Method and apparatus for assembling and testing a multi-integrated circuit package
An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.
XILINX, INC.
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Gamal Ivor G. Cheang-Whang Tien-Yu Mohsen H. Jaspreet Singh Suresh
Refai-Ahmed Barber Chang Lee Mardi Gandhi Ramalingam