Mattingly, Stanger & Malur, P.C.
Semiconductor device and a method of manufacturing the same
A central portion of a main face of a package substrate 2 is mounted with a memory chip 1 using face down bonding by a flip chip bonding system. Further, a plurality of chip condensers 7 are mounted at vicinities of the memory chip 1. A clearance between a main face (lower face) of the memory chip 1 and a main face of the package substrate 2 is filled with underfill resin (seal resin) 10 constituting a seal member for achieving protection of connecting portions and for relaxation of thermal stress. An outer edge of the underfill resin 10 is extended to an outer side of the memory chip 1 and covers entire faces of the chip condensers 7 mounted at vicinities of the memory chip 1. 
Hitachi, Ltd.
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Ikuo Toshihiko Hideko Tomo Hiroshi
Yoshida Sato Ando Shimizu Kikuchi