Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Thin film device having lead conductor film
The present invention relates to a thin-film device whose bump has an improved surface property. A thin-film element of the thin-film device includes at least one of an electromagnetic conversion element, a passive element and an active element. A lead conductor film containing Cu as a main component is connected to the thin-film element. The lead conductor is provided with a bump. The bump includes a first conductor film and a second conductor film. The first conductor film is adhered onto the lead conductor film and is a Ta film or made of a material having a comparably fine crystal structure. The second conductor film is a plated film which is directly or indirectly formed on the first conductor film and contains Au as a main component.
TDK Corporation
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G11B G11B H01L G11B G11B Y10T
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Takahide Masashi Hiroki
Masuda Sano Aritomo