Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
Pattern transfer mold and pattern formation method
According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.
Kabushiki Kaisha Toshiba
G C C C
G03F C25D C25D C25D
inventional inventional inventional inventional
Masato Koichi Yongfang Takashi Akiko Ryoichi
Saito Kokubun Li Sato Mimotogi Inanami