Heat sink assembly
An electronic assembly includes a printed circuit board mounted with an electronic component, a heat sink, and a clip securing the heat sink on the printed circuit board to enable the heat sink to have an intimate contact with the electronic component. The printed circuit board forms two engaging portions each defining a receiving hole therein. The heat sink includes a base and a plurality of fins. The clip includes a pressing member pressing the heat sink to the electronic component, two V-shaped operating members extending slantwise from ends of the pressing member, and two clasps extending outwardly from ends of the operating members. Height of each of the clasps is larger than that of each of the receiving holes of the engaging portions. The clasps of the clip lock with the engaging portions by manipulating the operating members.
Foxconn Technology Co., Ltd. Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
Y Y H H H
Y10T Y10T H01L H01L H01L
additional additional inventional additional inventional
Jian Jing Xiang-Yang Jian
Yang Zhang He Liu