Methods for processing a substrate
A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.
CORNING INCORPORATED
B B H H B Y H H Y Y B Y Y Y Y
B32B B32B H01L H01L B32B Y10S H01L H01L Y10S Y10T B32B Y10T Y10T Y10T Y10T
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Claire Renata Raymond Charles Byungchul Gary Carl Joseph William Christina Sue Hyun-Soo Timothy Michael
Coble Cady Kim Weber Soper Bennett Choi Miller