Finnegan, Henderson, Farabow, Garrett and Dunner
Method of forming a multilevel interconnection device
 A method of fabricating a high density electrical interconnection member by forming a composite interconnection from metallic conductors on cured liquid polymer resin on substrate. The resin is cured at an elevated temperature to form a solid dielectric layer. Successive metallic and dielectric layers form an interconnection subassembly with the coefficient of thermal expansion of the substrate being less than the subassembly. The temperature of the subassembly is lowered placing it in tension. A support member is adhered to the exposed surface of the subassembly and the substrate removed. Multiple subassemblies can be joined together physically and electricaly to form a complex device for interconnecting a plurality of integrated circuit chips for high performance computer applications. 
Digital Equipment Corporation
H Y H H Y H H H H H
H01L Y10S H05K H01L Y10T H01L H01L H05K H05K H05K
inventional additional additional inventional additional additional additional inventional additional inventional
Chung W. B. Y.
Ho Min