JCIPRNET
Die stack structure and method of fabricating the same and package
Provided is a die stack structure including a first die and a second die. The first die and the second die are bonded together through a hybrid bonding structure. A bonding insulating layer of the hybrid bonding structure extends to contact with one interconnect structure of the first die or the second die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional inventional inventional additional additional inventional inventional additional additional additional additional inventional additional inventional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional inventional inventional additional additional inventional inventional additional additional inventional inventional additional inventional additional additional additional inventional additional additional additional additional additional additional inventional inventional inventional
Jie Hsien-Wei Ming-Fa
Chen Chen Chen