WPAT, P.C., Intellectual Property Attorneys
Semiconductor package structure
A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Hsin-Chieh Hsi-Kuei Chih-Kang Ching-Fu
Huang Cheng Han Chang