Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
NEC Corporation
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Yoshimichi Takao Seiji Masahiko
Sogawa Yamazaki Kurashina Sano