Stevens, Davis, Miller & Mosher
Three-dimensional stacked LSI
 Disclosed is a three-dimensionally stacked LSI having a plurality of integrated-circuit layers stacked together, each of which is equipped with a plurality of circuit elements. Each of the circuit elements are equipped a power terminal of its own, which is connected through interlayer via-hole wiring to the power wiring of the uppermost integrated-circuit layer. The power wiring of the uppermost integrated-circuit layer is formed of a metal exhibiting a low electrical resistance, for example, Al, whereas the metal wirings of the other layers, which are exposed to high temperatures when forming the upper layers, are formed of W. 
Matsushita Electric Industrial Co., Ltd.
H H H H
H01L H01L H01L H01L
inventional additional inventional inventional
Kenichi Yasuhiro Yoshiyuki Shigenobu
Yamazaki Tomita Takagi Akiyama