Maschoff Brennan
Package structure with inductor and method of forming thereof
A package structure includes a first redistribution layer, a molding material, a semiconductor device and an inductor. The molding material is located on the first redistribution layer. The semiconductor device is molded in the molding material. The inductor penetrates through the molding material and electrically connected to the semiconductor device.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chih-Lin Chen-Hua Chih-Yuan Chuei-Tang Chung-Hao Jeng-Shien
Chen Yu Chang Wang Tsai Hsieh