McDermott Will & Emery LLP
Side-emitting LED package and method of manufacturing the same
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
Samsung LED Co., Ltd.
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Myoung Soo Chang Ho Seon Goo Hun Joo Seong Yeon Young Sam Kyung Taeg
Choi Song Lee Hahm Han Park Han