McDermott Will & Emery LLP
Particle improvement for single wafer apparatus
An apparatus includes a susceptor, a first piping, a second piping, a liquid source, a third piping and a gas source. The susceptor is suitable for placing a wafer, and the first piping is configured to dispense a chemical to the wafer on the susceptor. The second piping communicates with the first piping. The liquid source is configured to deliver a cleaning liquid to the first piping through the second piping to wash a portion of the first piping. The third piping communicates with the first piping. The gas source is configured to flow a purge gas to the first piping through the third piping to purge the portion of the first piping.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H
H01L
inventional
Ming-Sung Yu-Kuei Hung-Hsin Cheng-Nan
Hung Lee Liang Kao