Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Electronic package and method for fabricating the same
An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.
Siliconware Precision Industries Co., Ltd.
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Cheng Kai Jui-Feng Wen-Jung Chia-Cheng Chia-Cheng
Chang Chen Tsai Chen Hsu