Haynes and Boone, LLP
Apparatus for electrochemical plating semiconductor wafers
An electroplating apparatus for depositing a conductive material on a semiconductor wafer includes a vessel for holding an electroplating bath, a support for holding a semiconductor wafer within the vessel and beneath a surface of the bath; first and second electrodes within the vessel, between which an electrical current may flow causing conductive material to be electrolytically deposited onto the wafer, a third electrode disposed outside of the bath for applying a static electric charge to the wafer, and an electrical power supply coupled with the third electrode.
Taiwan Semiconductor Manufacturing Company, Ltd.
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C25D H01L C25D C25D H01L C25D
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Chung-Liang Shau-Lin
Chang Shue