Dentons US LLP
Encapsulation film and method for encapsulating organic electronic device using same
Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, prevent adhesion failure and damage to an organic film due to volume expansion occurring by a reaction between a moisture adsorbent and moisture, and provide high reliability due to increases in a lifespan and durability of the OED.
LG Chem, Ltd.
H H H H H H H
H01L H01L H01L H01L H01L H01L H01L
inventional inventional inventional inventional inventional additional inventional
Hyun Suk Suk Ky Seung Min Hyun Jee Jung Ok
Kim Chang Lee Yoo Moon