Oblon, McClelland, Maier & Neustadt, L.L.P.
Wiring substrate and method for manufacturing wiring substrate
A wiring substrate includes a laminate having a through hole and including conductor layers and insulating layers interposed between the conductor layers, solder resist layers formed on the laminate and including a first solder resist layer covering first surface of the laminate and a second solder resist layer covering second surface of the laminate and that the first and second solder resist layers have openings exposing the through hole, and a resin film covering the laminate not covered by the solder resist layers such that the resin film is formed on the first and second surfaces of the laminate inside the openings of the first and second solder resist layers without overlapping with the solder resist layers on the first and second surfaces and that the resin film covers inner wall surface inside the through hole and at least part of the first and second surfaces exposed inside the openings.
IBIDEN CO., LTD.
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Yoji Kotaro
Mori Takagi