J.C. Patents
Chip package structure
A chip package structure including a lead frame, at least one first bonding wire, at least one second bonding wire, third bonding wires and an encapsulant is provided. The lead frame includes a die pad, inner leads and at least one bus bar, wherein the bus bar is disposed therebetween and has a down-set with a height difference from the inner leads. The inner leads are disposed around the die pad. The chip disposed on the die pad has at least one first contact and second contacts. The first bonding wire electrically connects the first contact to the bus bar. The second bonding wire electrically connects the bus bar to one of the inner leads. The third bonding wires electrically connect the other of the inner leads to the second contacts. The lead frame, the chip, the bonding wires are wrapped inside the encapsulant.
ChipMOS Technologies (Bermuda) Ltd. ChipMOS Technologies (Shanghai) Ltd.
H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional
Yan-Yi Xin-Ming Chih-Lung
Wu Li Huang