Novak Druce Connolly Bove + Quigg LLP
Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers
A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Chao-Hsiung Hou-Te
Chang Lin