Bonding material for semiconductor devices
A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.
Senju Metal Industry Co., Ltd.
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Yoshie Tsukasa Kenzo Hiroyuki Shunsaku Yoshitsugu
Yamanaka Ohnishi Tadokoro Yamada Yoshikawa Sakamoto