Harness Dickey & Pierce, P.L.C.
Liquid-based gravity-driven etching-stop technique for controlling structure dimension
A liquid-based gravity-driven etching-stop technique for controlling structure dimension is provided, where opposite etching trenches in cooperation with an etching-stop solution are used for controlling the dimension of a microstructure on the wafer level. In an embodiment, opposite trenches surrounding the microstructure are respectively etched on sides of the wafer, and the trench depth on the side of the wafer, on which the microstructure is, is equal to the design dimension of the microstructure. Contrarily, it is unnecessary to define the trench depth on the back-side of the chip. In the final step of the fabrication process, when the device is etched, such that the trenches on the sides communicate with each other to separate the microstructure from the whole wafer automatically and thereby shift from the etchant into the etching-stop solution to stop etching.
Industrial Technology Research Institute
G B B B B H
G01Q B81B B81C B82Y B81C H01L
inventional additional additional inventional inventional inventional
Wei-Chin Ching-Hsiang Gen-Wen Chao-Chiun Yuh-Wen Hui-Ling
Lin Tsai Hsieh Liang Lee Chang