Smith & Hopen, P.A.
Thermally induced single-use valves and method of use
In accordance with an embodiment of the present invention, a thermally induced single-use valve is provided including a silicon wafer having a top surface and a bottom surface and at least one cavity formed in the bottom surface of the wafer, a thermally deformable membrane suspended across the cavity on the top surface of the wafer and at least one resistive element patterned on top of the thermally deformable membrane.
University of South Florida
Y F Y Y F F F F F
Y10T F16K Y10T Y10T F16K F16K F16K F16K F16K
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Michelle Larry Weidong Jay John Andres M.
Cardenas Langebrake Wang Dlutowski Bumgarner Cardenas-Valencia