Patterson and Sheridan
Load cup for chemical mechanical polishing
Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.
Applied Materials
B
B24B
inventional
Noel Hung Chih Toshikazu Hui Alpay David J. Simon
Manto Chen Tomita Chen Yilmaz Lischka Yavelberg