Nath, Goldberg & Meyer
Wafer inspection method and wafer inspection device
Provided is a wafer inspection method wherein a chuck top can be properly received. When an aligner receives a chuck top after a wafer W has been inspected, the distance between the chuck top and a chuck base is adjusted by adjusting the inclination of the chuck base such that the chuck top height, which is the distance between the chuck top and the chuck base after the chuck top is held, is a height in which any of 0 to 200 μm is added to the chuck top height before the chuck top is held.
TOKYO ELECTRON LIMITED
G H G
G01R H01L G01R
additional inventional inventional
Hiroshi
Yamada