Heat dissipation device
A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader.
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Foxconn Technology Co., Ltd.
H H F H F
H01L H01L F28D H01L F28D
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Wei Yi-Qiang Chun-Chi
Li Wu Chen