Winkle, PLLC
Heat dissipation device loading mechanisms
The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic assembly with a loading mechanism having at least one outrigger that is rotatable or pivotable between a first position and a second position to accommodate different heat dissipation device sizes or shapes.
Intel Corporation
G H H H H
G06F H01L H05K H01L H01L
inventional inventional inventional additional inventional
Chau V. Tejinder Pal S.
Ho Aulakh