Greenblum & Bernstein, P.L.C.
Phenolic resin composition, and methods for manufacturing cured relief pattern and semiconductor
Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.
Asahi Kasei E-Materials Corporation
G H C G G C C C H
G03F H01L C08G G03F G03F C08K C08L C08G H01L
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Jun Takahiro
Li Sasaki