Fay Sharpe LLP
Method for bonding discrete devices using anisotropic conductive film
Methods and system which eliminate steps in the mounting a discrete device to an electronic circuit using a conductive film, shortening the time required to attach each discrete device. The methods place a discrete device onto the conductive tape and partially cure portions of the adhesive. The discrete device is then removed from the conductive tape along with the adhesive and conductive particles which have been transferred onto the contact pads of the discrete device. The discrete device is then placed on the substrate and aligned. Pressure and heat are applied to complete the bond.
PALO ALTO RESEARCH CENTER INCORPORATED
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Ping Brent S.
Mei Krusor