Park, Vaughan, Fleming & Dowler LLP
Hybrid-integrated photonic chip package with an interposer
A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.
ORACLE INTERNATIONAL CORPORATION
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Robert David Jon Ronald Ashok V. John E. Ivan Xuezhe Hiren D.
Hopkins, II Lexau Ho Krishnamoorthy Cunningham Shubin Zheng Thacker