Cantor Colburn LLP
Substrate polishing apparatus
A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.
SAMSUNG DISPLAY CO., LTD.
B B B B
B24B B24B B24B B24B
inventional inventional inventional inventional
Oleg Sanghoon Byoungkwon Seunghwan Hyunjin Byoungho Joowoan Jeongkyun
Prudnikov Ahn Choo Lee Cho Cheong Cho Na