Antonelli, Terry, Stout & Kraus
Photocurable diallyl phthalate resin composition and printed circuit board using the same
 A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties. 
Hitachi, Ltd.
G H G Y
G03F H05K G03F Y10S
inventional additional inventional additional
Yukihiro Hiroshi Shinichiro Hitoshi Makio Isamu
Taniguti Kikuchi Imabayashi Oka Watanabe Tanaka