Wenderoth, Lind & Ponack, L.L.P.
Substrate processing method and apparatus
A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
Ebara Corporation
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C23C C25D H01L C25D H01L Y10S H01L C23C C23C
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Kenichi Mitsuru Toshio Teruyuki Yasuyuki Seiji Masahiko Takahiro
Kobayashi Miyazaki Yokoyama Watanabe Motojima Katsuoka Sekimoto Ogawa