Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
An apparatus for a stacked silicon interconnect technology (SSIT) product comprises an interposer die, a plurality of integrated circuit dies, a plurality of active components forming an active connection between the integrated circuit dies and the interposer die, and a plurality of dummy components at the interposer die, the dummy components not forming an active connection between the integrated circuit dies and the interposer die. At least a subset of the dummy components forms a pattern, and the pattern comprises an identifier for the interposer die.
XILINX, INC.
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Myongseob Mohsen H. Cinti X. Xiao-Yu
Kim Mardi Chen Li