Hauptman Ham, LLP
Wafer scale image sensor package and optical mechanism including the same
There is provided an optical mechanism including a substrate, an image sensor chip, a light source, a blocking member and a securing member. The image sensor chip is attached to the substrate and has an active area. The light source is attached to the substrate. The blocking member covers the image sensor chip and has an opening to expose at least the active area of the image sensor chip. The securing member fits on the blocking member to secure the blocking member to the substrate.
PIXART IMAGING INC.
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H01L H01L H01L
inventional inventional inventional
Tien-Chia Chia-Hsin Hui-Hsuan
Liu Yu Chen