Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such pads
Wafers, chips, or dies that contain fill cells with structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). Such NCEM-enabled fill cells may target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes, and may include NCEM pads that comprise a mesh of GATECNT and AACNT stripes. Such wafers, chips, or dies may include Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).
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Jonathan Rakesh Markus Marci Sheng-Che Nobuharu Tomasz Carl John Andrzej Sherry Conor Hideki Simone Dennis Kimon Christopher Timothy Jeremy Hans Stephen Larg Indranil Marcin Vyacheslav Kelvin
Haigh Vallishayee Rauscher Liao Lin Yokoyama Brozek Taylor Kibarian Strojwas Lee O'Sullivan Matsuhashi Comensoli Ciplickas Michaels Hess Fiscus Cheng Eisenmann Lam Weiland De Strojwas Rovner Doong