LED package
The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent powder and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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H01L H01L
inventional inventional
Chao-Hsiung Lung-Hsin Hou-Te Pin-Chuan
Chang Chen Lin Chen