Muir Patent Law, PLLC
Semiconductor package and method of manufacturing the same
A semiconductor package includes a redistribution structure including a redistribution insulating layer and a redistribution pattern, a semiconductor chip provided on a first surface of the redistribution insulation layer and electrically connected to the redistribution pattern, and a lower electrode pad provided on a second surface opposite to the first surface of the redistribution insulating layer, the lower electrode pad including a first portion embedded in the redistribution insulating layer and a second portion protruding from the second surface of the redistribution insulating layer, wherein a thickness of the first portion of the lower electrode pad is greater than a thickness of the second portion of the lower electrode pad.
SAMSUNG ELECTRONICS CO., LTD.
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Yeonho Jaegwon Jungho Seokhyun Jongyoun
Jang Jang Park Lee Kim