WPAT, P.C., Intellectual Property Attorneys
Semiconductor package structure and manufacturing method thereof
A semiconductor structure includes a substrate; a die disposed over the substrate, and including a die pad, a conductive via disposed over the die pad and a dielectric material surrounding the conductive via; a molding disposed over the substrate and surrounding the die; a lower dielectric layer disposed nearer the substrate and over the dielectric material and the molding; and an upper dielectric layer disposed further the substrate and over the lower dielectric layer, wherein a material content ratio in the upper dielectric layer is substantially greater than that in the lower dielectric layer, and the material content ratio substantially inversely affects a mechanical strength of the upper dielectric layer and the lower dielectric layer.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chih-Kang Hsin-Chieh Hsi-Kuei Ching-Fu
Han Huang Cheng Chang