Rabin & Berdo, P.C.
Stacked chips electrically connected by a plurality of juncture portions
An inventive semiconductor device includes: a first semiconductor chip; a second semiconductor chip having a front surface opposed to a front surface of the first semiconductor chip; a first electrode region including a first electrode provided between the first semiconductor chip and the second semiconductor chip to electrically connect the first semiconductor chip to the second semiconductor chip; and a juncture portion provided between the first semiconductor chip and the second semiconductor chip as surrounding the first electrode region to connect the first semiconductor chip to the second semiconductor chip.
ROHM CO., LTD.
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional additional additional inventional
Hidekazu
Kikuchi