Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor device having a cylindrical shaped conductive portion
A semiconductor device includes a first conductive portion, a second conductive portion, a first layer, and a second layer. The first conductive portion includes a first end portion and a first extending portion. The first extending portion extends in a first direction. The length of the first extending portion in a second direction is shorter than a length of at least a part of the first end portion in the second direction. The first layer includes multiple semiconductor chips, multiple passive chip components, and a resin. The first extending portion includes a first portion and a second portion. The first layer is provided around the first portion. The first layer expands along a first plane. The first plane intersects the first direction. The second layer includes a first multilayer wiring. The second layer expands along a second plane intersecting the first direction.
Kabushiki Kaisha Toshiba
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additional additional additional inventional additional additional additional additional inventional additional inventional inventional additional additional additional inventional additional additional inventional additional additional additional additional additional inventional additional inventional additional additional inventional inventional additional additional additional inventional inventional
Hiroshi Nobuto
Yamada Managaki