Plated probe structure
A plated test probe structure for testing electrical connections to integrated circuits (IC) devices with solder bumped interconnection pads that are an integral part of the fan-out wiring on the test substrate, or other printed wiring device.
International Business Machines Corporation
G G H G Y G H
G01R G01R H05K G01R Y10T G01R H05K
inventional inventional additional inventional additional additional additional
Da-Yuan Paul Alfred Brian Samuel Keith Edward Ho-Ming Eugene John
Shih Lauro Beaman Fogel Tong O'Sullivan