McClure, Qualey & Rodack, LLP
Heat dissipation housing, manufacturing method thereof and electronic device using the same
A heat dissipation housing includes an outer casing and the heat conduction block. The heat dissipation housing includes a thickness portion and at least one first tenon extending towards the inner direction of the outer casing from the inner surface of the thickness portion. Heat conduction block includes a base and at least one second tenon extending towards the outer direction of the outer casing from the base. The first tenon and the second tenon are combined, such that the first tenon, the second tenon, and the base together form a column extending towards the inner direction of the outer casing from the inner surface of the thickness portion. The outer casing and the heat conduction block both have a thermal conductivity greater than 0.5 W/m-k.
SERCOMM CORPORATION
H G H H H H
H01L G06F H05K H05K H05K H05K
additional inventional inventional inventional additional inventional
Cheng-Chung Shi-Jun
Chang Weng