Rothwell, Figg, Ernst & Manbeck, P.C.
Polyamic acid, photosensitive resin composition, dry film and circuit board
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
LG CHEM, LTD.
C G G H C C H C
C08L G03F G03F H05K C09D C08G H05K C08G
inventional inventional inventional inventional inventional inventional inventional inventional
Hee-Jung Kwang-Joo Jung-Hak You-Jin
Kim Lee Kim Kyung