Greenblum & Bernstein, P.L.C.
Light-emitting module and lamp using same
A light-emitting module includes a substrate, an LED chip arranged on a main surface of the substrate, a sealing member covering the LED chip on the main surface of the substrate and converting a wavelength of the light produced by the LED chip, and a heat transfer member thermally connecting the sides of the LED chip to the main surface of the substrate and dissipating heat produced by the LED chip to the substrate. The heat transfer member is made up of a silicone resin having particles dispersed therein, the particles being nanoparticles of ZrO2 and microparticles of MgO, which have higher thermal conductivity than the silicone resin.
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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Kazuyuki Toshio Ikuko Takaari Makoto
Okano Mori Aoki Uemoto Horiuchi