Moser, Patterson & Sheridan
Additives for pressure sensitive polishing compositions
A method and composition for planarizing a substrate. The composition includes a pressure sensitive solution and one or more chemical agents for complexing with a metal or oxidized metal. The method for removal of a copper containing layer from a substrate surface, comprising applying a composition to a polishing media, the composition comprising a pressure sensitive solution, and one or more chemical agents for complexing with a metal or oxidized metal, and polishing the substrate surface with the polishing media.
Applied Materials Inc.
B C B
B24B C09G B24B
inventional inventional inventional
Yuchun Rajeev Fred C. Jui-Lung
Wang Bajaj Redeker Li