Haynes and Boone, LLP
Dissection splitting with optical proximity correction and mask rule check enforcement
The present disclosure provides one embodiment of an integrated circuit (IC) design method. The method includes receiving an IC design layout having a plurality of main features; applying a main feature dissection to the main features of the IC design layout and generating sub-portions of the main features; performing an optical proximity correction (OPC) to the main features; performing a mask rule check (MRC) to a main feature of the IC design layout; and modifying one of the sub-portions of the main feature if the main feature fails the MRC.
Taiwan Semiconductor Manufacturing Company, Ltd.
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G06F Y02P G06F
additional additional inventional
Ming-Hui Cheng-Kun Wei-Long Ru-Gun Chia-Ping Tsai-Sheng Jeng-Shiun Josh J. H. Bing-Syun Cheng-Cheng Yu-Po Wen-Chun Cheng-Lung
Chih Tsai Wang Liu Chiang Gau Ho Feng Yeh Kuo Tang Huang Tsai