ScienBiziP, P.C.
Method for manufacturing rigid-flexible circuit board
A method for manufacturing rigid-flexible circuit board includes the step of providing an adhesive sheet defining at least one first opening, a copper foil, and a flexible board. The flexible board comprises a mounting region and a folding region. A removable sheet is pressed on a pressed surface of the adhesive sheet corresponding to each first opening. The copper foil, the adhesive sheet with the removable sheet, and the flexible board are pressed together in that sequence. The removable sheet corresponds to the folding region, and is embedded in the adhesive sheet. The copper foil contacts with the pressed surface and the removable sheet. An interspace is formed between the removable sheet and the flexible board. An outer conductive layer is formed on the copper foil. A removing region of the outer conductive layer corresponding to the folding region and the removable sheet is removed.
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. Avary Holding (Shenzhen) Co., Limited.
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Peng Meng-Lu Mei-Hua Wei-Xiang Xiao-Wei Biao
He Jia Huang Li Kang Li