Sughrue Mion, PLLC
Resin sealing apparatus and resin sealing method
An apparatus for sealing a resin uses a liquid resin. A substrate has a frame for surrounding the substrate and is provided with a plurality of semiconductor devices. The substrate has a first opening portion. A squeegee guide plate is placed on the frame and has a second opening portion. The second opening portion is larger than first opening portion in size. A first squeegee moves along the squeegee guide plate in a first direction and rakes the liquid resin. The liquid resin is protuberated in order to bury the semiconductor devices. A second squeegee moves along the squeegee guide plate in a second direction opposite to the first direction and further rakes the liquid resin so as to smooth a surface of the liquid resin. A turning mechanism serves to turn the second squeegee in a circular arc form during the movement of the second squeegee.
NEC Compound Semiconductor Devices, Ltd.
H H B H B B
H01L H01L B29C H01L B29L B29C
additional inventional inventional additional additional inventional
Hideki Kiyomitsu
Mizuno Ishimura