Method for making a semiconductor device with improved sidewall junction capacitance
 A semiconductor device (10) of the present invention has a gate (32) insulatively disposed above the substrate, source and drain regions (36, 38) disposed near the surface in the substrate adjacent opposite sides of the gate (32), and a field oxide region (26) disposed in the surface of the substrate surrounding the source and drain regions (36, 38) and defining an active moat region (20). The channel stop region (24) is disposed below the field oxide region (26) and is spaced from the active moat region (20) with a predetermined spacing. 
Texas Instruments Incorporated
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Jihong John A. Alister C. Michael C.
Chen Rodriguez Young Smayling