Haynes and Boone, LLP
Structure and method for reflective-type mask
The present disclosure provides an embodiment of a reflective mask that includes a substrate; a reflective multilayer formed on the substrate; a capping layer formed on the reflective multilayer and having a hardness greater than about 8; and an absorber layer formed on the capping layer and patterned according to an integrated circuit layout.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Anthony Jeng-Horng Chih-Tsung Chia-Chen Shinn-Sheng Wei-Hung Chi-Lun
Yen Chen Shih Chen Yu Liu Lu