Myers Bigel, P.A.
Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrate
Disclosed are a substrate drying apparatus, a facility of manufacturing a semiconductor device, and a method of drying a substrate. The substrate drying apparatus includes a chamber that is configured to dry a substrate at a first temperature, a first reservoir that is configured to store a first supercritical fluid at a second temperature that is less than the first temperature, a second reservoir that is configured to store a second supercritical fluid at a third temperature that is greater than the first temperature, and a supply unit connected between the chamber and the first reservoir and/or second reservoir. The supply unit is configured to supply the chamber with the first supercritical fluid and second supercritical fluid.
SAMSUNG ELECTRONICS CO., LTD.
B H H H H F F H H H H H B
B08B H01L H01L H01L H01L F26B F26B H01L H01L H01L H01L H01L B08B
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Yungjun Young-Hoo Yong-Jhin Jihoon Kuntack
Kim Kim Cho Jeong Lee