Camera module package
A camera module package comprises a housing having a lens section mounted therein; a circuit board having a window through which light transmitted through the lens section of the housing passes; an image sensor that is flip-chip bonded to a lower surface of the circuit board; and an impact absorbing member attached to an upper surface of the circuit board, of which the side surface serves as a coupling guide which is coupled to an inner periphery of the housing.
Samsung Electro-Mechanics Co., Ltd.
H H H G
H04N H04N H04N G03B
inventional inventional inventional inventional
Jae Sub Jung Jin
Cho Kim