Semiconductor package and method for packaging a semiconductor package
A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.
Advanced Semiconductor Engineering, Inc.
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Jian Cheng Hsiao Chuan Ho Ming Chang Ying Yi Shao Wei Chi Tsung Yueh
Chen Chang Tong Hung Lai Yih Tsai