Young & Thompson
Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition
A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.
Adeka Corporation
C C C C C C C H H H H H H C
C08G C08L C08K C08G C08L C08K C08K H01L H01L H01L H01L H01L H01L C08K
additional inventional additional additional inventional additional additional inventional additional additional additional additional inventional additional
Takehito Takuya Ichiro Masahiro Osamu Junko Ryota Masako
Tsukamoto Kanazawa Hiratsuka Wada Yoshioka Toda Chiba Saito