Rothwell, Figg, Ernst & Manbeck, P.C.
Adhesive film for semiconductor
The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.
LG CHEM, LTD.
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inventional inventional additional inventional additional inventional additional inventional additional inventional additional inventional additional additional additional additional additional inventional additional inventional inventional inventional inventional inventional inventional inventional inventional additional inventional inventional inventional additional additional additional inventional inventional additional inventional additional inventional additional additional additional additional additional inventional additional additional inventional inventional inventional inventional inventional additional additional additional inventional additional inventional inventional additional additional inventional inventional additional additional inventional additional inventional additional additional additional additional inventional inventional additional
Kwang Joo Jung Ho Seung Hee Se Ra Jung Hak Young Kook Hee Jung
Lee Jo Nam Kim Kim Kim Kim