J.C. Patents
Wafer test system wherein period of high voltage stress test of one chip overlaps period of function test of other chip
A wafer, a test system thereof, a test method thereof and a test device thereof are provided. The present invention utilizes a first group of probes to perform a high voltage stress (HVS) test on a first chip, and utilizes a second group of probes to perform a function test on a second chip, where a period of the high voltage stress test overlaps a period of the function test, thereby greatly decreasing the test time of the wafer.
Himax Technologies Limited
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Tzong-Yau Ying-Lieh Lin-Kai Chin-Tien Chien-Ru
Ku Chen Bu Chang Chen