William Park & Associates Ltd.
Manufacturing methods semiconductor packages including through mold connectors
A semiconductor package structure and a method for manufacturing the same are provided. According to the method, a first mold layer is formed to cover a first semiconductor chip and a first bumps. A portion of the first mold layer is removed to expose top portions of the first bumps and second bumps are disposed to be connected to each of the first bumps. A second mold layer is formed, and the second mold layer is recessed to form through mold connectors that substantially penetrate the second mold layer with the second bumps disposed on the first bumps.
SK hynix Inc.
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Hyeong Seok Ki Jun Young Geun Jong Hoon
Choi Sung Yoo Kim