Faegre Drinker Biddle & Reath LLP
Silicone-free thermal gel
The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.
Honeywell International Inc.
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Qi Ya Qun Haigang Liqiang Rongwei Huifeng
Zhang Liu Kang Zhang Pan Duan