Jianq Chyun IP Office
Package structure
A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a metal stud array having metal studs. The selective-electroplating epoxy compound covers the metal stud array. The selective-electroplating epoxy compound includes non-conductive metal complex. The conductive vias are directly embedded in the selective electroplating epoxy compound to be respectively connected to the metal studs and extended to a top surface of the selective-electroplating epoxy compound. Each of the conductive vias includes a lower segment connected to the corresponding metal stud and an upper segment connected to the lower segment and extended to the top surface, and a smallest diameter of the upper segment is greater than a largest diameter of the lower segment. The patterned circuit layer is directly disposed on the top surface and electrically connected to the conductive vias.
IBIS Innotech Inc.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H05K H01L H01L H05K H05K H01L H01L H01L H05K H05K H05K H01L H01L H05K H01L H05K H01L H05K H01L H01L H01L H05K H01L H01L H01L H01L H05K H05K H05K H01L H05K H05K H01L
additional additional inventional additional additional additional inventional inventional additional additional inventional inventional inventional additional additional additional additional inventional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional inventional inventional
Wen-Chun
Liu