Bond evaluation using piezochromic fluorescence
A composite bonded structure with integral stress sensing and bond evaluation system incorporates a bonded structure having a first component, a second component and a layer of adhesive bonding the first and second components. The layer of adhesive includes multiple embedded fluorescing particles which emit a first spectral intensity in an unstressed condition and a second spectral intensity in a stressed condition. A bond evaluation apparatus is then employed for measuring spectral intensity.
The Boeing Company
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John R. Richard H. Keith J.
Hull Bossi Davis