Rader, Fishman & Grauer PLLC
Method and apparatus for polishing
In a Chemical Mechanical Polishing flattening processing against a surface with minute bumps and dips in a semiconductor process, this invention provides a method of polishing to be able to perform selective polishing of the bumps. A laser beam is irradiated selectively on the surface of a work piece in accordance with a shape of minute bumps and dips on the surface of the work piece, thereby performing a removal control for the minute region and enabling to selectively polish particularly surface bumps.
Sony Corporation
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B24B B24B B24B
inventional inventional inventional
Takashi Keiichi
Miyoshi Kimura