Eschweiler & Potashnik, LLC
Semiconductor image sensor
In some embodiments, the present disclosure relates to an image sensor integrated chip. The integrated chip has an image sensing element arranged within a substrate. A first dielectric is disposed in one or more trenches within a first side of the substrate. The one or more trenches laterally surround the image sensing element. The substrate includes a recessed portion arranged along the first side of the substrate and defined by second sidewalls of the substrate directly over the image sensing element. The second sidewalls of the substrate are angled to meet at a point disposed along a horizontal plane that intersects the first dielectric within the one or more trenches.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Chih-Kung Keng-Yu Cheng Yu Jhy-Jyi Kazuaki Wei-Chieh Chun-Hao Chien-Hsien Wen-Hau
Chang Chou Huang Sze Hashimoto Chiang Chuang Tseng Wu