Foley & Lardner LLP
Electrical connection placement of semiconductor device package and method of manufacturing the same
A semiconductor device package includes a redistribution structure and an electrical connection. The redistribution structure has an electrical terminal adjacent to a surface of the redistribution structure and a seed layer covering a side surface of the electrical terminal. The electrical connection is disposed on a first surface of the electrical terminal. The seed layer extends to the first surface of the electrical terminal.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Cheng-Lin Chih-Cheng
Ho Lee