Systems and methods for reinforced adhesive bonding
The present disclosure relates to a bonding system (100) comprising an adhesive (200), in contact with a first contact surface (115) and a second contact surface (125), and a solder mesh (310) positioned in the adhesive (200) in contact with the first contact surface (115). Also, the present disclosure relates to a bonding method to produce a solder-reinforced adhesive bond joining a first substrate (110) and a second substrate (120), comprising applying, on a first contact surface (115) of the first substrate (110), an adhesive (200), positioning, at least partially into the adhesive (200), a solder mesh (310), such that the solder mesh (310) contacts the first contact surface (115), connecting, to a portion of the adhesive (200) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), and applying heat to the first contact surface (115) such that at least one portion of the solder mesh (310) reaches a solder-bonding temperature.
GM GLOBAL TECHNOLOGY OPERATIONS LLC
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Jianfeng Xin Yongqiang Blair E.
Wang Yang Li Carlson