McDermott Will & Emery LLP
High power LED package and fabrication method thereof
An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
Samsung Electro-Mechanics Co., Ltd.
H H H H
H01L H01L H01L H01L
additional additional inventional additional
Jung Kyu Seong Yeon Dae Yeon Young Sam Kyung Taeg Seon Goo Hun Joo
Park Han Kim Park Han Lee Hahm