Dorsey & Whitney LLP
Interposers having encapsulant fill control features
Interposers having an encapsulant fill control feature are disclosed. In one embodiment, an interposer includes a substrate having a first surface proximate the semiconductor component, and a fill control feature projecting from the first surface toward a region adapted to be occupied by a semiconductor component. The fill control feature is positioned between the region and the substrate and is sized to at least partially block an opening between a semiconductor component that may be positioned in the region and the first surface. As an encapsulant material is flowed about the semiconductor component, the fill control feature at least partially blocks the encapsulant material from entering the opening. The encapsulant material may then substantially surround the semiconductor component, after which the encapsulant material may substantially fill a space between the semiconductor component and the interposer.
Micron Technology, Inc.
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David J. Todd O.
Corisis Bolken