Oliff & Berridge, PLC
Layered chip package and method of manufacturing same
A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions stacked; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. The plurality of layer portions include a first-type layer portion and a second-type layer portion. The first-type layer portion includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip.
Headway Technologies, Inc. SAE Magnetics (H.K.) Ltd.
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additional additional inventional additional inventional additional additional additional additional additional additional inventional additional additional additional inventional additional inventional additional additional inventional inventional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional
Hiroyuki Yoshitaka Hiroshi Atsushi
Ito Sasaki Ikejima Iijima