Sterne, Kessler, Goldstein & Fox P.L.L.C.
Image sensor with pad structure
The present disclosure relates to an image sensor with a pad structure formed during a front-end-of-line process. The pad structure can be formed prior to formation of back side deep trench isolation structures and metal grid structures. An opening is formed on a back side of the image sensor device to expose the embedded pad structure and to form electrical connections.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Yun-Wei Chun-Hao Hsun-Ying Kuo-Cheng Yin-Chieh
Cheng Chou Huang Lee Huang