Predictive modeling of interconnect modules for advanced on-chip interconnect technology
A computer program product estimates performance of an interconnect structure of a semiconductor integrated circuit (IC). The program product includes code executing on a computer to calculate at least one electrical characteristic of the interconnect structure based on input data accounting for multiple layers of the interconnect structure. The electrical characteristics can be capacitance, resistance, and/or inductance. The capacitance may be based upon multiple components, including a fringe capacitance component, a terminal capacitance component, and a coupling capacitance component.
QUALCOMM Incorporated
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G06F
inventional
Seung H. Wei Matthew Xia Yu Shiqun
Kang Zhao Nowak Li Cao Gu