Patterson & Sheridan, LLP
Method and structure of expanding, upgrading, or fixing multi-chip package
Embodiments of the present invention generally provide techniques and apparatus for altering the functionality of a multi-chip package (MCP) without requiring entire replacement of the MCP. The MCP may be designed with a top package substrate designed to interface with an add-on package that, when sensed by the MCP, alters the functionality of the MCP.
Qimonda AG
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Octavian Lee Ward Oliver Jong Hoon Klaus Josef Jung Pill Wayne Frederick
Beldiman Collins Kiehl Oh Hummler Schnell Kim Ellis