Goodwin Procter LLP
Wafer transfer apparatus and wafer transfer method
A water transfer apparatus and a wafer transfer method are provided. The wafer transfer apparatus is provided with a heating component and a cooling component, the heating component heats the wafer carrying component to a temperature the same as the wafer when it is just unloaded from the rapid thermal anneal tool, and the cooling component cools the wafer carrying component along with the wafer to room temperature, thereby avoiding the large temperature difference between the wafer and the wafer transfer apparatus, preventing the high thermal stress induced inside the wafer during wafer transfer, avoiding wafer breakage, and ensuring the completeness of the wafer.
Institute of Microelectronics, Chinese Academy of Sciences
H H H
H01L H01L H01L
inventional inventional inventional
Junfeng Chunlong
Li Li