Foley & Lardner LLP
Semiconductor package structure and method for manufacturing the same
A semiconductor package structure includes: (1) a first substrate; (2) at least one first semiconductor element attached to the first substrate; and (3) a second substrate including a plurality of thermal vias and a plurality of conductive vias, wherein one end of each of the thermal vias directly contacts the first semiconductor element.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Tang-Yuan Jin-Feng Yu-Chang Chin-Li Bo-Syun Meng-Kai
Chen Yang Chen Kao Chen Shih