Dickstein Shapiro LLP
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
A wiring glass substrate includes a glass substrate formed of glass and having a plurality of holes formed at predetermined positions, bumps so formed as to be connected to a conductive material filling the holes and wirings formed on a surface opposite to a surface having the bumps formed thereon and electrically connecting a plurality of connection terminals arranged in intervals different from intervals of the holes to the conductive material. The shape of the conductive material is porous and porous electrodes are bonded to the inner wall surfaces of the holes by an anchor effect to increase the strength of the glass substrate.
Renesas Technology Corp.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H05K H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K H01L H05K H01L H01L H01L H05K H01L H01L H05K H01L H05K H01L H05K H01L H01L H01L H05K H01L H01L H01L H01L H05K
additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional
Shigehisa Tadanori Takao Takao Yasutaka Osamu Takashi Toshiya Daigorou Hiroki Ken Takashi
Motowaki Segawa Ishikawa Miwa Suzuki Shiono Namekawa Satoh Kamoto Yamamoto Takahashi Naito