Carbon nanotube interconnect
Method and system for fabricating an electrical interconnect capable of supporting very high current densities (106–1010 Amps/cm2), using an array of one or more carbon nanotubes (CNTs). The CNT array is grown in a selected spaced apart pattern, preferably with multi-wall CNTs, and a selected insulating material, such as SiOw or SiuNv, is deposited using CVD to encapsulate each CNT in the array. An exposed surface of the insulating material is planarized to provide one or more exposed electrical contacts for one or more CNTs.
The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
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Jun Meyya
Li Meyyappan