Metal-passivating CMP compositions and methods
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
Cabot Microelectronics Corporation
C H C
C09K H01L C09G
inventional inventional inventional
Pankaj Jason Vlasta
Singh Keleher Brusic