Foley & Lardner LLP
Antenna package and method of manufacturing the same
An antenna package includes a patterned antenna structure and an encapsulant. The patterned antenna structure includes a first surface, a second surface opposite the first surface and a third surface extended between the first surface and the second surface. The encapsulant is disposed on the first surface of the patterned antenna structure. The third surface of the patterned antenna structure includes a first portion covered by the encapsulant and a second portion exposed from the encapsulant.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Chih-Cheng Cheng-Lin
Lee Ho