Birch, Stewart, Kolasch & Birch, LLP
Method for forming semiconductor device structure
Embodiments of the disclosure provide a method for forming a semiconductor device structure. The method includes forming a dielectric layer over a semiconductor substrate. The method also includes applying a carbon-containing material over the dielectric layer. The method further includes irradiating the dielectric layer and the carbon-containing material with a light to repair the dielectric layer, and the light has a wavelength greater than about 450 nm.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chung-Chi Chia-Cheng Po-Cheng Chih-Hung Joung-Wei Tze-Liang Kuang-Yuan
Ko Chou Shih Sun Liou Lee Hsu