Hamilton, Brook, Smith & Reynolds
Laser-induced cutting of metal interconnect
 An electrical interconnect includes a substrate having an insulating surface upon which is placed an electrically-conductive cut-link pad and a pair of electrically-conductive lines. The lines are bonded to the cut-link pad and are substantially more resistant to heat flow per unit length than is the cut-link pad. In a preferred embodiment, the thermal resistance per unit length of the cut-link pad is lowered by designing the pad such that its width is greater than the width of either of the lines. A method for cutting a circuit includes directing a laser upon the cut-link pad of an interconnect, as described above. The laser is maintained upon the pad until the cut-link pad is ablated, severing the circuit. 
Massachusetts Institute of Technology University of Maryland
H H H H H H H H H H
H01L H05K H05K H05K H01L H01L H01L H05K H05K H01L
inventional additional additional additional inventional inventional inventional inventional additional additional
Zhihui Joseph B.
Duan Bernstein