Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Semiconductor package with shielding member and method of manufacturing the same
This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.
Siliconware Precision Industries Co., Ltd.
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Tsung-Hsien Hsin-Lung Te-Fang Chia-Yang Cho-Hsin
Hsu Chung Chu Chen Chang