Jiang Chyun IP Office
Bump fabrication method
A bump fabrication method is described. The method comprises the steps of providing a wafer having an active surface and a plurality of bonding pads formed on the active surface; respectively forming an under bump metallurgy layer onto the bonding pads, wherein the under bump metallurgy layer includes at least a wetting layer having an oxidized region and positioned at a top layer of the under bump metallurgy layer; patterning a masking layer on the active surface wherein the masking layer is provided with a plurality of openings to expose the wetting layers; removing the oxidized region of the wetting layer using ionic bombardment; fully forming a flux film on the active layer, wherein at least a portion of the flux film covers onto the wetting layer; filling a solder paste into the openings; performing a re-flow process to form a plurality of bumps after the solder paste melts so that the flux film removes the oxidized region of the wetting layer; and removing the masking layer.
Advanced Semiconductor Engineering, Inc.
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Jau-Shoung Jen-Kuang Min-Lung Yu-Chen Chun-Chi Chao-Fu Ching-Huei Su Tsung-Hua Yung-Chi Ho-Ming
Chen Fang Huang Chou Lee Weng Su Tao Wu Lee Tong