Eschweiler & Potashnik, LLC
Bonding support structure (and related process) for wafer stacking
In some embodiments, a method for bonding semiconductor wafers is provided. The method includes forming a first integrated circuit (IC) over a central region of a first semiconductor wafer. A first ring-shaped bonding support structure is formed over a ring-shaped peripheral region of the first semiconductor wafer, where the ring-shaped peripheral region of the first semiconductor wafer encircles the central region of the first semiconductor wafer. A second semiconductor wafer is bonded to the first semiconductor wafer, such that a second IC arranged on the second semiconductor wafer is electrically coupled to the first IC.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Kuo-Ming Sheng-Chan Cheng-Hsien Cheng-Yuan Chih-Hui
Wu Li Chou Tsai Huang