Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Cleaning fluid and cleaning method for component of semiconductor-treating apparatus
A cleaning solution is used to remove a byproduct derived from a decomposed substance of a process gas containing C and F. The cleaning solution contains 75 wt % N-methyl-2-pyrrolidone, 15 wt % ethylene glycol monobutyl ether, 0.5 wt % surfactant, and 9.5 wt % water. The content of an alkali metal in the cleaning solution is set to be less than 10 ppb.
Tokyo Electron Limited Nittou Chemical Industries, Ltd.
C C C H Y
C11D C11D C11D H01L Y10S
inventional inventional inventional inventional additional
Kiyoshi Shinichi Takahiro Hitoshi Kenichi Eiji Nobuyuki
Yuasa Kawaguchi Shimoda Yamada Hirota Yamaguchi Nagayama