Slater Matsil, LLP
Methods of packaging semiconductor devices and packaged semiconductor devices
Methods of packaging semiconductor devices and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes providing a semiconductor device comprising an integrated circuit die, connectors disposed over the integrated circuit die, and an insulating material disposed over the connectors and the integrated circuit die. The insulating material is removed from over corner regions of the integrated circuit die, and a molding material is disposed over the insulating material and the integrated circuit die. A top portion of the molding material and the insulating material is removed to expose the connectors.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional inventional inventional inventional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional
Jie Hsien-Wei
Chen Chen