Jianq Chyun IP Office
Method of forming bump
A method of forming a bump on an active surface of a wafer is disclosed. The method of the invention forms an under ball metallurgy (UBM) onto the active surface of the wafer. Then, the UBM is partially removed until a portion of the active surface of the wafer is exposed. At least one conductive stud is bonded onto the non-removed UBM by wire bonding.
Advanced Semiconductor Engineering, Inc.
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additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional
Jen-Kuang Jau-Shoung Ho-Ming Yung-Chi Chun-Chi Ching-Huei Min-Lung Chao-Fu
Fang Chen Tong Lee Lee Su Huang Weng