Curved grooving of polishing pads
A method is provided for forming grooves in a polishing pad useful for planarizing a substrate in a chemical mechanical planarization process. The method maintains average velocity as a function of bit diameter to enable groove formation using a rotating bit, whereby grooves can be formed at a higher rate while maintaining high groove quality and low defectivity.
Rohm and Haas Electronic Materials CMP Holdings, Inc.
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Weitung Steven J. Jeffrey R. Steven
Wang Pufka Stack Naugler