Slater Matsil, LLP
Packaging devices and methods of manufacture thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to a second portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element comprises a first side and a second side coupled to the first side. The first side and the second side of the transition element are non-tangential to the PPI pad.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional
Hsien-Wei Jie
Chen Chen