Slater and Matsil, L.L.P.
On-chip heat spreader
A three dimensional (3D) stacked chip structure with chips having on-chip heat spreader and method of forming are described. A 3D stacked chip structure comprises a first die having a first substrate with a dielectric layer formed on a front surface. One or more bonding pads and a heat spreader may be simultaneously formed in the dielectric layer. The first die is bonded with corresponding bond pads on a surface of a second die to form a stacked chip structure. Heat generated in the stacked chip structure may be diffused to the edges of the stacked chip structure through the heat spreader.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Ching-Chen Chuan-Yi Sheng-Yuan Chen Cheng
Hao Lin Lin Chou