Eschweiler & Potashnik, LLC
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Wen-Chuan Hsiang-Fu Chin-Min Cheng San Hua-Shu Ivan Fan Ching-Kai Yi-Chia
Tai Chen Lin Chou Wu Hu Shen Lee