Lowe, Hauptman, Ham & Berner, LLP
Glass cap molding package, manufacturing method thereof and camera module
A glass cap molding package includes a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member. The mold unit exposes the external connection terminal of the substrate to a lateral surface of the substrate. The glass cap molding package and a manufacturing method thereof and a camera module including the same reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process.
Samsung Electro-Mechanics Co., Ltd.
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Jin Mun Jung Seok Yun Seok Hyung Kyu Bo Kyoung Jung Jin
Ryu Lee Woo Park Kim Kim