ScienBiziP, P.C.
Circuit board and manufacturing method thereof
The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD Avary Holding (Shenzhen) Co., Limited.
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Xian-Qin Yong-Chao Hsiao-Ting Fu-Yun Ming-Jaan
Hu Wei Hsu Shen Ho