Patterson & Sheridan, LLP
Lid assembly for front end of line fabrication
A lid assembly for semiconductor processing is provided. In at least one embodiment, the lid assembly includes a first electrode comprising an expanding section that has a gradually increasing inner diameter. The lid assembly also includes a second electrode disposed opposite the first electrode. A plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode.
Applied Materials, Inc.
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Xinliang Sal Chiukin (Steven) Yu Wei W. Chien-Teh Xiaoxiong (John) Son See-Eng Joel M. Jing-Pei (Connie) Mei
Lu Umotoy Lai Chang Wang Kao Yuan Trinh Phan Huston Chou Chang