Slater Matsil, LLP
Heat dissipation panel, heat dissipation apparatus, and electronic device
A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.
Huawei Technologies Co., Ltd.
G G H H
G06F G06F H05K H05K
inventional additional inventional inventional
Xiaohu Guo Quanming Zhiguo Wei
Liu Yang Li Zhang Li