Slater Matsil, LLP
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a back side interconnect structure, and a winding of an inductor disposed in a material layer of the back side interconnect structure. A molding material is coupled to the back side interconnect structure. The package includes an integrated circuit die mounting region disposed within the molding material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jie Hsien-Wei
Chen Chen