Jiang Chyun IP Office
Bump manufacturing method
A method of forming bumps on the active surface of a silicon wafer. A first under-ball metallic layer is formed over the active surface of the wafer. A second under-ball metallic layer is formed over the first under-ball metallic layer. A portion of the second under-ball metallic layer is removed to expose the first under-ball metallic layer. A plurality of solder blocks is implanted over the second under-ball metallic layer. A reflux operation is conducted and then the exposed first under-ball metallic layer is removed so that only the first under-ball metallic layer underneath the second under-ball metallic layer remains.
Advanced Semiconductor Engineering, Inc.
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Jau-Shoung Chao-Fu Ho-Ming Jen-Kuang Yung-Chi Ching-Huei Chun-Chi Min-Lung
Chen Weng Tong Fang Lee Su Lee Huang