Method of applying micro-protection in defect analysis
The present invention discloses a method of applying micro-protection in defect analysis. The method includes providing a substrate having at least one defect thereon, forming the micro-protection on the surface of the defect, confirming the site of the defect, and forming a specimen of the defect by utilizing a focused ion beam microscope.
Powerchip Semiconductor Corp.
G G
G01N G01N
inventional additional
Ching-Ching Ting-Wei Ching-Pin
Shih Chen Chang