Anova Law Group, PLLC
Static random-access memory (SRAM) devices
A static random-access memory (SRAM) device includes a base substrate including a PU transistor region and a PD transistor region adjacent to the PU transistor region, a gate dielectric layer formed on a portion of the base substrate in the PU transistor region and the PD transistor region, a first WF layer formed on a portion of the gate dielectric layer in the PU transistor region and a second WF layer formed on the first WF layer in the PU transistor region, and a third WF layer formed on a top surface and a sidewall surface of the second WF layer in the PU transistor region, a sidewall surface of the first WF layer in the PU transistor region, and the gate dielectric layer in the PD transistor region. Each of the first WF layer and the second WF layer is made of a P-type WF material, and the third WF layer is made of an N-type WF material. The SRAM device also includes a gate electrode layer formed on the third WF layer.
Semiconductor Manufacturing International (Beijing) Corporation Semiconductor Manufacturing International (Shanghai) Corporation
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