Slater Matsil, LLP
Vertically integrated image sensor chips and methods for forming the same
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a first integrated circuit device in the BSI image sensor chip, forming a second via penetrating through the BSI image sensor chip to connect to a second integrated circuit device in the device chip, and forming a metal pad to connect the first via to the second via.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional inventional inventional inventional inventional additional inventional additional inventional inventional inventional inventional
Feng-Chi Jen-Cheng Jeng-Shyan Tzu-Hsuan Szu-Ying Dun-Nian Wen-De
Hung Liu Lin Hsu Chen Yaung Wang