J.C. Patents
Lead frame structure for preventing the warping of semiconductor package body
 A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame. 
Walsin Advanced Electronics LTD
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Wen-Chun Chih-Kung Jung-Jie
Liu Huang Liou