Eschweiler & Potashnik, LLC
Semiconductor package
Some embodiments relate to a semiconductor package. The package includes a redistribution layer (RDL), and a first semiconductor die disposed over the RDL. The first semiconductor die includes a plurality of contact pads electrically coupled to the RDL. The RDL enables fan-out connection of the first semiconductor die. A die package is disposed over the first semiconductor die and over the RDL. The die package is coupled to a first surface of the RDL by a plurality of conductive bump structures. The plurality of conductive bump structures laterally surround the plurality of contact pads and have uppermost surfaces that are level with an uppermost surface of the first semiconductor die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional additional inventional additional additional inventional inventional additional additional additional additional inventional inventional inventional additional additional inventional inventional inventional inventional inventional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional inventional inventional additional inventional inventional
Chin-Chuan Jing-Cheng Jui-Pin
Chang Lin Hung