WPAT, P.C., Intellectual Property Attorneys
Polishing pad and polishing apparatus
The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.
SAN FANG CHEMICAL INDUSTRY CO., LTD.
B B H B
B24D B24B H01L B24B
inventional inventional additional inventional
Chung-Chih Wen-Chieh Yung-Chang I-Peng Lyang-Gung Wei-Te
Feng Wu Hung Yao Wang Liu