Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Method of manufacturing multilayer wiring board
A manufacturing method of a multilayer wiring board that includes a core board, a wiring layer, and an electrically insulating layer that are stacked on the core board. The manufacturing method forms a plurality of through holes in a core member, a thermal expansion coefficient of the core board being between 2 to 20 ppm, and the core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal. The through holes are made conductive by a conductive material, to electrically connect between the front and the back of the core board. A wiring layer and an electrically insulating layer are stacked on one surface of the core board to form a multilayer wiring layer. A capacitor is formed on the other surface of the core board.
Dai Nippon Printing Co., Ltd.
Y H Y H H H H Y Y H H H Y H H H H H H H H H H Y H H Y H H H H H
Y10T H05K Y10T H01L H05K H01L H01L Y10T Y10T H05K H05K H05K Y10T H05K H05K H05K H05K H05K H05K H01L H05K H05K H05K Y10T H05K H05K Y10T H01L H05K H05K H05K H05K
additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Satoru Miyuki Toshiaki Koichi Kazunori
Kuramochi Akazawa Mori Nakayama Nakamura