Integrated circuit packaging system with interposer
An integrated circuit packaging system comprising: fabricating an interposer array having an access opening; fabricating a base package substrate sheet; attaching a first integrated circuit die over the base package substrate sheet; mounting the interposer array over the first integrated circuit die; and singulating a base package from the base package substrate sheet and the interposer array by cutting the access opening generally through the center.
STATS ChipPAC Ltd.
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SeongMin WonJun Sungmin
Lee Ko Song