Oliff PLC
Method of cleaning and drying semiconductor substrate
A cleaning and drying method of a semiconductor substrate capable of suppressing collapse or breakdown of a pattern which occur at the time of drying a cleaning solution after cleaning the substrate and decomposition of a resin at a bottom of the pattern, and capable of removing the cleaning solution with good efficiency without using a specific device.
SHIN-ETSU CHEMICAL CO., LTD.
H C C C H B B C B
H01L C11D C11D C11D H01L B81C B81C C11D B08B
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Tsutomu Takeshi Osamu Naoki Daisuke
Ogihara Nagata Watanabe Kobayashi Kori