Slater Matsil, LLP
Semiconductor package and method of forming the same
An embodiment is a method including forming a first passive device in a first wafer, forming a first dielectric layer over a first side of the first wafer, forming a first plurality of bond pads in the first dielectric layer, planarizing the first dielectric layer and the first plurality of bond pads to level top surfaces of the first dielectric layer and the first plurality of bond pads with each other, hybrid bonding a first device die to the first dielectric layer and at least some of the first plurality of bond pads, and encapsulating the first device die in a first encapsulant.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional inventional additional additional additional additional inventional inventional additional additional inventional additional inventional inventional additional additional additional inventional inventional additional inventional additional inventional inventional additional additional additional additional inventional additional inventional inventional additional additional additional inventional additional additional additional inventional additional
Jie Hsien-Wei Der-Chyang Chi-Hsi
Chen Chen Yeh Wu