KED & Associates, LLP
Dressing apparatus and wafer polishing apparatus comprising same
An embodiment according to the present invention relates to a dressing apparatus for cleaning a polishing pad attached to a lower surface plate, the dressing apparatus comprising: a brushing part comprising a brush; a cleaning solution spray unit, comprising a spray nozzle, for spraying the polishing pad with cleaning solution; and a suction unit, comprising a suction inlet, for suctioning particles generated when the cleaning solution is sprayed by the cleaning solution spray unit, wherein the brushing unit, cleaning solution spray unit and suction unit are attached to each other and swing above the polishing pad in unison.
SK SILTRON CO., LTD.
B H H B
B24B H01L H01L B24B
inventional additional additional inventional
Seung Won
Lee