Meyer & Williams PC
Semiconductor device and method for manufacturing a semiconductor device
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
Vishay General Semiconductor LLC
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Xian Yong-Qi Ta-Te
Li Tian Chou