Osha Liang LLP
Through substrate structure, device package having the same, and methods for manufacturing the same
A through substrate structure, an electronic device package using the same, and methods for manufacturing the same are disclosed. First, a via hole pattern is formed by etching an upper surface of a first substrate. A pattern layer of a second substrate is formed on the first substrate by filling the via hole pattern with a material for the second substrate by reflow. A via hole pattern is formed in the pattern layer of the second substrate by patterning the upper surface of the first substrate. Moreover, a via plug filling the via hole pattern is formed by a plating process, for example, thereby forming a through substrate structure, which can be used in an electronic device package.
Industry-Academic Cooperation Foundation, Dankook University
H H B B H
H01L H01L B81C B81B H01L
additional additional inventional additional additional
Ju Yong Jae Hyoung Seung Ki
Lee Park Lee