F. Chau & Associates, LLC
Stack semiconductor package and manufacturing the same
To manufacture a stack semiconductor package, a board mold covers a first semiconductor. The board mold includes a first face and a second face opposite to the first face. An active surface of the first semiconductor faces the second face. A first opening is formed in the board mold from the second surface. The first opening is disposed on the first semiconductor. A second opening penetrates the board mold from the first surface. A conductive metal layer fills the first and the second openings using an electroless plating method. A plurality of semiconductor devices is stacked on the first face of the board mold.
Samsung Electronics Co., Ltd.
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Tae-Hoon Ho-Geon Yun-Rae Seok-Won
Kim Song Cho Lee