Myers Bigel Sibley & Sajovec, P.A.
Methods of fabricating semiconductor devices having buried word line interconnects
A semiconductor device includes a semiconductor substrate having a cell region and a peripheral circuit region defined therein. A buried word line is disposed in the substrate in the cell region and has a top surface lower than top surfaces of cell active regions in the cell region. A gate line is disposed on the substrate in the peripheral circuit region. A word line interconnect is disposed in the substrate in the peripheral circuit region, the word line interconnect including a first portion contacting the buried word line and having a top surface lower than a top surfaces of the cell active regions and a second portion that is overlapped by and in contact with the gate line.
Samsung Electronics Co., Ltd.
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Young-Woong Bong-Soo Yun-Gi Hyeoung-Won
Son Kim Kim Seo