JCIPRNET
Impact resistant structure and electronic device
An impact resistant structure for an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, a thickness of the resistance stack layer is less than 10 μm, and a Young's modulus of the resistance stack layer is between 40 GPa and 150 GPa. The damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
Industrial Technology Research Institute Intellectual Property Innovation Corporation
B B G B H B
B32B B32B G02B B32B H01L B32B
additional additional inventional inventional additional additional
Chih-Chia Ting-Hsun Chen-Chu Jui-Chang Kai-Ming
Chang Cheng Tsai Chuang Chang