Paul & Paul
Method for producing metallized substrate materials
For manufacturing substrate materials which are needed for the manufacture of electrical circuit carriers, methods are known in which metal layers are applied to a dielectric substrate by means of a glow discharge process and thereafter additional metal layers are applied by means of electroplating processes. These methods however are not suitable for the manufacture of substrate materials which are suitable for high frequency applications in the gigahertz range. The invention starts from the previously-mentioned methods and solves the described problem through the use of fluoropolymers and through coating of these materials by means of a glow discharge process with nickel, since by this means even very smooth surfaces of the substrate can be securely coated. The metallised materials can be coated with additional metal layers from electroless or electrolytic deposition baths.
Atotech Deutschland GmbH
C H H C H
C23C H05K H05K C23C H05K
inventional inventional inventional inventional additional
Heinrich Eckart Ralf Roland
Meyer Klusmann Schulz Heinz