Lee & Morse, P.C.
Apparatus for manufacturing polishing pad and method of manufacturing polishing pad using the same
An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm.
SAMSUNG ELECTRONICS CO., LTD.
B B B B B B
B24B B01F B01F B24D B01F B29B
inventional inventional inventional inventional additional inventional
Youngjun Bong-Su Jin-Su Jungsik
Jang Ahn Jeong Choi