Methods of etching glass substrates and glass substrates
A method of forming a glass substrate includes providing a glass substrate having alumina, translating a pulsed laser beam on the glass substrate to form one or more pilot holes, contacting the glass substrate with an etching solution, and providing agitation. The etching solution has a pH from about 0 to about 2.0, and an etch rate is less than about 3 μm/min. A glass substrate is disclosed having a first surface and a second surface opposite the first surface in a thickness direction, and at least one hole penetrating the first surface, wherein the at least one hole has been etched by an etching solution. A greatest distance d1 between (1) a first plane that contacts the first surface in regions that do not have the at least one hole or a deviation in a thickness of the substrate surrounding the at least one hole and (2) a surface of the deviation recessed from the first plane is less than or equal to about 0.2 μm.
Corning Incorporated
C Y B B B B C Y B H B H Y B C Y
C03C Y10T B23K B23K B23K B23K C03C Y10T B23K H01L B23K H01L Y10T B23K C03C Y10T
inventional additional additional inventional inventional additional inventional additional inventional additional additional additional additional inventional additional additional
Yuhui Thomas Michael Tian Daniel Wayne Tammy Lynn
Jin Castle Huang Levesque, Jr. Petriwsky