Sughrue Mion, PLLC
Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same
Disclosed are support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same. The support substrate comprises a main body, and a plurality of first protrusions finely protruding from an upper surface of the main body. The main body and the first protrusions include the same material and are formed as a unitary structure. The first protrusions are spaced apart from each other in first and second directions intersecting each other, when viewed in plan.
SAMSUNG ELECTRONICS CO., LTD.
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Seung Hwan Kunsil
Lee Lee