Beyer Law Group LLP
Metal hardmask all in one integrated etch
A method for forming conductive contacts in a dielectric layer is provided. Partial vias are etched into the dielectric layer through a via mask. Trenches are etched into the dielectric layer through a trench mask, wherein the etching the trenches completes and over etches the vias to widen bottoms of the vias. Tops of the trenches or vias are rounded.
Lam Research Corporation
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Junwen Yu Liang Huiyuan Jiangang Youngjin
Huang Cheng Wang Pei Liu Choi