JCIPRNET
Packaging process and manufacturing method
A manufacturing method and a packaging process are provided. A package having a first die and a second die is provided. A circuit substrate having a first warpage level is provided. The package is mounted onto the circuit substrate and then heated under an elevated temperature to bond the package to the circuit substrate. The package heated under the elevated temperature is warped with a second warpage level, and the first warpage level is substantially in conformity with the second warpage level.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional additional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional inventional inventional inventional additional additional additional additional additional additional additional additional additional
Jiun-Ting Szu-Wei Ying-Ching Chih-Wei
Chen Lu Shih Wu