Scully Scott Murphy & Presser
Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair
Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
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C09J H01L H01L C09J C09J H01L C09J C09J C09J H01L C09J
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Chunbin Shaolin Yijiang Xiaotian Minghao
Zhang Zou Hu Zhou Shen