Lerner, David, Littenberg, Krumholz & Mentlik, LLP
Semiconductor device and method for manufacturing semiconductor device
The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.
LG Chem, Ltd.
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Kwang Joo Seung Hee Jung Hak Jung Ho Hee Jung Young Kook Se Ra
Lee Nam Kim Jo Kim Kim Kim