Oliff & Berridge, PLC
Resin-encapsulated type semiconductor packages, and production method and apparatus therefor
The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater by rotating an agitating rod projecting from a tip of an agitating plunger, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to a compression plunger inside a cavity of a lower molding unit, a semiconductor package is molded by encapsulating under pressurizing with the compression plunger.Even when the wires are thinned and arranged at a higher density, the above producing method can provide such method and apparatus for producing the resin-encapsulated type semiconductor packages that produce less flowing of the wires.
Sumitomo Bakelite Co., Ltd.
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H01L H01L H01L H01L B29C B29C B29C B29C H01L H01L H01L B29B B29C H01L H01L B29C H01L H01L H01L H01L H01L B29C
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Hideo Yoshitaka Tamaya
Ito Hirose Ubukata