McDermott Will & Emery LLP
Method for bonding with a silver paste
Disclosed is a method for bonding with a silver paste, the method including: coating a silver paste on a semiconductor device or a substrate, the silver paste containing silver and indium; disposing the semiconductor on the substrate; and heating the silver paste to form a bonding layer, wherein the semiconductor device and the substrate are bonded to each other through the bonding layer, and wherein the indium is contained in the silver paste at 40 mole % or less.
HYUNDAI MOTOR COMPANY
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Jong Seok Su Bin Dae Hwan Kyoung-Kook Hyun Woo Youngkyun
Lee Kang Chun Hong Noh Jung