Myers Bigel Sibley & Sajovec, PA
Electrical interconnections of semiconductor devices and methods for fabricating the same
Provided are electrical interconnections and methods for fabricating the same. The electrical interconnection may include a substrate including a bonding pad, a solder ball electrically connected to the bonding pad, a solder supporter on the bonding pad, a portion of the solder ball filling the solder supporter, and a metal layer between the bonding pad and the solder supporter, the metal layer having an ionization tendency lower than the bonding pad.
Samsung Electronics Co., Ltd.
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Jeonggi Yeun-Sang Jeong-Woo Ju-il
Jin Park Park Choi