Lowe Hauptman & Ham, LLP
Semiconductor structures having a metal-insulator-metal capacitor structure
A semiconductor structure includes a through-substrate-via (TSV) structure disposed in a substrate. A metal-insulator-metal (MIM) capacitor structure is disposed over the substrate. A dual damascene structure disposed over and electrically coupled with the TSV structure, wherein the dual damascene structure includes a via portion and a trench portion A first dielectric layer is disposed around the via portion of the dual damascene structure. A second dielectric layer disposed around the trench portion of the dual damascene, wherein the second dielectric layer is disposed over the MIM capacitor structure.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Sung-Hui Chun Hua Der-Chyang
Huang Chang Yeh