McClure, Qualey & Rodack, LLP
Circuit board and heat dissipating device thereof
A circuit board and a heat dissipating device are provided. The heat dissipating device is for dissipating heat from a heat element. The heat dissipating device comprises: a base, having a plurality of fixing holes, each of the fixing holes is disposed adjacent to a periphery of the base, each connecting direction is respectively defined according to a connecting line between each of the fixing holes and the adjacent fixing holes; a fin set, disposed on the base and having at least one airflow channel; and a fan assembly, disposed in the fin set to generate an airflow flows through the at least one airflow channel, wherein a vertical projection of the direction of the at least one airflow channel on the base and a vertical projection of the connecting line direction on the base are non-orthogonal and non-parallel.
ASUSTEK COMPUTER INC.
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Chia-Wei
Chang