William Park & Associates Ltd.
Stack packages including a fan-out sub-package
A stack package includes a package substrate and a fan-out sub-package mounted on the package substrate using first and second connection bumps. The fan-out sub-package includes a first semiconductor die and redistributed line (RDL) patterns. Second semiconductor dies are stacked on the package substrate to provide a first step structure, and third semiconductor dies are stacked on the second semiconductor dies to provide a second step structure. The second and third semiconductor dies are connected to the package substrate by bonding wires.
SK hynix Inc.
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Seung Yeop
Lee