Lowe Hauptman & Ham, LLP
Bump-on-trace (BOT) structures
A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The BOT structure further includes a second work piece with an elongated metal bump, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis. The BOT structure further includes a metal bump, wherein the metal bump electrically connects the metal trace and the elongated metal bump. A package having a BOT structure and a method of forming the BOT structure are also described.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Han-Ping Yuh Chern Yu-Feng Tin-Hao
Pu Shieh Chen Kuo