Bacon & Thomas, PLLC
MEMS microphone package structure having non-planar substrate and method of manufacturing same
A MEMS microphone package structure having a non-planar substrate includes the non-planar substrate, a cover plate, and a sound wave transducer. The non-planar substrate has a carrying bottom portion and a sidewall. The carrying bottom portion has a sound hole. The cover plate covers the non-planar substrate from above and connects to the sidewall. Both the cover plate and the sidewall have a metal layer for shielding the microphone from electromagnetic interference. The sound wave transducer is located corresponding to the sound hole. Hence, the sidewall reinforces the non-planar substrate, such that the carrying bottom portion is thinned without weakening the non-planar substrate, so as to increase the capacity of a back chamber of the microphone without changing the appearance and dimensions of the package structure.
MERRY ELECTRONICS (SHENZHEN) CO., LTD.
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Yong-Shiang Jen-Yi Chao-Sen Chun-Chieh
Chang Chen Chang Wang