Kenyon & Kenyon LLP
Integrated circuit package including miniature antenna
The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna.
Fractus, S.A.
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Jaume Jordi Carles Carmen
Anguera Pros Soler Castany Puente Baliarda Borja Borau