William Park & Associates Ltd.
Method of manufacturing wafer level package and wafer level package manufactured thereby
Provided are a wafer level package and a manufacturing method thereof. A reconfigured substrate may be formed by disposing a first semiconductor die on a dummy wafer, and forming a molding layer and a mold covering layer. A second semiconductor die may be stacked on the first semiconductor die and a photosensitive dielectric layer may be formed. Conductive vias penetrating the photosensitive dielectric layer may be plated.
SK hynix Inc.
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inventional additional inventional additional additional inventional additional additional additional inventional inventional additional inventional inventional inventional inventional inventional additional inventional inventional additional additional additional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional inventional
Hyeong Seok Dae Won Tae Hoon Jong Hoon
Choi Kim Kim Kim