ScienBiziP, P.C.
Transmission circuit board and method for manufacturing the same
A transmission circuit board includes a bendable area, a first transmission areas, and a second transmission areas. The first and second transmission areas are connected to the bendable area. The inner circuit substrate board further includes a substrate layer and an inner circuit layer formed on the substrate layer and including a first signal circuit. The transmission circuit board further includes a first dielectric layer formed on the inner circuit layer, a first outer circuit layer formed on the first dielectric layer, a first protecting layer formed on the first outer circuit layer, and a first shielding layer formed on the first protecting layer. The first dielectric layer lies the first and second transmission areas. Two ends of the first signal circuit are connected to the first outer circuit layer. The first shielding layer is connected to the first outer circuit layer and lies the bendable area.
Avary Holding (Shenzhen) Co., Limited. QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
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Fu-Yun Ming-Jaan Wen-Zhu
Shen Ho Wei