J.C. Patents
Structure of semiconductor device and method for bonding two substrates
A structure of semiconductor device is provided. The structure includes a first bonding pattern, formed on a first substrate. A first grating pattern is disposed on the first substrate, having a plurality of first bars extending along a first direction. A second bonding pattern is formed on a second substrate. A second grating pattern, disposed on the second substrate, having a plurality of second bars extending along the first direction. The first bonding pattern is bonded to the second bonding pattern. One of the first grating pattern and the second grating pattern is stacked over and overlapping at the first direction with another one of the first grating pattern and the second grating pattern. A first gap between adjacent two of the first bars is different from a second gap between adjacent two of the second bars.
UNITED MICROELECTRONICS CORP.
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Chien-Ming Chung-Hsing Chun-Ting Ming-Tse Hui-Ling
Lai Kuo Yeh Lin Chen