Finnegan, Henderson, Farabow, Garrett and Dunner
Semiconductor IC device with dummy wires
 A plurality of cells providing constituent elements for a semiconductor integrated circuit are provided in and on a major surface of a semiconductor substrate of a semiconductor integrated circuit chip. A plurality of wires are each provided between a cell and a cell to provide cell-to-cell wires. A plurality of dummy wires are connected to an internal power source terminal of a second power source potential which is different from a first power source terminal. A capacitance is created between the dummy wire and the semiconductor substrate to prevent a voltage fluctuation at the power source. The dummy wires are selectively cut off the internal power source terminal of the second potential to correct a wrong connection line or a signal delay time. 
Kabushiki Kaisha Toshiba
H H H
H01L H01L H01L
inventional additional inventional
Shinichi Satoshi Masayo
Wakabayashi Wada Fukuda