Slater & Matsil, L.L.P.
Methods for detecting defect connections between metal bumps
A method includes electrically grounding a first plurality of metal bumps on a first surface of an interconnection component to a common ground plate. A voltage contrast (VC) image of a second plurality of metal bumps of the interconnection component is generated. Grey levels of the second plurality of metal bumps in the VC image are analyzed to find defect connections between the second plurality of metal bumps and respective ones of the first plurality of metal bumps.
Taiwan Semiconductor Manufacturing Company, Ltd
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G01R G01R
inventional inventional
Ji-Jan Yun-Han Nan-Hsin Chien-Hui Chin-Chou Wei-Pin
Chen Lee Tseng Chen Liu Changchien