McDermott Will & Emery LLP
Method for manufacturing a semiconductor device
In a method of manufacturing a semiconductor device, a photo resist layer is formed over a substrate with underlying structures. The first photo resist layer is exposed to exposure radiation. The exposed first photo resist layer is developed with a developing solution. A planarization layer is formed over the developed photo resist layer. The underlying structures include concave portions, and a part of the concave portions is not filled by the developed first photo resist.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ching-Yu Yu-Chung Yahru
Chang Su Cheng