Eschweiler & Potashnik, LLC
Integrated antenna on interposer substrate
The present disclosure relates to an integrated antenna structure. The integrated antenna structure includes a radiator and a ground plane disposed between a semiconductor substrate and the radiator. A conductive structure is separated from the ground plane by the semiconductor substrate. The conductive structure is electrically coupled to the ground plane. The semiconductor substrate has a thickness of less than approximately 100 microns.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yun-Han Chin-Her Chin-Chou Bo-Jr William Wu
Lee Chien Liu Huang Shen