Westerman, Hattori, Daniels & Adrian, LLP
Electrode body, wiring substrate, and semiconductor device
An electrode body is provided as an electrode body capable of appropriately reducing a load when silicon wafer direct bonding is performed. The electrode body 1 includes a base member 10 that has a predetermined thickness; and an electrode portion 20 that is formed on one surface of the base member in a thickness direction thereof. The electrode portion 20 includes a basic bump 21 formed in a substantially columnar shape to protrude on the base member 10 and a fragile bump 22 formed independently from the basic bump to form a metallic bond with the basic bump 21. 
OLYMPUS CORPORATION
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Hiroshi Chihiro Yoshiaki
Kikuchi Migita Takemoto