Semiconductor wafer and testing method for the same
A semiconductor wafer includes a plurality of areas and an array of dice disposed within each of the areas. The feature of the present invention is that at least two fiducial marks are disposed in each of the areas. The present invention further provides a method of testing a sawed semiconductor wafer.
Advanced Semiconductor Engineering Inc.
G
G01R
inventional
Su Kuo Pin Sung Ching Ho Ming Yueh Lung Chi Cheng Yao Hsin
Tao Yang Hung Tong Lin Pan Feng