NSIP Law
Printed circuit board and manufacturing method for the same
A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.
Samsung Electro-Mechanics Co., Ltd.
H H H H H H H H H H H H H H
H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K H05K
inventional additional inventional additional inventional inventional additional inventional additional additional additional additional additional additional
Kee-Ju Ju-Ho Jin-Won Seung-On Jong-Guk A-ran Myeong-Hui Kyuong-Hwan
Um Kim Lee Kang Kim Lee Jung Lim