Process for making and using mesh-style NCEM pads
Wafers, chips, or dies that contain fill cells with structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). Such NCEM-enabled fill cells may target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes, and may include NCEM pads that comprise a mesh of GATECNT and AACNT stripes. Such wafers, chips, or dies may include Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).
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Sheng-Che Jonathan Kimon Markus Tomasz Jeremy Hideki Marci Kelvin Nobuharu Hans Larg Marcin Andrzej Conor Carl Sherry Timothy Rakesh Christopher Indranil Dennis Stephen John Vyacheslav Simone
Lin Haigh Michaels Rauscher Brozek Cheng Matsuhashi Liao Doong Yokoyama Eisenmann Weiland Strojwas Strojwas O'Sullivan Taylor Lee Fiscus Vallishayee Hess De Ciplickas Lam Kibarian Rovner Comensoli