Foley & Lardner LLP
Semiconductor device package and a method of manufacturing the same
A substrate includes a first dielectric layer having a first surface and a second surface opposite to the first surface, a first patterned conductive layer adjacent to the first surface of the first dielectric layer and comprising an interconnection structure, and an interconnection element. The interconnection element extends from the first surface of the first dielectric layer to the second surface of the first dielectric layer and is surrounded by the interconnection structure.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional inventional inventional inventional additional additional additional inventional additional
Cheng-Lin Po-Shu Chih-Cheng
Ho Peng Lee