WPAT, P.C., Intellectual Property Attorneys
Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same
A semiconductor structure includes: a semiconductor substrate arranged over a back end of line (BEOL) metallization stack, and including a scribe line opening; a conductive pad having an upper surface that is substantially flush with an upper surface of the semiconductor substrate, the conductive pad including an upper conductive region and a lower conductive region, the upper conductive region being confined to the scribe line opening substantially from the upper surface of the semiconductor substrate to a bottom of the scribe line opening, and the lower conductive region protruding downward from the upper conductive region, through the BEOL metallization stack; a passivation layer arranged over the semiconductor substrate; and an array of pixel sensors arranged in the semiconductor substrate adjacent to the conductive pad.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Min-Feng Cheng-Hsien Sheng-Chau
Kao Chou Chen