Foley & Lardner LLP
Recessed chip scale packaging light emitting device and manufacturing method of the same
A chip-scale packaging (CSP) LED device, comprising an LED semiconductor die and a packaging structure, is disclosed. The LED semiconductor die is encapsulated by the packaging structure, wherein the lower surface of the packaging structure has a recessed space underneath. A manufacturing method of the CPS LED device is also disclosed.
MAVEN OPTRONICS CO., LTD.
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Tsung-Hsi Chieh Junwei
Wang Chen Chung