Law Offices of Charles Guenzer
Multi-component doping of copper seed layer
A method of sputtering a copper seed layer and the target used therewith. The copper included in the sputtering target includes a first dopant reactive with copper and a second dopant unreactive with copper. Examples of the first dopant include Ti, Mg, and Al. Examples of the second dopant include Pd, Sn, In, Ir, and Ag. The amount of the first dopant may be determined by testing stress migration and that of the second dopant by testing electromigration.
Applied Materials, Inc.
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Tram Peijun Ling Jie Suraj
Vo Ding Chen Chen Rengarajan