Integrated circuit package system with stacking module
An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.
STATS Chippac Ltd.
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BumJoon Jong-Woo SeongMin Flynn
Hong Ha Lee Carson