J.C. Patents
Printed wiring board and method of fabricating the same
A method of fabricating a printed wiring board comprising the following steps is provided. A portion of each of two dielectric layers or metal layers bonds to both sides of a carrier plate, respectively. Two build-up wiring structures are respectively formed on the dielectric layers or the metal layers by a build-up process. The portions of the dielectric layers or metal layers bonded to the carrier plate are removed such that the dielectric layers or metal layers and the build-up wiring structures formed thereon are released from the carrier plate to form two printed wiring boards.
Subtron Technology Co., Ltd.
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Chung W. Shih-Lian Leo
Ho Cheng Shen