Antonelli, Terry, Stout & Kraus, LLP.
Semiconductor device and its manufacturing method
A technique for mounting a plurality of electronic parts on one surface of a wiring substrate is provided. A semiconductor device comprises a wiring substrate having connection pads disposed outside a parts mount; a plurality of electronic parts with the first surface having a plurality of electrodes and the second surface fixing; a first underlying insulation layer provided between the connecting pads and the electrodes; a first metal layer formed overlaid on the first underlying insulation layer and providing connections between the connecting pads and the electrodes; a second underlying insulation layer having electrically insulating properties, provided between the respective electrodes of adjacent electronic parts; a second metal layer formed overlaid on the second underlying insulation layer and providing connections between the respective electrodes of adjacent electronic parts; and a first surface insulation layer covering the first metal layer and a second surface insulation layer covering the second metal layer.
Hitachi, Ltd.
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additional additional additional additional additional additional additional additional additional inventional additional additional inventional inventional inventional additional inventional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional
Hiroshi Chihiro
Kikuchi Mochizuki