Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
 This invention relates generally to structure and method for preventing metal diffusion between a noble metal layer and an adjoining non-noble metal layer, and more specifically to new structures and methods for providing a superbarrier structure between copper and an adjoining noble metal layer. This is achieved by sequentially deposited a layer of non-noble metal, a layer of titanium, a layer of molybdenum, and a layer of noble or relatively less noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate. 
International Business Machines Corporation
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inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional
Giulio Chandrasekhar Jung-Ihl Sampath
DiGiacomo Narayan Kim Purushothaman