Moser, Patterson & Sheridan
Method and apparatus for polishing metal and dielectric substrates
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.
Applied Materials, Inc.
B H B H
B24B H01L B24B H01L
inventional inventional inventional inventional
Rajeev Fred C. Tony S. David Kapila Gary Yongqi Jui-Lung Shi-Ping Yongsik Shijian Rahul
Bajaj Redeker Kaushal Mai Wijekoon Lam Hu Li Wang Moon Li Surana