MEMS structure and method of fabricating the same
A method of fabricating a MEMS structure includes providing a substrate comprising a logic element region and a MEMS region. Next, a logic element is formed within the logic element region. A nitrogen-containing material layer is formed to cover the logic element region and the MEMS region conformally. Then, part of the nitrogen-containing material layer within the MEMS region is removed to form at least one shrinking region. Subsequently, a dielectric layer is formed to cover the logic element region and MEMS region, and the dielectric layer fills in the shrinking region. After that, the dielectric layer is etched to form at least one releasing hole, wherein the shrinking region surrounds the releasing hole. Finally, the substrate is etched to form a chamber.
UNITED MICROELECTRONICS CORP.
B B B B B B B B B B
B81C B81C B81B B81B B81B B81B B81C B81B B81B B81C
inventional inventional additional additional additional inventional additional additional additional additional
Chung-Hsien Meng-Jia Yung-Hsiao Shih-Wei Weng-Yi
Liu Lin Lee Li Chen