Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Method of fabricating crossing wiring pattern on a printed circuit board
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
Ibiden Co., Ltd.
H H H H Y H Y H H H H H H H H H H H H H H H H H H H H H H H H H Y
H05K H05K H05K H05K Y10T H05K Y10T H05K H05K H05K H05K H05K H05K H05K H01L H05K H05K H05K H05K H05K H05K H05K H01L H05K H05K H05K H05K H01R H01L H01L H05K H01L Y10T
additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional
Yoji Naohiro Takashi
Mori Hirose Kariya