Slater Matsil, LLP
Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
In some embodiments, a package substrate for a semiconductor device includes a substrate core and a material layer disposed over the substrate core. The package substrate includes a spot-faced aperture disposed in the substrate core and the material layer.
Taiwan Semiconductor Manufacturing Company
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inventional inventional additional additional additional additional additional inventional additional inventional inventional inventional inventional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional
Yu-Min Yu-Feng Tsung-Ding Hao-Cheng Jung Wei
Liang Chen Wang Hou Cheng