McKay and Hodgson, LLP
Semiconductor device and fabricating method thereof
A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.
Amkor Technology, Inc.
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Seung Jae Min Sang Won Boo Yang Sung Kyu
Lee Yoo Kim Jung Kim