Room temperature wafer-to-wafer bonding by polydimethylsiloxane
A method of forming bonds between similar and dissimilar material surfaces particularly the surfaces of silicon wafers having various devices disposes thereon, wherein such bonds can be formed at room temperature and do not require the application of high pressures or voltages. The bonding material is polydimethylsiloxane, which is transparent and bio-compatible.
Institute of Microelectronics
C B H C
C09J B81C H01L C08J
inventional inventional inventional inventional
Pang Dow Quanbo Yu Uppili
Foo Zou Chen Sridhar