McAndrews, Held & Malloy
Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same
A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.
Amkor Technology, Inc.
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Seo Won Joon Young Kyeong Sool Jin Suk
Lee Park Seong Jeong