Birch, Stewart, Kolasch & Birch, LLP
Manufacturing method of printed circuit board using dry film resist
Disclosed is a manufacturing method of a circuit of a printed circuit board using a dry film resist in forming a circuit pattern on a copper overlaid laminate as a normal printed circuit board, in which a modification of the manufacturing process can enhance the resolution and fine weldability of the resist to realize a fine structure of the circuit pattern. The method includes: laminating the dry film resist on the top surface of the printed circuit board; exposing the dry film resist to ultraviolet (UV) radiations using a photomask in which a desired circuit pattern is formed; annealing the resulting material of the previous step with infrared (IR) radiations; and removing unexposed areas of the resist by development.
Kolon Industries Inc.
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H01L H05K G03F H05K Y10T Y10T Y10T Y10T
additional inventional inventional additional additional additional additional additional
Kook Hyeon Jun Hyeak Jan Hun
Han Choi Kim