Patterson & Sheridan, L.L.P.
Structure to share internally generated voltages between chips in MCP
Embodiments of the invention generally provide an apparatus and technique for sharing an internally generated voltage between devices of a multi-chip package (MCP). The internally generated voltage may be shared via a conductive structure that electrically couples the devices and carries the internally generated voltage.
Qimonda North America Corp.
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Lee Ward Oliver Klaus Octavian Jung Pill Jong Hoon Josef Wayne Frederick
Collins Kiehl Hummler Beldiman Kim Oh Schnell Ellis