Ostrolenk, Faber, Gerb & Soffen, LLP
Photosensitive insulating paste and thick-film multi-layer circuit substrate
A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO2, B2O3 and K2O such that the compositional proportions by weight of the three components represented by (SiO2, B2O3, K2O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof. A thick-film multi-layer circuit substrate including the paste is also disclosed.
Murata Manufacturing Co., Ltd.
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Makoto Michiaki Hiromichi Shizuharu
Tose Iha Kawakami Watanabe