LED package and LED die
The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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inventional inventional inventional additional inventional
Lung-Hsin Hou-Te Wen-Liang Pin-Chuan Chao-Hsiung
Chen Lin Tseng Chen Chang