Katten Muchin Zavis Rosenman
Semiconductor device and method for packaging same
A semiconductor device has an LSI device provided with a plurality of power supply line connection pads and ground line connection pad in a peripheral edge part of a circuit-formation surface, metal foil leads 5 electrically connected to each of the pads and adhered to the LSI device via an insulation layer, and decoupling capacitors mounted on one surface of the metal foil leads.
NEC Corporation
H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional inventional
Akinobu Takao Shintaro Toru Yuzo
Shibuya Yamazaki Yamamichi Mori Shimada