Duane Morris LLP
MEMS package with roughend interface
A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.
Taiwan Semiconductor Manufacturing Co., Ltd.
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I-Shi Jen-Hao Yu-Jui Ren-Dou
Wang Liu Chen Lee