Foley & Lardner LLP
Semiconductor substrate and semiconductor package structure
A semiconductor substrate includes an insulating layer, a first conductive patterned layer disposed adjacent to a first surface of the insulating layer, and conductive bumps disposed on the first conductive patterned layer. Each conductive bump has a first dimension along a first direction and a second dimension along a second direction perpendicular to the first direction, and the first dimension is greater than the second dimension. A semiconductor package structure includes the semiconductor substrate, at least one die electrically connected to the conductive bumps, and a molding compound encapsulating the conductive bumps.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Sheng-Ming Kuang-Hsiung Yu-Ying Tien-Szu
Wang Chen Lee Chen