Rankin, Hill, Porter & Clark LLP
Connection substrate
 The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure. The substrate parts with the fine, dense and flexible elements are associated with the inner areas of the overall circuit, the substrate parts with the rigid elements and/or components are associated with the outer areas of the overall circuit and a stiffening support material is so placed in the outer area that the circuit is given a mechanical support structure, which is designed in locally rigid manner passing into flexible areas. The overall circuit is folded and/or wound corresponding to the rigid and flexible portions. The mechanical support structure can be formed by separately produced apparatus housing parts or by the apparatus housing. 
Ciba Specialty Chemicals Holding, Inc. Fraunhofer-Gesellschaft zur Foerderung der Angewandten, Forschung E.V. Dyconex Patente AG Atotech Deutschland GmbH Techn. Universitaet Dresden
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Gunter Heinrich Walter Wolfgang Frank Ewald Hans-Jurg Theis
Rohrs Meyer Schmidt Scheel Rudolf Losert Barte Zur Nieden