Slater Matsil, LLP
3DIC seal ring structure and methods of forming same
A semiconductor device includes a first semiconductor chip including a first substrate, a plurality of first dielectric layers and a plurality of conductive lines formed in the first dielectric layers over the first substrate. The semiconductor device further includes a second semiconductor chip having a surface bonded to a first surface of the first semiconductor chip, the second semiconductor chip including a second substrate, a plurality of second dielectric layers and a plurality of second conductive lines formed in the second dielectric layers over the second substrate. The semiconductor device further includes a first conductive feature extending from the first semiconductor chip to one of the plurality of second conductive lines, and a first seal ring structure extending from the first semiconductor chip to the second semiconductor chip.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Wen-De Jen-Cheng Dun-Nian Pao-Tung Cheng-Ying
Wang Liu Yaung Chen Ho