Circuit for and method of testing bond connections between a first die and a second die
A circuit for testing bond connections between a first die and a second die is described. The circuit comprises a defect monitoring circuit implemented on the first die, which is configured as a test die; and a plurality of bond connections between the first die and the second die; wherein the defect monitoring circuit is configured to detect a defect in a bond connection of the plurality of bond connections between the first die and the second die. A method of testing bond connections between a first die and a second die is also described.
XILINX, INC.
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Yuqing Suresh P. Henley Boon Y. Myongseob Cheang-Whang
Gong Parameswaran Liu Ang Kim Chang