Myers Bigel Sibley & Sajovec, PA
Electrical interconnection structures including stress buffer layers
Provided are electrical connection structures and methods of fabricating the same. The structures may include a substrate including a bonding pad region provided with a bonding pad and a fuse region provided with a fuse, an insulating layer provided on the substrate and including a bonding pad opening exposing the bonding pad and a fuse opening exposing the fuse region, a connection terminal provided in the bonding pad region and electrically connected to the bonding pad, and a protection layer provided on the insulating layer including a first protection layer provided within the bonding pad region and a second protection layer in the fuse opening.
Samsung Electronics Co., Ltd.
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Jeonggi Jeong-woo Ju-il
Jin Park Choi