Haynes and Boone, LLP
Method of semiconductor integrated circuit fabrication
A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A patterned adhesion layer is formed on the substrate. A metal layer is deposited on the patterned adhesion layer. An elevated temperature thermal process is applied to agglomerate the metal layer to form a self-forming-metal-feature (SFMF) and a dielectric layer is deposited between SFMFs.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Minghsing Chien-An Ya-Lien Syun-Ming Wen-Jiun Hung-Wen
Tsai Chen Lee Jang Liu Su