Lerner, David, Littenberg, Krumholz & Mentlik, LLP
Resin composition
A thermally conductive resin composition is disclosed herein. The thermally conductive resin composition exhibits high thermal conductivity while having excellent handling properties. In an embodiment, a resin composition includes a resin component and 600 parts by weight or more of a thermally conductive filler relative to 100 parts by weight of the resin component. The thermally conductive filler comprise 30 to 50 wt % of a first thermally conductive filler having a D50 particle diameter of 35 μm or more, 25 to 45 wt % of a second thermally conductive filler having a D50 particle diameter in a range of 15 μm to 30 μm, and 15 to 35 wt % of a third thermally conductive filler having a D50 particle diameter of 1 to 4 μm, based on the total weight of the thermally conductive filler.
LG Chem, Ltd.
C C C C C C C C C C C C C C C C C
C08L C08K C08G C08K C08G C09J C09K C08K C08L C08K C08K C08K C08K C08G C08K C08G C08K
inventional additional inventional additional inventional inventional inventional inventional inventional inventional additional additional additional inventional additional inventional inventional
Sang Min Yang Gu Seong Kyun Se Woo Yoon Gyung Hyeon Eun Suk
Park Kang Kang Yang Cho Choi Park