Eschweiler & Associates, LLC
Method to determine optimal micro-bump-probe pad pairing for efficient PGD testing in interposer designs
The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.
Taiwan Semiconductor Manufacturing Co. Ltd.
G
G01R
inventional
Yi-Lin Sandeep Kumar Ching-Fang Cheng-Pin Yun-Han Charles C. C. Ji-Jan
Chuang Goel Chen Chiu Lee Liu Chen