Sughrue, Mion, Zinn, Macpeak & Seas, PLLC
Semiconductor device, lead frame, and lead bonding
 In a semiconductor device, each of a plurality of leads has a chip mounting portion electrically connected to the semiconductor chip through a bump and a lead main body supporting the chip mounting portion. A lead path from the distal end of the lead main body to the bump is bent in X, Y, and Z directions so that the distal end portion of the lead main body and the chip mounting portion are arranged on different levels when viewed from a side surface. The lead main body and the chip mounting portion substantially make a right angle to form an L shape when viewed from an upper side. The semiconductor chip is connected, through bumps, to upper surfaces of distal end portions of the chip mounting portions of the leads on a plane. A molded body seals constituent elements except a part separated from a connection portion between the lead main body and the chip mounting portion, and incorporates a bent portion of the lead main body. Each lead is arranged such that the chip mounting portions are arranged on both sides of a centerline of the semiconductor device in a longitudinal direction to be parallel to the centerline. The L-shaped leads are arranged on one side such that the chip mounting portions oppose each other on a plane. A lead frame and lead bonding are also disclosed. 
NEC Corporation
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Mitsunori Hideki
Kanemoto Mizuno