McKenna Long & Aldridge
Etching solution for multiple layer of copper and molybdenum and etching method using the same
An etching solution for a multiple layer of copper and molybdenum includes: about 5% to about 30% by weight of a hydrogen peroxide; about 0.5% to about 5% by weight of an organic acid; about 0.2% to about 5% by weight of a phosphate; about 0.2% to about 5% by weight of a first additive having nitrogen; about 0.2% to about 5% by weight of a second additive having nitrogen; about 0.01% to about 1.0% by weight of a fluoric compound; and de-ionized water making a total amount of the etching solution 100% by weight.
LG Display Co., Ltd Dongwoo Fine-Chem Co., Ltd.
C C H C C
C23F C23F H01L C23F C09K
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Yong-Suk Gee-Sung Gyoo-Chul Yong-Sup Oh-Nam Seung-Yong Seong-Su Kyoung-Mook
Choi Chae Jo Hwang Kwon Lee Kim Lee