Oblon, McClelland, Maier & Neustadt, L.L.P.
Method for manufacturing silicon carbide semiconductor apparatus, and energization test apparatus
The present invention provides a method for manufacturing silicon carbide semiconductor apparatus including a testing step of testing a PN diode for the presence or absence of stacking faults in a relatively short time and an energization test apparatus. The present invention sets the temperature of a bipolar semiconductor element at 150° C. or higher and 230° C. or lower, causes a forward current having a current density of 120 [A/cm2] or more and 400 [A/cm2] or less to continuously flow through the bipolar semiconductor element, calculates, in a case where a forward resistance of the bipolar semiconductor element through which the forward current flows reaches a saturation state, the degree of change in the forward resistance, and determines whether the calculated degree of change is smaller than a threshold value.
MITSUBISHI ELECTRIC CORPORATION
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Kazuya Shoyu Akihiro Shigehisa Yukiyasu
Konishi Watanabe Koyama Yamamoto Nakao