Dentons US LLP
Adhesive film and sealing product for organic electronic device using same
Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
LG Chem, Ltd.
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C09J C08G C08G C08K H01L C08L H01L C08K H01L C08K
inventional additional inventional inventional additional inventional additional additional additional additional
Suk Ky Jung Sup Hyun Jee Seung Min Kyung Yul Yoon Gyung
Chang Shim Yoo Lee Bae Cho