Antonelli, Terry, Stout & Kraus, LLP.
Adhesive for bonding circuit members, circuit board and process for its production
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
Hitachi Chemical Company, Ltd.
H Y H Y H H C H H H H H H Y H H H H H H H H H H H H H H Y H H H H H H H H H H H Y H H H Y H H H H H H H Y H Y H H H H H Y
H01L Y10T H01L Y10T H01L H01L C09J H01L H01L H01L H01L H01L H01L Y10T H01L H05K H05K H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L Y10T H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L Y10T H01L H05K H01L Y10T H01L H01L H01L H05K H01L H01L H01L Y10T H05K Y10T H01L H01L H01L H01L H01L Y10T
additional additional additional additional additional inventional inventional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional
Osamu Akira Kazuyoshi Kazuhiro Itsuo Kenzo
Watanabe Nagai Kojima Isaka Watanabe Takemura