Slater Matsil, LLP
Packaging methods for semiconductor devices with encapsulant ring
Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L
additional additional inventional additional additional additional additional additional
Chien-Kuo Shih-Yen Wei-Ting Kuan-Lin Yu-Chih Chin-Liang
Chang Lin Lin Ho Liu Chen