Rabin & Berdo, P.C.
Airflow guiding and heat dissipating assembly for electronic device
An airflow guiding and heat dissipating assembly is mounted in an electronic device and has a base and at least one baffle being mounted on the base. Multiple electronic components are mounted on the base and are arranged in a line. Airflow flows along one electronic component upstream, past the baffle and then over the other electronic component downstream to take away heat from the electronic component. The baffle prevents the airflow from becoming turbulent and, therefore, temperatures of the electronic component are lowered efficiently.
Acbel Polytech Inc.
H H
H01L H01L
additional inventional
Wen-Hsiung Chia-Hao Chien-An
Chen Lin Chou