Nields & Lemack
Resin composition and solder resist composition
 Disclosed herein is a resin composition or a solder resist resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photopolymerization initiator (E). 
Nippon Kayaku Kabushiki Kaisha
C C C H C
C08L C08F C08L H05K C08F
inventional inventional inventional additional inventional
Minoru Kazuyoshi Tetsuo
Yokoshima Nawata Ohkubo