Dentons US LLP
Adhesive film and product for encapsulating organic electronic device using same
Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability.
LG Chem, Ltd.
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Kyung Yul Jung Sup Seung Min Suk Ky Hyun Jee Yoon Gyung
Bae Shim Lee Chang Yoo Cho