Myers Bigel & Sibley, P.A.
Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes and method of manufacturing the same
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
Samsung Electronics Co., Ltd.
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Jung-Woo Sung-Un Jun-Kyum
Seo Kwon Kim