Birch, Stewart, Kolasch & Birch, LLP
Electronic device package and method for fabricating the same
The invention provides an electronic device package and a method for fabricating the same. The electronic device package includes a carrier wafer. An electronic device chip with a plurality of conductive pads thereon is disposed over the carrier wafer. An isolation laminating layer includes a lower first isolation layer, which covers the carrier wafer and the electronic device chip, and an upper second isolation layer. The isolation laminating layer has a plurality of openings to expose the conductive pads. A plurality of redistribution patterns is conformably formed on the isolation laminating layer and in the openings. The redistribution patterns are electrically connected to the conductive pads, respectively. A plurality of conductive bumps is respectively formed on the redistribution patterns, electrically connected to the conductive pads.
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Wen-Cheng Shu-Ming Wei-Ming Ching-Yu Bai-Yao Chia-Lun Chia-Ming Tien-Hao Nan-Chun
Chien Chang Chen Ni Lou Tsai Cheng Huang Lin