Drinker Biddle & Reath LLP
Manufacturing method of wiring substrate and manufacturing method of semiconductor device
A multilayer wiring structural body 13 is formed on a surface 57A of a metal plate 57 used as a support plate in the case of forming the multilayer wiring structural body 13, and the metal plate 57 is patterned and a slot antenna 60 is formed.
Shinko Electric Industries Co., Ltd.
H H H H H H Y H H H Y Y H H H H H H H H
H01Q H01L H01L H01L H01Q H01L Y10T H01L H01L H05K Y10T Y10T H01L H01L H05K H01Q H05K H05K H05K H01L
inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional
Tomoharu
Fujii