Birch, Stewart, Kolasch & Birch, LLP
Photo- or heat-curable resin composition and multilayer printed wiring board
This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of (A) photo- or heat-polymerizable unsaturated compound composed of a polycarboxylic acid adduct of bisphenol-epoxy (meth)acrylate, 10-100 parts by weight of (B) alkylene oxide-modified product of (meth)acrylate or oligomers thereof, 0-50 parts by weight of (C) compound containing epoxy group and 0-50 parts by weight of (D) photopolymerization initiator or sensitizer. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards.
Nippon Steel Chemical, Co., Ltd
G H G Y Y H H C
G03F H05K G03F Y10T Y10T H05K H05K C08G
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Masahiko Kazuhiko Hironobu
Takeuchi Mizuuchi Kawasato