Slater & Matsil, L.L.P.
Semiconductor devices, packaging methods and structures
Semiconductor devices, packaging methods and structures are disclosed. In one embodiment, a semiconductor device includes an integrated circuit die with a surface having a peripheral region and a central region. A plurality of bumps is disposed on the surface of the integrated circuit die in the peripheral region. A spacer is disposed on the surface of the integrated circuit die in the central region.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Ming Hung Yi-Jen Yu-Ren
Tseng Lai Chen