Roberts Mlotkowski Safran Cole & Calderon, P.C.
Variable space mandrel cut for self aligned double patterning
The present disclosure relates to semiconductor structures and, more particularly, to variable space mandrel cut for self-aligned double patterning and methods of manufacture. The method includes: forming a plurality of mandrels on a substrate; forming spacers about the plurality of mandrels and exposed portions of the substrate; removing a portion of at least one of the plurality of mandrels to form an opening; and filling in the opening with material.
GLOBALFOUNDRIES INC.
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Jiehui Byoung Youp Jinping
Shu Kim Liu