Oliff & Berridge, PLC
Process for producing a flexible wiring board
Process for producing a flexible wiring board by etching a metal foil halfway to form a thick film part and a thin film part, etching the thin film part in order to form a first wiring film having the thick film part and a second wiring film having the thin film part with the first wiring film having a larger thickness than the second wiring film. The sectional area and electrical resistance of the first wiring film can be enlarged, even in cases where the first wiring film and the second wiring film have almost the same width, because of the larger film thickness of the first wiring film.
Sony Chemicals Corp.
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Masanori
Takeuchi