Maschoff Brennan
Inspection method and apparatus
A method includes generating a primary radiation beam from a radiation source; splitting the primary beam into a first radiation beam and a second radiation beam; directing the first radiation beam onto a front side of a wafer; directing the second radiation beam onto a back side of a wafer; generating an image of the front side of the wafer by receiving a reflection of the first radiation beam reflected from the wafer; and generating an image of the back side of the wafer by receiving a reflection of the second radiation beam reflected from the wafer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
G G G G G
G06T G01N G01N G06T G01N
inventional inventional inventional additional inventional
Yu-Liang Chung-Pin
Tseng Chou