Horizon IP Pte Ltd
Device with integrated power supply
Semiconductor devices and methods for forming a semiconductor device are disclosed. The semiconductor device includes a die. The die includes a die substrate having first and second major surfaces. The semiconductor device includes a power module disposed below the second major surface of the die substrate. The power module is electrically coupled to the die through silicon via (TSV) contacts.
GLOBALFOUNDRIES Singapore Pte. Ltd.
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Yeow Kheng Juan Boon Soh Yun Wei Shunqiang
Lim Tan Siah Liu Gong