Muir Patent Consulting, PLLC
Stacked package structure including insulating layer between two stacked packages
A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.
Samsung Electronics Co., Ltd.
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additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional additional additional additional additional inventional
Se-Ho Seong-Ho Hee-Seok Yun-Hee Yong-Hoon
You Shin Lee Lee Kim