Breiner & Breiner, L.L.C.
Use of glass laminate as a substrate in semiconductor devices
 A method for making a semiconductor device is disclosed which comprises the step of applying a functional layer on a substrate, characterized in that said substrate is a laminate which comprises a support and a glass layer, said glass layer having a thickness of less than 700 .mu.m. The support is preferably a plastic foil. The laminate has the combined benefits of low weight and high strength and is therefore a suitable substrate for making flat panel displays such as liquid crystal displays, plasma displays, field emission displays or organic light-emitting polymer displays. Preferred examples of the functional layer are e.g. electroconductive layers, liquid crystal orientation layers, color filters, electroluminescent layers, passivation layers and phosphor layers. 
Agfa-Gevaert
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H01L H01L B32B B32B B32B G06K H01L B32B H01L Y02P H01L Y02E B32B G02B G06K G03C B32B G03C B32B G03C G02B B32B G03C H01L G02F G02B H01L G02F B32B B32B B32B G02F G06K H01L H01L G02F B32B H01L G03C G03C B32B G03C B32B
inventional inventional inventional inventional additional inventional additional inventional additional additional inventional additional additional inventional inventional additional inventional additional inventional additional inventional inventional additional additional additional inventional inventional additional inventional inventional additional inventional inventional inventional inventional additional inventional inventional inventional additional additional additional inventional
Bartholomeus Jean-Pierre Rudi
Verlinden Tahon Goedeweeck