Myers Bigel, P.A.
Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
A semiconductor package includes a package substrate, at least one first semiconductor chip on the package substrate and having a first height as measured from the package substrate, at least one second semiconductor chip on the package substrate spaced apart from the first semiconductor chip and having a second height less than the first height as measured from the package substrate, at least one third semiconductor chip stacked on the first and second semiconductor chips, and at least one support structure between the at least one second semiconductor chip and the at least one third semiconductor chip configured to support the at least one third semiconductor chip.
Samsung Electronics Co., Ltd.
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Sung-Il Yong-Je Won-Gil Seung-Lo
Cho Lee Han Lee