Harness, Dickey & Pierce, PLC
Semiconductor device, method and apparatus for fabricating the same
A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the radiator plate and at least a part of the side surface adjoining the outer main surface are exposed from the molded resin.
Denso Corporation
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Hidehisa Shusaku Tsutomu Hiroaki
Nasu Nakazawa Onoue Mizuno