Harness, Dickey & Pierce
Semiconductor chip package manufacturing method including screen printing process
A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.
Samsung Electronics, Co., Ltd.
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Gil-Beag Hyun-Ik Jun-Soo Yong-Jin Sang-Young
Kim Hwang Han Jung Kim