Haynes and Boone, LLP
Seal ring structure with metal pad
A method includes providing a substrate having a seal ring region and a circuit region, forming a seal ring structure over the seal ring region, forming a first frontside passivation layer above the seal ring structure, etching a frontside aperture in the first frontside passivation layer adjacent to an exterior portion of the seal ring structure, forming a frontside metal pad in the frontside aperture to couple the frontside metal pad to the exterior portion of the seal ring structure, forming a first backside passivation layer below the seal ring structure, etching a backside aperture in the first backside passivation layer adjacent to the exterior portion of the seal ring structure, and forming a backside metal pad in the backside aperture to couple the backside metal pad to the exterior portion of the seal ring structure. Semiconductor devices fabricated by such a method are also provided.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsin-Hui Wen-De Jeng-Shyan Dun-Nian Jen-Cheng Shu-Ting
Lee Wang Lin Yaung Liu Tsai