Harness, Dickey & Pierce, P.L.C.
Semiconductor package, package-on-package device, and method of fabricating the same
A semiconductor package including a package substrate, a semiconductor chip on a first surface of the package substrate, a connection substrate on the package substrate and spaced apart from and surrounding the semiconductor chip, the connection substrate including a plurality of conductive connection structures penetrating therethrough, a plurality of first connecting elements between the semiconductor chip and the package substrate and electrically connecting the semiconductor chip to the package substrate, a plurality of second connecting elements between the connection substrate and the package substrate and electrically connecting the connection substrate to package substrate, a mold layer encapsulating the semiconductor chip and the connection substrate, and an upper redistribution pattern on the mold layer and the semiconductor chip and electrically connected to a corresponding one of the plurality of conductive connection structures may be provided.
Samsung Electronics Co., Ltd.
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additional additional additional inventional additional inventional additional additional additional additional additional inventional inventional inventional additional additional inventional additional additional inventional additional inventional inventional inventional inventional additional inventional inventional additional inventional inventional additional inventional additional additional inventional inventional additional additional
Kyung Suk Seokhyun
Oh Lee