Integrated circuit device and fabrication method thereof
An integrated circuit device includes a substrate, an integrated circuit region on the substrate, a seal ring disposed in a dielectric stack of the integrated circuit region and around a periphery of the integrated circuit region, a trench around the seal ring and exposing a sidewall of the dielectric stack, a moisture blocking layer continuously covering the integrated circuit region and extending to the sidewall of the dielectric stack, thereby sealing a boundary between two adjacent dielectric films in the dielectric stack; and a passivation layer over the moisture blocking layer.
UNITED MICROELECTRONICS CORP.
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Kuo-Yuh Chia-Huei Purakh Raj Chu-Chun
Yang Lin Verma Chang