Foley & Lardner LLP
Semiconductor packages
A method of manufacturing a semiconductor package includes: (1) providing a first passivation layer on a carrier; (2) patterning the first passivation layer to define a first hole; (3) disposing a first seed layer on the first hole; (4) disposing a first conductive layer on the first seed layer; (5) replacing the carrier with a second passivation layer; (6) patterning the second passivation layer to define a second hole exposing the first seed layer; and (7) disposing a second conductive layer on the exposed first seed layer through the second hole.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Hung-Sheng Yuan-Fu Ming-Chi Shin-Hua
Chen Sung Liu Chao