Patterson Thuente Pedersen, P.A.
COF type semiconductor package and method of manufacturing the same
Provided is a chip on film (COF) type semiconductor package. The COF type semiconductor device includes a flexible film, an electrode pattern formed on the flexible film, a semiconductor device disposed on the electrode pattern, a conductive pad disposed between the electrode pattern and the semiconductor device to electrically connect the semiconductor device with the electrode pattern, and a first protective layer which seals the conductive pad and the semiconductor device and is formed on a portion of the electrode pattern and the semiconductor device. The first protective layer includes a heat conductive material for dissipating heat generated from the semiconductor device.
Dongbu Hitek Co., Ltd.
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Sung Jin Hag Mo Jun Il
Kim Kim Kim