Ladas & Parry, LLP
Method for manufacturing printed circuit board
Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
Samsung Electro-Mechanics Co., Ltd.
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inventional additional inventional additional additional additional additional additional
Jae Ho Sang Hoon Kwang Sun Joong Hyuk Seung Ryeol Kyung Jin
Shin Park You Jung Lee Heo