Bacon & Thomas, PLLC
Photosensitive ink composition
Provided is a novel photosensitive resistive ink composition, comprising: (A) a photo curable prepolymer containing at least two ethylenically unsaturated bonds with an a,&bgr;-unsaturated carboxylic acid, represented by the formula I, (B) a photocurable monomer containing at least three vinyl groups and an a,&bgr;-unsaturated carboxylic acid, (C) a photo-initiator, (D) organic solvents, (E) an epoxy compound containing at least one vinyl group and one epoxy group in the molecule unit, (F) a curing agent capable of allowing a photocurable prepolymer (A) undergo a thermal reaction, and (G) a clay nano-composite capable of increasing the surface area of inorganic materials of the photosensitive resistive ink composition. The composition produces a solder mask film having a desired pattern after coating, exposure, development and postcuring and excellent in adhesiveness, resistance to chemicals, resistance to insulatiion, resistance to heat, developability, pot life, resistance to electroless gold plating, transparency of the photo-resist film and resolution.
Nan Ya Plastics Corporation
G G G G
G03F G03F G03F G03F
inventional inventional inventional inventional
Chun-Che Cheng-Li Hsiao-Loung Chi-Ming Chung-Chi
Tsao Chao Lu Chang Su