Mills & Onello, LLP
Semiconductor device and method of arranging pad thereof
A semiconductor device and method of forming a pad thereof are provided. The device includes: a substrate; at least one first active region disposed in a first region of the substrate; at least one second active region disposed in a second region adjacent to the first region of the substrate; a plurality of first contacts disposed on the second active region; a first insulating layer disposed on the first active region and between the first contacts; a poly layer disposed on the first contacts and the first insulating layer; a plurality of second contacts disposed on the poly layer in the second region; a second insulating layer disposed between the second contacts and on the poly layer in the first region; and a pad disposed on the second insulating layer and the second contacts.
Samsung Electronics Co., Ltd.
H H
H01L H01L
additional inventional
Young-Ok Chan-Hee Jun-Bae
Cho Jeon Kim