Vierra Magen Marcus LLP
Physical defect detection in an integrated memory assembly
Technology for physical defect detection in an integrated memory assembly having a control semiconductor die and a memory semiconductor die is disclosed. The control die compares actual current usage during a memory operation (such as a program operation) with expected current usage. In the event that the actual current usage deviates from the expected current usage by more than a threshold, a region of the memory structure is suspected as having a physical defect. For example, the selected word that is connected to the memory cells that were programmed may be suspected as having a physical defect. If a region is suspected as having a physical defect, a data integrity check may be performed in that region. If the data integrity check fails, the region may be marked as ineligible to store data.
Western Digital Technologies, Inc.
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Tomer Yu-Chung Eran Alexander
Eliash Lien Sharon Bazarsky