McDermott, Will & Emery
Resist removal from patterned recording media
A method for patterning a carbon-containing substrate utilizing a patterned layer of a resist material as a mask and then safely removing the mask from the substrate without adversely affecting the substrate, comprising sequential steps of:(a) providing a substrate including a surface comprising carbon;(b) forming a thin metal layer on the substrate surface;(c) forming a layer of a resist material on the thin metal layer;(d) patterning the layer of resist material;(e) patterning the substrate utilizing the patterned layer of resist material as a pattern-defining mask; and(f) removing the mask utilizing the thin metal layer as a wet strippable layer or a plasma etch/ash stop layer.
Seagate Technology LLC
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Li-Ping David Shiao-Min Jianwei
Wang Kuo Liu