Rothwell, Figg, Ernst & Manbeck, P.C.
Semiconductor device and method for manufacturing the same using an adhesive
The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.
LG CHEM, LTD.
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Hee Jung Jung Hak Se Ra Kwang Joo Seung Hee Young Kook
Kim Kim Kim Lee Nam Kim