Lee & Morse, P.C.
Wire clamp and wire bonding apparatus having the same
A wire clamp includes a pair of clamp arms at a predetermined distance from each other to define an interval therebetween for a bonding wire, a clamp body coupled to the clamp arms, the clamp body configured to adjust the predetermined distance between the clamp arms with respect to a process to be performed, a clamping section in each clamp arm, the clamping section having concave portions facing the interval between the clamp arms, the concave portions being configured to contact the bonding wire when the clamp arms are brought close together, and at least one abrasion prevention member in each clamping section, the abrasion prevention members being configured to prevent abrasion during contact with the bonding wire.
Samsung Electronics Co., Ltd.
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additional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional
Jung-Hyeon Ki-Taik Sung-Soo
Kim Oh Lee