Hauptman Ham, LLP
Crack stopper on under-bump metallization layer
A semiconductor die includes a crack stopper on an under-bump metallization (UBM) layer. The crack stopper is in the shape of hollow cylinder with at least two openings.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Yu-Feng Kai-Chiang Han-Ping Chun-Hung Ming-Che Chih-Hang
Chen Wu Pu Lin Ho Tung