Sughrue Mion, PLLC
Flexible semiconductor device and method of manufacturing the same
Provided is a method of transferring semiconductor elements formed on a non-flexible substrate to a flexible substrate. Also, provided is a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. A semiconductor element grown or formed on the substrate may be efficiently transferred to the resin layer while maintaining an arrangement of the semiconductor elements. Furthermore, the resin layer acts as a flexible substrate supporting the vertical semiconductor elements.
Samsung Electronics Co., Ltd.
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Y02E H01L H01L H01L H01L
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Eun-hyoung Jin-seung Jun-hee
Cho Sohn Choi