Slater Matsil, LLP
Chemical clean of semiconductor device
A method of forming a semiconductor device includes forming a conductive feature in a first dielectric layer, forming one or more dielectric layers over the first dielectric layer, and forming a via opening in the one or more dielectric layers, a bottom of the via opening exposing the conductive feature. The method further includes cleaning the via opening using a chemical mixture, and rinsing the via opening using basic-ion doped water after cleaning the via opening.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Nai-Chia Chun-Hung Chun-Li Yu-Li Yen-Chiu
Chen Chao Chou Cheng Kuo