Muncy, Geissler, Olds & Lowe, P.C.
Radiative cooling substrate and manufacturing method of the same
A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 μm to 10 μm. The chitosan layer emits radiation within a waveband between 8 μm and 13 μm.
National Tsing Hua University
C C C C C F F C
C25D C25D C09D C09D C25D F28F F28F C25D
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Hung-Sheng Yu-Bin
Han Chen