Klein, O'Neill & Singh, LLP
Semiconductor device packages with protective layer and related methods
A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.
Advanced Semiconductor Engineering, Inc.
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Sheng-Ming Kuang-Hsiung Mei-Lin Yu-Ying Hsiang-Ming
Wang Chen Hsieh Lee Feng