LED and method for making the same
An LED includes a substrate, an LED die, and a packaging layer. The substrate has conductive pins extending therethrough. The LED die is arranged on the substrate and electronically connected to the conductive pins of the substrate. The packaging layer fills in the substrate to encapsulate the LED die therein. A plurality of fillers are distributed in the packaging layer. Each of the fillers has a plurality of nano-particles distributed therein for enhancing a light dispersion of light generated by the LED die.
Foxconn Technology Co., Ltd.
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Chia-Shou
Chang