Townsend and Townsend and Crew LLP
Field emission display device fabrication method
 An improved field emission display device fabrication method which adopts both a silicon wafer direct bonding method and a mold method so as to fabricate an improved field emission display device, which includes the steps of a first step which forms a tip array by a molding method; and a second step which bonds the tip array to a second semiconductor substrate. 
Korea Institute of Science and Technology
H Y
H01J Y10S
inventional additional
Nam Yang Myung Hwan Yun Hi Byeong Kwon
Lee Oh Lee Ju