Patterson + Sheridan LLP
Local area polishing system and polishing pad assemblies for a polishing system
A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
APPLIED MATERIALS, INC.
B B
B24B B24B
inventional inventional
Wei-Cheng Garrett Ho Yee King Yi Jeonghoon Hui Charles C. Eric Edwin C. Chih Chung
Lee Sin Heung Oh Chen Garretson Lau Suarez Chou