Slater Matsil, LLP
Bonding structure and method of forming same
A device includes an interconnect structure over a substrate, multiple first conductive pads over and connected to the interconnect structure, a planarization stop layer extending over the sidewalls and top surfaces of the first conductive pads of the multiple first conductive pads, a surface dielectric layer extending over the planarization stop layer, and multiple first bonding pads within the surface dielectric layer and connected to the multiple first conductive pads.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional inventional additional additional additional additional inventional inventional inventional inventional additional inventional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional inventional additional inventional additional additional inventional
Hsien-Wei Ming-Fa Jie
Chen Chen Chen