Anova Law Group, PLLC
Flash memory device and fabrication method thereof
Flash memory devices and fabrication methods thereof are provided. An exemplary method includes providing discrete bit lines on a semiconductor substrate, a first dielectric layer on top surfaces of the bit lines, and a floating gate structure on the first dielectric layer, trenches being formed between adjacent bit lines and on the semiconductor substrate; forming a sacrificial layer with a top surface above the top surfaces of the bit lines in the trenches; forming a second dielectric layer on top and side surfaces of the floating gate structure and the top surface of the sacrificial layer; forming a control gate structure on the second dielectric layer; removing portions of the second dielectric layer, the floating gate structure and the first dielectric layer to expose a portion of the sacrificial layer; and removing the sacrificial layer from the adjacent bit lines and the semiconductor substrate, thereby forming air gaps.
Semiconductor Manufacturing International (Beijing) Corporation Semiconductor Manufacturing International (Shanghai) Corporation
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Xiao Bo Sheng Fen Chao Feng Liang
Li Chiu Zhou Chen