Rosenberg, Klein & Lee
Testing module for testing the strength of the welding area on a PCB
 A testing module for testing the strength of the welding area on a PCB is disclosed. The testing module has a plurality of first plates each provided with a plurality of pressing plates adjustably mounted thereon and a plurality of second plates each provided with a plurality of supporting plates securely mounted thereon. Each of the pressing plates are located at the center of two adjacent supporting plates, such that a plurality of PCBs are able to be tested for the strength of the welding area at a time. 
Advanced Semiconductor Engineering, Inc.
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Ming-Shuoh Hung-Nan Sung-Ching Simon
Liang Chen Hung Lee