TraskBritt
Sealed electronic device packages with transparent coverings
The invention provides improved packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. Methods of assembly are also provided. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
Micron Technology, Inc.
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Chad A. Todd O.
Cobbley Bolken