Dies-on-package devices and methods therefor
Dies-on-package devices and methods therefor are disclosed. In a dies-on-package device, a first IC die is surface mount coupled to an upper surface of a package substrate. Conductive lines are coupled to the upper surface of the package substrate in a fan-out region with respect to the first IC die. A molding layer is formed over the upper surface of the package substrate, around sidewall surfaces of the first IC die, and around bases and shafts of the conductive lines. A plurality of second IC dies is located at a same level above an upper surface of the molding layer respectively surface mount coupled to sets of upper portions of the conductive lines. The plurality of second IC dies are respectively coupled to the sets of the conductive lines in middle third portions respectively of the plurality of second IC dies for corresponding fan-in regions thereof.
Invensas Corporation
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additional inventional inventional additional additional inventional additional additional inventional inventional inventional inventional inventional additional inventional inventional additional inventional additional inventional inventional additional inventional additional inventional additional additional inventional inventional additional additional additional inventional inventional additional additional additional additional additional additional inventional inventional additional inventional additional additional inventional inventional additional additional additional inventional inventional
Zhuowen Belgacem Hoki Ashok S. Min Wael
Sun Haba Kim Prabhu Tao Zohni