JCIPRNET
Method of fabricating semiconductor device
A method of fabricating a semiconductor device is provided. A hybrid bonded structure is provided. A cover lid comprising a base portion and at least one dummy portion protruding from the base portion is provided. The at least one dummy portion of the cover lid is bonded to the hybrid bonding structure. The base portion is removed. A redistribution structure over the hybrid bonding structure and the at least one dummy portion is formed.
Taiwan Semiconductor Manufacturing Co., Ltd.
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inventional additional inventional additional additional additional additional additional additional additional inventional additional inventional inventional additional inventional additional inventional inventional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional inventional additional additional inventional additional additional additional additional additional
Hsien-Wei Jie
Chen Chen