Rothwell, Figg, Ernst & Manbeck, P.C.
Method for setting substrate-treatment time, and storage medium
In a method for setting substrate-treatment time, substrate-treatment time is set by the following method. A predicted supply time of wafers of a following lot to a substrate processing apparatus is calculated based on a predicted plasma-treatment completion time of another substrate processing apparatus. A predicted plasma-treatment completion time of all of wafers of a present lot is calculated. A predicted idle time after the completion of the plasma treatment of all of the wafers of the present lot is calculated based on the predicted supply time of the following lot and the predicted plasma-treatment completion time of the present lot. If the predicted idle time is equal to or longer than the idle time required for dummy treatment, supplementary idle time is added between the plasma treatments of unprocessed wafers of the present lot.
TOKYO ELECTRON LIMITED
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G05B G05B Y02P G05B
additional additional additional inventional
Shinji
Wakabayashi