McDermott Will & Emery LLP
Light emitting diode package with metal reflective layer and method of manufacturing the same
The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.
Samsung Electro-Mechanics Co., Ltd.
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Kyung Taeg Jung Kyu Seong Yeon Seon Goo
Han Park Han Lee