Pillsbury Winthrop LLP
Printed circuit board and method of production thereof
A filet F is added to a portion constituting a corner portion C equal to or smaller than 90&deg; in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.
Ibiden Co., Ltd.
H H H H H H H H H Y H H H Y H H H H H H H H H H H H H H H H H Y H
H05K H05K H05K H05K H05K H05K H01L H05K H05K Y10T H05K H05K H05K Y10T H05K H05K H01L H05K H05K H05K H01L H05K H05K H05K H05K H01R H05K H05K H01L H05K H01L Y10T H05K
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Takashi Naohiro Yoji
Kariya Hirose Mori