Harness, Dickey & Pierce, P.L.C.
Die bonding apparatus
The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.
Samsung Electronics Co., Ltd.
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Yisung Chulmin Yongdae Jaeryoung Teaseog Yongjin
Hwang Kim Ha Lee Um Jung