Rankin, Hill & Clark LLP
Peeling apparatus and peeling method
A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and a support die 253 that supports a side surface of the conductive wire material 2 from a downstream side in a moving direction of the cutting blades 251 at the time of cutting by the cutting blades 251, the support die 253 of the first peeling die including a convex portion 2533 protruding toward the conductive wire material 2. 
SHINKO ELECTRIC INDUSTRIES CO., LTD. HONDA MOTOR CO., LTD
Y H H H H
Y02W H01B H02G H02G H02G
additional inventional inventional inventional inventional
Masafumi Keita Hideki Hiroyuki Ryuzo Akio
Saito Miyashita Shigematsu Miyajima Sakamoto Komamura