Lead reduction for improved creepage distance
Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged semiconductor device is formed; and a first die pad arm, wherein an end of the first die pad arm remains within the package body perimeter and is separated from the package body perimeter by a gap distance; wherein a first outermost lead finger of the first row of lead fingers is adjacent to the first die pad arm.
NXP USA, Inc.
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Burton Jesse Allen Marfil Jinmei Mariano Layson Yit Meng
Carpenter Descartin Liu Ching, Jr. Lee