Muir Patent Consulting, PLLC
Semiconductor package, test socket and related methods
Provided are a socket, a semiconductor package, a test device and a method of manufacturing a semiconductor package. A socket to test a semiconductor package comprising a housing, a trench receiving a semiconductor package in the housing, at least one probe connected to the semiconductor package at a bottom of the trench, and at least one connector electrically connecting a plurality of contact points exposed at a side of the semiconductor package when the semiconductor package is inserted into the trench. A semiconductor package with contacts exposed from a side of a package substrate, and a method of manufacturing such a semiconductor package are also disclosed.
Samsung Electronics Co., Ltd.
G
G01R
inventional
Seok-Chan
Lee