Slater Matsil, LLP
Multi-chip integrated fan-out package
A method includes surrounding a die and a conductive pillar proximate the die with a molding material, where the die and the conductive pillar are disposed over a first side of a first redistribution structure, where a second side of the first redistribution structure opposing the first side is attached to a first carrier; bonding conductive pads disposed on a first surface of a pre-made second redistribution structure to the die and to the conductive pillar, where a second surface of the pre-made second redistribution structure opposing the first surface is attached to a second carrier; after bonding the conductive pads, removing the second carrier to expose conductive features of the pre-made second redistribution structure proximate the second surface; and forming conductive bumps over and electrically coupled to the conductive features of the pre-made second redistribution structure.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional additional additional additional additional additional additional additional additional additional inventional additional inventional inventional inventional additional additional additional additional additional inventional inventional inventional inventional additional inventional additional additional inventional inventional inventional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional
Hsien-Wei Jie
Chen Chen