Greer Burns & Crain, Ltd.
Protective sheet disposing method
A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.
DISCO CORPORATION
H B H H B C H B H B B H H C H H
H01L B32B H01L H01L B32B C09J H01L B32B H01L B32B B32B H01L H01L C09J H01L H01L
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Yoshikuni Makoto Kazuki Takashi Mitsuru Yoshinori Shinichi Emiko Yuta
Migiyama Saito Sugiura Mori Ikushima Kakinuma Namioka Kawamura Taniyama