Sughrue Mion, PLLC
Semiconductor device and semiconductor package comprising the same
A semiconductor device is provided. The semiconductor device includes: a substrate which includes a semiconductor chip region and a scribe line region surrounding the semiconductor chip region; an insulating film arranged over the semiconductor chip region and the scribe line region on the substrate, and including a first surface, a second surface opposite to the first surface, a third surface connecting the first surface and the second surface, and a fourth surface opposite to the third surface and connecting the first surface and the second surface; and an opening portion formed on the second surface of the insulating film and the fourth surface of the insulating film to expose the substrate, wherein the opening portion is formed in the scribe line region, and the first surface of the insulating film and the third surface of the insulating film do not include an opening portion which expose the substrate.
SAMSUNG ELECTRONICS CO., LTD.
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Jun Ho Hyun Su Yun Hee Jung Ho Byung Moon Yoon Sung
Yoon Sim Kim Choi Bae Kim