Birch, Stewart, Kolasch & Birch, LLP
Photoresist polymeric compound and photoresist resin composition
A polymeric compound for photoresist of the present invention includes a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton in the structure. The monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton includes a monomer unit represented by the following Formula (I): wherein R is a hydrogen atom or a methyl group. The polymeric compound for photoresist may include a monomer unit having 2,6-dioxabicyclo[3.3.0]octane skeleton, a monomer unit having a group of adhesion to substrate, and a monomer unit having an acid-eliminating group. The polymeric compound for photoresist of the present invention exhibits not only adhesion to substrate, acid-eliminating property and resistance to dry-etching but also has well-balanced solubility in solvents for photoresist and alkali-soluble property.
Daicel Chemical Industries, Ltd.
C Y C G G Y
C08F Y10S C08F G03F G03F Y10S
additional additional inventional inventional additional additional
Kiyoharu Hiroshi Masamichi
Tsutsumi Koyama Nishimura