Wet cleaning cavitation system and method to remove particulate wafer contamination
A cavitation cleaning system and method for using the same to remove particulate contamination from a substrate including providing at least one substrate immersed in a cleaning solution said cleaning solution contained in a cleaning solution container. The container further includes means for producing gaseous cavitation bubbles of ultrasound energy, said gaseous cavitation bubbles arranged to contact at least a portion of the at least one substrate; applying ultrasound energy to create gaseous cavitation bubbles to contact the substrate to remove adhering residual particles in a substrate surface cleaning process; and, recirculating the cleaning solution through a particulate filtering means.
Taiwan Semiconductor Manufacturing Co. Ltd
B H Y
B08B H01L Y10S
inventional inventional additional
Hun-Jan Chun-Li Peng-Fu
Tao Chou Hsu