Viering, Jentschura & Partner mbb
Assembly for handling a semiconductor die and method of handling a semiconductor die
In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.
Infineon Technologies AG
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H01L Y10T Y10T H01L H01L B32B B32B Y10T Y10T B25J Y10T Y10T H01L H01L B32B H01L H01L
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Kian Heong Avelino Ronald Jagen Thanabal Ganesh Nestor Kuang Ming Soon Hock
Tan Oliveros Sumagpoa Paramio Joves Krishnan Kunamani Vergara Bicomong Lee Tong