Christensen O'Connor Johnson Kindness PLLC
Lithography method using tilted evaporation
The present invention relates to a lithography method using tilted evaporation, and includes: (1) coating a resist on top of a substrate; (2) patterning the resist using a lithography process; (3) tilt-evaporating a first thin film material on an upper layer of the patterned resist to form a modified pattern mask; (4) evaporating a second thin film material on the top of the substrate with the modified pattern mask; and (5) removing the resist coated on the top of the substrate.
Korea Research Institute of Bioscience and Biotechnology
G G B G H
G03F G03F B82Y G02B H01L
inventional inventional inventional additional inventional
Yong Beom Seung Woo
Shin Lee