Integrated circuit including NCEM-enabled, diagonal gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of diagonal shorts and/or leakages.
PDF Solutions, Inc.
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Andrzej Larg Nobuharu Kimon Stephen Simone Rakesh Dennis Vyacheslav Timothy Indranil Jonathan John Tomasz Sheng-Che Markus Hideki Marcin Hans Jeremy Marci Christopher Carl Kelvin Conor Sherry
Strojwas Weiland Yokoyama Michaels Lam Comensoli Vallishayee Ciplickas Rovner Fiscus De Haigh Kibarian Brozek Lin Rauscher Matsuhashi Strojwas Eisenmann Cheng Liao Hess Taylor Doong O'Sullivan Lee