Fitch, Even, Tabin & Flannery LLP
Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.
Hitachi Chemical Company, Ltd.
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Kouji Takayuki Shinya Tatsuya Rie Michio Kouhei
Komorida Matsuzaki Katou Sakuta Katou Mashino Taniguchi