Slater Matsil, LLP
Electric magnetic shielding structure in packages
A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jie Shin-Puu Hsien-Wei Chen-Hua Der-Chyang
Chen Jeng Chen Yu Yeh