Slater & Matsil, L.L.P.
Package on package devices and methods of forming same
An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jiun Yi Chien-Hsun Chen-Hua Mirng-Ji Yung Ching
Wu Lee Yu Lii Chen