Kilpatrick Townsend & Stockton LLP
Vertical inductor and method of manufacturing the same
A spiral inductor formed in a vertical plane relative to a planar surface of a substrate includes a plurality of through holes disposed in the vertical plane and spaced apart from each other, a metal interconnect structure on the top surface, and a redistribution layer on the bottom surface and having at least one bottom metal layer. The metal interconnect structure and the redistribution layer are connected to each other through the plurality of through holes to form the vertical spiral inductor. The thus formed vertical spiral inductor has a significantly reduced surface area comparing with lateral spiral inductors.
Semiconductor Manufacturing International (Shanghai) Corporation
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Dekui Xin Xuanjie Haifang Zheng
Qi Li Liu Zhang Chen