Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
Second Sight Medical Products, Inc.
C C C C C A A H H H
C25D C25D C25D C25D C25D A61N A61N H05K H05K H05K
inventional additional inventional inventional inventional inventional inventional inventional additional inventional
Robert J. James Singleton Dao Min
Greenberg Little Zhou