Cantor Colburn LLP
Wafer-level package structure of light emitting diode and manufacturing method thereof
A wafer-level package structure of a light emitting diode and a manufacturing method thereof are provided in the present invention. The wafer-level package structure of a light emitting diode includes a die, a first insulating layer, at least two wires, bumps, an annular second insulating layer on the wires and the insulating layer, the annular second insulating layer surrounding an area between the bumps and there being spaces arranged between the second insulating layer and the bumps; a light reflecting cup on the second insulating layer; at least two discrete lead areas and leads in the lead areas. The technical solution of the invention reduces the area required for the substrate; and the electrodes can be extracted in the subsequent structure of the package without gold wiring to thereby further reduce the volume of the package.
China Wafer Level CSP Ltd.
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inventional inventional inventional additional additional inventional
Guoqing Wei Wenbin Qiuhong Junjie
Yu Wang Wang Zou Li