Integrated circuit device test tooling with dual angle cavities
A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block.
ESSAI, INC.
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Oksana Joven R. Chee Wah Nasser
Kryachek Tienzo Ho Barabi