Carrier substrate and method for making the same
A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the PCB side in an array manner. The plurality of resilient flanges electrically connects with the LGA pads correspondingly.
Unimicron Technology Corp.
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Ling-Kai Wen-Fang Shih-Jung
Su Liu Huang