Posz Law Group, PLC
Seal member, etching apparatus, and a method of manufacturing a semiconductor device
Provided is a seal member according to embodiments. The seal member is disposed between an upper electrode and a backing plate in an etching apparatus to seal a gap between the upper electrode and the backing plate. In addition, the seal member is configured to include a high heat conductivity member having a heat conductivity higher than that of a first member formed by using siloxane bond and a low resistance member having a resistivity lower than that of the first member.
KABUSHIKI KAISHA TOSHIBA
H F H H H
H01L F16J H01J H01L H01J
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Makoto Hideo
Saito Eto