JCIPRNET
Method of packaging CSP LED and CSP LED
A method of packaging CSP LED, comprising the following steps: placing LED chips on a carrier plate; coating light-blocking glue or fluorescent glue on the LED chips; at last cutting to form CSP LEDs with coating light-blocking glue or fluorescent glue outside the chip. Multiple LEDs with one light-emitting surface could be fabricated simultaneously. The process is simple and can prevent yellow light from appearing at the bonding surface of the light-blocking glue and the chip. The invention provides a CPS LED with the chip covered by packaging glue and the electrode of the chip protruding exposed and protruding. The invention provides CPS LED with three light-emitting surfaces and light-blocking glue arranged on two side surfaces and fluorescent glue arranged on other surfaces. This kind of LED could be used in various fields such as backlight and light bar, from side surfaces of which light could be emitted.
Hongli Zhihui Group Co.,Ltd.
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Tiangang Yuefei Yi Kunzhui Guoping
Lv Wang Xiong Li Li