Printed circuit board shielding and power distribution via edge plating
A circuit board and method of manufacture therefor utilize voltage domain edge plating disposed on at least a portion of one or more edges of a circuit board to electrically couple voltage domain conductive shapes disposed in different conductive layers of the circuit board. By doing so, interconnection of multiple voltage domain conductive shapes in different conductive layers may be facilitated with improved power integrity, while also providing EMI shielding along the edge of the circuit board.
International Business Machines Corporation
H H H H H H H H H H H H H H H H
H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K
additional additional inventional inventional inventional inventional inventional inventional inventional additional additional additional additional inventional additional inventional
Edni David Anil
Del Rosal Green Yuksel