Package for an implantable neural stimulation device
An implantable device, including a first electrically non-conductive substrate; a plurality of electrically conductive vias through the first electrically non-conductive substrate; a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of the plurality of electrically conductive vias; a flip-chip driver circuit attached to the flip-chip multiplexer circuit using conductive bumps; a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps; discrete passives attached to the second electrically non-conductive substrate; and a cover bonded to the first electrically non-conductive substrate, the cover, the first electrically non-conductive substrate and the electrically conductive vias forming a hermetic package.
Second Sight Medical Products, Inc.
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