Haynes and Boone, LLP
Semiconductor structure and manufacturing method thereof
The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional additional additional inventional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional inventional additional additional additional additional inventional inventional
Yeur-Luen Sheng-Chau Shih-Pei Kuo-Ming Cheng-Yuan Ming-Jhe Cheng-Hsien
Tu Chen Chou Wu Tsai Lee Chou