Muncy, Geissler, Olds & Lowe, P.C.
Thermal paths for glass substrates
Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.
QUALCOMM Incorporated
H H H H H H H H H H H
H01G H01L H01L H01L H01L H01F H01L H01L H01G H01F H01L
inventional additional additional inventional inventional inventional inventional inventional inventional inventional additional
Bin Xiaoju Kai Xia
Yang Yu Liu Li