Cooper Legal Group, LLC
Semiconductor arrangement and method of making
A semiconductor arrangement is provided. The semiconductor arrangement includes a molding layer and a first capacitor. The first capacitor includes a first vertical conductive structure within the molding layer, a second vertical conductive structure within the molding layer, and a first high-k dielectric material between the first vertical conductive structure and the second vertical conductive structure.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
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Huan-Neng Wen-Shiang
Chen Liao