Maschoff Brennan
Strategic placement of plastic structures for EMI management of transceiver module
An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
II-VI Delaware Inc.
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Tat Ming Hon Siu William H. Jinxiang John Troy Wy Piew
Teo Wee Wang Liu Hsieh Chiang