Mei & Mark LLP
Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
LUMENS CO., LTD.
H H H H H F H F H H
H01L H01L H05B H01L H01L F21S H01L F21S H01L H05B
additional additional inventional additional inventional inventional additional inventional inventional inventional
Tae Kyung In Soo Sung Sik Seung Hyun Jung A Seung Hoon Sung Yole
Yoo Kim Jo Oh Lim Lee Yun