TraskBritt
Two-stage transfer molding method to encapsulate MMC module
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery. A method for fabricating the semiconductor card is also included.
Micron Technology, Inc.
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H05K H01L B29C H05K H05K H05K B29C H01L H01L G06K H01L H01L H01L H01L H01L Y10T H05K G06K H01L B29C H05K H01L H01L H01L H05K H01L H01L H01L H01L H01L H01L Y10T H01L H01L
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Todd O.
Bolken