Blakely, Sokoloff, Taylor & Zafman, LLP
Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer
Disclosed herein are a method of attaching a die using a self-assembling monolayer and a package substrate including a die attached thereto using a self-assembling monolayer. A first self-assembling monolayer formed on a die and a second self-assembling monolayer formed on a substrate are provided with the same hydrophilic or hydrophobic functional group, so that the die is attached to the substrate using an attractive force acting between the first and second self-assembling monolayers. An accuracy of alignment between the die and the substrate can be improved by the simple solution.
Samsung Electro-Mechanics Co., Ltd.
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Jong Woo Soon Gyu Seung Seoup
Han Yim Lee