Sinorica, LLC
Test apparatus having pogo probes for chip scale package
A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body comprises two end portions disposed with a first probe head and a second probe head respectively, wherein each of the probe heads is composed of a plurality of taper members to form a crown shape, and each of the taper members has an individual chamfer so that each chamfer has a tip to contact each contact pad of the semiconductor device under test for chip scale package.
King Yuan Electronics Co., Ltd.
G G
G01R G01R
inventional inventional
Chiu-Fang
Chang