Novak Druce Connolly Bove + Quigg LLP
Light emitting diode package with lens and method for manufacturing the same
A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.
Advanced Optoelectronic Technology, Inc.
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Hsuen-Feng Chung-Min Chien-Lin Chang-Wen Yu-Wei
Hu Chang Chang-Chien Sun Tsai