McDermott Will & Emery LLP
Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same
A method of grinding a substrate is provided. A substrate including a first main surface having a semiconductor layer formed thereon and a second main surface opposed to the first main surface is prepared. A support film is attached to the first main surface using a glue. The second main surface of the substrate is ground so as to reduce a thickness of the substrate. The support film is removed from the first main surface by applying force to the support film in a non-traverse direction.
SAMSUNG ELECTRONICS CO., LTD.
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inventional additional additional additional inventional additional
Seong Deok Jae Yoon Jin Gi Seung Jae Ha Yeong
Hwang Kim Hong Lee Son