JCIPRNET
Three-dimensional integrated circuit structures
Three-dimensional integrated circuit (3DIC) structures are disclosed. A 3DIC structure includes a first die and a second die bonded to the first die. The first die includes a first integrated circuit region and a first seal ring region around the first integrated circuit region, and has a first alignment mark within the first integrated circuit region. The second die includes a second integrated circuit region and a second seal ring region around the second integrated circuit region, and has a second alignment mark within the second seal ring region and corresponding to the first alignment mark.
Taiwan Semiconductor Manufacturing Co., Ltd.
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additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional additional additional inventional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional additional additional additional
Jie Ying-Ju Hsien-Wei
Chen Chen Chen