McDermott Will & Emery LLP
Polishing head, chemical-mechanical polishing system and method for polishing substrate
A polishing head includes a carrier head and a plurality of pressure units arranged on the carrier head. At least two of the pressure units are located on the same circumferential line relative to a center axis of the carrier head.
Taiwan Semiconductor Manufacturing Co., Ltd.
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B24B B24B B24B B24B B24B
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Ren-Guei Feng-Inn Jung-Yu Sheng-Chen Shu-Bin
Lin Wu Li Wang Hsu