Harness, Dickey & Pierce, P.L.C.
Light emitting device and method of manufacturing the same
Provided is a light emitting diode (LED) manufactured by using a wafer bonding method and a method of manufacturing a LED by using a wafer bonding method. The wafer bonding method may include interposing a stress relaxation layer formed of a metal between a semiconductor layer and a bonding substrate. When the stress relaxation layer is used, stress between the bonding substrate and a growth substrate may be offset due to the flexibility of metal, and accordingly, bending or warpage of the bonding substrate may be reduced or prevented.
Samsung Electronics Co., Ltd.
H H
H01L H01L
inventional inventional
Su-hee Hyung-su Taek Kyoung-kook Young-soo Jun-youn Jae-chul Moon-seung
Chae Jeong Kim Kim Park Kim Park Yang