Hauptman Ham, LLP
Semiconductor device with compressive layers
A semiconductor device includes a substrate having a first side and a second side opposite the first side. The substrate has a sensor region proximate the first side. The semiconductor device also includes a first compressive layer over the second side of the substrate. The semiconductor device further includes a light blocking element over the first compressive layer. The semiconductor device additionally includes a second compressive layer over the first compressive layer and covering a portion of the light blocking element. The semiconductor device also includes a third compressive layer between the second compressive layer and the portion of the light blocking element.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Shyh-Fann Yeur-Luen Chih-Yu Chun-Han Cheng-Ta Ching-Chun Chia-Shiung Chih-Hui
Ting Tu Lai Tsao Wu Wang Tsai Huang