Venable LLP
Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
A pattern is formed on a substrate with forming a layer of a first curable composition (A1) containing a component (a1) as a polymerizable compound and a first component (c1) as a surfactant on a surface of the substrate, then dispensing droplets of a second curable composition (A2) containing a component (a2) as a polymerizable compound and a second component (c2) as a surfactant onto the layer formed of the first curable composition (A1), subsequently sandwiching a mixture layer of the first and second curable compositions (A1) and (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after curing. The first curable composition (A1) contains at least 0.5 wt % of the first component (c1), the second curable composition (A2) contains at least 0.5 wt % of the second component (c2).
CANON KABUSHIKI KAISHA
C G
C09D G03F
inventional inventional
Toshiki Niyaz Timothy Brian Weijun Keiko
Ito Khusnatdinov Stachowiak Liu Chiba