J.C. Patents
Flip chip package process
A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically connected to the substrate. Then, a stencil having at least one opening and an air slot hole is disposed on an upper surface of the substrate strip, an air gap is formed between the stencil and the substrate strip, the air gap connects the opening and the air slot hole, and the chip is located in the opening. Finally, a liquid compound is formed into the opening of the stencil to encapsulate the chip, and a vacuum process is performed through the air slot hole and the air gap, so as to prevent the air inside the opening from being encapsulated by the liquid compound to become voids.
Advanced Semiconductor Engineering, Inc.
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Chao-Yuan Tai-Yuan Yung-Cheng Jen-Chieh Ming-Chiang Shin-Hua Ho-Ming Teck-Chong Jau-Shoung
Liu Huang Huang Kao Lee Chao Tong Lee Chen