Haynes and Boone, LLP
Patterning process with silicon mask layer
A lithography method is provided in accordance with some embodiments. The lithography method includes forming an under layer on a substrate; forming a silicon-containing middle layer on the under layer, wherein the silicon-containing middle layer has a thermal base generator (TBG) composite; forming a photosensitive layer on the silicon-containing middle layer; performing an exposing process to the photosensitive layer; and developing the photosensitive layer, thereby forming a patterned photosensitive layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chin-Hsiang Ching-Yu Chen-Yu
Lin Chang Liu