Morgan, Lewis & Bockius LLP
Copper-alloy capping layers for metallization in touch-panel displays
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
H.C. STARCK INC.
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Qi Patrick Francois-Charles Shuwei Marc
Zhang Hogan Dary Sun Abouaf