Edwards Wildman Palmer LLP
Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure
A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.
Siliconware Precision Industries Co., Ltd.
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Chien-Ping Chih-Ming Cheng-Chia Jung-Pin Chin-Huang
Huang Huang Chiang Huang Chang