JCIPRNET
Die stack structure and method of fabricating the same
Provided is a die stack structure including a first die, a second die, a first bonding structure, and a second bonding structure. The first bonding structure is disposed on a back side of the first die. The second bonding structure is disposed on a front side of the second die. The first die and the second die are bonded together via the first bonding structure and the second bonding structure and a bondable topography variation of a surface of the first bonding structure bonding with the second bonding structure is less than less than 1 μm per 1 mm range. A method of manufacturing the die stack structure is also provided.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yi-Hsiu Wen-Chih Yung-Lung
Chen Chiou Chen