Harness, Dickey, & Pierce, P.L.C.
Apparatus and method for drying semiconductor wafers using IPA vapor drying method
An apparatus for drying semiconductor wafers includes a bath for receiving semiconductor wafers and for holding a fluid, a chamber for providing an area where vapor is flowable over the bath, a supply pipeline for supplying vapor to the chamber, a vapor discharging pipeline for expunging vapor in the chamber, a fluid discharging pipeline for draining fluid in the chamber therefrom, and a protector for maintaining a distance between the semiconductor wafers during a drying process.
Samsung Electronics Co., Ltd.
H H Y
H01L H01L Y10S
inventional inventional additional
Jung-Min Myung-hwan Young-hee
Kim Shin Kim