Haupman Ham, LLP
Method of forming a semiconductor device including strain reduced structure
A method of forming a device includes forming conductive pads on a semiconductor die. The conductive pads include a first conductive pad having a first width on a first region of the semiconductor die; and a second conductive pad having a second width on a second region of the semiconductor die. The method includes forming bonding pads on a substrate. The bonding pads include a third bonding pad having a third width on a third region of the substrate; and a fourth bonding pad having a fourth width on a fourth region of the substrate. The method further includes forming a conductive material coupled between the first conductive pad and the third bonding pad, and between the second conductive pad and the fourth bonding pad. A ratio A of the first width to the third width is different from a ratio B of the second width to the fourth width.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Ying-Ju Tsung-Ding Yu-Feng Hsien-Wei Tsung-Yuan
Chen Wang Chen Chen Yu