Saile Ackerman LLC
Seed/AFM combination for CCP GMR device
Improved CPP GMR devices have been fabricated by replacing the conventional seed layer (typically Ta) with a bilayer of NiCr on Ta, said seed being deposited on the NiFe layer that constitutes a magnetic shield. Additional improvement was also obtained by replacing the conventional non-magnetic spacer layer of copper with a sandwich structure of two copper layers with an NOL (nano-oxide layer) between them. A process for manufacturing the devices is also described.
Headway Technologies, Inc.
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Y10T Y10T B82Y G11B Y10T B82Y G11B
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Min Ru-Ying Cheng T. Cherng Chyi Yue Yu-Hsia
Li Tong Horng Han Liu Chen