Slater Matsil, LLP
Metal liner overhang reduction and manufacturing method thereof
Overhang reduction methods are disclosed. In some embodiments, a method includes forming a recess in a dielectric layer, the recess defining first sidewalls of the dielectric layer. The method also includes depositing a first conductive layer over an upper surface of the dielectric layer and the sidewalls of the dielectric layer, the first conductive layer having a first overhang, removing the first overhang of the first conductive layer using an etchant selected from the group consisting of a halide of the first conductive layer, Cl2, BCl3, SPM, SC1, SC2, and combinations thereof, and filling the recess with a second conductive layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Yida Pei-Wen Yee-Chia Chi On Sung-Li Jyh-Cherng Chih-Wei Huang-Yi Cheng-Tung Min-Hsiu
Li Wu Yeo Chui Wang Sheu Chang Huang Lin Hung