Altis Law Group, Inc.
Method for manufacturing printed circuit board with thick traces
A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.
Zhen Ding Technology Co., Ltd. Hong Heng Sheng Electrical Technology (HuaiAn) Co., Ltd
H
H05K
inventional
Yao-Wen Xiao-Ping Pan
Bai Li Tang