Die seal ring and method of forming the same
A die seal ring is provided. The die seal ring includes a substrate and a first layer extruding from the substrate. The first layer has a first fin ring structure and a layout of the first fin ring structure has a stamp-like shape. In addition, a method for forming a die seal ring is provided. A substrate having an active region is provided. A patterned sacrificial layer is formed on the substrate. A spacer is formed on the sidewall of the patterned sacrificial layer. The patterned sacrificial layer is removed. The substrate is patterned by using the spacer as a mask, thereby simultaneously forming at least a fin structure of a Fin-FET and a first layer of the die seal ring.
UNITED MICROELECTRONICS CORP.
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inventional additional inventional inventional inventional
Guan-Kai Ming-Te Chien-Yang Ching-Li Hui-Ling Po-Chao
Huang Wei Chen Yang Chen Tsao