Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Electronic package and method for fabricating the same
An electronic package is provided, including: a first carrying structure having a first circuit layer; a package module disposed on the first carrying structure and electrically connected to the first circuit layer; a first electronic component disposed on the first carrying structure and electrically connected to the first circuit layer; and a second electronic component stacked on and electrically connected to the first electronic component. As the second electronic component is stacked with the first electronic component, a surface area of the first carrying structure that the first and second electronic components occupy is reduced, and the electronic package can have sufficient space to accommodate the package modules. A method for fabricating an electronic package is also provided.
Siliconware Precision Industries Co., Ltd.
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Cheng-Kai Hsin-Yi
Chang Liao