Chemical mechanical polishing slurry, its preparation method and use for the same
A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.
Epoch Material Co., Ltd.
C C C H
C09K C09K C09G H01L
inventional inventional inventional inventional
Hui-Fang Yen-Liang Jui-Ching Wen-Cheng
Hou Chen Chen Liu