Jianq Chyun IP Office
Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof
A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
Industrial Technology Research Institute
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Yu-Hua Shur-Fen Jinn-Shing Cheng-Ta Wei-Chung Shinn-Juh Min-Lin
Chen Liu King Ko Lo Lai Lee