Harness, Dickey & Pierce, PLC
Semiconductor package with joint reliability, entangled wires including insulating material
A semiconductor package with improved joint reliability and a method of fabricating the semiconductor package are disclosed. A conductive connector may be formed on a surface of a semiconductor wafer on which semiconductor devices may be arranged. A first insulating layer including a first opening through which a portion of the connection pad is exposed may be formed on the connection pad and the semiconductor wafer. A rewiring line electrically connected to an exposed portion of the connection pad may be formed on the first insulating layer. A second insulating layer including a second opening through which a portion of the rewiring line is exposed may be formed on the rewiring line and the first insulating layer. A connection terminal including one or more entangled wires may be formed on an exposed portion of the rewiring line so as to be electrically connected to the rewiring line.
Samsung Electronics Co., Ltd.
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additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional inventional inventional additional additional additional inventional additional additional additional inventional additional additional inventional additional additional inventional
Hyun-soo Jum-gon Jae-shin Ki-hyuk Seong-deok
Chung Kim Cho Kim Hwang