Rosenberg, Klein & Lee
Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same
An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a component structure that is adhered onto a substrate and is applied to a USB terminal in order to protect an electronic device that uses the USB. Hence, the present invention has an OCP function, an OVP function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrates two or more passive components in order to increase functionality. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.
Inpaq Technology Co., Ltd.
Y H H
Y10T H05K H05K
additional inventional additional
Wen-Chih Chien-Hao
Li Huang