Haynes and Boone, LLP
Surface modifying material for semiconductor device fabrication
Methods and materials for making a semiconductor device are described. The method includes forming a surface preparation layer over the semiconductor substrate. The surface preparation material layer includes an aziridine structure. A coating layer may then be deposited on the surface preparation material layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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H01L H01L H01L H01L
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Ching-Yu Chen-Yu
Chang Liu