McDermott Will & Emery LLP
Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes forming a structure protruding from a substrate, forming a dielectric layer covering the structure, forming a dummy layer covering the dielectric layer, and performing a planarization process to completely remove the dummy layer. A material of the dummy layer has a slower removal rate to the planarization process than a material of the dielectric layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chin-Wei Wei-Chieh Ching-Sen Feng-Jia Hsia-Wei Jieh-Jang
Liang Huang Kuo Shiu Chen Chen