Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths
A method for fabricating a light emitting diode includes the steps of providing a thermal conductive substrate having an electrical isolation layer, forming an anode via and a cathode via side by side on a first side of the substrate part way through the substrate, forming an anode through interconnect in the anode via and a cathode through interconnect in the cathode via, thinning the substrate from a second side of the substrate to the anode through interconnect and the cathode through interconnect, and mounting a LED chip to the first side in electrical communication with the cathode through interconnect and the anode through interconnect.
SemiLEDS Optoelectrics Co., Ltd.
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Chen-Fu Trung Tri Feng-Hsu Fu-Hsien Wen-Huang Hao-Chun
Chu Doan Fan Wang Liu Cheng