Sughrue Mion, PLLC
Chip including a scribe lane
A semiconductor chip includes a substrate including: a main chip region; and a scribe lane surrounding the main chip region; a lower interlayer insulating layer disposed on the substrate in the scribe lane; a circuit structure disposed on the lower interlayer insulating layer in the scribe lane; and a pad structure disposed on the lower interlayer insulating layer. The circuit structure and the pad structure are disposed to be spaced apart from each other in a longitudinal direction of the scribe lane.
SAMSUNG ELECTRONICS CO., LTD.
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additional inventional additional inventional inventional
Jung Ho Jun Ho Yoon Sung Hyun Su Yun Hee Byung Moon
Choi Yoon Kim Sim Kim Bae