Muir Patent Law, PLLC
Solder reflow apparatus and method of manufacturing an electronic device
In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.
SAMSUNG ELECTRONICS CO., LTD.
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additional inventional additional inventional additional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional additional inventional
Hyun-Seok Dong-Woo Sin-Yeob
Choi Shin Lee