Hauptman Ham, LLP
Heat transfer structures and methods for IC packages
A method of transferring heat in a package includes conducting heat from a first device to a second device by a low thermal resistance substrate path in a chip layer of the package, conducting heat from an integrated circuit (IC) to a first package layer of the package, conducting heat from the first package layer of the package to at least a first set of through-vias positioned in the chip layer, and conducting heat from the first set of through-vias to a surface of a second package layer opposite the chip layer. The first device and the second device is part of the IC chip. The first package layer is adjacent to the chip layer.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Chih-Lin Eric Ying-Chih Chih-Yuan Chuei-Tang Alan
Chen Soenen Hsu Chang Wang Roth