Slater & Matsil, L.L.P.
Package on package devices and methods of packaging semiconductor dies
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional additional additional inventional additional inventional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional inventional additional additional additional inventional additional additional inventional additional additional additional inventional
Ming-Da Chen-Hua Mirng-Ji Jiun Yi Chien-Hsun Yung Ching
Cheng Yu Lii Wu Lee Chen