Fitzpatrick, Cella, Harper & Scinto
Precise polishing apparatus and method
The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.
Canon Kabushiki Kaisha
H H B B B
H01L H01L B24B B24B B24B
inventional additional inventional inventional inventional
Mikichi Takashi Shinzo Matsuomi Kazuo
Ban Kamono Uchiyama Nishimura Takahashi