Morgan, Lewis & Bockius LLP
Photon extraction from nitride ultraviolet light-emitting devices
In various embodiments, a rigid lens is attached to a light-emitting semiconductor die via a layer of encapsulant having a thickness insufficient to prevent propagation of thermal expansion mismatch-induced strain between the rigid lens and the semiconductor die.
Crystal IS, Inc.
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Jianfeng James R. Leo J.
Chen Grandusky Schowalter