Birch, Stewart, Kolasch & Birch, LLP
Method for forming a semiconductor device structure having an electrical connection structure
A method for forming an electrical connection structure is provided. The method includes forming a first metal material in an opening of a dielectric layer. The first metal material includes a plurality of grains. The method also includes forming a second metal material over the first metal material. The method also includes annealing the second metal material so that the second metal material diffuses along grain boundaries of the grains of the first metal material. The method also includes removing the second metal material from the upper surface of the first metal material.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Tien-Lu Yu-Ming Chia-Hao Chih-Hao Jia-Chuan Shih-Chuan Chun-Yuan
Lin Lin Chang Wang You Chiu Chen