Ladas & Parry, LLP
Semiconductor component, assembly and method for manufacturing semiconductor component
A semiconductor component 150 has a semiconductor layer 1 including a winding wire part 10 and a winding return wire part 50 connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side, wherein the semiconductor component is disposed so as to surround an object to be measured.
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
G G G G
G01R G01R G01R G01R
inventional inventional inventional inventional
Shinji Kenichi Kazuyuki Kenichi Mizue
Kunori Suzuki Sashida Yoshida Yamaji