Antonelli, Terry, Stout & Kraus, LLP
Semiconductor device chip on lead and lead on chip manufacturing
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
Hitachi, Ltd.
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Takashi Tetsuro Kunihiko Akihiro Hiroshi Takashi Isamu Sueo Hiroyoshi Makoto Hiroshi Gen Masahiro Aizo Masatsugu Junichi Syuuji Akio Noriyuki Asao Ichiro Kazuyoshi Shozo Masanori Kunihiro
Yokoyama Matsumoto Nishi Yaguchi Hozoji Yamazaki Yoshida Kawai Kokaku Kitano Kikuchi Murakami Ichitani Kaneda Ogata Saeki Eguchi Hasebe Kinjo Nishimura Anjo Oshima Nakamura Segawa Tsubosaki