Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Insulating material and a circuit substrate in use thereof
 An insulating material characterized by that said insulating material is made by curing a mixture composed of a bisphenol A type epoxy resin having purity which is equal to or more than 90% and an organic filler, the thermal conductivity thereof is in a range of 5.0.times.10.sup.-3 to 18.0.times.10.sup.-3 (cal/.degree.C..multidot.cm.multidot.sec) and the glass transition temperature thereof is in a range of 164.degree. to 240.degree. C. 
Denki Kagaku Kogyo Kabushiki Kaisha
C C Y H H Y H Y
C08K C08K Y10T H01B H05K Y10S H01B Y10T
inventional inventional additional inventional inventional additional inventional additional
Tatsuo Kazuo Chiharu
Nakano Kato Watanabe