Edell, Shapiro & Finnan, LLC
Localized skew compensation technique for reducing electromagnetic radiation
Techniques are provided for electrically connecting components on a printed circuit board (PCB), semiconductor chip package, or other electronic device. More specifically, a first component, configured to generate a differential signal, is disposed on the PCB, while a second component, configured to receive the differential signal from the first component, is also disposed on the PCB. A differential conductor pair comprising first and second parallel conductors extends along a path between the first and second components. The path of the differential conductor pair comprises at least one turn that causes a change in direction of the first and second conductors. The first conductor comprises at least one localized skew compensation bend disposed at the turn such that, at the end of the turn, the first and second conductors have substantially the same length with respect to the first component.
Cisco Technology, Inc.
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Hongmei Phillipe Hailong Alpesh U. Jinghan Xiaoxia
Fan Sochoux Zhang Bhobe Yu Zhou