Morgan, Lewis & Bockius LLP
Fan-out sensor package
A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.
SAMSUNG ELECTRO-MECHANICS CO., LTD.
H G G G G G G
H01L G01R G06F G01D G06V G01N G06V
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Ju Ho Jong Man Eun Sil Seok Hwan Sang Kyu
Kim Kim Kim Kim Lee