Lowe Hauptman Ham & Berner, LLP
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device in a MLM process to reduce compression stress of a metal line or a HDP oxide film, and to reduce compression stress in a subsequent metal line thermal treatment process. It is thus possible to reduce generation of a crack caused by compression stress. Further, by obviating a heterogeneous interface becoming a cause of a crack and stabilizing the interface of an unstable TEOS oxide film, generation of a crack in a semiconductor device can be reduced.
Hynix Semiconductor Inc.
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Ki Hong Jung Geun
Yang Kim