Volentine & Whitt, PLLC
Memory chip package having optically and electrically connected chips, memory system having the same and driving method thereof
A memory chip package includes memory chips stacked, electrically connected one another, and configured to input and output an optical signal through an optical line formed by a via penetrating the memory chips. The memory chips input and output optical signals with different wavelengths, and each of the memory chips has an optical-electrical converter configured to convert an optical signal with a corresponding wavelength into an electrical signal and to convert an electrical signal into an optical signal with the corresponding wavelength.
Samsung Electronics Co., Ltd.
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Jeong-Kyoum Indal Junghwan
Kim Song Choi