Cured thermoset for high thermal conductive materials
An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
Rohm and Haas Company Dow Global Technologies LLC
C H H C C H C C C H C C C C H
C08K H01L H01L C08K C08K H01L C08G C08K C08G H01L C08L C08K C08K C08K H01L
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Yu Yan Xiaomei Hongyu Wei
Zhang Huang Song Chen Liu