J.C. Patents
Chip package structure
A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.
Advanced Semiconductor Engineering, Inc.
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B29C H01L B29C H01L H01L H01L H01L B29C H01L H01L
inventional additional inventional additional additional inventional additional additional inventional additional
Chih-Hung Ying-Shih Huan-Wen Shih-Chieh
Hsu Lin Chen Chiu