Additon, Higgins & Pendleton, P.A.
Organic film CMP slurry composition and polishing method using same
The present invention relates to an organic film CMP slurry composition for polishing an organic film, which includes at least either of a polar solvent or a non-polar solvent and a metal oxide abrasive, is acidic, and has a carbon content of around 50 to 95 atm %, and a polishing method using the same.
Samsung SDI Co., Ltd.
C C C C C H H C C C H B B
C09K C09G C09K C09G C09K H01L H01L C09K C09G C09G H01L B24B B24B
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Yong Soon Dong Hun Jung Min Go Un Haruki Tae Wan Yong Sik
Park Kang Choi Kim Nojo Kim Yoo