Myers Bigel & Sibley, P.A.
Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same
A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.
Shin-Etsu Chemical Co., Ltd.
H H H C B H H C C C B C H H H C H
H01L H01L H01L C09J B05D H01L H01L C08G C08L C08G B32B C09J H01L H01L H01L C09J H01L
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Michihiro Jung-Sik Jae-Hyun Jun-Won Shohei Hideto Tae-Hoon Hiroyuki
Sugo Choi Kim Han Tagami Kato Kim Yasuda