McClure, Qualey & Rodack, LLP
Semiconductor package having varying conductive pad sizes
A semiconductor package is provided, including a package component and a number of conductive connectors. The package component has a number of conductive features on a surface of the package component. The conductive connectors are formed on the conductive features of the package component. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
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Tzu-Kai Chung-Chih Chih-Hao Jr-Lin Chien-Kuo
Lan Chen Lin Hsu Chang