Molded package and method of manufacture
A package is manufactured by placing a substrate (10), for example a lead frame, in a mold (30) with a protection flange (38) extending into a notch (14) in the substrate (10) around a contact surface (12). The protection flange (38) impedes molding compound from reaching the contact surface reducing the need for a deflash step.
KONINKLIJKE PHILIPS N.V.
H H H B H H H H H H H B H
H01L H01L H01L B29C H01L H01L H01L H01L H01L H01L H01L B29C H01L
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Yun Mengming Chengsheng Dusan Chingming Yujie Yuhua
Liu Zhu Ku Golubovic Liu Huang Lee