Maschoff Brennan
Inspection and cleaning system and method for the same
A system includes an inspection device and an image processing unit. The inspection device is configured to scan a wafer to generate an inspected image. The image processing unit is configured to receive the inspected image, and is configured to analyze the inspected image by using at least one deep learning algorithm in order to determine whether there is any defect image shown in a region of interest in the inspected image. When there is at least one defect image shown in the region of interest in the inspected image, the inspection device is further configured to magnify the region of interest in the inspected image to generate a magnified inspected image for identification of defects.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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In-Tsang Yu-Ting Tien-Wen Jui-Kuo Hsin-Hui Jun-Xiu Chung-Pin Sheng-Wen
Lin Wang Wang Lai Chou Liu Chou Huang