Duane Morris LLP
Systems and methods of compensating for filling material losses in electroplating processes
A computer-implemented system and method of compensating for filling material losses in a semiconductor process. The computer-implemented method includes determining using a computer a pattern density difference between a first circuit pattern above a semiconductor substrate and a second circuit pattern adjacent to the first pattern. A dummy pattern is inserted between the first pattern and the second pattern so as to compensate for an estimated loss of filling material induced during electrochemical plating by the pattern density difference exceeding a threshold pattern density difference.
Taiwan Semiconductor Manufacturing Co., Ltd.
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H01L G05B H01L H01L H01L
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Chih-Yi Liang-Yueh Ou Chen-Yuan Hung-Wen
Chang Yang Kao Su