Thomas, Kayden, Horstemeyer & Risley
System and method of coinsurance wafer management
A system and method of coinsurance wafer management. The system includes at least one production line and an order management unit. The production line processes a MPW shuttle including original wafers and coinsurance wafers with a common fabrication process before metal layering, processes the original wafers with different metal layering fabrication processes according to a metal layering technology of each device design of the MPW shuttle, and withholds the coinsurance wafers without further fabrication. The order management unit receives a request for a designated device design before a cutoff date, and the production line releases and processes coinsurance wafers with the metal layering fabrication process corresponding to the designated device design when the request is received.
Taiwan Semiconductor Manufacturing Co., Ltd.
G
G06Q
inventional
Chin-Yung Jen-Lin
Chang Chao