Altis & Wispro Law Group, Inc.
Heat dissipation device and method for manufacturing the same
A heat dissipation device includes a plurality of fins, a plurality of heat pipes connected to the fins in a thermal conductive relationship and a plurality of electric conductors extending through the fins. The fins are stacked together and spaced from each other. The heat pipes are extended through the fins. The electric conductors are electrically connected to the fins to enable consistent metal oxide films to be formed all over surfaces of the fins when anodizing the fins.
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Foxconn Technology Co., Ltd.
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F28F H01L B23P H01L C25D H01L F28F H01L F28D Y10T
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Wei Chun-Chi Yi-Qiang
Li Chen Wu