Cantor Colburn LLP
Strained and unstrained semiconductor device features formed on the same substrate
Embodiments are directed to a method of forming a feature of a semiconductor device. The method includes forming the feature from a semiconductor material having compressive strain that extends throughout a cut region of the feature and throughout a preserve region of the feature. The method further includes converting the cut region of the feature to a dielectric.
INTERNATIONAL BUSINESS MACHINES CORPORATION
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Kangguo Peng Juntao
Cheng Xu Li