Duane Morris LLP
Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits
A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground. The ground shielding layer drives radiation signals received therein to ground to prevent induced noise in the first signal path.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Feng Wei William Wu Wen-Shiang Huan-Neng Lan-Chou Chewn-Pu
Kuo Shen Liao Chen Cho Jou