Eschweiler & Potashnik, LLC
Package and method for integration of heterogeneous integrated circuits
In some embodiments, the present disclosure relates to a package for holding a plurality of integrated circuits. The package includes a first conductive pad disposed over a first substrate and a second conductive pad disposed over a second substrate. The second conductive pad is a multi-layer structure having an uppermost metal layer including titanium or nickel. A molding structure surrounds the first substrate and the second substrate. A conductive structure is over the first substrate and the second substrate. The conductive structure is conductively coupled to the second conductive pad.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Tien-Yu Wan-Yu Chun-Hao Ying-Hao Jui Hsieh Kuo-Chung
Huang Lee Tseng Kuo Lai Yee