RatnerPrestia
Electronic component and method of manufacturing the same
An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.
Matsushita Electric Industrial Co., Ltd.
H H H H Y H H Y
H01L H01L H01C H01C Y10T H01F H01G Y10T
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Takeshi Hiroyuki Yasuharu
Iseki Yamada Kinoshita