Harness, Dickey & Pierce, P.L.C.
Stacked semiconductor module, method of fabricating the same, and electronic system using the same
A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
Samsung Electro-Mechanics Samsung Electronics Co., Ltd.
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Yang-Je Yong-Jin Do-Hyung Jung-Hyeon Jung-Chan Kyoung-Sun Hyun-Seok Jae-Sang Yong-Hyun Hyo-Jae Young-Ho
Lee Kim Kim Kim Cho Kim Choi Baik Kim Bang Lee