Package substrate having die pad with outer raised portion and interior recessed portion
An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
Texas Instruments Incorporated
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Saihsi Chih-Chien Eric
Jen Ho Hsieh