Millen, White, Zelano & Branigan, P.C.
Chemically amplified positive resist composition
 A chemically amplified positive resist composition contains (A) an organic solvent, (B) a base resin, (C) a photoacid generator, and optionally, (D) a dissolution rate regulator. The base resin (B) is a hydroxystyrene copolymer having different acid labile groups and Mw of 3,000-300,000. The resist composition is highly sensitive to actinic radiation such as deep-UV, electron beam and X-ray, can be developed with aqueous base to form a pattern, and is thus suitable for use in a fine patterning technique. 
Shin-Etsu Chemical Co., Ltd.
G Y G
G03F Y10S G03F
additional additional inventional
Shigehiro Satoshi Toshinobu Osamu
Nagura Watanabe Ishihara Watanabe