Jones Day
Systems and methods for edge bead removal
Systems and methods are provided for edge bead removal. A laser beam of approximately a wavelength is received. The laser beam is delivered along a predetermined beam path. The laser beam is projected on an edge portion of a wafer for edge bead removal.
Taiwan Semiconductor Manufacturing Company Limited
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Fei-Gwo Hsueh-Yi Chun-Hao Li-Kong Shang-Yun Jui-Ping
Tsai Chung Chang Turn Huang Chuang