Muncy, Geissler, Olds & Lowe, PLLC
Semiconductor device package having a jumper chip and method of fabricating the same
A semiconductor device package and a method of fabricating the same are provided. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.
Advanced Semiconductor Engineering, Inc.
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additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional inventional inventional additional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional additional additional additional
Ming-Hsiang Tsung-Yueh Jiunn Hsiao-Chuan Yi-Shao
Cheng Tsai Chen Chang Lai