Stroock & Stroock & Lavan LLP
Method and apparatus for bonding using brazing material
 High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film. 
Seiko Epson Corporation
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C23G B23K B23K B23K
inventional inventional additional inventional
Yoshiaki Takuya Satoshi Yasuhiko Makoto Yohei Osamu
Mori Miyakawa Miyamori Asano Anan Kurashima Kurashina