Park & Associates IP Law, P.C.
Ceramic chip assembly
Provided is a ceramic chip assembly configured to economically and reliably insulate an exposed portion of a metal lead wire from an environmental change. The ceramic chip assembly includes a ceramic base having electrical characteristics, a pair of external electrodes that are disposed on a pair of surfaces of the ceramic base, respectively, the surfaces of the ceramic base being opposed to each other, a pair of metal lead wires as single cores having first ends that are electrically and mechanically connected to the external electrodes, respectively, by an electrical conductive adhesive member, an insulation sealant sealing the ceramic base, the external electrodes, and the first ends of the metal lead wires to expose second ends of the metal lead wires, and an insulation polymer coating layer continuously formed on both the insulation sealant and portions of the metal lead wires exposed out of the insulation sealant.
Joinset Co., Ltd.
H Y H H Y Y H H G G H
H01C Y10T H01G H01G Y10T Y10T H01L H01G G01K G01K H01C
inventional additional inventional inventional additional additional additional inventional inventional inventional inventional
Ki-Han Seong-Jin Sun-Ki
Park Lee Kim