Schmeiser Olsen & Watts LLP
Circuit board and method for fabricating the same
A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core layer better, thereby preventing delamination and forming a fine-pitch wiring layer.
Unimicron Technology Corp.
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Chia-Wei
Chang