Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
Lead frame for semiconductor package and lead frame plating method
 A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate. 
Samsung Aerospace Industries, Ltd.
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Kyu-han Dong-il Se-chul Bae-soon Ju-bong Sung-il
Lee Shin Park Jang Kim Kang