Slater & Matsil, L.L.P.
Package having substrate with embedded metal trace overlapped by landing pad
An embodiment package includes a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape, a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate, and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional inventional additional inventional additional inventional additional additional inventional inventional additional additional additional additional inventional additional additional additional additional
Yu-Min Mirng-Ji Yu-Feng
Liang Lii Chen