Slater Matsil, LLP
Pre-applying supporting materials between bonded package components
A structure includes a first package component, and a second package component over and bonded to the first package component. A supporting material is disposed in a gap between the first package component and the second package component. A molding material is disposed in the gap and encircling the supporting material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yu-Feng Guan-Yu Meng-Tse Yu-Chen Han-Ping
Chen Chen Chen Hsu Pu