Kilpatrick Townsend and Stockton LLP
Enhanced stress memorization technique for metal gate transistors
A method of manufacturing a semiconductor device includes forming a dummy gate structure on a semiconductor substrate, forming sidewall spacers, and forming heavily doped source/drain regions. After removing the spacers, a stress material layer is formed over the dummy gate structure. An annealing process is performed to transfer the stress to the device channel region. After the annealing process, the stress material layer is removed. The dummy gate structure is replaced by a high-k dielectric layer and a metal gate structure. Subsequently, contact holes are formed to expose at least part of the heavily doped source/drain regions, and self-aligned silicide is formed over exposed portions of the heavily doped source/drain regions.
Semiconductor Manufacturing International (Shanghai) Corporation Semiconductor Manufacturing International (Beijing) Corporation
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Yong
Li