Submicron silver particle ink compositions, process and applications
Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.
HENKEL AG & CO. KGAA HENKEL IP & HOLDING GMBH
C H H C C H H G G H H H C H
C09D H05K H05K C09D C22C H05K H05K G06F G06F H05K H01B H05K C09D H01B
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Gunther Bo Jianping Rudolf W.
Dreezen Xia Chen Oldenzijl