NSIP Law
Resin composition, printed circuit board using the composition, and method of manufacturing the same
A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.
Samsung Electro-Mechanics Co., Ltd.
G H H G G G H H H H Y H G G H Y
G03F H05K H05K G03F G03F G03F H05K H05K H05K H05K Y10T H05K G03F G03F H05K Y10T
inventional additional additional inventional inventional inventional additional additional additional additional additional additional inventional inventional inventional additional
Young Kwan Jun Young
Seo Kim