Foley & Lardner LLP
Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer
The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H H
H01L H01L
inventional inventional
Yu Cheng Syu-Tang Huang-Hsien Shao Hsuan Min Lung
Chen Liu Chang Chuang Huang