Norris McLaughlin, P.A.
Piezoelectric wafer, piezoelectric vibration piece, and piezoelectric vibrator
This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.
Daishinku Corporation
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Tomo Satoru Tadataka Yoshinari Kozo Kazuki
Fujii Ishino Koga Morimoto Shibutani Otani