Rankin, Hill & Clark LLP
Power supply module, package for the power supply module, method of manufacturing the power supply module and wireless sensor module
A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member.
SHINKO ELECTRIC INDUSTRIES CO., LTD.
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Tomoharu
Fujii