Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Substrate processing apparatus
A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film. Then, the substrate, with distribution of the predetermined component thus adjusted, is subjected to a heat process at a temperature not lower than the lower limit of temperature.
Tokyo Electron Limited
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Tsuyoshi Takahisa
Shibata Otsuka