Metal structure
A semiconductor wafer comprises a plurality of die areas, at least a first scribe line area and at least a second scribe line area surrounding each die area, at least a first metal structure positioned in the first scribe line area, and at least a second metal structure positioned in the second scribe line area. The first metal structure comprises at least a first slot split parallel to the first scribe line area, or comprises a plurality of openings arranged in an array. The second metal structure comprises at least a second slot split parallel to the second scribe line area, or comprises a plurality of openings arranged in an array.
United Microelectronics Corp.
H H H H H H
H01L H01L H01L H01L H01L H01L
inventional inventional additional additional additional inventional
Ching-Li Chien-Li Ping-Chang Hui-Ling Jui-Meng Kai-Kuang
Yang Kuo Wu Chen Jao Ho