Molded package
A package is manufactured by placing a substrate, for example a lead frame, in a mold with a protection flange extending into a notch in the substrate around a contact surface. The protection flange impedes molding compound from reaching the contact surface reducing the need for a deflash step.
Koninklijke Philips N.V.
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Yujie Chingming Mengming Chengsheng Yuhua Yun Dusan
Huang Liu Zhu Ku Lee Liu Golubovic