Metallic nanowire interconnections for integrated circuit fabrication
A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic precursor of a metal nanowire (MeNW) is provided around the catalyst array, and MeNWs grow between the conductive layer and the catalyst array. The catalyst array and a portion of each of the MeNWs are removed to provide exposed ends of the MeNWs.
The United States of America as represented by the Administrator of the National Aeronautics and Space Administration (NASA)
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Hou Tee Meyya Jun
Ng Meyyappan Li