Lee & Morse, P.C.
Method of fabricating semiconductor device
Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %. hydroxide based on a total weight of the cleaning composition and deionized water.
SAMSUNG ELECTRONICS CO., LTD.
H H B H H C C C B H H H B C H
H01L H01L B08B H01L H01L C11D C11D C11D B08B H01L H01L H01L B08B C11D H01L
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Jungsik Dong-Min Ingoo Sangkyun Young Taek Yun-Jeong
Choi Kang Kang Kim Hong Kim