Staas & Halsey
Semiconductor device having a bi-level leadframe
 A lead frame for a semiconductor device includes a resin base film having opposed surfaces and an opening therein. A plurality of inner leads are formed of a metal foil on one surface of the film in a desired inner lead circuit pattern that includes inner edges arranged for connection to a semiconductor device mounted on the film and outer edges positioned over the opening. A plurality of outer leads are formed of a metal sheet and adhered to the other surface of the film in a desired outer lead circuit pattern that includes inner edges positioned over the opening and outer edges that extend outwardly from the frame. 
Shinko Electric Industries Co., Ltd.
H H
H01L H01L
additional inventional
Shinichi Akihiko
Wakabayashi Murata