Anova Law Group, PLLC
Semiconductor structures and fabrication methods thereof
A method for fabricating a semiconductor structure includes providing a substrate, forming a plurality of gate electrodes on the substrate, forming a plurality of first sidewall spacers on the side surfaces of the plurality of gate electrodes, forming an oxide layer on the substrate, and forming a plurality of second sidewall spacers on the oxide layer covering the side surfaces of the plurality of first sidewall spacers. Each gate electrode, first sidewall spacers formed on the side surfaces of the gate electrode, and second sidewall spacers formed on the side surfaces of the first sidewall spacers together form a gate structure. The method includes forming an undercut, having an undercut angle made between the oxide layer and the substrate under each second sidewall spacer, and forming a plurality of grooves through the oxide layer and into the substrate. Each groove includes undercuts under second sidewall spacers of adjacent gate structures.
Semiconductor Manufacturing International (Beijing) Corporation Semiconductor Manufacturing International (Shanghai) Corporation
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Jia Yan
Liu Liu