Maschoff Brennan
Method of forming a molding layer for semiconductor package
A method of forming a molding layer includes the following operations: forming a substrate having at least one column structure thereon; flipping over the substrate having the column structure such that the column structure is beneath the substrate; dipping the column structure of the flipped substrate into a molding material fluid contained in a container; and separating the column structure of the flipped substrate from the container to form a molding layer covering and in contact with the column structure.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Jie Hsien-Wei
Chen Chen