Eschweiler & Associates, LLC
Tool induced shift reduction determination for overlay metrology
One embodiment relates to a method for semiconductor workpiece processing. In this method, a baseline tool induced shift (TIS) is measured by performing a baseline number of TIS measurements on a first semiconductor workpiece. After the baseline TIS has been determined, the method determines a subsequent TIS based on a subsequent number of TIS measurements taken on a first subsequent semiconductor workpiece. The subsequent number of TIS measurements is less than the baseline number of TIS measurements.
Taiwan Semiconductor Manufacturing Co., Ltd.
G G
G01B G03F
inventional inventional
Heng-Jen Heng-Hsin Yung-Yao Ying Ying
Lee Liu Lee Wang