Oliff PLC
Organic film composition, method for forming organic film and patterning process using this, and heat-decomposable polymer
The invention provides an organic film composition comprises (A) a heat-decomposable polymer, (B) an organic solvent, and (C) an aromatic ring containing resin, with the weight reduction rate of (A) the heat-decomposable polymer from 30° C. to 250° C. being 40% or more by mass. There can be provided an organic film composition having not only a high dry etching resistance but also an excellent filling-up or flattening characteristics.
SHIN-ETSU CHEMICAL CO., LTD.
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Toshiharu Takeshi Toshihiko Kazumi Seiichiro Takeru
Yano Kinsho Fujii Noda Tachibana Watanabe