Lee & Morse, P.C.
Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2:
Cheil Industries, Inc.
H H H H C C H C C H H H H H C H H C C H H H H H C H H C
H01L H01B H01L H01B C08K C08K H01L C09J C09J H01L H01L H01L H01L H01L C09J H01L H01L C09J C09J H01L H01L H01L H01L H01L C09J H01L H01L C08K
additional inventional additional inventional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional
Nam Ju Arum Hyun Min Kyoung Soo Kyung Il Dong Seon Young Woo Joon Mo
Kim Yu Choi Park Sul Uh Park Seo