Muncy, Geissler, Olds & Lowe, P.C.
Substrate separation system and method
A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.
PRINCO CORP.
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H01L B32B Y10S Y10T H01L Y10T H01L Y10T Y10T H01L H01L Y10T H01L Y10S Y10T H01L Y10T
inventional inventional additional additional inventional additional inventional additional additional additional inventional additional inventional additional additional additional additional
Chih-Kuang Chin-Huang Chun-Hsiung
Yang Huang Chou