Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor device
According to an embodiment, a semiconductor device includes a first metal plate, a second metal plate, and two or more semiconductor units. The two or more semiconductor units are disposed on the first metal plate. The each of the two or more semiconductor units includes a first metal member, a second metal member, and a semiconductor element. The first metal member has a first connection surface connected to the first major surface. The second metal member has a second connection surface connected to the second major surface. The semiconductor element includes an active region having surfaces respectively opposing the first connection surface and the second connection surface. A surface area of the first connection surface is greater than a surface area of the surface of the active region opposing the first connection surface. A surface area of the second connection surface is greater than a surface area of the surface of the active region opposing the second connection surface.
TOSHIBA ENERGY SYSTEMS & SOLUTIONS CORPORATION KABUSHIKI KAISHA TOSHIBA
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Kazuyasu Naotake Toshiharu Yuuji Nobumitsu Naoki Hiroaki Yuta Daisuke Hitoshi Hiroki Naotaka
Takimoto Watanabe Ohbu Hisazato Tada Yamanari Ito Ichikura Hiratsuka Matsumura Sekiya Iio