Sughrue Mion, PLLC
Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin composition for photosemiconductor element encapsulation, which comprises the following components (A) to (C):
Nitto Denko Corporation
C C C C Y Y C H C C C C
C08G C08G C08G C08G Y10T Y10T C08L H01L C08G C08G C08G C08L
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Hisataka
Ito