Park, Vaughan & Fleming LLP
Engine with cable direct to outboard memory
A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface.
Sun Microsystems, Inc.
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Arthur R. Ashok
Zingher Krishnamoorthy