CKC & Partners Co., Ltd.
Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device
A method for preparing a plurality of micro-devices for transfer includes temporarily bonding the micro-devices onto a carrier substrate; testing the micro-devices on the carrier substrate to determine if there is at least one first failed micro-device in the micro-devices; and removing the first failed micro-device from the carrier substrate.
MIKRO MESA TECHNOLOGY CO., LTD.
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Pei-Yu Hsin-Wei Chun-Yi Shih-Chyn Chih-Hui Li-Yi
Chang Lee Chang Lin Chan Chen