Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
Method and apparatus for manufacturing semiconductor device
A method for manufacturing a semiconductor device, comprising: loading a wafer to be subjected to film formation to a chamber; supporting the wafer to be spaced from a film formation position of the wafer; preliminarily heating the wafer while rotating a rotating member for rotating the wafer through a supporting member during the film formation at a predetermined rotational speed under a state of the wafer to be spaced from the film formation position; placing the wafer on the supporting member in the film formation position; and heating the wafer at a predetermined temperature and supplying a process gas onto the wafer while rotating the wafer.
NuFlare Technology, Inc.
H
H01L
inventional
Hideki Naohisa
Ito Ikeya