Anova Law Group, PLLC
Fin-FET device and fabrication method thereof
A method for fabricating a Fin-FET device includes forming fin structures on a substrate and an isolation structure to cover a portion of sidewall surfaces of the fin structures, forming gate structures to cover a portion of sidewall and top surfaces of the fin structures, forming doped source/drain regions in the fin structures, forming a metal layer on the doped source/drain regions and the gate structures, performing a reaction annealing process to convert the metal layer formed on the doped source/drain regions into a metal contact layer and then removing the unreacted metal layer, forming a dielectric layer on the metal contact layer and the gate structures with a top surface higher than the top surfaces of the gate structures, forming a plurality of vias through the dielectric layer above the metal contact layer, and forming a plurality of conductive plugs by filling the vias.
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
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Yong
Li