Onello & Mello, LLP
Method of manufacturing for semiconductor device using expandable material
A semiconductor device is manufactured using an expandable material. The method includes forming a first gate insulating layer on a substrate, forming first and second gate structures on the first gate insulating layer, the first and second gate structures being spaced apart from each other at a distance, forming an expandable material on sidewalls and upper surfaces of the first and second gate structures, forming a gap-fill layer on the expandable material between the first and second gate structures, and performing a heat-treatment process to increase the volume of the expandable material.
Samsung Electronics Co., Ltd.
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Sangbom Sangho Jeong-Kyu Seungjae Kyungseok Jungchan Shinhye Seungjae
Kang Rha Lee Lee Oh Lee Kim Zulkarnain