Conley Rose, P.C.
Metal core solder ball and heat dissipation structure for semiconductor device using the same
Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.
DUKSAN HI-METAL CO., LTD.
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additional inventional additional additional inventional inventional additional inventional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional inventional additional inventional additional additional additional additional additional
Yong Sik Seung Jin Hyun Kyu Jung Ug Sang Ho Yong Cheol
Choi Lee Lee Kwak Jeon Chu