Muncy, Geissler, Olds & Lowe, P.C.
Micro light emitting diode module and manufacturing method thereof
A micro light emitting diode module contains: multiple flip-chip LEDs and a dielectric layer. The multiple flip-chip LEDs are arranged side by side. The flip-chip LEDs have a light emitting side and an electrical connecting side. The electrical connecting side of the flip-chip LEDs has a p-contact pad and an n pad. The dielectric layer is formed on the electrical connecting side of the flip-chip LEDs. The dielectric layer has multiple electric channels in which multiple electrical circuits are formed. The electrical circuits are corresponded to the p-contact pads and the n-contact pads of the flip-chip LEDs respectively, and each electrical circuit is electrically connected to its corresponding p-contact pad or n-contact pad. By reconstruction of circuits on LED array, the present invention not only has high processing yield, but also significantly reduces the manufacturing time. A method for making the micro light emitting diode module is also provided.
Uniflex Technology Inc.
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Yuan-Chih Chia-Ming
Lee Li