Slater Matsil, LLP
Apparatus and package structure of optical chip
An apparatus includes a package structure. The package structure includes a chip, a conductive structure over the chip, a molding structure surrounding and underneath the chip, and a first passivation layer over the conductive structure. The chip includes an optical component and a chip conductive pad. The conductive structure is electrically coupled to the chip conductive pad. The conductive structure has a planar portion substantially in parallel with an upper surface of the chip. The first passivation layer has a first opening defined therein. The first opening exposes a portion of the planar portion. The package structure is configured to receive an electrical coupling through the first opening in the first passivation layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chun-Hao Kuo-Chung Ying-Hao Wan-Yu Jui Hsieh Tien-Yu
Tseng Yee Kuo Lee Lai Huang