Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Heat treatment apparatus, heat treatment method, and computer readable storage medium
In the present invention, a plurality of heat treatment units are arranged side by side in a linear form and a substrate transfer mechanism for transferring the substrate between the heat treatment units is provided in a heat treatment apparatus. The substrate is sequentially heat-treated in the arrangement order, whereby one heat treatment as a whole is dividedly and successively performed in the plurality of heat treatment units. This allows substrates to be heat-treated along the same route and uniforms the thermal history among the substrates. At the time when heat-treating a plurality of substrates, the present invention causes less variation in thermal history among the substrates as compared to the case of parallel heat treatments.
Tokyo Electron Limited
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Takahisa Tsuyoshi
Otsuka Shibata