ScienBiziP, P.C.
Low dielectric resin composition, film and circuit board using the same
A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.
Zhen Ding Technology Co., Ltd.
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Mao-Feng Shou-Jui Ming-Jaan Szu-Hsiang
Hsu Hsiang Ho Su