Slater Matsil, LLP
Photonic package and method forming same
A method includes bonding an electronic die to a photonic die. The photonic die includes an opening. The method further includes attaching an adapter onto the photonic die, with a portion of the adapter being at a same level as a portion of the electronic die, forming a through-hole penetrating through the adapter, with the through-hole being aligned to the opening, and attaching an optical device to the adapter. The optical device is configured to emit a light into the photonic die or receive a light from the photonic die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jui Hsieh Wen-Cheng Sung-Hui Tien-Yu Yushun
Lai Chen Huang Huang Lin