Ladas & Parry LLP
Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same
A semiconductor package capable of being efficiently stacked and a method of manufacturing the same is presented. The semiconductor package includes a semiconductor chip, an insulation layer, and a through-electrode. The semiconductor chip has a first surface and a second surface, a circuit section in the semiconductor chip, an internal circuit pattern electrically connected to the circuit section, and a through-hole that passes through the internal circuit pattern and through the first and second surfaces. The insulation layer is on a through-hole of the semiconductor chip and has an opening which exposes the internal circuit pattern which was exposed by the through-hole. The through-electrode is in the through-hole and electrically coupled to the internal circuit pattern which is exposed through the opening of the insulation layer.
Hynix Semiconductor Inc.
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Ho Young Seung Taek Jun Gi
Son Yang Choi