Lewis Roca Rothgerber Christie LLP
Bonding apparatus and bonding method thereof
A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.
Samsung Display Co., Ltd.
H B G B H H H B G H H G G H G
H05K B23K G02F B23K H05K H05K H05K B23K G02F H01L H05B G02F G02F H05B G02F
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Kyung Hwan Mun Sik Ju Hwan Gye Hwan Sang Kyo
Jung Choi Kim Lim Shin