McAndrews, Held & Malloy, Ltd.
Electronic device package and fabricating method thereof
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
AMKOR TECHNOLOGY, INC.
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Se Woong Ju Hoon Seung Jae Sung Kyu Jin Young Yoon Joo No Sun
Cha Yoon Lee Kim Kim Kim Park