Eschweiler & Potashnik, LLC
Array boundfary structure to reduce dishing
A semiconductor structure including a semiconductor substrate and at least one patterned dielectric layer is provided. The semiconductor substrate includes a semiconductor portion, at least one first device, at least one second device and at least one first dummy ring. The at least one first device is disposed on a first region surrounded by the semiconductor portion. The at least one second device and the at least one first dummy ring are disposed on a second region, and the second region surrounds the first region. The at least one patterned dielectric layer covers the semiconductor substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Meng-Han Chien-Hung Li-Feng Wei-Cheng Te-Hsin
Lin Chang Teng Wu Chiu