Greer Burns & Crain, Ltd.
Dividing method of workpiece and laser processing apparatus
A dividing method of a workpiece includes a dicing tape sticking step of sticking a dicing tape to the workpiece. A first laser processing step includes irradiating the workpiece with a laser beam with such a wavelength as to be absorbed by the workpiece along a first direction to form first laser-processed grooves. A first expanding step includes expanding the dicing tape in a second direction to enlarge the width of the first laser-processed grooves. A second laser processing step includes irradiating the workpiece with the laser beam with such a wavelength as to be absorbed by the workpiece along the second direction to form second laser-processed grooves, and a second expanding step includes expanding the dicing tape in the first direction to enlarge the width of the second laser-processed grooves.
DISCO CORPORATION
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Hiroaki
Yamada