Hauptman Ham, LLP
Wafer on wafer stack method of forming and method of using the same
A wafer on wafer (WOW) stack includes a first wafer having dies of a first type. The WOW stack further includes a second wafer bonded to the first wafer. The second wafer has dies of a second type. An integer number of dies of the second type are bonded to a corresponding die of the first type. A total area of the dies of the second type bonded to the corresponding die of the first type is less than or equal to an area of the corresponding die of the first type. A functionality of the dies of the first type is different from a functionality of the dies of the second type.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Sandeep Kumar Yun-Han
Goel Lee