WPAT, P.C., Intellectual Property Attorneys
Method and apparatus for manufacturing semiconductor structure
A method for manufacturing a semiconductor structure is provided. The method includes the following operations. A first semiconductor substrate is provided on a spin chuck. A first humidity factor near the first semiconductor substrate is obtained. A resist material is dispensed on the first semiconductor substrate. The spin chuck is rotated at a first speed. The first speed is determined based on the first humidity factor.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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G03F H01L H01L G01N H01L G01N
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Wei-Hsiang Yung-Yao
Tseng Lee