Rothwell, Figg, Ernst & Manbeck, P.C.
Semiconductor device
The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.
LG CHEM, LTD.
H H C C H H H H H H H H H H H H H H H H H C C H H H C H H H C C C H C C H C H C H H H H H H H H C H H H H H H H
H01L H01L C09J C09J H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L C09J C09J H01L H01L H01L C09J H01L H01L H01L C09J C09J C09J H01L C09J C09J H01L C08G H01L C09J H01L H01L H01L H01L H01L H01L H01L H01L C09J H01L H01L H01L H01L H01L H01L H01L
additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional inventional additional inventional additional inventional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional
Se Ra Seung Hee Young Kook Hee Jung Jung Hak Kwang Joo
Kim Nam Kim Kim Kim Lee