Birch, Stewart, Kolasch & Birch, LLP
Photo-curable resin composition, patterning process, and substrate protecting film
A photo-curable resin composition comprising (A) an organosiloxane-bearing polymer comprising recurring units of formula (1): wherein R1 to R4 are monovalent C1-C8 hydrocarbon, n is an integer of 1-1,000, and X is and having a Mw of 500-200,000, (B) a formalin-modified or formalin-alcohol-modified amino condensate, a phenol compound having on the average at least two methylol or alkoxymethylol radicals, or an epoxy compound having on the average at least two epoxy radicals, (C) a photoacid generator, and (D) a silicon compound of the formula: (R11)mSi(OR12)4−m wherein R11 is monovalent C1-C9 hydrocarbon, R12 is C1-C4 alkyl, m is 0-2, forms cured pattern films having dry etch resistance and improved adhesion to substrates.
Shin-Etsu Chemical Co., Ltd.
Y G C G
Y10S G03F C09D G03F
additional inventional inventional inventional
Hideto Toshihiko Satoshi Kazuhiro Kazumi
Kato Fujii Asai Arai Noda