F. Chau & Associates, LLC
Substrate treating composition and method for fabricating a semiconductor device using the same
Provided is a substrate treating composition. The substrate treating composition includes a first monomer, a second monomer and an acid. The first monomer is represented by Formula 1 and the second monomer is represented by Formula 7. The molecular weight of the solid content of the substrate treating composition including the first monomer, the second monomer and the acid is from about 1,000 g/mol to about 50,000 g/mol. X—Si(R1)2(R2)  [Formula 1]Y—Si(R3)3  [Formula 7]
NISSAN CHEMICAL CORPORATION SAMSUNG ELECTRONICS CO., LTD.
G G G C C G C G G G G G
G03F G03F G03F C08G C09D G03F C09D G03F G03F G03F G03F G03F
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Hyunwoo Satoshi Makoto Wataru Ju-Young Shuhei
Kim Takeda Nakajima Shibayama Kim Shigaki