ScienBiziP, P.C.
Method for connecting stacked circuits boards
A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD Avary Holding (Shenzhen) Co., Limited.
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Ming-Jaan Man-Zhi Rui-Wu
Ho Peng Liu