McDermott Will & Emery LLP
Chemical mechanical polishing apparatus and polishing method using the same
A chemical mechanical polishing apparatus includes a platen, a polishing head, a magnetizable polishing pad, and an electromagnetic component. The magnetizable polishing pad is disposed between the polishing head and the platen. The electromagnetic component is configured for fastening the magnetizable polishing pad on the platen.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
B B B
B24B B24B B24B
inventional inventional inventional
Sheng-Chen Yuan-Hsuan Feng-Inn
Wang Chen Wu