Slater Matsil, LLP
Ring structures in device die
A die includes a metal pad, a passivation layer over the metal pad, and a polymer layer over the passivation layer. A metal pillar is over and electrically coupled to the metal pad. A metal ring is coplanar with the metal pillar. The polymer layer includes a portion coplanar with the metal pillar and the metal ring.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jie Hsien-Wei Ying-Ju
Chen Chen Chen