Grossman, Tucker, Perreault & Pfleger, PLLC
Capacitive structures for crosstalk reduction
One embodiment provides an apparatus. The apparatus includes a dual in-line memory module (DIMM). The DIMM includes at least one memory module integrated circuit (IC); a DIMM printed circuit board (PCB); a plurality of DIMM PCB contacts; and a capacitive structure. Each DIMM PCB contact is to couple the memory module IC to a respective DIMM connector pin. The capacitive structure is to provide a mutual capacitance between a first DIMM connector signal pin and a second DIMM connector signal pin.
Intel Corporation
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H05K G11C H05K H01R H05K G11C H05K G06F H05K H05K G11C
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Xiang Zhichao Zhiguo Kemal Tolga
Li Zhang Qian Aygun Memioglu