IP & T Group LLP
Semiconductor device having a plurality of repair fuse units
A semiconductor system includes a controller; a semiconductor device comprising a plurality of stacked semiconductor chips stacked over the controller, and a plurality of through-silicon vias (TSVs) configured to commonly transfer a signal to the plurality of stacked semiconductor chips; and a defect information transfer TSV configured to transfer TSV defect information sequentially outputted from at least one of the semiconductor chips to the controller, wherein the controller comprises: a plurality of first repair fuse units configured to set first fuse information based on the TSV defect information; and a plurality of first TSV selection units configured to selectively drive the TSVs in response to the first fuse information.
Hynix Semiconductor Inc.
H H H H H H H H H H G H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L G01R H01L H01L
additional inventional additional inventional additional inventional additional additional additional additional additional inventional additional
Hyung-Dong Sang-Hoon Jeong-Woo Hyang-Hwa
Lee Shin Lee Choi