J.C. Patents
Semiconductor package structure and package process
A semiconductor package structure and a package process are provided, wherein a lower surface of a die pad of a leadframe is exposed by an encapsulant so as to improve the heat dissipation efficiency of the semiconductor package structure. In addition, two chips are disposed at the same sides of the leadframe and the end portion of each of leads bonding to the upper chip is encapsulated by the encapsulant such that the scratch on the lead tips in wire bonding and die attach steps can be prevented and thus the wire bondability can be enhanced.
Advanced Semiconductor Engineering, Inc.
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additional additional inventional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional
Seokbong Yuyong Ingyu
Kim Lee Han