Birch, Stewart, Kolasch & Birch, LLP
Lithography process using photoresist material with photosensitive functional group
Methods for forming a semiconductor structure including using a photoresist material are provided. The method for forming a semiconductor structure includes forming a material layer over a substrate and forming a photoresist layer over the material layer. The method for forming a semiconductor structure further includes performing an exposure process on the photoresist layer and developing the photoresist layer. In addition, the photoresist layer is made of a photoresist material comprising a photosensitive polymer, and the photosensitive polymer has a first photosensitive functional group bonding to a main chain of the photosensitive polymer and a first acid labile group bonding to the first photosensitive functional group.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ming-Hui Ching-Yu Siao-Shan Chin-Hsiang Cheng-Han
Weng Chang Wang Lin Wu