Schwabe, Williamson & Wyatt, P.C.
Low z-height package assembly
In embodiments, a package assembly may include a die coupled with one or more conductive pads. A barrier layer may be directly coupled with and between the die and one or more of the conductive pads. The package assembly may further include a solder resist layer coupled with the die and the conductive pads, and one or more interconnects positioned at least partially within the solder resist layer and directly coupled with one or more of the conductive pads.
INTEL CORPORATION
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Qinglei Sri Ranga Sai
Zhang Boyapati