Kirton McConkie
Fingerprint identification module and manufacturing method thereof
A fingerprint identification module includes a substrate, a fingerprint sensor die, a covering adhesive layer, a cover plate and a mold compound layer. The fingerprint sensor die is attached on the substrate for sensing a fingerprint image. The covering adhesive layer is formed on a top surface of the fingerprint sensor die. The cover plate is attached on the covering adhesive layer. The mold compound layer is formed over the substrate. The fingerprint sensor die, the covering adhesive layer and the cover plate over the substrate are molded together through the mold compound layer, and the cover plate is exposed. The fingerprint identification module has small thickness and enhanced sensing accuracy.
PRIMAX ELECTRONICS LTD.
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Tung-Ying Ching-Hui
Wu Chang