Method to increase wafer utility by implementing deep trench in scribe line
 A method that teaches the formation of deep trenches within the surface of a semiconductor wafer, these deep trenches are used to separate the wafer into individual chips by applying stress to the wafer. The formation of the deep trenches uses exposing a thick layer of photoresist followed by etching. The etching is a two step etch, a stabilization etch and a main etch. The stress used to separate the wafer into individual chips can be invoked by applying physical force to the wafer. 
Taiwan Semiconductor Manufacturing Company
Y H
Y10S H01L
additional inventional
Chen-Yu Horng-Wen
Chang Chen