Semiconductor device and method for fabricating the same
A method for fabricating semiconductor device is disclosed. First, a substrate is provided, a dielectric layer is formed on the substrate, and an opening is formed in the dielectric layer, in which the dielectric layer includes a damaged layer adjacent to the opening. Next, a dielectric protective layer is formed in the opening, a metal layer is formed in the opening, and the damaged layer and the dielectric protective layer are removed.
UNITED MICROELECTRONICS CORP.
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inventional inventional inventional additional inventional inventional inventional inventional
Ya-Jyuan Chich-Neng Bin-Siang
Hung Chang Tsai