Low profile package for an implantable device
The present invention is a low profile hermetic package for an implantable medical device. The package includes a non-conductive substrate including a plurality of straight conductive vias through the non-conductive substrate. A conductive cover hermetically enclosing an electronics circuit is bonded to the non-conductive substrate. The device is low profile. The width of the non-conductive substrate is grater than the height of the cover.
Second Sight Medical Products, Inc.
A A Y A H
A61N A61N Y10T A61N H01L
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Joseph H. Robert J.
Schulman Greenberg