Hauptman Ham, LLP
Heat transfer structures and methods for IC packages
A package structure includes a first package layer, a second package layer, and a chip layer positioned between the first package layer and the second package layer. The first package layer includes an electrical signal structure electrically isolated from a first thermal conduction structure. The chip layer includes an integrated circuit (IC) chip electrically connected to the electrical signal structure, a molding material, and a through-via positioned in the molding material. The first thermal conduction structure, the through-via, and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Chih-Lin Ying-Chih Alan Chuei-Tang Chih-Yuan Eric
Chen Hsu Roth Wang Chang Soenen