Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Method for removing particles from a surface of an article
 A method for removing particles from a surface of an article, such as a semiconductor wafer in a clean room. The particles are supplied with an electric charge. Subsequently, an ultrasonic wave or a gas stream is applied onto the surface of the article while an electric field is applied for driving away the electrically charged particles from the surface, thereby removing particles having a dimension smaller than 1 micrometer from the surface. The presence of a collecting member allows the removal of resulting, floating particles. 
Ebara Corporation
Y H H B
Y10S H01L H01L B08B
additional inventional inventional inventional
Manabu Toshiaki Kikuo
Shimada Fujii Okuyama