Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
 The present invention discloses a two basic structures (including multiple variations within one of the basic structures) and methods for fabrication of the structures which facilitate the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck. The basic structures address both the problem of breakdown of a heat transfer gas in an RF plasma environment and the problem of arcing between a semiconductor substrate and the conductive pedestal portion of the electrostatic chuck in such an RF plasma environment. 
Applied Materials, Inc.
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Brian Dan Robert J. Timothy Edwin C. Arik
Lue Maydan Steger Dyer Weldon Donde