Park, Vaughan, Fleming & Dowler LLP
Chip package with reinforced positive alignment features
A chip package includes a substrate having a positive feature, which is defined on a surface of the substrate and which protrudes above a region on the surface proximate to the positive feature. Furthermore, the chip package includes a mechanical reinforcement mechanism defined on the substrate proximate to the positive feature that increases a lateral shear strength of the positive feature relative to the substrate. In this way, the chip package may facilitate increased reliability of a multi-chip module (MCM) that includes the chip package.
Oracle International Corporation
H H H H H H H H H H H H H H Y H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L Y10T H01L H01L H01L H01L H01L H01L
additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional
Ashok V. John E. Craig A. James G.
Krishnamoorthy Cunningham Stephen Mitchell