Slater Matsil, LLP
Fingerprint sensor in InFO structure and formation method
A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chung-Shi Hao-Yi Chen-Hua Chih-Hua Yu-Chih Yu-Feng
Liu Tsai Yu Chen Huang Chen