Fitch, Even, Tabin & Flannery, L.L.P.
Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board
The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.
HITACHI CHEMICAL COMPANY, LTD.
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Kazuhito Katsuhiko Yuta Yoshitsugu Masaki
Obata Yasu Nakano Matsuura Takeuchi