Coudert Brothers LLP
Opto-electronic substrates with electrical and optical interconnections and methods for making
Disclosed is device and/or material integration into thin opto-electronic layers, which increase room for chip-mounting, and reduce the total system cost by eliminating the difficulty of optical alignment between opto-electronic devices and optical waveguides. Opto-electronic devices are integrated with optical waveguides in ultra thin polymer layers on the order of 1 &mgr;m to 250 &mgr;m in thickness.
Fujitsu Limited
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Masaaki Michael G. William Solomon I. Yashuhito Tetsuzo James J. Thomas J. Wen-chou Vincent
Inao Lee Chou Beilin Takahashi Yoshimura Roman Massingill Wang