Hauptman Ham, LLP
Image sensor having stress releasing structure and method of forming same
A semiconductor structure includes a sensor wafer comprising a plurality of sensor chips on and within a substrate. Each of the plurality of sensor chips includes a pixel array region, a bonding pad region, and a periphery region. The periphery region is between adjacent to a scribe line, and the scribe line is between adjacent sensor chips of the plurality of sensor chips. Each of the plurality of sensor chips further includes a stress-releasing trench structure embedded in the substrate, wherein the stress-releasing trench structure is in the periphery region, and the stress-releasing trench structure fully surrounds a perimeter of the pixel array region and the bonding pad region of a corresponding sensor chip of the plurality of sensor chips.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chun-Hao Kuo-Cheng Chun-Wei Ying-Hao Yun-Wei
Chou Lee Chia Chen Cheng