McDermott Will & Emery LLP
Method of nickel-gold plating and printed circuit board
Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.
Samsung LED Co., Ltd. Samsung Electro-Mechanics Co., Ltd.
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Eun-Ju Yeo-Joo Seoung-Jae Jong-Yun Bae-Kyun Jin-Hak
Yang Yoon Lee Kim Kim Choi