Bond pad reliability of semiconductor devices
According to an aspect of the present disclosure, a semiconductor device is provided that includes a substrate, at least one bond pad, a passivation layer and a NBLoK layer. The bond pad is formed over the substrate. The passivation layer is deposited over the substrate and has an opening defined by end portions of the passivation layer over the bond pad. The NBLoK layer is covering the end portions of the passivation layer.
GLOBALFOUNDRIES Singapore Pte. Ltd.
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Juan Boon Ramasamy Xiaodong
Tan Chockalingam Li