Slater Matsil, LLP
Package on package devices and methods of packaging semiconductor dies
A method of packaging semiconductor dies may include: coupling a first die to a first substrate; forming a plurality of first portions of a plurality of metal pillars on a surface of the first substrate; forming a second portion of the plurality of metal pillars over each of the plurality of first portions of the plurality of metal pillars; forming a protection layer over sidewalls of each of the plurality of first portions and second portions of the plurality of metal pillars; coupling a second die to a second substrate; and coupling the plurality of metal pillars to the second substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Feng Chung-Shi Chun-Lei Ming-Che De-Yuan
Chen Liu Hsu Ho Lu