McClure, Qualey & Rodack, LLP
Semiconductor package having varying conductive pad sizes
A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chung-Chih Chien-Kuo Chih-Hao Tzu-Kai Jr-Lin
Chen Chang Lin Lan Hsu