Slater Matsil, LLP
Stress compensation layer for 3D packaging
A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Feng Chun-Hung Han-Ping Hung-Jui
Chen Lin Pu Kuo