Venable LLP
Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25° C. of 40 mPa·s or more and less than 500 mPa·s. The curable composition (A2) except a solvent has a viscosity at 25° C. of 1 mPa·s or more and less than 40 mPa·s.
CANON KABUSHIKI KAISHA
B B B B B B C B B B G G C C C C C
B05D B29K B29C B05D B29C B29C C09D B05D B29L B29L G03F G03F C09D C09D C09D C09D C09D
inventional additional inventional inventional inventional additional inventional inventional additional additional inventional inventional inventional inventional inventional inventional inventional
Niyaz Toshiki Keiko Weijun Timothy Brian
Khusnatdinov Ito Chiba Liu Stachowiak