Posz Law Group, PLC
Semiconductor device having passivation cap and method for manufacturing the same
A semiconductor device includes a semiconductor wafer having a weak portion and a removable passivation cap disposed on the wafer for covering the weak portion. The passivation cap has an absorption coefficient of a laser beam, which is smaller than that of the wafer. The cap has a capability of passing water therethrough. In a case where the device is diced and cut into a plurality of chips, the passivation cap can be removed easily without bonding the cap again. That is because the passivation cap remains one body after dicing.
Denso Corporation
H B B H H B
H01L B23K B23K H01L H01L B23K
inventional additional inventional inventional additional inventional
Yasutoshi Shinji
Suzuki Yoshihara