Altis Law Group, Inc.
Method for manufacturing a printed circuit board
An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.
FuKui Precision Component (Shenzhen) Co., Ltd. Zhen Ding Technology Co., Ltd.
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Yung-Wei Qi Shing-Tza
Lai Zhang Liou