Sughrue, Mion, Zinn, Macpeak & Seas, PPLC
Poly(amic acid) solution and polyimide film or polymide-coated material obtained therefrom
 This invention provides a poly(amic acid) solution which does not contain aprotic polar solvents such as DMF, NMP, DMAc, DMSO, as well as a polyimide film obtained therefrom having appropriate flexibility and a small coefficient of linear thermal expansion and a coated material in which the polyimide film is formed on a substrate. More particularly, it provides a poly(amic acid) solution which has an aromatic poly(amic acid) and a tertiary amine as the solute and a water soluble alcohol compound and/or a water soluble ether compound as the solvent and contains substantially no aprotic polar solvent, as well as a polyimide film obtained from the poly(amic acid) solution and a coated material obtained by forming the film on a substrate. 
Unitika Ltd.
C C H C
C08G C08G H05K C09D
inventional inventional additional inventional
Hiroshi Yoshiaki Yoshiaki Isao Shoji
Yamada Echigo Iwaya Tomioka Okamoto