Haynes Boone, LLP
Etching bias reduction
A patterning device for implementing a pattern on a substrate includes a main pattern feature and a sacrificial pattern feature. Both the main pattern feature and the sacrificial pattern feature are transferable to an overlying layer on the substrate. The sacrificial pattern feature is positioned a distance from the main pattern feature and is configured to have a dimension less than an etching bias of an etching process. The etching process is capable of transferring the main pattern feature to an underlying layer, such that the sacrificial pattern feature adjusts an etching behavior of the main pattern feature and is eliminated from the underlying layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
G G
G03F G03F
inventional inventional
Shih-Ming Chi-Lun Wen-Chuan Chih-Cheng Sheng-Chi
Chang Lu Wang Chin Chin