Rosenberg, Klein & Lee
Re-routing lead frame package and semiconductor memory package using the same
 The present invention discloses a semiconductor memory stack including two semiconductor memory packages stacked together. The semiconductor memory packages are electrically connected by pins. At least one of the semiconductor memory packages has a lead frame provided with a re-routing pin connected to a laterally extended conductive layer. According to the present invention, a memory device with a larger capacity can be obtained by stacking two semiconductor memory packages with a smaller capacity, thereby reducing the cost and simplifying the manufacturing process. 
PTI Powertest Technology, Inc.
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Dah-Sheng Chang-Min
Yen Chou