Slater Matsil, LLP
Contact area design for solder bonding
A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H Y H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L Y02P H01L H01L H05K H01L H01L H01L H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional inventional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional
Yu-Feng Pei-Chun Chen-Shien Sheng-Yu Tin-Hao Yu-Chih
Chen Tsai Chen Wu Kuo Huang