J.C. Patents
Lead frame with heat slug
 The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the silicon chip can still be channeled away through the radiating surface of the heat slug. Furthermore, the heat slug can be bent over to cover burrs outside the package. 
Walsin Advanced Electronics Ltd. Sitron Precision Co., Ltd.
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Chih-Kung Wen-Chun
Huang Liu