Williams, Morgan & Amerson, P.C.
Chemical mechanical polish platen and method of use
 The present disclosure relates to a chemical mechanical polishing apparatus used for polishing wafers. The apparatus includes a polish platen and structure for separating the platen into at least first and second zones such that polishing fluid used in the first zone is prevented from entering the second zone. 
Advanced Micro Devices, Inc.
B B
B24B B24B
inventional inventional
Thomas M. Peter Austin
Brown Burke