Wenderoth, Lind & Ponack, L.L.P.
Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition
A deposition apparatus includes a processing chamber internally having a reduced-pressure space for deposition process to be carried out therein, a base material holding member for holding a base material to be subjected to the deposition process, a target support member for supporting a target thereon, and a power supply unit for applying electric power to the target support member to generate a plasma in the reduced-pressure space. In the deposition apparatus, deposition process is carried out by using the target, which has a recess portion in its surface and in which a powder target formed of a powder material is placed in an inner surface of the recess portion. Thus, the in-plane uniformity of deposition rate is improved and a stable film deposition is fulfilled.
Panasonic Corporation
H C
H01J C23C
inventional inventional
Hideki Hitoshi Tadashi Takafumi Hiroshi Hirokazu
Yamashita Yamanishi Kimura Okuma Hayata Nakaue