated circuit device includes a substrate, a landing pad on the substrate, and a through-via structure passing through the substrate and connected to the landing pad. The through-via structure may include a conductive plug, a first conductive barrier layer covering a sidewall and a lower surface of the conductive plug, and a second conductive barrier layer covering a sidewall of the first conductive barrier layer.
Samsung Electronics Co., Ltd.
H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional additional inventional inventional inventional inventional additional additional
Atsushi Ju-il Ju-bin Su-jeong Kwang-jin Dong-chan
Fujisaki Choi Seo Park Moon Lim