Rosenberg, Klein & Lee
Heat-dissipating structure with air-guiding device
A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipating device can efficiently dissipate the heat from the Central Processing Unit and another electronic element that is disposed in the vicinity of the Central Processing Unit. Furthermore, the air-guiding device can guide the air from the fan to the correct place for cooling the Central Processing Unit or another electronic element.
Giga-Byte Technology Co., Ltd.
H H H
H01L H01L H01L
inventional additional inventional
Hsiang-Chieh Chia-Min
Tseng Chou