Eschweiler & Potashnik, LLC
Top electrode for device structures in interconnect
Some embodiments relate to a device. The device includes a top electrode and a via disposed over the top electrode. A peripheral upper surface of the top electrode is above a central upper surface of the top electrode, and a tapered inner sidewall of the top electrode connects the peripheral upper surface to the central upper surface. The via establishes electrical contact with the tapered inner sidewall but is spaced apart from the central upper surface.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Wen-Ting Hsia-Wei Chih-Yang Chin-Chieh Sheng-Hung Yu-Wen Kuo-Chi Wen-Chun
Chu Chen Chang Yang Shih Liao Tu You