Rabin & Berdo, P.C.
Two-stage die-bonding method for simultaneous die-bonding of multiple dies
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.
Advanced Semiconductor Engineering, Inc.
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Teck-Chong Chih-Nan Ho-Ming Kao-Ming Chian-Chi Chao-Fu Song-Fu Chia-Jung
Lee Wei Tong Su Lin Weng Yang Tsai