Harness, Dickey & Pierce, P.L.C.
Substrate structures and methods of manufacturing the same
Substrate structures and methods of manufacturing the substrate structures. A substrate structure is manufactured by forming a protrusion area of a substrate under a buffer layer, and forming a semiconductor layer on the buffer layer, thereby separating the substrate from the buffer layer except in an area where the protrusion is formed. The semiconductor layer on the buffer layer not contacting the substrate has freestanding characteristics, and dislocation or cracks may be reduced and/or prevented.
Samsung Electronics Co., Ltd.
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Young-jo Jae-won Hyun-gi Hyung-su Jun-youn
Tak Lee Hong Jeong Kim