Hauptman Ham, LLP
Method for fabricating an embedded pattern using a transfer-based imprinting
In a method for fabricating an embedded pattern using a transfer-based imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photo curable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formed on an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiated to cure the adhesive layer. The stamp is removed.
KOREA INSTITUTE OF MACHINERY & MATERIALS
G B B Y Y G
G09F B32B B82Y Y10T Y10T G02B
additional inventional additional additional additional inventional
Eung-Sug Joo-Yun Cheol-Hyeon Ji-Hye Jun-Hyuk Dae-Guen Jun-ho
Lee Jung Kim Lee Choi Choi Jeong