Rabin & Berdo, P.C.
Mounting method of passive component
The present invention relates to a mounting method of passive component, and particularly relates to a mounting method of a small-size passive component. A passive component partially covered by an adhesive material is provided. Before the adhesive layer is melted, the adhesive material is melted and then solidified to form a fixing structure between the passive component and a substrate for fixing the passive component on the substrate. Therefore, the tombstone problem caused by uneven pulling force that the melted solder applies to the two ends of the passive component is effectively solved. The yield rate is increased, and the product loss is reduced.
Advaced Semiconductor Engineering, Inc.
H H Y H Y H H Y H Y
H05K H05K Y10T H05K Y02P H05K H05K Y10T H05K Y10T
inventional additional additional additional additional additional inventional additional additional additional
Wei-Chih Wen-Shin
Wang Lin