Patterson + Sheridan, LLP
Minimization of ring erosion during plasma processes
Methods are disclosed for etching a substrate. The method includes preferentially coating cover ring relative other chamber components in the processing chamber, while under vacuum, and while a substrate is not present in the processing chamber. The substrate is subsequently etched the processing chamber. After etching, the interior of the processing chamber is cleaned after the substrate has been removed.
Applied Materials, Inc.
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Vedapuram S. Olivier Olivier
Achutharaman Joubert Luere