Tutunjian & Bitetto, P.C.
Surface nitridation in metal interconnects
Methods of forming vias include nitridizing exposed surfaces of a first layer and an exposed surface of a conductor underlying the first layer to form a layer of nitridation at said exposed surfaces. Material from the layer of nitridation at the exposed surface of the underlying conductor is etched away. The exposed surface of the underlying conductor is etched away to form a recessed area in the underlying conductor after etching away material from the layer of nitridation. A conductive via that forms a conductive contact with the underlying conductor is formed.
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Roger A. Wei Terry A. Lawrence A. Chih-Chao
Quon Wang Spooner Clevenger Yang