Foley & Lardner LLP
Semiconductor device package and a method of manufacturing the same
A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
H H B H H H B
H01L H01L B81B H01L H01L H01L B81C
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Lu-Ming Yu-Ying Mei-Yi Yung-Yi
Lai Lee Wu Chang