Slater Matsil, LLP
Devices employing thermal and mechanical enhanced layers and methods of forming same
A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Li-Hsien Chi-Hsi Hsien-Wei Der-Chyang Wei-Cheng Chen-Hua Tsung-Shu Chin-Chuan Wei-Yu Ying-Ju An-Jhih
Huang Wu Chen Yeh Wu Yu Lin Chang Chen Chen Su