McDermott Will & Emery, LLP
Semiconductor chip with post-passivation scheme formed over passivation layer
The invention provides a semiconductor chip comprising an interconnecting structure over said passivation layer. The interconnecting structure comprises a first contact pad connected to a second contact pad exposed by an opening in a passivation layer. A metal bump is on the first contact pad and over multiple semiconductor devices, wherein the metal bump has more than 50 percent by weight of gold and has a height of between 8 and 50 microns.
Megica Corporation
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additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional inventional
Chiu-Ming Chien-Kang Hsin-Jung Mou-Shiung Ching-San
Chou Chou Lo Lin Lin