Thomas, Kayden, Horstemeyer & Risley, LLP
Ball grid array package and substrate within
A ball grid array (BGA) package includes a substrate and a chip. A bottom surface of the substrate includes a central area and a marginal area. Several source balls are disposed in the central area. Several ball groups are disposed in the marginal area. Each ball group includes one ground ball and at most three signal balls. The chip is disposed on a top surface of the substrate and electrically connected to the substrate.
Via Technologies, Inc.
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Yun-Han
Chen