Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Semiconductor structure and method of fabricating the same
The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads, forming a metal layer on the conductive pads, forming a passivation layer on a portion of the metal layer, and forming conductive pillars on the metal layer. Since the metal layer is protected by the passivation layer, the undercut problem is solved, the supporting strength of the conductive pillars is increased, and the product reliability is improved.
Siliconware Precision Industries Co., Ltd.
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Cheng-An Yi-Cheih Sung-Huan Chien-Hung Fu-Tang
Chang Chen Sun Wu Huang