Foley & Lardner LLP
Embedded trace substrate structure and semiconductor package structure including the same
A substrate structure includes a carrier, a first metal layer, a circuit layer and a dielectric layer. The carrier has a first surface and a second surface. The first metal layer is disposed on the first surface of the carrier. The circuit layer is disposed on the first metal layer. The dielectric layer covers the circuit layer and defines a plurality of openings to expose portions of the circuit layer and portions of the first metal layer.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Yu-Ying
Lee