Haynes and Boone, LLP
Methods of reducing pattern roughness in semiconductor fabrication
A method includes forming a metal-containing material layer over a substrate, patterning the metal-containing material layer, where the patterned material layer has an average roughness, and electrochemically treating the patterned metal-containing material layer to reduce the average roughness. The treatment may be implemented by exposing the patterned metal-containing material layer to an electrically conducting solution and applying a potential between the patterned material layer and a counter electrode exposed to the solution, such that the treating reduces the average roughness of the patterned material layer. The electrically conducting solution may include an ionic compound dissolved in water, alcohol, and/or a surfactant.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Joy Chin-Hsiang Chien-Wei Ching-Yu
Cheng Lin Wang Chang