Slater Matsil, LLP
Contact pad for semiconductor devices
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer and/or polymer layer disposed over the substrate and a portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to an exposed portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes line having a width greater than the PPI line.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Ying-Ju Hsien-Wei Jie
Chen Chen Chen