Flynn, Thiel, Boutell & Tanis
Resin composition to seal electronic device
 A resin composition is suitable to seal an electronic device, when cured, and comprises: PA1 (a) an unsaturated alicyclic epoxy ester compound obtained by reacting an alicyclic epoxy compound having at least two epoxy groups in the molecule with 0.5 to 1.1 equivalent, per equivalent of the epoxy group, of acrylic or methacrylic acid, PA1 (b) a polymerizable vinyl monomer, and PA1 (c) a photopolymerization initiator. 
Daicel Chemical Industries, Ltd.
H H H C H H Y H
H01L H01B H01B C08F H01C H01L Y10S H01G
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Yosuke Tomohisa Shoji Akira Susumu
Sagami Isobe Watanabe Yamamoto Funato