Altis Law Group, Inc.
LED package
A LED package includes a substrate, at least one LED chip, a transparent adhesive and a lens. The at least one LED chip is mounted on the substrate. The transparent adhesive is filled between the LED chip and the lens. A number of through holes is regularly defined in an optical non-effective portion of the lens. The through holes are configured for increasing the air convection between inside and outside of the lens.
Foxsemicon Integrated Technology, Inc.
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H01L H01L H01L H01L
inventional additional inventional additional
Kuo-Feng Zheng-Jay Yu-Shu Kuo-Mang Ying-Chieh Hsin-Fei
Chiang Huang Chen Lo Lu Huang