Ostrolenk, Faber, Gerb & Soffen
Circuit substrate having ceramic multilayer structure containing chip-like electronic components
 A circuit substrate (1) comprises a ceramic laminated structure (10) which has a plurality of ceramic layers (2-7) including ceramic layers (3-6) having cavities (44-49). Chip-like electronic components such as a laminated ceramic capacitor (26, 27) and a resistor (28) are received in the cavities. The chip-like electronic components are formed with external terminal electrodes (29-34) respectively. Conductors (15-20) are formed in through holes (35-43) provided in the ceramic layers and interfaces between adjacent pairs of the ceramic layers, to be connected to the external terminal electrodes. The external terminal electrodes are prepared from metal which is mainly composed of at least one of nickel, copper and palladium, and the conductors are prepared from metal which is mainly composed of copper. 
Murata Manufacturing Co., Ltd.
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Yukio Yoshiaki Horshi
Sakabe Mori Takagi