Westman, Champlin & Koehler, P.A.
Motherboard to be cut
In one embodiment, a motherboard to be cut, includes: a motherboard body provided, on a surface thereof, with a cutting line comprising a special-shaped cutting line section, wherein, a plurality of positional marker groups are provided on a portion of the surface where the special-shaped cutting line section is provided; each positional marker group includes a first marker assembly and a second marker assembly provided at both sides of the special-shaped cutting line section; and, in the arrangement direction of the first marker assembly and the second marker assembly, size of the first marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the first marker assembly is in, and size of the second marker assembly is not less than tolerance size of a side of the special-shaped cutting line section where the second marker assembly is in.
BOE TECHNOLOGY GROUP CO., LTD. CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
H H H H H H H H H H H Y H H
H05K H01L H01L H05K H05K H01L H05K H05K H01L H05K H05K Y10T H01L H01L
additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional
Xiaoxia Junshuo Meiling Fuzheng Binfeng
Liu Li Piao Xie Feng