Fish & Richardson P.C.
Flexible skin incorporating MEMS technology
A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1–100 μm thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10–500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).
California Institute of Technology
B H B H
B81C H01L B81B H01L
inventional additional inventional inventional
Fukang Chihming Yu-Chong
Jiang Ho Tai