McDermott Will & Emery LLP
Method for manufacturing a semiconductor device
In a method of manufacturing a semiconductor device, a first layer having an opening is formed over a substrate. A second layer is formed over the first layer and the substrate. A photo resist pattern is formed over the second layer above the opening of the first layer. The photo resist pattern is reflowed by a thermal process. An etch-back operation is performed to planarize the second layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Jieh-Jang Yi Jen Tsai-Ming Ching-Sen Feng-Jia Cheng-Che
Chen Tsai Huang Kuo Shiu Chung