Birch, Stewart, Kolasch & Birch, LLP
Module structure
Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
B H B Y H B H B H H B B B C C C B
B32B H01L B32B Y02E H01L B32B H01L B32B H01L H01L B32B B32B B32B C08L C09D C09D B32B
inventional inventional additional additional inventional inventional inventional additional inventional inventional inventional inventional additional additional inventional inventional additional
Tzong-Ming Wen-Kuei Chin Zeng Hsueh Jen Wen-Hsien Min-Tsung Ming-Hung Wen-Hsien Chung-Teng Fu-Ming
Lee Lee Yeh Fu Wang Kuan Chen Chou Huang Lin