Ceramic base component packaging assembly
 A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device. 
International Business Machines Corporation
H
H01C
inventional
Herman P. Donald P. Eric P. James C.
Meyer Rearick Lovgren Gordon