Slater and Matsil, L.L.P.
Method for forming seed layer structure
A seed layer comprises a bottom seed layer portion formed on the bottom of a via opening, a sidewall seed layer portion formed on an upper portion of the sidewall of the via opening and a corner seed layer portion formed between the bottom seed layer portion and the sidewall seed layer portion. The sidewall seed layer portion is of a first thickness. The corner seed layer portion is of a second thickness and the second thickness is greater than the first thickness.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H H
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Yao Hsiang Chen-Bin Chi-Yu Hung-Chih Kuei-Pin
Liang Chiang Chou Wang Lee