Birch, Stewart, Kolasch & Birch, LLP
Chip package with redistribution layers
A chip package is provided. The chip package includes a semiconductor die and a protective layer surrounding the semiconductor die. The chip package also includes an interface between the semiconductor die and the protective layer. The chip package further includes a conductive line over the protective layer and the semiconductor die. The conductive line has a first portion and a second portion in direct contact with the first portion, and the second section at least partially covers the interface. In a top view of the conductive layer, line widths of the first portion and the second portion are different from each other.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional inventional additional inventional additional additional additional additional additional additional additional inventional additional inventional additional additional additional additional inventional inventional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional
Jie Hsien-Wei
Chen Chen