Slater and Matsil, L.L.P.
Integrated circuit structure and method of forming the same
An embodiment is an integrated circuit (IC) structure. The structure comprises a deep n well in a substrate, a first pickup device in the deep n well, a first signal device in the deep n well, a dissipation device in the substrate, a second signal device in the substrate, a first electrical path between the first pickup device and the dissipation device, and a second electrical path between the first signal device and the second signal device. The dissipation device is outside of the deep n well, and the second signal device is outside of the deep n well. A highest point of the first electrical path is lower than a highest point of the second electrical path.
Taiwan Semiconductor Manufacturing Company, Ltd.
H
H01L
inventional
Chih-Kang Yao-Jen Shih-Che Hung-Che David Chih Mou Yuan-Jen Yee-Ren Chih-Fu
Chuang Tsai Fang Hsueh Yen Huang Liao Wuang Chang