Coudert Brothers
Wet chemical processing techniques for plating high aspect ratio features
 Methods of forming high-aspect ratio blind apertures and thereafter filling the apertures with a plating solution are disclosed. A layer of photosensitive material is pattern exposed to actinic radiation to define the apertures, and thereafter exposed to aqueous developer solution. The apertures are then rinsed with water and thereafter exposed to plating solution without drying the aperture of water or developer solution. This is contrary to conventional practice where photoresist layers are dried, and usually post-baked after the development step in order to improve dimensional integrity and reduce swelling of the photoresist material. However, the inventors have recognized that the conventional drying and post-baking steps forever destroy the best opportunity to wet the walls of high-aspect ratio apertures with water, and have discovered that continually maintaining water within the aperture between the development and electroplating steps provides the best opportunity to fill the apertures with plating solution. 
Fujitsu Limited
C H
C25D H05K
inventional inventional
Michael G. Wen-chou Vincent William T. Solomon I.
Lee Wang Chou Beilin