Fish & Richardson P.C.
Bare die carrier
 A bare semiconductor circuit die carrier is provided for use in the test of semiconductor circuits, the carrier, comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to form a flexible membrane that spans the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible membrane with particles deposited on the die contact pads; a fence upstanding from the membrane and sized to receive a test die; a top cap that rests upon the die when the die is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the die disposed therebetween. 
Kulicke & Soffa Ind. Inc.
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Brad Syed Chung W. William C. Robert Fariborz
Griswold Husain Ho Robinette, Jr. Moti Agahdel