Myers Bigel Sibley & Sajovec PA
Semiconductor memory devices and methods of forming the same
Semiconductor devices and methods of forming the same may be provided. The semiconductor devices may include gate patterns and insulation patterns repeatedly and alternatingly stacked on a substrate. The semiconductor devices may also include a through region penetrating the gate patterns and the insulation patterns. The semiconductor devices may further include a channel structure extending from the substrate through the through region. The channel structure may include a first channel pattern having a first shape. The first channel pattern may include a first semiconductor region on a sidewall of a portion of the through region, and a buried pattern dividing the first semiconductor region. The channel structure may also include a second channel pattern having a second shape. The second channel pattern may include a second semiconductor region in the through region. A grain size of the second semiconductor region may be larger than that of the first semiconductor region.
Samsung Electronics Co., Ltd.
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Ju-Eun Yong-Hoon Sunghae JinGyun Sangryol Dongwoo Myoungbum Kihyun Jung Ho Daehyun
Kim Son Lee Kim Yang Kim Lee Hwang Kim Jang