Mayer & Williams PC
Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.
Vishay General Semiconductor LLC
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Hai Xiong-Jie Xian Ta-Te Yong-Qi
Fu Zhang Li Chou Tian