Birch, Stewart, Kolasch & Birch, LLP
Resin molding equipment and resin molding method
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.
APIC Yamada Corporation
H H B H B B B B B H H B B B
H01L H01L B29C H01L B29C B29C B29C B29C B29C H01L H01L B29C B29C B29C
inventional inventional additional additional inventional additional inventional additional inventional additional additional additional inventional additional
Kazuro Haruhisa Kenji Fumio Naoya Haruhisa Haruhisa Kazuhiko
Wada Takahashi Nakajima Miyajima Gotoh Makino Takahashi Kobayashi