Haynes and Boone, LLP
Backside illumination sensor having a bonding pad structure and method of making the same
The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure comprises a device substrate having a front side and a back side; an interconnect structure disposed on the front side of the device substrate; and a bonding pad connected to the interconnect structure. The bonding pad comprises a recessed region in a dielectric material layer; a dielectric mesa of the dielectric material layer interposed between the recessed region; and a metal layer disposed in the recessed region and on the dielectric mesa.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Shuang-Ji Dun-Nian Jen-Cheng Wen-De Yueh-Chiou Jeng-Shyan
Tsai Yaung Liu Wang Lin Lin