Kilpatrick Townsend & Stockton LLP
Methods of manufacturing a semiconductor device having a node array
Methods of manufacturing a semiconductor device are provided. The method includes forming a preliminary mask pattern on an etch target layer. The preliminary mask pattern includes wave line type patterns, and each of the wave line type patterns includes main pattern portions and connection bar pattern portions. Node separation walls are formed on sidewalls of the preliminary mask patterns. The etch target layer is etched using the node separation walls as etch masks to form through holes penetrating the etch target layer. Nodes are formed in respective ones of the through holes.
SK hynix Inc.
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Yong Soon
Jung