Vierra Magen Marcus LLP
Spacer layer for embedding semiconductor die
A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.
SanDisk Semiconductor (Shanghai) Co. Ltd.
H H H H Y H H H H Y H H H H H H H H H H H H H
H01L H01L H01L H01L Y10T H05K H05K H01L H01L Y02P H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K
additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional inventional inventional inventional additional additional additional additional
Jianbin Peng Pradeep Junrong Weili Li Xin
Gu Lu Rai Yan Wang Wang Lu