Maschoff Brennan
Package-on-package device with supplemental underfill and method for manufacturing the same
A method of forming a semiconductor device includes the following operations: (i) receiving a precursor package including a precursor substrate and a plurality of semiconductor packages on the precursor substrate, in which a gap is presented between the precursor substrate and each of the semiconductor packages; (ii) forming underfill material filling the gaps; (iii) cutting the precursor substrate along a region between adjacent ones of the semiconductor packages to form a plurality of discrete package-on-package devices; and (iv) applying supplemental underfill material to one of the package-on-package devices.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Jie Hsien-Wei Ying-Ju
Chen Chen Chen