Rankin, Hill & Clark LLP
Wiring substrate, its manufacturing method, and semiconductor device
One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump.
Shinko Electric Industries Co., Ltd.
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Tomoo Michio Yasue Yuichi
Yamasaki Horiuchi Tokutake Matsuda