Stein IP, LLC
CMP apparatus
Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.
SAMSUNG ELECTRONICS CO., LTD. EHWA DIAMOND INDUSTRIAL CO., LTD.
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B24B B24B B24B B24B
inventional inventional inventional inventional
Youn Chul Joo Han Seh Kwang Jae Phil Jae Kwang
Kim Lee Lee Boo Choi