IP Group of Pillsbury Madison & Sutro LLP
Packing structure of semiconductor packages
 A packing structure for a surface mounting type semiconductor package, wherein at least one semiconductor chips are mounted on a die pad. A conductive pattern is formed on a printed circuit board which is located beneath an exposed side of a die pad of the package. A nonconductive thin film or a conductive layer is formed between the conductive pattern and the die pad. The conductive pattern is electrically connected to the die pad so that there is generated the package voltage difference therebetween, thereby reducing the electric noise of the package and facilitating high speed operation of the package without reducing a mounting density. 
Samsung Electronics Co., Ltd.
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Jung Jin Young Do Joung Rhang Young Jae Young Hee
Kim Kweon Lee Song Song