Heat dissipating apparatus for chips
A heat dissipating apparatus includes a heat sink, a blower, and a fan. The blower and the fan can be mounted together via a connection element. The heat sink defines an accommodating space. The blower and the fan can be positioned to the heat sink via the connection element, with the blower being accommodated in the accommodating space. The heat dissipating apparatus can achieve an optimal heat dissipating effect.
Hon Hai Precision Industry Co., Ltd. Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
H H
H01L H01L
inventional additional
Chia-Shin Xiao-Zhu Zhen-Xing
Chou Chen Ye