Haynes and Boone, LLP
Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates
In a microelectronic component having conductive vias (114) passing through a substrate (104) and protruding above the substrate, conductive features (120E.A, 120E.B) are provided above the substrate that wrap around the conductive vias' protrusions (114′) to form capacitors, electromagnetic shields, and possibly other elements. Other features and embodiments are also provided.
Invensas Corporation
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Charles G. Zhuowen Liang Hong Cyprian Emeka Guilian Arkalgud R.
Woychik Sun Wang Shen Uzoh Gao Sitaram