Jiang Chyun IP Office
Bump and fabricating process thereof
A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 μm is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.
Advanced Semiconductor Engineering, Inc.
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Po-Jen Jeng-Da Ho-Ming Chih-Huang Chun-Chi Wen-Pin Su William Tze-You
Cheng Wu Tong Chang Lee Huang Tao Chen