Antonelli, Terry, Stout & Kraus, LLP
Semiconductor device
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
Hitachi, Ltd.
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Kazuyoshi Hiroyoshi Kunihiko Hiroshi Tetsurou Shozo Junichi Makoto Hiroshi Akihiro Takashi Masahiro Takashi Noriyuki Isamu Masanori Gen Kunihiro Aizo Masatsugu Syuuji Sueo Akio Ichiro Asao
Oshima Kokaku Nishi Hozoji Matsumoto Nakamura Saeki Kitano Kikuchi Yaguchi Yokoyama Ichitani Yamazaki Kinjo Yoshida Segawa Murakami Tsubosaki Kaneda Ogata Eguchi Kawai Hasebe Anjo Nishimura