Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package
A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line portion and a block portion, wherein the block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The pad is bonded to the block portion. The non-conductive adhesive material covers the pad and seals the whole block portion of the bonding wire.
Advanced Semiconductor Engineering, Inc.
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Ho Ming Wei Chi Chang Ying Jian Cheng Hsiao Chuan Tsung Yueh Yi Shao
Tong Yih Hung Chen Chang Tsai Lai