Pearne & Gordon LLP
Antenna-integrated type communication module and manufacturing method for the same
A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
MURATA MANUFACTURING CO., LTD.
H H H H H H H H H H H H H H H H H H
H01Q H01Q H01L H01L H01Q H01Q H01Q H01Q H01Q H01Q H04B H01L H01Q H01L H01L H01Q H01L H01Q
inventional inventional additional additional inventional inventional inventional inventional inventional inventional inventional additional inventional additional inventional inventional additional inventional
Shinichiro Hideki Ryuken Hideaki Michiharu Noboru
Banba Ueda Mizunuma Yamada Yokoyama Morioka