Haynes and Boone, LLP
Metal-compound-removing solvent and method in lithography
A wafer is rinsed with a solvent. The wafer has an increased hydrophobicity as a result of being rinsed with the solvent. A metal-containing material is formed over the wafer after the wafer has been rinsed with the solvent. One or more lithography processes are performed at least in part using the metal-containing material. The metal-containing material is removed during or after the performing of the one or more lithography processes. The increased hydrophobicity of the wafer facilitates a removal of the metal-containing material.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ching-Yu Joy An-Ren
Chang Cheng Zi