Hemisphere Law, PLLC
LED package and method for manufacturing the same
A LED package includes a substrate, a LED chip, a sealing layer; and a quartz glass in this order. The sealing layer includes a graphene oxide fluororesin sealant layer and a KH550 silane coupling agent layer. The graphene oxide fluororesin sealant layer is composed of a graphene oxide dispersion liquid and a fluororesin matrix. The KH550 silane coupling agent layer is composed of deionized water solution and silane coupling agent. The disclosure further provides a method of manufacturing LED package.
HUAZHONG U. OF SCI. AND TECH. EZHOU INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
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Hao Jingwen Renli Linlin
Wang Chen Liang Xu