Staas & Halsey LLP
Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate
A multichip module is provided. The multichip module comprises a rigid substrate including a core material and having an opening, a thin film fixed on an upper surface of the rigid substrate so as to be electrically connected to the rigid substrate and to close the opening, a first chip mounted on the upper surface of the thin film, and a second chip mounted on the under surface of the thin film so as to be located in the opening of the rigid substrate. The rigid substrate and the thin film form a wiring substrate having a composite structure.
Fujitsu Limited
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Hiroshi Haruhiko Kiyotaka
Yamada Yamamoto Seyama