William Park & Associates Ltd.
Substrate processing apparatus and substrate processing method using the same
Provided are a substrate processing apparatus and a substrate processing method using the same and, more particularly, a substrate processing apparatus capable of controlling deposition of a reactive-metal-containing precursor in an exhaust line, and a substrate processing method using the same.
WONIK IPS CO., LTD.
H C C H H H C H
H01L C23C C23C H01L H01L H01L C23C H01L
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Byoung Guk Tae Ho Seung Han Jin Pil Jeong Min
Son Jeon Lee Heo Lee