Ishimaru & Associates LLP
System for peeling semiconductor chips from tape
A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.
Stats Chippac Ltd.
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Dong Hyong SeungYun Jung Ho Gab Yong
Lee Ahn Kim Min