Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Package structure and method for fabricating the same
A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.
Siliconware Precision Industries Co., Ltd.
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Hsin-Lung Cho-Hsin Chao-Ya Chih-Hsien Chia-Yang
Chung Chang Yang Chiu Chen