Altis Law Group, Inc.
Light emitting diode package and manufacturing method thereof
A light emitting diode package comprises a substrate with a first surface and a second surface opposite to each other, a circuit on the substrate, a support on the substrate for reinforcing strength of the substrate, a plurality of light emitting diodes on the substrate and electrically connected to the circuit, and a cover layer on the plurality of light emitting diodes. A method for manufacturing a light-emitting diode package is further provided.
Advanced Optoelectronic Technology, Inc.
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Chieh-Ling Chao-Hsiung Shen-Bo
Chang Chang Lin