Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Substrate structure and fabrication method thereof
A substrate structure is provided, which includes: a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and having a plurality of openings for correspondingly exposing the conductive pads; and a plurality of ring bodies formed in the openings and corresponding in position to edges of the conductive pads. As such, a plurality of conductive elements can be subsequently formed inside the ring bodies so as to be prevented by the ring bodies from expanding outward during a reflow process, thereby protecting the insulating layer from being compressed by the conductive elements and preventing cracking of the insulating layer.
Siliconware Precision Industries Co., Ltd.
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Cheng-An Sung-Huan Yi-Cheih Wen-Kai Chien-Hung
Chang Sun Chen Liao Wu