Schwabe, Williamson & Wyatt P.C.
CPU package substrates with removable memory mechanical interfaces
Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
Intel Corporation
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Dimitrios Sanka Ram S. David J. Jonathan W. George Zhichao Jeffory L. John M. Kuang C. Gregorio R. Chong J. Xiang Bassam N. Thomas T. Mani Rajasekaran
Ziakas Ganesan Viswanath Llapitan Thibado Vergis Zhang Smalley Lynch Liu Murtagian Zhao Li Coury Holden Prakash Swaminathan