Dorsey & Whitney LLP
Solder bond site including an opening with discontinuous profile
Apparatuses and methods for formation of a bond site including an opening with a discontinuous profile are disclosed herein. An example apparatus may at least include a substrate, a contact on the substrate, and a mask layer formed on the substrate and at least a portion of the contact. The mask layer may also include an opening formed therein, with the opening having a discontinuous profile from a top surface of the mask layer to the contact.
Micron Technology, Inc.
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Dale Jaspreet S.
Arnold Gandhi