Harness, Dickey & Pierce, P.L.C.
Semiconductor device and method of manufacturing the same
A semiconductor device includes a first semiconductor package including a first mold part, a second semiconductor package including a second mold part, a connecting pattern configured to electrically connect the first and second semiconductor packages to each other, and a molding pattern between the first and second semiconductor packages. The molding pattern extends to cover at least a portion of a sidewall of only the second semiconductor package.
Samsung Electronics Co., Ltd.
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JiSun JongBo SeokWon Kyoungsei Hyunki
Hong Shim Lee Choi Kim