JCIPRNET
Package having different metal densities in different regions and manufacturing method thereof
A package has a first region and a second region. The package includes a first die, a second die, an encapsulant, and an inductor. The second die is stacked on and bonded to the first die. The encapsulant is aside the second die. At least a portion of the encapsulant is located in the second region. The inductor is located in the second region. A metal density in the first region is greater than a metal density in the second region.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Hsien-Wei Jie Ming-Fa Sen-Bor
Chen Chen Chen Jan