Allen & Overy LLP
Chip package
A chip package according to one embodiment includes a magnetic field sensor and a chip housing. The chip housing is a rectangular parallelepiped body. A solenoid coil is wound around four outer surfaces of the chip housing. The magnetic field sensor is disposed in the chip package. A plurality of first electrode pads connected to the solenoid coil and a plurality of second electrode pads connected to the magnetic field sensor are disposed on one mounting surface.
KABUSHIKI KAISHA TOSHIBA TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
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Jia
Liu