Sughrue Mion, PLLC
Ultrasonic probe
An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.
Samsung Electronics Co., Ltd.
H G H H H H B G
H05K G01N H05K H05K H05K H05K B06B G01N
additional inventional additional additional inventional inventional inventional inventional
Seung Heun Jong Keun Bae Hyung Kyung Il Young Il
Lee Song Kim Cho Kim