Kenyon & Kenyon LLP
Semiconductor module
A semiconductor module comprises: a metal block; a semiconductor device installed via a solder layer in a semiconductor device installation area on a surface of the metal block; and a molded portion formed by molding a resin on the metal block and the semiconductor device; wherein the surface of the metal block includes a plating area and a roughened area, and the semiconductor device installation area is provided in the plating area.
Toyota Jidosha Kabushiki Kaisha
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Tomomi Takuya Tatsuya
Okumura Kadoguchi Miyoshi