Integrated circuit including NCEM-enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of tip-to-side shorts and/or leakages.
PDF Solutions, Inc.
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Cheng Kibarian De Matsuhashi Rauscher O'Sullivan Rovner Taylor Eisenmann Haigh Liao Comensoli Vallishayee Lin Lee Doong Yokoyama Fiscus Hess Lam Strojwas Ciplickas Michaels Brozek Strojwas Weiland