Koda and Androlia
Single point bonding method
 A single point bonding method used in individually bonding, for example, the leads of a pad of a chip to a pad of a circuit board, including the steps of forming a pressure scar at the free end of each lead by a bonding tool, catching the irregular portions of the thus made pressure scar by the end of the bonding tool so as to move the free end of the lead towards its fixed end and then bonding the lead to a corresponding pad. 
Kabushiki Kaisha Shinkawa
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Yasushi Kazumasa
Suzuki Kimura