Perkins Coie LLP
Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface. The method further includes molding the encapsulant such that at least a portion of the interconnect extends through the encapsulant and into the spacer material. The interconnect can include a contact surface that is substantially co-planar with the active surface of the semiconductor device for providing an electrical connection with the semiconductor device.
Micron Technology, Inc.
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additional additional inventional additional additional additional inventional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional inventional inventional inventional additional inventional inventional additional additional additional additional additional additional additional inventional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional inventional
Chan Todd O.
Yoo Bolken