Wenderoth, Lind & Ponack, L.L.P.
Method of manufacturing component-embedded printed wiring board
The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.
Panasonic Corporation
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Motoyoshi Eiji Toshihiko Kazuhiko Junichi
Kitagawa Kawamoto Mori Honjo Kimura