Slater & Matsil, L.L.P.
Packaging methods and structures using a die attach film
Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional inventional inventional additional inventional additional additional additional additional additional additional inventional inventional additional inventional additional additional additional additional
Chin-Fu Nai-Wei Jui-Pin Szu Wei Yi-Chao Chin-Chuan Shin-Puu Chen-Hua Jing-Cheng
Kao Liu Hung Lu Mao Chang Jeng Yu Lin