Blakely, Sokoloff, Taylor & Zafman LLP
Apparatus and method to monitor die edge defects
Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.
Intel Corporation
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Zhiyong Yuan-Chuan Steven Mayue
Wang Chen Xie