Fletcher, Yoder & Van Someren
Molded ball grid array
A method and apparatus for encapsulating a BGA package. Specifically, the molded packaging material is configured to provide cups on the backside of the package, opposite the semiconductor device. The cups expose pads on the substrate and are configured to receive solder balls.
Micron Technology, Inc.
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inventional additional additional additional inventional additional additional additional additional
Todd O. William R. Bret K.
Bolken Stephenson Street