Slater Matsil, LLP
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes an integrated circuit die mounting region and a molding material disposed around the integrated circuit die mounting region. An interconnect structure is disposed over the molding material and the integrated circuit die mounting region. A protection pattern is disposed in a perimeter region of the package. The protection pattern includes a conductive feature.
Taiwan Semiconductor Manufacturing Company
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additional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional inventional additional additional additional inventional additional inventional additional inventional additional inventional inventional additional additional additional additional additional additional additional inventional inventional additional inventional inventional additional additional additional inventional additional inventional inventional inventional inventional inventional additional inventional additional additional additional additional inventional
Ying-Ju Jie Hsien-Wei
Chen Chen Chen