Slater Matsil, LLP
3-D package having plurality of substrates
A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first plurality of connectors over and electrically coupled to the redistribution lines. A first die is over and bonded to the first plurality of connectors. The first die includes a second substrate, and through-vias in the second substrate. A second die is over and bonded to the plurality of connectors. The first die and the second die are electrically coupled to each other through the redistribution lines. A second plurality of connectors is over the first die and the second die. The second plurality of connectors is electrically coupled to the first plurality of connectors through the through-vias in the second substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional inventional inventional additional additional additional additional additional inventional additional inventional additional inventional additional additional additional inventional additional additional additional additional additional inventional additional additional inventional additional additional inventional additional inventional additional additional inventional inventional additional additional inventional inventional inventional inventional additional additional inventional additional additional additional inventional additional inventional inventional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional inventional additional additional
Chin-Chuan Chen-Hua Jing-Cheng
Chang Yu Lin