Sughrue, Mion, Zinn, Macpeak & Seas
Semiconductor device with structure to decrease wiring capacitance
 It is the object of the invention to expand a band width of an amplifier by effectively decreasing wiring capacitances of the amplifier formed in a semiconductor chip. The semiconductor chip is implemented in a package, and an output signal of the amplifier (not shown) formed in the semiconductor chip is supplied to the input terminal of an external buffer amplifier. In various signal paths which connect the output amplifier to the buffer amplifier, a signal wire, which connects the output terminal of the output amplifier to an output pad formed in the circumference of the chip, is provided with a shield wire thereunder. The shield wire is supplied with the output signal of the buffer amplifier. Since the phase and the amplitude of the voltage supplied by the buffer amplifier is nearly the same as those of the signal wire, the wiring capacitance between both wires is equivalently zero. 
NEC Corporation
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Takashi Yukio
Nakano Taniji