Eschweiler & Potashnik, LLC
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Ching-Kai Wen-Chuan Fan Cheng San Hua-Shu Ivan Yi-Chia Chin-Min Hsiang-Fu
Shen Tai Hu Chou Wu Lee Lin Chen