McKenna, Long & Aldridge, LLP
Etching solution for multiple layer of copper and molybdenum and etching method using the same
An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight of a first additive having nitrogen; about 0.2% to about 5% by weight of a second additive having nitrogen; about 0.01% to about 1.0% by weight of a fluoric compound; and de-ionized water making a total amount of the etching solution 100% by weight.
Dong-Woo Fine Chem Co., Ltd. LG Display Co., Ltd.
H C C C C
H01L C23F C09K C23F C23F
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Gee-Sung Yong-Sup Oh-Nam Seong-Su Kyoung-Mook Yong-Suk Seung-Yong Gyoo-Chul
Chae Hwang Kwon Kim Lee Choi Lee Jo