Perkins Coie LLP
Multi-wafer based light absorption apparatus and applications thereof
Structures and techniques introduced here enable the design and fabrication of photodetectors (PDs) and/or other electronic circuits using typical semiconductor device manufacturing technologies meanwhile reducing the adverse impacts on PDs' performance. Examples of the various structures and techniques introduced here include, but not limited to, a pre-PD homogeneous wafer bonding technique, a pre-PD heterogeneous wafer bonding technique, a post-PD wafer bonding technique, their combinations, and a number of mirror equipped PD structures. With the introduced structures and techniques, it is possible to implement PDs using typical direct growth material epitaxy technology while reducing the adverse impact of the defect layer at the material interface caused by lattice mismatch.
Artilux Inc.
H H H H Y H H H H H H Y H H
H01L H01L H01L H01L Y02E H01L H01L H01L H01L H01L H01L Y02E H01L H01L
inventional inventional inventional inventional additional inventional inventional inventional inventional inventional inventional additional inventional inventional
Szu-Lin Hui-Wen Shu-Lu Han-Din Yun-Chung
Cheng Chen Chen Liu Na