Finch & Maloney PLLC
Integrated RF frontend structures
Techniques are disclosed for forming a monolithic integrated circuit semiconductor structure that includes a radio frequency (RF) frontend portion and may further include a CMOS portion. The RF frontend portion includes componentry implemented with column III-N semiconductor materials such as gallium nitride (GaN), indium nitride (InN), aluminum nitride (AlN), and compounds thereof, and the CMOS portion includes CMOS logic componentry implemented with semiconductor materials selected from group IV of the periodic table, such as silicon, germanium, and/or silicon germanium (SiGe). Either of the CMOS or RF frontend portions can be native to the underlying substrate to some degree. The techniques can be used, for example, for system-on-chip integration of III-N transistors and/or RF filters, along with column IV CMOS devices on a single substrate. In a more general sense, the techniques can be used for SoC integration of an RF frontend having diverse III-N componentry on a single substrate, in accordance with some embodiments.
INTEL CORPORATION
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Marko Han Wui Sansaptak
Radosavljevic Then Dasgupta