WPAT, P.C., Intellectual Property Attorneys
Semiconductor structure and method of manufacturing the same
A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate having a front surface and a back surface facing opposite to the front surface; a filling material extending from the front surface into the semiconductor substrate without penetrating through the semiconductor substrate, the filling material including an upper portion and a lower portion, the upper portion being in contact with the semiconductor substrate; and an epitaxial layer lined between the lower portion of the filling material and the semiconductor substrate. An associated manufacturing method is also disclosed.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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inventional inventional additional inventional additional inventional inventional
Yen-Ting Cheng-Yuan Yu-Jen Tzu-Hsiang Cheng-Hsien Sheng-Chan I-Nan
Chiang Tsai Wang Chen Chou Li Chen