Slater & Matsil, L.L.P.
Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of contact pads disposed over the substrate. The contact pads are arranged in a ball grid array (BGA), and the BGA includes a plurality of corners. A metal dam is disposed around each of the plurality of corners of the BGA.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional inventional additional additional inventional inventional inventional inventional inventional additional additional additional additional additional inventional inventional additional inventional inventional inventional additional additional inventional inventional additional inventional additional additional additional additional additional additional inventional additional inventional additional additional inventional additional additional additional additional inventional inventional additional inventional additional additional inventional additional additional additional inventional additional additional inventional inventional additional additional inventional inventional inventional additional additional additional additional inventional inventional additional inventional inventional inventional additional additional additional inventional inventional additional inventional additional inventional additional additional inventional additional inventional inventional additional additional additional additional additional additional
Kai-Chiang Hung-Jui Chun-Lin Yu-Feng
Wu Kuo Lu Chen