Birch, Stewart, Kolasch & Birch, LLP
Semiconductor structure having a via and methods of manufacturing the same
A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a substrate and a seed layer on the substrate. The substrate includes a base and a composite layer encapsulating the base. The semiconductor structure also includes an epitaxial layer on the seed layer. The semiconductor structure also includes a semiconductor device on the epitaxial layer, and an interlayer dielectric layer on the epitaxial layer. The interlayer dielectric layer covers the semiconductor device. The semiconductor structure further includes a via structure that penetrates at least the composite layer of the substrate and is in contact with the base.
Vanguard International Semiconductor Corporation
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Yung-Fong Li-Wen Cheng-Tao Jui-Hung Chun-Hsu Yu-Chieh
Lin Chuang Chou Yu Chen Chou