Sheppard, Mullin, Richter & Hampton LLP
High reliability lead-free solder alloys for harsh environment electronics applications
A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloy is particularly suitable for, but not limited to, producing solder joints, in the form of solder preforms, solder balls, solder powder, or solder paste (a mixture of solder powder and flux), for harsh environment electronics. An additive selected from 0.1-2.5 wt. % of Bi and/or 0.1-4.5 wt. % of In may be included in the solder alloy.
INDIUM CORPORATION
H H H H H H H H H H C H H H C H H H H H H B H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L C22C H01L H01L H01L C22C H01L H01L H01L H01L H01L H01L B23K H01L H01L H01L H01L H01L H01L H01L
additional additional inventional additional inventional additional additional additional additional inventional inventional additional additional additional inventional additional additional inventional additional additional additional inventional inventional additional additional additional additional additional additional
Weiping Ning-Cheng
Liu Lee