WPAT, P.C., Intellectual Property Attorneys
Lithographic overlay correction and lithographic process
A method includes receiving a wafer, defining a plurality of zones over the wafer, performing a multi-zone alignment compensation for each of the plurality of zones according to an equation along a first direction to obtain a plurality of compensation values for each of the plurality of zones, and performing a wafer alignment and a lithography exposure for each of the plurality of zones according to the plurality of compensation values. The wafer alignment and the lithography exposure are performed zone-by-zone.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Ying Ying Ai-Jen Chin-Chen Yung-Yao Heng-Hsin
Wang Hung Wang Lee Liu