McAndrews, Held & Malloy
Wafer level fan-out package with a fiducial die
A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.
Amkor Technology, Inc.
H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional inventional additional additional additional additional inventional additional inventional additional additional additional additional inventional inventional inventional additional inventional additional inventional inventional inventional
Sung Kyu Jin Han Se Woong Won Myoung Seung Jae Dong Jin Jin Young Yoon Joo Jae Hun
Kim Kim Cha Ki Lee Kim Kim Kim Bae