Hauptman Ham, LLP
Electromigration evaluation methodology with consideration of both self-heating and heat sink thermal effects
An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling volume or range.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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inventional inventional additional additional additional additional
Sheng-Feng Amit Szu-Lin Chun-Wei Hsien
Liu Kundu Liu Chang Yu Tseng