Haynes Beffel & Wolfeld LLP
Bulk image modeling for optical proximity correction
A method is described herein for predicting lateral position information about a feature represented in an integrated circuit layout for use with an integrated circuit fabrication process, where the process projects an image onto a resist. The method includes providing a lateral distribution of intensity values of the image at different depths with the resist. Next, the lateral position of an edge point of the feature is predicted in dependence upon a particular resist development time, and further in dependence upon the image intensity values at more than one depth within the resist.
Synopsys, Inc.
G
G03F
inventional
Qiaolin Yongfa Bradley J.
Zhang Fan Falch