JCIPRNET
Package structure for backlight module
A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.
UNIFLEX Technology Inc.
H H H
H01L H01L H01L
inventional inventional inventional
Ying-Hsing Bo-Hua Yuan-Chih Yi-Chun
Chen Chen Lee Liu