ScienBiziP, P.C.
Heat dissipation structure, method for making the same, and electronic device having the same
A heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The graphite sheet is connected to the second surface. At least one containing cavity is defined on an interface between the second surface and the graphite sheet. The heat insulating material is filled in the at least one containing cavity to form a heat insulating structure.
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. Avary Holding (Shenzhen) Co., Limited.
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Fu-Yun Cong Hsiao-Ting Ming-Jaan
Shen Lei Hsu Ho