WPAT, PC
Semiconductor structure and method for manufacturing the same
A semiconductor structure comprises a first wire level, a second wire level and a via level. The first wire level comprises a first conductive feature. The second wire level is disposed on the first wire level. The second wire level comprises a second conductive feature and a third conductive feature. The via level is disposed between the first wire level and the second wire level. The via level comprises a via connecting the first conductive feature and the second conductive feature. There is a first air gap between the first conductive feature and the second conductive feature. There is a second air gap between the second conductive feature and the third conductive feature. The first air gap and the second air gap are linked.
UNITED MICROELECTRONICS CORP.
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Yun-Tzu Nien-Ting Shih-Min Wei-Ning Chia-Chang Ching-Yun Wei-Ming Yen-Chen Yang-Ju Kuo-Chih
Chang Ho Chou Chen Hsu Chang Hsiao Chen Lu Lai