Jianq Chyun IP Office
Circuit board and manufacturing method thereof
A circuit board and a manufacturing method thereof are provided. The circuit board includes a dielectric substrate, a circuit pattern and a dielectric layer. The circuit pattern is disposed on the dielectric substrate. The dielectric layer is disposed on the dielectric substrate and covers the circuit pattern. The dielectric layer includes a dielectric matrix and a mesh-shaped fiber structure disposed in the dielectric matrix. There is no mesh-shaped fiber structure on a portion of the dielectric substrate exposed by the circuit pattern.
Unimicron Technology Corp.
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additional inventional additional additional inventional
Yin-Ju Chi-Min Cheng-Po
Chen Chang Yu