McKenna Long & Aldridge LLP
Light emitting device package and method for manufacturing the same
The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package.
LG Innotek Co., Ltd. LG Electronics Inc.
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Seung yeob Geun ho
Lee Kim