Myers Bigel Sibley & Sajovec, PA
Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device
Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other.
Samsung Electronics Co., Ltd.
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inventional additional inventional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional
Young-Bae Yun-Hee Heung-Kyu
Kim Lee Kwon