Weaver Austin Villeneuve & Sampson LLP
MEMS encapsulation by multilayer film lamination
This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures. In one aspect, a MEMS apparatus includes a substrate having a device region and an edge region surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer facing away from the array of MEMS structures, and a desiccant layer facing toward the array of MEMS structures.
QUALCOMM MEMS Technologies, Inc.
B B B B
B81B B81C B81C B81B
inventional inventional additional inventional
Wenguang Tsongming
Li Kao