McDermott Will & Emery LLP
Multilayer ceramic electronic component, manufacturing method thereof, and board for mounting the same
A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02≦(CW2 or CW3)−CW1≦0.10.
Samsung Electro-Mechanics Co., Ltd.
Y H H H
Y10T H01G H01G H05K
additional inventional inventional inventional
Min Gon Seung Ho Dae Bok Jong Han
Lee Lee Oh Kim