Rothwell, Figg, Ernst & Manbeck, P.C.
Composition for forming adhesive layer of dicing film, and dicing film
There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.
LG CHEM, LTD.
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Se Ra Jung Ho Jung Hak Kwang Joo Seung Hee Hee Jung Young Kook
Kim Jo Kim Lee Nam Kim Kim