Idea Intellectual Limited
Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing
A manufacturing method for a multi-layer circuit board is provided. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer, the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.
KINSUS INTERCONNECT TECHNOLOGY CORP.
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Chao-Lung Chin-Kuan Shuo-Hsun Yu-Te Chin-Hsi
Wang Liu Chang Lu Chang