Lewis Roca Rothgerber Christie LLP
Fan-out package with rabbet
A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.
Rockley Photonics Limited
Seungjae Chia-Te Brett
Lee Chou Sawyer