Eschweiler & Potashnik, LLC
Multi-terminal inductor for integrated circuit
A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Ching-Chung Cheng-Chieh Tsung-Yu Che-Yung Chung-Long Grace Hung-Chi
Hsu Hsieh Yang Lin Chang Chang Li