Nelson Mullins Riley & Scarborough LLP
Composition for organic electronic element encapsulant, and encapsulant formed by using same
A composition for an encapsulant according to one embodiment of the present application comprises 1) a silicone resin, 2) one or more types of moisture absorbent, 3) one or more types of photoinitiator, 4) one or more types of fillers, and 5) a reactive silicone oligomer.
Momentive Performance Materials Korea Co., Ltd.
C C C C C C H H C H C C C H
C08L C08K C08K C08L C08K C08F H01L H01L C08K H01L C08K C08G C08G H01L
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Sun Nan Soo Hyun-Sang
Yu Kim Choi