Slater Matsil, LLP
Contact structures and methods of forming the same
Embodiments of the present disclosure include contact structures and methods of forming the same. An embodiment is a method of forming a semiconductor device, the method including forming a contact region over a substrate, forming a dielectric layer over the contact region and the substrate, and forming an opening through the dielectric layer to expose a portion of the contact region. The method further includes forming a metal-silicide layer on the exposed portion of the contact region and along sidewalls of the opening; and filling the opening with a conductive material to form a conductive plug in the dielectric layer, the conductive plug being electrically coupled to the contact region.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chih-Wei Yu-Hung Chia-Lin Sheng-Hsuan You-Hua
Chang Lin Hsu Lin Chou