Foley & Lardner LLP
Semiconductor device package with a conductive post
A semiconductor package includes: (1) a substrate; (2) a first isolation layer disposed on the substrate, the first isolation layer including an opening; (3) a pad disposed on the substrate and exposed from the opening; (4) an interconnection layer disposed on the pad; and (5) a conductive post including a bottom surface, the bottom surface having a first part disposed on the interconnection layer and a plurality of second parts disposed on the first isolation layer.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Kuang-Hsiung Yu-Ying Yu-Tzu Tien-Szu Sheng-Ming
Chen Lee Peng Chen Wang