McClure, Qualey & Rodack, LLP
Chip package structure and method for forming the same
A method for forming a chip package structure is provided. The method includes bonding a first chip structure and a second chip structure to a surface of a substrate. The first chip structure and the second chip structure are spaced apart from each other. There is a first gap between the first chip structure and the second chip structure. The method includes removing a first portion of the first chip structure and a second portion of the second chip structure to form a trench partially in the first chip structure and the second chip structure and partially over the first gap. The method includes forming an anti-warpage bar in the trench. The anti-warpage bar is over the first chip structure, the second chip structure, and the first gap.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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additional inventional additional additional additional inventional additional inventional inventional additional additional additional additional additional additional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional inventional inventional additional additional additional
Szu-Wei Jiun-Ting Ying-Ching Chih-Wei
Lu Chen Shih Wu