Heat dissipation assembly and portable electronic device employing same
A heat dissipation assembly includes a main body, a heat conductor element, and a heat dissipation member. The heat conductor element is mounted to the main body and in thermal conductive contact with at least one electronic component. The heat dissipation member is mounted to the main body and is in thermal conductive communication with the heat conductor element. The heat generated by the at least one electronic component is transmitted through the heat conductor element to the heat dissipation member.
FIH (HONG KONG) LIMITED
G G
G06F G06F
inventional inventional
Ching-Shiang
Chang