Oblon, Fisher, Spivak, McClelland & Maier
Hybrid integrated circuit and preparation thereof
 A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering. 
Denki Kagaku Kogyo Kabushiki Kaisha
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additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Shinichiro Kazuo Tatsuo
Asai Katoh Nakano