Volpe and Koenig, P.C.
Electronic element mounting substrate and electronic device
An electronic element mounting substrate includes: a first wiring substrate configured to be a frame defining an interior portion as a first through-hole, the first wiring substrate including a lower surface including an external circuit connection electrode; a metal plate disposed on the lower surface of the first wiring substrate so as to cover an opening of the first through-hole, an outer edge thereof being located between an outer edge of the first wiring substrate and an inner edge of the first wiring substrate, an electronic element mounting portion being disposed in a region of an upper surface of the metal plate which region is surrounded by the first wiring substrate; and a second wiring substrate which is disposed in a peripheral region of the metal plate on the lower surface of the first wiring substrate and is electrically connected to the external circuit connection electrode.
KYOCERA CORPORATION
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H05K H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional inventional inventional additional additional additional inventional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional
Hiroshi Takuji Akihiko
Yamada Okamura Funahashi