Foley & Lardner LLP
Semiconductor device package, electronic assembly and method for manufacturing the same
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Chen Yuang Chih-Cheng Cheng-Lin Chun Chen
Chen Lee Ho Chen