J C Patents
Lead frame structure
 A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces. 
Walsin Advanced Electronics Ltd.
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Sheng-Tung Wen-Chun Hui-Ping Jung-Jie Yi-Hsiang
Tsai Liu Liu Liou Pan