Harness, Dickey & Pierce, P.L.C.
Semiconductor device and method of manufacturing the same
Example embodiments relate to a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device may include a pre-seeding layer and a nucleation layer. The pre-seeding layer may include a first material for pre-seeding and a second material for masking so as to reduce tensile stress.
Samsung Electronics Co., Ltd.
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Young-jo Jun-youn Hyun-gi Su-hee
Tak Kim Hong Chae