Oliff PLC
Junction structure for an electronic device and electronic device
A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer includes an AuSn eutectic phase.
TDK CORPORATION
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Hisayuki Kenichi Yuhei
Abe Yoshida Horikawa