Angled die pad of a leadframe for a molded integrated circuit package
A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.
Texas Instruments Incorporated
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Chia-Yu Yuh-Harng Fu-Kang Chung-Ming
Chang Chien Lee Cheng