Tung & Associates
Method for fabricating microelectronic product with attenuated bond pad corrosion
A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.
Taiwan Semiconductor Manufacturing Co., LTD
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Sheng-Liang Fu-Tien Yu-Kung Chih-Kung Po-Wen Chung-Sheng Te-Fu Yi-Ming Hung-Jen Chin-Chen
Pan Wong Hsiao Chang Lin Hsiung Tseng Dai Hsu Kuo