Gibb I.P. Law Firm, LLC
CMP assisted liftoff micropatterning
A method and structure for a microelectronic device comprises a first film over a substrate, a first polish resistant layer over the first film, a second film over the first polish resistant layer, a second polish resistant layer over the second film, wherein the first and second polish resistant layers comprise diamond-like carbon. The first film comprises an electrically resistive material, while the second film comprises low resistance conductive material. The first film is an electrical resistor embodied as a magnetic read sensor. The electrically resistive material is sensitive to magnetic fields. The device further comprises a generally vertical junction between the first and second films and a dielectric film abutted to the electrically resistive material.
International Business Machines Corporation
G
G11B
inventional
Cherngye Marie-Claire Frederick H. Jui-Lung
Hwang Cyrille Dill Li