Liu & Liu
Wafer coating system and method of manufacturing chip package
A wafer coating system includes a wafer chuck, a flowing insulating material sprayer and a wafer tilting lifting pin. The wafer chuck has a carrier part and a rotating part, which the carrier part is mounted on the rotating part to carry a wafer, and the rotating part is configured to rotate with a predetermined axis. The flowing insulating material sprayer is above the wafer chuck and configured to spray a flowing insulating material to the wafer, and the wafer tilting lifting pin is configured to form a first acute angle between the wafer and direction of gravity.
XINTEC INC.
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Chien-Hui Quan-Qun Chuan-Jin Yu-Tung Yen-Shih Hsiao-Lan
Chen Su Shiu Chen Ho Yeh