Jianq Chyun IP Office
Method of modifying tin to lead ratio in tin-lead bump
A method of modifying the tin to lead ratio of a tin-lead bump forms a patterned solder mask over a substrate that comprises a first tin-lead bump formed thereon, the patterned solder mask having an opening that exposes the tin-lead bump. A solder material including tin and lead is filled in the opening of the solder mask over the first tin-lead bump. The solder material has a tin to lead ratio that differs from that of the first tin-lead bump. The solder material is reflowed to fuse with the first tin-lead bump, which forms a second tin-lead bump. The tin to lead ratio of the second tin-lead bump is thereby different from that of the first tin-lead bump.
Advanced Semiconductor Engineering, Inc.
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Ching-Huei Ho-Ming Chun-Chi Jen-Kuang Min-Lung Yu-Chen Jau-Shoung Chao-Fu Su Yung-Chi Tsung-Hua
Su Tong Lee Fang Huang Chou Chen Weng Tao Lee Wu