A & J
Method of forming bumps on wafers or substrates
A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.
Orient Semiconductor Electronics Limited
H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L H01L
additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional
Chung-Ming Hui-Pin Hsuan Jui Feng-Chang Wen Lo Yung-Cheng Ning Fu Yu Chia-Chieh Hua Wen
Chang Chen Chang Tu Shieh Chuang Huang Huang Hu Chiang