Birch, Stewart, Kolasch & Birch, LLP
Resist composition and patterning process
Resist compositions comprising as the base resin a polymer using tert-amyloxystyrene as a reactive group which is decomposable under the action of an acid to increase solubility in alkali have advantages including a significantly enhanced contrast of alkali dissolution rate before and after exposure, a high sensitivity, and a high resolution in the baking temperature range of 100-110° C. which is unachievable with tert-butoxystyrene. The compositions are best suited as a chemically amplified resist material for micropatterning in the manufacture of VLSI.
Shin-Etsu Chemical Co., Ltd.
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G03F Y10S G03F Y10S Y10S
inventional additional inventional additional additional
Kazunori Takanobu Hiroshi Osamu
Maeda Takeda Miyakoshi Watanabe