McDermott Will & Emery LLP
Side-emitting LED package and manufacturing method of the same
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.
Samsung Electro-Mechanics Co., Ltd.
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Ho Sik Kyung Taeg Young Sam Hun Joo Seong Yeon Seon Goo Dae Yeon
Ahn Han Park Hahm Han Lee Kim