Lewis Roca Rothgerber Christie LLP
Method of forming a thermal shield in a monolithic 3-D integrated circuit
A monolithic three-dimensional integrated circuit including a first device, a second device on the first device, and a thermal shield stack between the first device and the second device. The thermal shield stack includes a thermal retarder portion having a low thermal conductivity in a vertical direction, and a thermal spreader portion having a high thermal conductivity in a horizontal direction. The thermal shield stack of the monolithic three-dimensional integrated circuit includes only dielectric materials.
Samsung Electronics Co., Ltd.
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Vassilios Mark S. Wei-E
Gerousis Rodder Wang