Haynes and Boone, LLP
Qualitative fault detection and classification system for tool condition monitoring and associated methods
The present disclosure provides various methods for tool condition monitoring, including systems for implementing such monitoring. An exemplary method includes receiving data associated with a process performed on wafers by an integrated circuit manufacturing process tool; and monitoring a condition of the integrated circuit manufacturing process tool using the data. The monitoring includes evaluating the data based on an abnormality identification criterion, an abnormality filtering criterion, and an abnormality threshold to determine whether the data meets an alarm threshold. The method may further include issuing an alarm when the data meets the alarm threshold.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Tze-Liang Chin-Hsiang Jo Fei Jung-Chang Jong-I Po-Feng Chia-Tong
Lee Lin Wang Chen Mou Tsai Ho