Hauptman Ham, LLP
Strain reduced structure for IC packaging
A semiconductor device includes a semiconductor die having first and second conductive pads, and a substrate having third and fourth bonding pads. A width ratio of the first conductive pad over the third bonding pad at an inner region is different from a width ratio of the second conductive pad over the fourth bonding pad at an outer region.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Yu-Feng Tsung-Ding Ying-Ju Tsung-Yuan Hsien-Wei
Chen Wang Chen Yu Chen