Robinson Intellectual Property Law Office, P.C.
Securities, chip mounting product, and manufacturing method thereof
The invention provides an ID chip with reduced cost, increased impact resistance and attractive design, as well as products and the like mounting the ID chip and a manufacturing method thereof. In view of the foregoing, an integrated circuit having a semiconductor film with a thickness of 0.2 μm or less is mounted on securities including bills, belongings, containers of food and drink, and the like (hereinafter referred to as products and the like). The ID chip of the invention can be reduced in cost and increased in impact resistance as compared with a chip formed over a silicon wafer while maintaining an attractive design.
Semiconductor Energy Laboratory Co., Ltd.
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H01L G06K G06K G07D H01L G06K
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Shunpei Kiyoshi
Yamazaki Kato