Scully, Scott, Murphy & Presser, P.C.
Method for manufacturing strained silicon directly-on-insulator substrate with hybrid crystalline orientation and different stress levels
The present invention provides a strained Si directly on insulator (SSDOI) substrate having multiple crystallographic orientations and a method of forming thereof. Broadly, but in specific terms, the inventive SSDOI substrate includes a substrate; an insulating layer atop the substrate; and a semiconducting layer positioned atop and in direct contact with the insulating layer, the semiconducting layer comprising a first strained Si region and a second strained Si region; wherein the first strained Si region has a crystallographic orientation different from the second strained Si region and the first strained Si region has a crystallographic orientation the same or different from the second strained Si region. The strained level of the first strained Si region is different from that of the second strained Si region.
International Business Machines Corporation
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Huilong Huajie Stephen W. Bruce B. Patricia M.
Zhu Chen Bedell Doris Mooney