Dentons US LLP
Adhesive film and method for encapsulating organic electronic device using same
The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.
LG Chem, Ltd.
C B C C C B H Y C B B C C
C09J B32B C09J C09J C09J B32B H01L Y10T C09J B32B B32B C09J C09J
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Suk Ky Jung Sup Seung Min Yoon Gyung Kyung Yul Hyun Jee
Chang Shim Lee Cho Bae Yoo