Leadframe package for high-speed data rate applications
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.
Mediatek Inc.
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Che-Yuan Ching-Chih Sheng-Ming Nan-Cheng Chun-Wei Nan-Jang
Jao Li Chang Chen Chang Chen