Muir Patent Consulting, PLLC
Fin-type heat sink for electronic component
One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.
Samsung Electronics Co., Ltd.
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inventional inventional additional inventional
Hyo-Jae Jung-Hyeon
Bang Kim