Sughrue Mion, PLLC
Radio-frequency integrated chip configured to support carrier aggregation and wireless communication apparatus including the same
A radio-frequency integrated chip (RFIC) is described which provides a number of low noise amplifiers (LNAs) and load circuits. The low noise amplifiers are organized in groups. In some embodiments, a load circuit may be dedicated to a group or shared between groups. The RFIC includes an LNA group including a plurality of LNAs configured to amplify carrier signals related to a plurality of frequency bands, a second LNA group configured to amplify a plurality of second carrier signals, a first load circuit group dedicated to the first LNA group, a second load circuit group dedicated to the second LNA group, and a third load circuit group shared between the first LNA group and the second LNA group. In some embodiments the third load circuit group adaptively performs frequency down-conversion on a carrier signal amplified by at least one of the first LNA group and the second LNA group.
SAMSUNG ELECTRONICS CO., LTD.
H H H H H H H H H H H H H H H H H H
H04B H03F H03F H03F H03F H04B H04B H04B H03F H03F H04B H03F H03F H04B H03F H03F H03F H03F
inventional additional additional inventional inventional inventional inventional inventional inventional inventional inventional additional additional additional inventional additional additional inventional
Pilsung Byoungjoong Jungwoo
Jang Kang Kim