F. Chau & Associates, LLC
Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same
A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.
SAMSUNG ELECTRONICS CO., LTD.
B H H H B B H B B B H
B32B H01L H01L H01L B32B B32B H01L B32B B32B B32B H01L
inventional inventional inventional inventional inventional additional inventional inventional inventional additional inventional
Hoon-Joo Kwang-Jin Jun-Hyung Tae-Yeong Hoe-Chul
Na Moon Kim Kim Kim