Lewis Roca Rothgerber Christie LLP
Photosensitive resin composition and electronic device including cured product of pattern-forming composition including the photosensitive resin composition
A photosensitive resin composition is provided. The photosensitive resin composition includes a first binder resin and a second binder resin that have a weight average molecular weight of about 7,000 g/mol to about 12,000 g/mol, and an electronic apparatus including a cured product of a pattern-forming composition including the photosensitive resin composition.
Samsung Display Co., Ltd.
H H G G G H G G G G H H
H01L H01L G03F G03F G03F H01L G03F G03F G03F G03F H01L H01L
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Yuiku Inseok Sujeong
Lee Song Kim