Package for an implantable device
The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.
Second Sight Medical Products, Inc.
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Da-Yu Jordan Matthew Jerry Neil Hamilton Robert J Kevin
Chang Neysmith Ok Talbot Greenberg Wilkin