Marshall, Gerstein & Borun LLP
Method of manufacturing flash memory device
Provided relates to a method of a flash memory device, which performs a first rapid thermal oxidation process at a H2 rich atmosphere for recovering an etched damage during a gate forming process, and performs a second rapid thermal oxidation process at the H2 rich atmosphere for ion-activating after performing an ion implantation process for forming a cell transistor junction and a peripheral circuit transistor junction. As a result of those processes, a Si-dangling bond cut off during a gate etching process has a Si—H combination structure and the whole processing time is reduced, and thus an abnormal oxidation caused at an edge of an ONO layer and a tunnel oxide film, which can make it possible to prevent a smiling phenomena of the ONO layer and a bird's beak phenomena of the tunnel oxide film.
Hynix Semiconductor Inc.
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Seung Cheol Pil Geun Sang Wook
Lee Song Park