Harness, Dickey & Pierce
Semiconductor package and method of fabricating the same
Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.
Samsung Electronics Co., LTD.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional inventional additional additional additional additional additional inventional additional additional additional inventional additional inventional additional additional inventional additional additional additional additional additional inventional inventional additional additional additional inventional
Jongkook Bona Soojeoung Hohyeuk Yoonha Su-min Byoungwook
Kim Baek Park Im Jung Park Jang