Harness, Dickey & Pierce, P.L.C.
Wafer temporary bonding method using silicon direct bonding
A wafer temporary bonding method using silicon direct bonding (SDB) may include preparing a carrier wafer and a device wafer, adjusting roughness of a surface of the carrier wafer, and combining the carrier wafer and the device wafer using the SDB. Because the method uses SDB, instead of an adhesive layer, for a temporary bonding process, a module or process to generate and remove an adhesive is unnecessary. Also, a defect in a subsequent process, for example, a back-grinding process, due to irregularity of the adhesive may be prevented.
Samsung Electronics Co., Ltd.
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Pil-kyu Seung-woo Jong-wook Jung-ho Dae-lok
Kang Choi Lee Kim Bae