Horizon IP Pte. Ltd.
Non-volatile memory device with TSI/TSV application
Memory devices and methods for forming the device are disclosed. The device includes a substrate having an array surface and a non-array surface and a memory array having a plurality of memory cells interconnected by first conductors in a first direction and second conductors in a second direction. The memory array is disposed on the array surface of the substrate. The device further includes through silicon via (TSV) contacts disposed in the substrate. The TSV contacts extend from the array surface to the non-array surface, enabling electrical connections to the array from the non-array surface.
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
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inventional inventional inventional additional additional inventional inventional inventional
Jens Wanbing Wei Lei Shunqiang Juan Boon
Oswald Yi Liu Wang Gong Tan