Howrey & Simon
Ball grid array semiconductor package
 A ball grid array semiconductor package including a semiconductor chip, at least one lead having one end attached to the semiconductor chip and other end bent at a predetermined angle, a wire connecting the bent lead to an electrode formed on the semiconductor chip, a first bump attached to a bent end portion of the bent lead, and a resin molding enclosing the semiconductor chip, the lead and the wire to allow one side surface of the bump to be exposed out of the resin molding. 
Samsung Aerospace Industries, Ltd.
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Yung-joon
Kim