Oblon, McClelland, Maier & Neustadt, L.L.P.
Wiring board manufacturing method and wiring board manufacturing device
A device forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a first conveyance speed (low speed) in a case in which a wiring layer forming process is performed directly after the resin layer forming process, and forms a resin layer by applying a UV light line-shaped in the X direction while conveying the work table in the Y direction at a second conveyance speed (high speed) in a case in which a consecutive resin layer forming process is performed directly after the resin layer forming process.
FUJI CORPORATION
B B H H B B H H H B B H B H B H B B B H B
B29C B33Y H05K H05K B41M B29C H05K H05K H01L B29C B29K H05K B41M H05K B33Y H05K B33Y B33Y B29C H05K B29L
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Kenji Masato Yoshitaka Akihiro Masatoshi
Tsukada Suzuki Hashimoto Kawajiri Fujita