Murphy, Bilak & Homiller, PLLC
Selective plating of semiconductor package leads
A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.
Infineon Technologies AG
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Syahir Mian Mian Jagen Jayaganasan Christian Thomas Fabian
Abd Hamid Lam Krishnan Narayanasamy Stuempfl Stoek Schnoy