Slater Matsil, LLP
Zero stand-off bonding system and method
A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional additional additional inventional additional inventional additional additional additional inventional inventional additional additional inventional additional additional additional inventional
Yi-Wen Ming-Che Han-Ping Chun-Hung Hsien-Liang Yu-Feng
Wu Ho Pu Lin Meng Chen