Haynes and Boone, LLP
Multiple seal ring structure
The present disclosure provides a method of fabricating a semiconductor device, the method including providing a substrate having a seal ring region and a circuit region, forming a first seal ring structure over the seal ring region, forming a second seal ring structure over the seal ring region and adjacent to the first seal ring structure, and forming a first passivation layer disposed over the first and second seal ring structures. A semiconductor device fabricated by such a method is also provided.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jeng-Shyan Dun-Nian Jen-Cheng Shu-Ting Wen-De
Lin Yaung Liu Tsai Wang