Tung & Associates
Guide mechanism for aligning a handheld vacuum pickup wand with a selected wafer in a cassette
 A guided vacuum pick-up device for picking up wafers in a wafer storage cassette and a method for using such device. In the device, a vacuum pick-up head is equipped with a guide member which intimately engages a guide bar molded on a wafer storage cassette such that the movement of the vacuum pick-up head can be precisely indexed to the spacing between the adjacent wafers by engaging a guide pin on the guide member to one of a number of positioning grooves provided circumferentially on the guide bar. The device can be used for picking up or putting back wafers in a wafer storage cassette without the danger of scratching or breaking the wafers by accidentally colliding with the wafers. 
Taiwan Semiconductor Manufacturing Company Ltd.
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additional inventional additional additional
Meng Chun
Li