Low temperature tin-bismuth electroplating system
 A system for electroplating a tin-bismuth alloy at near eutectic composition is disclosed. The system includes the plating bath and the process for initially preparing the bath as well as the process for plating an object with tin-bismuth alloy. The system further includes an apparatus for regulating the concentrations of tin and bismuth in the plating bath and the process by which the concentrations are controlled. 
Unisys Corporation
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Y10S C25D H05K H05K
additional inventional additional additional
Timothy I. Brian R.
Murphy Reynolds