Nath, Goldberg & Meyer
Substrate inspection method and substrate inspection device
Provided is a substrate inspection method capable of accurately performing inspection. A wafer inspection device includes a chuck top on which a wafer having a semiconductor device formed thereon is mounted and a probe card disposed above the chuck top so as to face the chuck top. The probe card includes a plurality of contact probes protruding toward the wafer. When bringing the chuck top close to the probe card, a tubular expandable/contractible bellows extending downward from the probe card side so as to surround the contact probes is attracted to the chuck top via a lip seal before the contact probes come into contact with the semiconductor device.
TOKYO ELECTRON LIMITED
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inventional inventional inventional inventional
Hiroshi Jun
Yamada Fujihara