Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Substrate structure and method of manufacturing the same
A substrate structure is provided, including: a carrier having at least a wiring area defined and positioned on a portion of a surface of the carrier; a first insulating layer formed on the wiring area; a wiring layer formed on the first insulating layer formed on the wiring area; and a second insulating layer formed on the wiring area. Therefore, a contact surface between the carrier and the first and second insulating layers is reduced by reducing the areas of the first and second insulating layers, whereby a substrate warpage due to mismatch of coefficients of thermal expansion (CTE) is avoided. The present invention further provides a method of manufacturing the substrate structure as described above.
Siliconware Precision Industries Co., Ltd.
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Wen-Kai Sung-Huan Cheng-An Yi-Cheih Chien-Hung
Liao Sun Chang Chen Wu