Marquez IP Law Office, PLLC
Method for setting up a molding system
The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.
CORETECH SYSTEM CO., LTD.
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Chuan-Wei Chia-Hsiang Rong-Yeu Ching-Chang Yuing
Chang Hsu Chang Chien Chang