Syncoda LLC
Flip-chip light emitting device and fabrication method
A flip-chip light emitting device includes: a light-emitting epitaxial laminated layer with two opposite surfaces, in which, the first surface is a light-emitting surface; a first electrode and a second electrode that are separated from each other on the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with two opposite surfaces and two side walls connecting those two surfaces, in which, the first surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; a first external electrode and a second external electrode on the second surface of the non-conductive substrate, which extend to the side walls of the non-conductive substrate till and at least cover parts of the side walls of the first and the second electrodes to form electrical connection.
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
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Chia-en Su-hui Zhibai Chen-ke Jianming Yen-chih Wen-yu
Lee Lin Zhong Hsu Liu Chiang Lin