Oliff & Berridge, PLC
Die bonding apparatus
A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.
Fujitsu Ten Limited
H H H H H H H H H H H H B H H H H H H H H H H B H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L B23K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L B23K H01L
additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional
Toshihiko Katsufumi Takashi Toshimasa Shinichi
Fujii Morimune Ohta Akamatsu Sugiura