Buchanan Ingersoll & Rooney PC
Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
Mitsui Chemicals, Inc.
C C C H C C
C08L C07C C08G H01L C07C C07D
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Mitsuaki Naritoshi Hiroaki Takashi Yuichi Yugo
Chida Yoshimura Tamatani Nakano Ito Yamamoto