Light emitting diode package and method for manufacturing same
An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Fu-Hsiang Chao-Hsiung Lung-Hsin Hou-Te Pin-Chuan
Yeh Chang Chen Lin Chen