Muir Patent Law, PLLC
Semiconductor package and method of fabricating the same
A method of fabricating a semiconductor package includes providing a semiconductor chip, forming a redistribution substrate, and fabricating a package including the semiconductor chip disposed on the redistribution substrate. The forming of the redistribution substrate may include forming a first insulating layer on a substrate, the first insulating layer having a first opening formed therein, forming an integrally formed first redistribution pattern in the first opening and on the first insulating layer, forming a second insulating layer on the first insulating layer to cover the first redistribution pattern, and performing a planarization process on the second insulating layer to expose the first redistribution pattern.
SAMSUNG ELECTRONICS CO., LTD.
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additional inventional additional additional additional inventional additional inventional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional additional inventional additional inventional inventional additional additional inventional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional
Seokhyun Kyoung Lim
Lee Suk