JCIPRNET
Chip package circuit board module
A chip package circuit board module includes a circuit board and an original chip. The circuit board includes a first pad and a second pad disposed besides the first pad and separated from the first pad. The original chip is connected to the first pad and the second pad. A width of the original chip is W1, a total width of the first pad is P1, and a total width of the second pad is P2. The total width P1 of the first pad is larger than twice of the width W1 of the original chip, and the total width P2 of the second pad is larger than twice of the width W1 of the original chip.
Unimicron Technology Corp.
H H H
H01L H01L H01L
inventional inventional inventional
Wen-Fang Shao-Chien Chen-Wei Zong-Hua
Liu Lee Tseng Li