Nixon & Vanderhye, P.C.
Chip component assembly manufacturing method
A substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is cut while being supported on a sheet, and thereafter, chip components obtained by the cutting are handled while being supported on the sheet. That is, in the state in which the substrate of a semiconductor wafer, an insulating substrate or the like on which a circuit is formed is supported on the sheet, a layer of a sealing material is formed on the substrate before cutting or the chip component after cutting. Each chip component is directly picked up from the sheet by being peeled off, and the chip components are successively stacked on the sheet. This enables the easy handling of even small-size thin chip components scarcely causing the damage and warp of the chip components and enables the correct stacking of the chip components.
Sharp Kabushiki Kaisha
H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional inventional inventional inventional additional additional inventional additional additional inventional
Tomonori Tomotoshi
Fujii Sato