ScienBiziP, P.C.
Lead frame and light emitting diode package having the same
A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Yu-Lun Che-Hsang Yau-Tzu Lung-Hsin Yu-Liang Pin-Chuan Chao-Hsiung Hsing-Fen Wen-Liang
Hsieh Huang Jang Chen Huang Chen Chang Lo Tseng