Keating & Bennett, LLP
Packaging material with electromagnetic coupling module
A packaging material includes an electromagnetic coupling module for an RFID system, in which a radio IC chip is protected from external shock and environmental change without affecting the planarity of the packaging material, the assembly including an electromagnetic coupling module is facilitated, and the radiation characteristics are satisfactory. A packaging material includes a liner and a wave-shaped core material, wherein an electromagnetic coupling module is arranged inside of the packaging material. The electromagnetic coupling module includes a radio IC chip and a feeder circuit board, on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element. The packaging material is made of a dielectric, wherein the dielectric and the electromagnetic coupling module are electromagnetically coupled to transmit/receive high frequency signals.
Murata Manufacturing Co., Ltd.
H H H B B H G H
H01Q H01Q H01L B65D B65D H01Q G06K H01Q
inventional inventional additional inventional additional inventional inventional inventional
Noboru Makoto Norio
Kato Osamura Sakai