Integrated circuit including NCEM-enabled, interlayer overlap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of interlayer overlap shorts and/or leakages.
PDF Solutions, Inc.
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John Markus Carl Simone Nobuharu Jeremy Rakesh Andrzej Dennis Hans Stephen Christopher Kelvin Larg Vyacheslav Tomasz Kimon Indranil Marcin Timothy Conor Marci Hideki Jonathan Sherry Sheng-Che
Kibarian Rauscher Taylor Comensoli Yokoyama Cheng Vallishayee Strojwas Ciplickas Eisenmann Lam Hess Doong Weiland Rovner Brozek Michaels De Strojwas Fiscus O'Sullivan Liao Matsuhashi Haigh Lee Lin