Muir Patent Consulting, PLLC
Method of manufacturing a wafer including providing electrical conductors isolated from circuitry
Conductive lines are formed on a wafer containing multiple circuits. The conductive lines are isolated from the circuits formed within the wafer. Chips are mounted on the wafer and have their chip pads connected to the conductive lines of the wafer. The wafer may then be protected with a packaging resin and singulated.
Samsung Electronics Co., Ltd.
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additional inventional additional additional additional additional inventional inventional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional
Sunpil Seok-Chan
Youn Lee