Myers Bigel, P.A.
Semiconductor devices and semiconductor packages including the same
Semiconductor devices are provided. A semiconductor device includes an insulating layer and a conductive element in the insulating layer. The semiconductor device includes a first barrier pattern in contact with a surface of the conductive element and a surface of the insulating layer. The semiconductor device includes a second barrier pattern on the first barrier pattern. Moreover, the semiconductor device includes a metal pattern on the second barrier pattern. Related semiconductor packages are also provided.
SAMSUNG ELECTRONICS CO., LTD.
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Un-Byoung Jongho Jin Ho Ju-Il Jeonggi Atsushi
Kang Lee An Choi Jin Fujisaki