Pennie & Edmonds LLP
Curable sheet for circuit transfer
Provided is a curable sheet for the formation of a wiring circuit layer by circuit transfer from a transfer base material, wherein the curable sheet comprises (A) a reaction product between a polyphenylene ether resin and an unsaturated carboxylic acid or acid anhydride, (B) triallyl isocyanurate and/or triallyl cyanurate, (C) a hydrogenated block copolymer obtained by hydrogenation of a block copolymer comprising at least one polymer block A mainly comprising an aromatic vinyl compound and at least one polymer block B mainly comprising a conjugated diene compound, and (D) an inorganic filler; said Component (A), Component (B) and Component (C) being contained in amounts of 45 to 55 parts by weight, 55 to 45 parts by weight, and 25 to 35 parts by weight, respectively, each based on 100 parts by weight of total of Components (A) and (B), and said Component (C) being contained in an amount of 20 to 80 vol. %.
Asahi Kasei Kabushiki Kaisha Kyocera Corporation
H H H H H C H C H C H Y
H05K H05K H05K H05K H05K C08L H05K C08K H05K C08L H05K Y10T
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Masaaki Masaki Toshikazu Katsura Shozo
Hori Yamamoto Fujii Hayashi Kinoshita