Foley & Lardner LLP
Optical device package and method for manufacturing the same
An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Wen-Long Po Ju Huang-Hsien Yu Cheng
Lu Wu Chang Chen