Gunnison, McKay & Hodgson, L.L.P.
Semiconductor package and method for manufacturing the same
A semiconductor package, and a method for fabricating the semiconductor package, includes a semiconductor die having a plurality of bond pads including a first bond pad positioned at a center of the bond pad and formed at a first surface of the semiconductor die and a second bond pad spaced from the first bond pad by a predetermined distance while surrounding the first bond pad. The semiconductor package includes first and second posts formed on the bond pads of the semiconductor die and a substrate formed with electrically conductive patterns corresponding to the bond pads of the semiconductor die and bonded to the post.
Amkor Technology, Inc.
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Jong Sik Seung Ju Kwang Eung
Paek Lee Lee