Hauptman Ham, LLP
Polishing system and polishing method
A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Min Hao Chih-Jen Chen-Ming You-Hua Chih-Yuan Chih-Tsung Kun-Tai Shih-Chi Chin-Hsiang Soon-Kang
Hong Wu Huang Chou Yang Lee Wu Lin Chang Huang