Electronic device packaging
The present invention discloses a large form factor media enclosure structure configured to removably retain a smaller form factor device therein. The large form factor media enclosure structure includes a first flexible retainer, and a second retainer oppositely disposed from said first retainer. A catch paw is disposed along the first retainer, for frictionally engaging the smaller form factor device.
3Com Corporation
H H
H05K H05K
inventional inventional
Seang Wee
Lee