McAndrews, Held & Malloy
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.
Amkor Technology, Inc.
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JongSik JinHan SeWoong SeungJae SungKyu DongJin JinYoung YoonJoo DooHyun JaeHun
Paek Kim Cha Lee Kim Kim Kim Kim Park Bae