Birch, Stewart, Kolasch & Birch, LLP
Bonding pad structure having island portions and method for manufacturing the same
A bonding pad structure is provided. The structure includes a dielectric layer on a substrate. A bonding pad is disposed on the dielectric layer and a first metal pattern layer is embedded in the dielectric layer and directly below the bonding pad. The first metal pattern layer includes a first body portion and first island portions. The first body portion has first openings in a central region of the first body portion and second openings arranged along a peripheral region of the first body portion and surrounding the first openings. The first island portions are correspondingly disposed in the second openings and spaced apart from the first body portion. First interconnect structures are disposed in the dielectric layer and correspond to the first island portions, such that the bonding pad is electrically connected to the first island portions.
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
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Ching-Wen Hung-Wei Shi-Hsiang Chi-Li
Wang Chen Lu Tu