Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
Semiconductor device having a reductant layer and manufacturing method thereof
A semiconductor device includes an inter-metal dielectric (IMD) formed on a substrate and having at least one via hole, a via hole formed by filling the via hole with a first metal, a reductant layer formed on the via plug and the inter-metal dielectric to a predetermined thickness, and a metal line layer formed by depositing a second metal on the reductant layer.
Dongbu Electronics Co. Ltd.
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Jung Joo
Kim