Myers Bigel Sibley & Sajovec, P.A.
Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same
Provided is a method of forming a semiconductor package including providing a substrate having a first side and an opposite second side and providing a wafer having a plurality of semiconductor chips, each of the semiconductor chips having a conductive pad, wherein at least one of the substrate and the wafer includes a seed pattern. The first side of the substrate is bonded to the wafer with the conductive pad positioned adjacent to the first side of the substrate and the seed pattern positioned between the conductive pad and the first side of the substrate. A through hole is then formed penetrating the substrate from the second side of the substrate to expose the seed pattern. A through electrode is formed in the through hole using the seed pattern as a seed. Corresponding devices are also provided.
Samsung Electronics Co., Ltd.
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additional additional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional
Tae Hong Jae-hyun Jung-Hwan Kyu-Ha Ju-il
Min Phee Kim Lee Choi