Lee IP Law, P.C.
Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
SAMSUNG ELECTRONICS CO., LTD.
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Jun-Kyum Jung-Woo Sung-Un
Kim Seo Kwon