McDermott Will & Emery LLP
Method for forming a photoresist-laminated substrate, method for plating an insulating substrate, method for surface treating of a metal layer of a circuit board, and method for manufacturing a multi layer ceramic condenser using metal nanoparticles aerosol
The present invention relates to a method for forming a photoresist-laminated substrate including: preparing a laminated substrate having an insulating substrate and a metal layer; coating with an aerosol of metal nanoparticles on the metal layer; laminating a photoresist film on the metal layer coated with the aerosol of metal nanoparticles. The method of the present invention is a environmentally friendly method since an aerosol of metal nanoparticles is used, differentiated from the conventional wet process.
Samsung Electro-Mechanics Co., Ltd.
H H H H H H H H Y H
H05K H05K H05K H05K H05K H05K H05K H05K Y10T H05K
additional additional additional additional additional inventional inventional inventional additional additional
Mi-Yang Bae-Kyun Seoung-Jae Hee-Sung
Kim Kim Lee Choi