Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Semiconductor device having a metallic fuse member and cutting method thereof with laser light
 A semiconductor device has a plurality of fuse members (1a, 1b) composed of a metal that can be cut by laser light (4), disposed over a semiconductor substrate (5). The length L of the fuse members (1a, 1b) is smaller than a value obtained by subtracting an alignment error .alpha. of the laser light (4) from a spot diameter D of the laser light (4), i.e., the value (D-.alpha.). The fuse members (1a, 1b) are spaced a distance l larger than a value obtained by adding the alignment error .alpha. to the half of the spot diameter D, i.e., the value (D/2+.alpha.). 
Mitsubishi Denki Kabushiki Kaisha
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H01L H01L H01L
inventional inventional additional
Yasuhiro Shigeru Koji Hideki Atsushi
Ido Shiratake Taniguchi Genjo Hachisuka