Rothwell, Figg, Ernst & Manbeck, P.C.
Photosensitive polyimide and photosensitive resin composition comprising the same
The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.
LG Chem, Ltd.
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C08G G03F C08G C08G C08G C08L G03F
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Kyoung Ho Se Jin Chan Hyo Hye Ran Jung Ho Yu Na Sang Woo Kyung Jun Hye Won
Ahn Shin Park Seong Jo Kim Kim Kim Jeong