Mountable integrated circuit package-in-package system with adhesive spacing structures
A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer, and forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer.
STATS ChipPAC Ltd.
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JoHyun SeongMin Jong-Woo
Bae Lee Ha