Scully Scott Murphy & Presser
Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpage
Disclosed is a semiconductor device and method of manufacturing a semiconductor device that includes planarizing surfaces of a semiconductor substrate and a carrier substrate and then placing the semiconductor substrate on the carrier substrate such that the planarized surfaces of each are adjoining and allowing the semiconductor substrate to bond to the carrier substrate using a Van der Waals force. The method also includes forming a metal filled trench around the semiconductor substrate and in contact with the carrier substrate, which can also be formed of metal. The metal filled trench and carrier substrate together form a metal cage-like structure around the semiconductor substrate that can serve as a heat sink, integrated heat spreader, and Electro-Magnetic Interference shield for the semiconductor substrate.
DiDrew Technology (BVI) Limited
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Xiaotian Chunbin Minghao Xiaoming
Zhou Zhang Shen Du