Steptoe & Johnson LLP
Wiring board and soldering method therefor
A circuit board for surface mounting by solder flow an electronic component having narrow lead pitches, the board having a first solder leading land having a first side and located on the circuit board adjacent to a land for mounting an electronic component, and a second solder leading land located next to the first solder leading land and opposite the first side of the first solder leading land. A method for flow soldering a surface mounted electronic component on such a circuit board, wherein the second solder leading land is positioned at a rear end of the circuit board against a direction of a movement of the circuit board when the circuit board moves toward a solder flow.
Matsushita Electric Industrial Co., Inc.
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Keiichi Koji Akihiro Mitsuhisa Yoshinao Hiroaki
Kuriyama Taniguchi Kyogoku Nakai Nakamoto Higashi