WPAT, P.C., Intellectual Property Attorneys
Manufacturing method for semiconductor structure
A method of manufacturing a semiconductor structure is provided. The method includes providing a substrate, disposing a die over the substrate, forming a molding over the substrate and around the die, disposing a first dielectric layer over the die and the molding, curing the first dielectric layer under a first curing condition, disposing a second dielectric layer over the first dielectric layer, and curing the first dielectric layer and the second dielectric layer under the first curing condition.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chih-Kang Hsi-Kuei Hsin-Chieh Ching-Fu
Han Cheng Huang Chang