Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas
A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side-to-side short, and chamfer short test areas.
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Conor Stephen Christopher Larg John Indranil Marcin Sheng-Che Nobuharu Sherry Hans Kelvin Jeremy Andrzej Jonathan Carl Vyacheslav Marci Timothy Tomasz Simone Dennis Markus Kimon Rakesh Hideki
O'Sullivan Lam Hess Weiland Kibarian De Strojwas Lin Yokoyama Lee Eisenmann Doong Cheng Strojwas Haigh Taylor Rovner Liao Fiscus Brozek Comensoli Ciplickas Rauscher Michaels Vallishayee Matsuhashi