William Park & Associates Ltd.
Semiconductor packages with socket plug interconnection structures
A semiconductor package may include a first substrate and a second substrate. Socket bumps may be disposed on the first substrate to provide insertion grooves within the socket bumps. Plug bumps may be disposed on the second substrate. The plug bumps may be configured for insertion into the insertion grooves of the socket bumps and may electrically connect to the socket bumps. Related memory cards and electronic systems may also be provided.
SK hynix Inc.
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Hyeong Seok
Choi