Lowe Hauptman & Ham, LLP
Three-dimensional integrated circuit and method for wireless information access thereof
A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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inventional additional additional additional additional inventional additional additional additional additional additional additional additional
Ming-Chieh Kuang Kai Feng Wei Hao Hung-Chih Tsung-Hsiung Ching-Nen Huan-Neng Mill-Jer Chewn-Pu
Liu Yen Kuo Chen Lin Li Peng Chen Wang Jou