Scully, Scott, Murphy & Presser, P.C.
Method and structure of forming FinFET electrical fuse structure
An e-Fuse structure is provided on a surface of an insulator layer of a semiconductor-on-insulator substrate (SOI). The e-Fuse structure includes a first metal semiconductor alloy structure of a first thickness, a second metal semiconductor alloy structure of the first thickness, and a metal semiconductor alloy fuse link is located laterally between and connected to the first and second metal semiconductor alloy structures. The metal semiconductor alloy fuse link has a second thickness that is less than the first thickness.
International Business Machines Corporation
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Hong Chih-Chao Juntao Yunpeng
He Yang Li Yin