Staas & Halsey
Circuit board and process for manufacturing same
 A circuit board comprising a base having a substantially flat surface and an insulative layer made of a heat-resisting synthetic resin formed on the flat surface of the base. The insulative layer is provided with grooves for forming conductive parts, and each of the groove is defined by a bottom surface formed by the base and side walls formed by the insulative layer. A conductive adhesive layer having a good adhesion characteristic with respect to the base, such as Cr, is formed on the bottom surface of the grooves, and a conductive layer is formed on the conductive adhesive layer so that a surface defined by the insulative layer and the conductive parts including the conductive layer and conductive adhesive layer is substantially flat. 
Shinko Electric Industries, Co., Ltd.
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Takahiro Shinichi
Iijima Wakabayashi