J.C. Patents
Method for fabricating handling wafer
A method for fabricating handling wafer includes providing a substrate, having a front side and a back side. The front side of the substrate is disposed on a supporting pin. A first oxide layer is formed surrounding the substrate. A portion of the first oxide layer is removed to expose the front side of the substrate. An alignment mark is formed on the front side of the substrate.
United Microelectronics Corp.
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Zhi-Biao Wei-Jin
Zhou Wang