Harness, Dickey & Pierce, P.L.C.
Semiconductor devices and methods of manufacturing the same
Disclosed are semiconductor devices and methods of manufacturing the same. The method includes providing a semiconductor substrate, forming a redistribution line on a top surface of the semiconductor substrate, and forming a passivation layer to cover the redistribution line on the top surface of the semiconductor substrate. The forming a redistribution line includes a first stage of forming a first segment of the redistribution line on the top surface of the semiconductor substrate, and a second stage of forming a second segment of the redistribution line on the first segment of the redistribution line. An average grain size of the second segment of the redistribution line is less than an average grain size of the first segment of the redistribution line.
Samsung Electronics Co., Ltd.
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inventional additional additional additional additional inventional inventional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional inventional additional
Atsushi Teahwa Ju-Il Jeonggi
Fujisaki Jeong Choi Jin