Eschweiler & Associates, LLC
4 port L-2L de-embedding method
Some embodiments relate to a wafer. The wafer includes a first dummy component comprising two or more first dummy component transmission lines. One of the first dummy component transmission lines operably couples a first signal test pad to a second signal test pad, and an other of the first dummy component transmission lines operably couples a third signal test pad to a fourth signal test pad. A second dummy component comprises two or more second dummy component transmission lines. One of the second dummy component transmission lines operably couples a fifth signal test pad to a sixth signal test pad, and an other of the second dummy component transmission lines operably couples a seventh signal test pad to an eighth signal test pad. Other embodiments are also disclosed.
Taiwan Semiconductor Manufacturing Co., Ltd.
H H G G
H01L H01L G01R G01R
inventional inventional inventional inventional
Chin-Wei Min-Chie Chih-Yuan Hsiao-Tsung
Kuo Jeng Chang Yen