Innovation Counsel LLP
Semiconductor device and method of manufacturing the same
A semiconductor device includes a bottom substrate, wherein a front-end device including a microelectromechanical systems (MEMS) device and an inductor is disposed on the bottom substrate, and a top substrate bonded to the bottom substrate so as form a cavity enclosing the front-end device. The semiconductor device further includes an adsorption layer disposed on a portion of the top substrate facing the front-end device, wherein the adsorption layer and the inductor do not overlap in a vertical direction.
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
B
B81B
inventional
Chao Wei
Zheng Wang