Light emitting diode and manufacturing method thereof
An exemplary light emitting diode (LED) includes a substrate, a LED chip and an encapsulation unit. The encapsulation unit includes a first encapsulation material located over the LED chip and a second encapsulation material located around the first encapsulation material. A plurality of first particles with a first distributing density is distributed in the first encapsulation material. A plurality of second particles with a second distributing density is distributed in the second encapsulation material. The first distributing density is larger than the second distributing density, a central portion of light from the light emitting diode chip transmits through the first encapsulation material and exits the encapsulation unit from a top surface thereof, and a periphery portion of light from the light emitting diode chip transmits through the second encapsulation material and exits the encapsulation unit from the top surface thereof.
Foxconn Technology Co., Ltd.
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Chia-Shou
Chang