Sughrue Mion, PLLC
Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
An epoxy resin composition for encapsulating an optical semiconductor element, which has small internal stress and also can obtain good light transmittance within a broad temperature range. An epoxy resin composition for encapsulating an optical semiconductor element comprising the following component (A):(A) an epoxy resin complex which comprises an epoxy resin as the matrix component and silicon dioxide particles (a) dispersed therein:(a) silicon dioxide particles having an average particle size of from 5 to 40 nm measured by the small angle neutron scattering (SANS).
Nitto Denko Corporation
C H C C H
C08K H01L C09D C09D H01L
inventional inventional inventional inventional additional
Hisataka Shinya
Ito Ota