Paul & Paul
Microstructure cooler and use thereof
The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 μm, a depth in the range of 25 to 1,000 μm, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 μm, and the base plate 5 has a thickness in the range of 200 to 2,000 μm.
Atotech Deutschland GmbH
H F H F
H01L F28F H01L F28F
additional inventional inventional inventional
Peter Ralph Sven Markus Olaf Konrad Heinrich
Prechtl Herber Theisen Hohn Kurtz Cramer Meyer