Kenyon & Kenyon LLP
Semiconductor module
A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.
TOYOTA JIDOSHA KABUSHIKI KAISHA
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Takanori Masaya Kiyofumi Tomomi Yoshikazu Tatsuya Takuya
Kawashima Kaji Nakajima Okumura Suzuki Miyoshi Kadoguchi