Haynes and Boone, LLP
Back side illuminated image sensor having isolated bonding pads
Provided is an image sensor device. The image sensor device includes having a front side, a back side, and a sidewall connecting the front and back sides. The image sensor device includes a plurality of radiation-sensing regions disposed in the substrate. Each of the radiation-sensing regions is operable to sense radiation projected toward the radiation-sensing region through the back side. The image sensor device includes an interconnect structure that is coupled to the front side of the substrate. The interconnect structure includes a plurality of interconnect layers and extends beyond the sidewall of the substrate. The image sensor device includes a bonding pad that is spaced apart from the sidewall of the substrate. The bonding pad is electrically coupled to one of the interconnect layers of the interconnect structure.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jen-Cheng Dun-Nian Shuang-Ji Wen-De Hsiao-Hui
Liu Yaung Tsai Wang Tseng