Rothwell, Figg, Ernst & Manbeck, P.C.
Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film.
LG CHEM, LTD.
G C G H H G
G03F C08G G03F H05K H05K G03F
inventional inventional inventional inventional additional inventional
Jung-Hak You-Jin Hee-Jung Kwang-Joo
Kim Kyung Kim Lee