McDermott Will & Emery LLP
Method of manufacturing LED package for formation of molding member
Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.
Samsung LED Co., Ltd.
H B B B H B
H01L B29L B29C B29C H01L B29C
additional additional inventional additional additional inventional
Young Jae Yong Tae Seon Goo Geun Chang Dong Yeoul
Song Kim Lee Ryo Lee