Oblon, Spivak, McClelland, Maier & Neustadt
Method for producing lead frame material
 The present invention relates to a lead frame material for a semiconductor, which comprises a copper or copper alloy matrix having a layer obtained by applying an Ag-plating of a thickness of from 0.005 to 0.5 .mu.m on the surface of the matrix and diffusing Ag into the matrix by heat treatment. 
Mitsubishi Denki Kabushiki Kaisha
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