JCIPRNET
Package structure and manufacturing method thereof
A package structure includes a plurality of first dies, a first encapsulant, and a first redistribution structure. The first encapsulant encapsulates the first dies. The first redistribution structure is disposed on the first dies and the first encapsulant. The first redistribution structure includes a dielectric layer covering a top surface and sidewalls of the first encapsulant.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Chin-Fu Li-Hui Szu-Wei Ping-Yin
Kao Cheng Lu Hsieh