Kenyon & Kenyon LLP
Power module, method for manufacturing power module, and molding die
A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.
TOYOTA JIDOSHA KABUSHIKI KAISHA DENSO CORPORATION
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Takanori Takuya Yoshikazu Tatsuya Tomomi
Kawashima Kadoguchi Suzuki Miyoshi Okumura