Posz Law Group, PLC
Mold type semiconductor device
A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
DENSO Corporation
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Takanori Nobuyuki Akihiro Yoshitsugu Shoji Naohiko
Teshima Kato Niimi Sakamoto Miura Hirano