Kamrath IP Lawfirm, P.A.
Substrate, semiconductor construction, and manufacturing method thereof
A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.
Unistars Corporation
H H H H H H H H H Y H H H Y H H H H H H H H H H Y H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L Y10T H01L H01L H01L Y10T H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L Y10T H01L H01L
additional inventional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional
Yi-Chun Shang-Yi Hsin-Hsie Tien-Hao
Wu Wu Lee Huang