Thorp Reed & Armstrong
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
 A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled. 
Micron Technology, Inc.
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Mark S. Todd O.
Johnson Bolken