Bracewell & Giuliani LLP
Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same
Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
Y B Y Y Y B B Y Y H H H H B B Y B Y B Y B B Y B Y
Y10T B32B Y10T Y10T Y10T B32B B32B Y10T Y10T H05K H05K H05K H05K B32B B32B Y10T B32B Y10T B32B Y10T B32B B32B Y10T B32B Y10T
additional inventional additional additional additional inventional inventional additional additional inventional additional inventional additional inventional additional additional inventional additional inventional additional inventional inventional additional inventional additional
Seok Kyu Jin Yong Suk Hyeon Ki Hwan Jae Joon
Lee Ahn Cho Kim Lee