Haynes and Boone, LLP
Photoresist stripping technique
A method for fabricating an integrated circuit device is disclosed. The method may include providing a substrate; forming a first material layer over the substrate; forming a patterned second material layer over the substrate; and removing the patterned second material layer with a fluid comprising a steric hindered organic base and organic solvent.
Taiwan Semiconductor Manufacturing Company, Ltd.
H G
H01L G03F
inventional inventional
Chien-Wei Ching-Yu
Wang Chang