Locke Lord LLP
Electronic device and heat sink
The invention provides a heat sink. The heat sink is configured to be in thermal contact with a heat source. The heat sink includes a base portion, a plurality of fin portions, and a wall portion. The base portion includes a thermal contact surface and a rear surface. The thermal contact surface is configured to be in thermal contact with the heat source, and the rear surface faces away from the thermal contact surface. The fin portions protrude from the rear surface of the base portion. The wall portion protrudes from the rear surface of the base portion and surrounds the fin portions. In addition, the invention also provides an electronic assembly including the heat sink.
INVENTEC (PUDONG) TECHNOLOGY CORPORATION INVENTEC CORPORATION
H H H H H G
H05K H01L H05K H01L H01L G06F
inventional inventional inventional additional inventional inventional
Hung-Ju Kai-Yang
Chen Tung