Lowe, Price, LeBlanc & Becker
Epoxy resin composition for sealing semiconductor
 Disclosed herein is an epoxy resin composition for sealing a semiconductor, which contains a flexibilizer, epoxy resin, a hardener, a hardening accelerator, a filler, a mold releasing agent, a colorant and a finishing agent. The flexibilizer is prepared from silicone containing hydroxyphenyl groups on ends of and/or in its molecules, which is formed of a copolymer of denatured silicone oil A having hydroxyphenyl groups, denatured silicone oil B having epoxy groups and/or bifunctional epoxy resin having epoxy groups on both ends. In addition to heat resistance, moisture resistance, a low elastic modulus, a low thermal expansion coefficient and a high glass-transition temperature, the epoxy resin composition according to the present invention has toughness which is higher than that of a conventional one, due to fine dispersion of silicone. 
Mitsubishi Denki Kabushiki Kaisha
C C C C
C08L C08L C08G C08G
inventional inventional inventional inventional
Ichiro Hiromi Hirozoh
Takahashi Ito Kanegae