Keating & Bennett, LLP
Wireless communication device and wireless communication module manufacturing method
In a wireless communication device, an impedance matching circuit includes a first layered coil conductor one end of which is connected to a first I/O terminal, the first layered coil conductor includes loop conductors including a plurality of layers, and a second layered coil conductor one end of which is connected to the other end of the first layered coil conductor and the other end of which is respectively connected to a second I/O terminal, the second layered coil conductor includes loop conductors including a plurality of layers. On the surface of the wireless communication device, first and second terminal electrodes are connected via first and second in-plane conductors and first and second inter-layer conductors to any of the loop conductors of the first and second layered coil conductors. Connection locations of the first and second in-plane conductors to the first and second layered conductors determine the antenna element-side impedance seen by the first and second I/O terminals of the wireless IC chip.
MURATA MANUFACTURING CO., LTD.
G H H H H H G H H H H G
G06K H01L H01Q H01L H01L H01Q G06K H01Q H01Q H01Q H01Q G06K
inventional additional inventional additional additional inventional inventional additional inventional inventional inventional inventional
Noboru
Kato