Sughrue Mion, PLLC
Semiconductor module
A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.
SAMSUNG ELECTRONICS CO., LTD.
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Joonyoung Jae-Woo Junghoon Dongok Heeyoub Won-Hwa Jaebum Jinyoung
Oh Jeong Kim Kwak Kang Lee Byun Choi