JCIPRNET
Package substrate and method of fabricating the same
A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. The insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least the passive component is directly provided on the conductive pad exposed from the opening.
Unimicron Technology Corp. Industrial Technology Research Institute
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inventional inventional inventional inventional additional inventional inventional
Wei-Chung Yu-Hua Dyi-Chung Chang-Hong
Lo Chen Hu Hsieh