Jianq Chyun IP Office
Heating platform and 3D printing apparatus
A heating platform including a substrate, a heating plate, a conducting plate and a temperature sensing element is provided. The substrate has a first surface for forming a three dimensional (3D) object and an opposite second surface. The heating plate is attached to the second surface of the substrate to heat the substrate. The conducting plate is attached to the heating plate, and the heating plate is coved between the substrate and the conducting plate, wherein the area of the conducting plate is smaller than the area of the substrate, and an end of the conducting plate extends to the outer of the heating plate. The temperature sensing element is disposed at the end of the conducting plate extending to the outer of the heating plate to sense the temperature of the substrate through the conducting plate. A 3D printing apparatus including the heating platform aforementioned is also provided.
Kinpo Electronics, Inc. XYZprinting, Inc. Cal-Comp Electronics & Communications Company Limited
B H H B B B
B29C H05B H05B B29C B29C B29C
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Chih-Ming Kwan
Chang Ho