Birch, Stewart, Kolasch & Birch, LLP
Light emitting diode chip, light emitting diode package structure, and method for forming the same
A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.
Industrial Technology Research Institute
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Ji-Feng Hung-Lieh Kuo-Feng Chen-Peng Hsun-Chih Yao-Jun Chien-Jen
Chen Hu Lin Hsu Liu Tsai Sun