JCIPRNET
Chip package structure
A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. The substrate has a first surface and a second surface. The redistribution layer is disposed on the first surface. The chip and the conductive pillars are disposed on the redistribution layer. The molding compound covers the chip, the conductive pillars, and the redistribution layer. The circuit board is connected with the carrier board, wherein the circuit board is disposed on the molding compound, such that the chip is located between the substrate and the circuit board, and the chip and the redistribution layer are electrically connected with the circuit board through the conductive pillars. Heat generated by the chip is transmitted through the substrate from the first surface to the second surface to dissipate.
Unimicron Technology Corp.
C H H H H C H H C H H H H Y H C H H H H H H C H H H H H H H H H H
C25D H01L H01L H05K H01L C25D H05K H01L C25D H05K H01L H01L H01L Y10T H05K C25D H01L H01L H01L H01L H05K H01L C25D H01L H05K H05K H01L H01L H01L H01L H01L H01L H01L
inventional inventional inventional additional additional additional additional inventional inventional inventional inventional additional additional additional additional inventional additional inventional additional inventional additional additional inventional inventional additional inventional additional additional additional inventional additional inventional additional
Ra-Min Yu-Hua Tzyy-Jang
Tain Chen Tseng