Ladas & Parry
Chemical mechanical polishing apparatus
A chemical mechanical polishing apparatus comprises a platen having a polishing pad thereon, a wafer carrier holding a wafer on the polishing pad, a washer having a cleaning device; and a dresser. The dresser comprises a bottom disk contacting the polishing pad. The dresser can move between the polishing pad and the washer. When the dresser moves into the washer, a diamond zone on the bottom disk cleans the polishing pad, and the cleaning device cleans the diamond zone.
Nanya Technology Corporation
B B B B B B H B
B08B B24B B08B B08B B08B B24B H01L B24B
inventional inventional inventional inventional inventional inventional additional inventional
Chung-Min Ching-Hung Li-Chung
Lin Chang Liu