Wenderoth, Lind & Ponack, L.L.P.
Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.
Panasonic Corporation
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additional additional additional additional additional additional additional inventional additional additional additional additional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional inventional additional
Toshio Takashi Koichi Yoshihiro Seiichi Seiji
Fujii Ichiryu Hirano Tomita Nakatani Karashima