Burke, Williams & Sorensen, LLP
Multiple wafers fabrication technique on large carrier with warpage control stiffener
Disclosed is a method of manufacturing a semiconductor device that includes adhering a plurality of semiconductor substrates and a framing member to a supporting surface of a carrier substrate. The semiconductor substrates can be wafers that can be diced or cut into a plurality of dies. Thus, the wafers each have respective active surfaces and at least one respective integrated circuit region. The method can further include encapsulating the framing member and the plurality of semiconductor substrates within an encapsulant. Subsequently, the carrier substrate is removed and a redistribution layer (RDL) is formed on the semiconductor substrates and the framing member.
BEIJING ESWIN TECHNOLOGY CO., LTD. CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional additional inventional additional additional inventional inventional inventional inventional inventional inventional inventional additional inventional additional inventional additional additional
Xiaotian Minghao
Zhou Shen