Alleman Hall Creasman & Tuttle LLP
Adhesive bonded micro electro mechanical system
A micro electro mechanical system is provided. The micro electro mechanical system includes a first part bonded to a second part by a structural adhesive interface. The structural adhesive interface includes a conductive structural adhesive portion, and a non-conductive structural adhesive portion at least partially surrounding the conductive structural adhesive portion. The conductive structural adhesive portion and the non-conductive structural adhesive portion have a thixotropy index greater than one.
Microsoft Technology Licensing, LLC
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Robert J. Utku Seungwoo Michael James Joseph Michael
Dyer Baran Lee Nystrom Luizzi