Seyfarth Shaw LLP
Metal pad or metal bump over pad exposed by passivation layer
A circuitry component comprising a semiconductor substrate, a pad over said semiconductor substrate, a tantalum-containing layer on a side wall and a bottom surface of said pad, a passivation layer over said semiconductor substrate, an opening in said passivation layer exposing said pad, a titanium-containing layer over said pad exposed by said opening, and a gold layer over said titanium-containing layer.
Megica Corporation
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Hsin-Jung Chien-Kang Chiu-Ming Mou-Shiung Ke-Hung
Lo Chou Chou Lin Chen