Slater Matsil, LLP
Molding wafer chamber
A bottom chase and a top chase of a molding system form a cavity to house a molding carrier and one or more devices. The molding carrier is placed in a desired location defined by a guiding component. The guiding component may be entirely within the cavity, or extend above a surface of the bottom chase and extend over a contacting edge of the top chase and the bottom chase, so that there is a gap between the edge of the top chase and the edge of the molding carrier which are filled by molding materials to cover the edge of the molding carrier. Releasing components may be associated with the top chase and/or the bottom chase, which may be a plurality of tape roller with a releasing film, or a plurality of vacuum holes within the bottom chase, or a plurality of bottom pins with the bottom chase.
Taiwan Semiconductor Manufacturing Company, Ltd.
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H01L H01L H01L B29C H01L H01L H01L
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Jui-Pin Szu Wei Jing-Cheng Chen-Hua Chin-Chuan Shin-Puu
Hung Lu Lin Yu Chang Jeng