Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, one or more conductive features (120E.A, 120E.B, or both) are provided above the substrate that wrap around the conductive vias' protrusions (114′) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.
Invensas Corporation
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Hong Liang Guilian Arkalgud R. Zhuowen Cyprian Emeka Charles G.
Shen Wang Gao Sitaram Sun Uzoh Woychik