Oliff & Berridge, PLC
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion.
SAE Magnetics (H.K.) Ltd. Headway Technologies, Inc.
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Atsushi Hiroyuki Yoshitaka
Iijima Ito Sasaki