Slater Matsil, LLP
Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chih-Wei Chien Rhone Jing-Cheng Kewei Chih-Chiang
Lai Wang Lin Zuo Chang