Thomas, Kayden, Horstemeyer & Risley, LLP
Method of planarization
 A method for planarizing a semiconductor wafer. An insulation layer is formed over the wafer. A spin-on-glass layer is coated over the insulation layer. Subsequently, the spin-on-glass layer is baked to smooth out its upper surface. A chemical-mechanical polishing process is carried out to planarize the insulation layer. The method eliminates recess cavities in the more loosely packed device region of the insulation layer after a planarization process. 
Worldwide Semiconductor Manufacturing Corp.
H
H01L
inventional
Chang-Sheng Pao-Kang Bih-Tiao Sen-Nan
Lee Niu Lin Lee