Lee & Morse, P.C.
CMP slurry composition for organic film and polishing method using same
The present invention relates to a CMP slurry composition, for an organic film, for polishing an organic film and an organic film polishing method using same, the CMP slurry composition comprising: a polar solvent and/or a non-polar solvent; metal oxide abrasives; an oxidant; and a heterocyclic compound, wherein the heterocyclic compound, as a heteroatom, comprises one or two of oxygen (O) atom, sulfur (S) atom and nitrogen (N) atom and has carbon content of 50-95 atom %.
SAMSUNG SDI CO., LTD.
C C H C H
C09G C09K H01L C09K H01L
inventional inventional inventional inventional inventional
Jung Min Yong Sik Go Un Tae Wan Yong Kuk Dong Hun
Choi Yoo Kim Kim Kim Kang