Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Method and apparatus for soldering inspection of a surface mounted circuit board
 It is an object of the present invention to provide a method and an apparatus for soldering inspection of a surface mounted circuit board, which can improve an inspection accuracy by obtaining a highly accurate X-rays transmission image corresponding to a real shape of the mounted surface. An apparatus and a method for soldering inspection of a surface mounted circuit board, includes an one-side transmission image reading process (23), an one-side soldering inspection process (22,7), a both-side transmission image reading process (17), a response adjustment process (15,18) for adjusting responses of the one-side transmission image and both-side transmission image so as to make their response characteristics into uniform in a referred spatial frequency range on the basis of response characteristics to a spatial frequency concerning an image radiographic system and an image processing system at said reading processes, a subtraction process (19,16,20) for subtracting the adjusted one-side transmission image from the adjusted both-side transmission image in order to obtain an other-side transmission image, and an other-side soldering inspection process (21). 
Kabushiki Kaisha Kobe Seiko Sho
H G B H B B G
H05K G01N B23K H05K B23K B23K G01R
inventional inventional inventional inventional additional additional inventional
Taro Yoshikazu Shiro Yasunori Yasuo Eiji
Nishijima Mori Koike Kakebayashi Morita Yoshida