Brumbaugh, Graves, Donohue & Raymond
Semiconductor wafer testing apparatus using intermediate semiconductor wafer
 Bump electrodes are formed on the bottom surface of an intermediate semiconductor wafer at locations corresponding to electrode pads of circuit elements formed on a subject semiconductor wafer. Pickup electrodes and control electrodes are formed on the top surface of the intermediate semiconductor wafer. A switching circuit is formed in the intermediate semiconductor wafer, and serves to connect selected ones of the bump electrodes to the pickup electrodes in accordance with switching control signals provided from a tester via the control electrodes. The pickup electrodes and the control electrodes are connected to the tester via pogo pins. 
Rohm Co., Ltd.
G
G01R
inventional
Toshifumi Masayoshi
Fujii Koine