Jaffery Watson Mendonsa & Hamilton LLP
High bandwidth routing for die to die interposer and on-chip applications
Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
APPLE INC.
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Huabo Zhenggang Sanjay David A.
Chen Cheng Dabral Secker