Ishimaru & Associates LLP
Stacked integrated circuit package system
A stacked integrated circuit package system includes: providing a base integrated circuit package, and mounting a top integrated circuit package having a top interposer and a top encapsulation with a cavity therein or the cavity as a space between top intra-stack interconnects and the top interposer, with the top interposer exposed by the cavity, over the base integrated circuit package.
STATS ChipPAC Ltd.
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SeongMin Jong-Woo Flynn BumJoon
Lee Ha Carson Hong