Integrated circuit including NCEM-enabled, side-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of side-to-side shorts and/or leakages.
PDF Solutions, Inc.
G H H G H H H G H H H H H H H H G G H H H G H H G H H H
G06F H01L H01L G01R H01L H01L H01L G06F H01L H01L H01L H01L H01L H01L H01L H01L G06F G06F H01L H01L H01L G06F H01L H01L G06F H01L H01L H01L
additional inventional inventional inventional inventional additional inventional additional inventional inventional inventional additional additional inventional inventional additional inventional inventional inventional inventional inventional additional inventional inventional additional inventional inventional inventional
Kelvin Conor Larg Sheng-Che Tomasz Timothy Stephen Jonathan Christopher John Marci Markus Sherry Simone Vyacheslav Hideki Andrzej Nobuharu Marcin Kimon Carl Rakesh Jeremy Hans Indranil Dennis
Doong O'Sullivan Weiland Lin Brozek Fiscus Lam Haigh Hess Kibarian Liao Rauscher Lee Comensoli Rovner Matsuhashi Strojwas Yokoyama Strojwas Michaels Taylor Vallishayee Cheng Eisenmann De Ciplickas