Foley & Lardner
Packing material and method of making same
 A packing material for sealing electronic devices having improved, higher thermal conductivity than amorphous silica-containing packing material. The packing material comprises a thermosetting resin and a filler particle comprising a core inorganic particle and an amorphous silica coating on the core particle. The core particle is made from material having a thermal conductivity higher than that of amorphous silica, for example, a metal nitride such as aluminum nitride or silicon nitride, or a metal oxide such as aluminum oxide, or crystalline silicon dioxide. The amorphous silica coating may be formed by hydrolysis of alkoxysilane. 
Toshiba Ceramics Co., Ltd.
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Yoji Tsutomu Hajime
Nagano Nishiwaki Abe