Slater & Matsil, L.L.P.
Extending metal traces in bump-on-trace structures
A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jiun Yi Tin-Hao Han-Ping Yuh Chern Yu-Feng Tsung-Shu
Wu Kuo Pu Shieh Chen Lin