Ishimaru & Associates LLP
Integrated circuit packaging system with interposer shield and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.
STATS ChipPAC Ltd.
H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional inventional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional
SeongHun SeongMin Sungmin
Mun Lee Song