Haynes and Boone, LLP
Semiconductor device having a liner layer with a configured profile
Devices and methods that include for configuring a profile of a liner layer before filling an opening disposed over a semiconductor substrate. The liner layer has a first thickness at the bottom of the opening and a second thickness a top of the opening, the second thickness being smaller that the first thickness. In an embodiment, the filled opening provides a contact structure.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Joanna Chaw Yane Hua Feng
Yin Chen