Maschoff Brennan
Flexible electronic device and method for manufacturing the same
A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
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Yuh-Zheng Shi-Chang Chen-Chu Cheng-Yi Ko-Chin
Lee Chen Tsai Wang Yang