Schwegman, Lundberg & Woessner, P.A.
Protection in integrated circuits
A method including, prior to a plasma heat-up operation, forming a liner on structure coated with an insulator. And a method including forming a trench on a substrate, forming an insulator on the trench, and after forming a liner having a thickness of between about 50 angstroms and about 400 angstroms on the insulator, applying a plasma heat-up operation to the substrate.
Micron Technology, Inc.
H
H01L
inventional
Neal R. William Weimin
Rueger Budge Li