Keating & Bennett, LLP
Circuit module and manufacturing method for the same
A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.
Murata Manufacturing Co., Ltd.
H H H H H Y H H H Y Y H H Y H H H H H H H H H H Y Y H H H H H H Y H Y H
H01L H05K H05K H01L H01L Y10T H01L H05K H01L Y10T Y10T H01L H01L Y10T H01L H01L H01L H01L H01L H05K H05K H01L H01L H05K Y10T Y10T H01L H01L H05K H05K H01L H01L Y10T H01L Y10T H01L
additional additional additional additional inventional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional
Fumikiyo Makoto Hiroshi
Kawahara Fujita Nishikawa