Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap
A semiconductor device according to an embodiment includes a semiconductor chip, a cap disposed to face the semiconductor chip, and having a through-hole electrode arranged in a through hole, and a bump electrode provided between the semiconductor chip and the cap, wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through-hole electrode, and wherein at least a portion of the bump electrode is included in the through-hole electrode, and electrically connected thereto, so that the adhesive performance between the cap and the bump electrode can be increased.
Kabushiki Kaisha Toshiba
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Nobuto Hiroshi Tadahiro Yutaka
Managaki Yamada Sasaki Onozuka