Slater Matsil, LLP
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes through-vias, an integrated circuit die mounting region, and a material disposed around and between the through-vias and the integrated circuit die mounting region. An interconnect structure is disposed over the material, the through-vias, and the integrated circuit die mounting region. The interconnect structure includes a dummy feature disposed proximate one of the through-vias.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsien-Wei Jie
Chen Chen