Organic electronic devices having external barrier layer
An organic device package includes a flexible substrate having a topside and a bottom side. Further, the organic device package includes an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate. In addition, the organic device package includes a first barrier layer disposed on the bottom side of the flexible substrate.
General Electric Company
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William Francis Jie Donald Franklin
Nealon Liu Foust