Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Semiconductor device with improved encapsulating resin
 A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler. 
Kabushiki Kaisha Toshiba
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additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional
Soichi Hiroshi Takasi Masayuki Kazuki Miki
Honma Yamada Togasaki Saito Tateyama Mori