Park, Vaughan, Fleming & Dowler LLP
Mechanical coupling in a multi-chip module using magnetic components
A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.
Oracle America, Inc.
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Jing Ashok V. John E. Hiren D.
Shi Krishnamoorthy Cunningham Thacker