Tarolli, Sundheim, Covell & Tummino LLP
Wiring substrate
A wiring substrate includes a stack having a plurality of insulation layers and a plurality of wiring layers. Each of the plurality of insulation layer is formed by an insulative resin of which main component is a photosensitive resin. The plurality of insulation layers and the plurality of wiring layers are alternately stacked one upon another. The wiring substrate further includes a first insulation layer covering a lower surface of the stack and entirely covering a side surface of the stack. The first insulation layer has a higher rigidity than the plurality of insulation layers. An upper surface of the uppermost one of the plurality of wiring layers and an upper surface of the uppermost one of the plurality of insulation layers are exposed from the first insulation layer.
SHINKO ELECTRIC INDUSTRIES CO., LTD.
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Ken Shoji
Miyairi Watanabe