Sughrue Mion, PLLC
Semiconductor package
A semiconductor package includes a connection structure including a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a first connection via penetrating through the first insulating layer and connected to the first redistribution layer, a semiconductor chip disposed on the connection structure, an encapsulant covering at least a portion of the semiconductor chip, a second insulating layer disposed on the encapsulant, a second redistribution layer including a signal line disposed on the encapsulant, and a heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line.
SAMSUNG ELECTRONICS CO., LTD.
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Jihyun Jungsoo Doohwan Kyoungmoo Junggon
Lee Park Lee Harr Choi