Oliff & Berridge, PLC
Method of plating and method of manufacturing a micro device
A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.
TDK Corporation
H H H C C
H05K H05K H05K C25D C25D
inventional inventional additional inventional inventional
Souhei Shingo Masahiro Yuji Atsushi Akifumi
Horiuchi Miyata Saito Otsubo Yamaguchi Kamijima