Schwabe, Williamson & Wyatt, P.C.
Techniques and configurations to impart strain to integrated circuit devices
Embodiments of the present disclosure describe techniques and configurations to impart strain to integrated circuit devices such as horizontal field effect transistors. An integrated circuit device includes a semiconductor substrate, a first barrier layer coupled with the semiconductor substrate, a quantum well channel coupled to the first barrier layer, the quantum well channel comprising a first material having a first lattice constant, and a source structure coupled to the quantum well channel, the source structure comprising a second material having a second lattice constant, wherein the second lattice constant is different than the first lattice constant to impart a strain on the quantum well channel. Other embodiments may be described and/or claimed.
Intel Corporation
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Niloy Gilbert Ravi Marko
Mukherjee Dewey Pillarisetty Radosavljevic