Jianq Chyun IP Office
Method of fabricating opening and plug
A method of fabricating an opening or plug. In the process of forming the opening, before a photoresist layer is formed over a dielectric layer, a treatment process is performed to form a film on the dielectric layer, wherein the film can suppress the outgasing phenomenon of the dielectric layer and prevent the later formed photoresist layer from reacting with the running-off composition component from the dielectric layer. Therefore, the problem of incomplete development due to outgasing of the dielectric layer can be solved. Additionally, in the procedure for forming a plug, before a block layer is forming on a surface of a via, a treatment process is performed to form a film on the surface of the via. Therefore, the problem of having defects inside the block layer caused by outgasing of the dielectric layer can be overcome.
United Microelectronics Corp.
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Yi-Fang Chopin
Cheng Chou