Jianq Chyun  IP Office
Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor
A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface.
Industrial Technology Research Institute
H G G G
H01L G01B G01L G01L
additional inventional inventional inventional
Ming-Che Wei Ming-Ji John H. Ra-Min
Hsieh Li Dai Lau Tain