Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
Integrated circuit die decoupling system with reduced inductance
A system that includes an integrated circuit die and a power supply decoupling unit is disclosed. The system includes an integrated circuit die, and interconnection region, and a decoupling unit. The integrated circuit die includes a plurality of circuits, which each include multiple devices interconnected using wires fabricated on a first plurality of conductive layers. The interconnection region includes multiple solder balls, and multiple conductive paths, each of which includes wires fabricated on a second plurality conductive layers. At least one solder ball is connected to an Input/Output terminal of a first circuit of the plurality of circuits via one of the conductive paths. The decoupling unit may include a plurality of capacitors and a plurality of terminals. Each terminal of the decoupling unit may be coupled to a respective power terminal of a second circuit of the plurality of circuits via the conductive paths.
Apple Inc.
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Jun Shawn Huabo Chonghua Young Doo Vidhya
Zhai Searles Chen Zhong Jeon Ramachandran