Fish & Richardson P.C.
Flexible skin incorporating mems technology
 A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 .mu.m thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 .mu.m) by Si wet etching and then patterned from the back side by reactive ion etching (RIE). 
California Institute of Technology
H B B H
H01L B81C B81B H01L
inventional inventional inventional additional
Yu-Chong Fukang Chihming
Tai Jiang Ho