Slater Matsil, LLP
Chip packages and methods of manufacture thereof
A chip package may include: a first die; at least one second die disposed over the first die; and a lid disposed over lateral portions of the first die and at least partially surrounding the at least one second die, the lid having inclined sidewalls spaced apart from and facing the at least one second die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Feng Chen-Shien Kuo Lung Ying-Jui
Chen Chen Pan Huang