Altis Law Group, Inc.
Bonding apparatus
A bonding apparatus includes a frame, a first feeding mechanism, a second feeding mechanism, and a bonding mechanism. The first feeding mechanism is mounted on the frame and includes a turntable capable of rotating relative to the frame. A plurality of workpiece seats are arranged on the turntable. Each workpiece seat defines a plurality of first air holes. The second feeding mechanism is mounted on the frame and includes a first carrier and a second carrier. The first carrier includes a plurality of holding seats and the second carrier including a plurality of temporary holding seats. The first carrier is capable of rotating to stack on the second carrier. Each of the holding seats defines a plurality of second air holes. The bonding mechanism is movably mounted on the frame to correspond to the workpiece seats or the second carrier.
Hon Hai Precision Industry Co., Ltd. Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
Y Y Y Y Y B
Y10T Y10T Y10T Y10T Y10T B32B
additional additional additional additional additional inventional
Jia-Jie Dong-Sheng Tzyy-Chyi
Chen Lin Tsai