J.C. Patents
Connector and manufacturing method thereof
A method of manufacturing a connector is provided. Firstly, a substrate having a first surface, a second surface opposite to the first surface and a through hole is provided. Next, a first conductive layer covering the inside wall of the through hole is formed on the substrate. Then, a filler is filled in the through hole to form a filler post. Next, a conductive elastic cantilever is formed over the first surface and electrically connected to the first conductive layer. Then, a gold layer is formed on the conductive elastic cantilever and over the first surface. A solder ball electrically connected to the first conductive layer is formed over the second surface.
Unimicron Technology Corp.
H H Y H
H05K H05K Y10T H05K
inventional additional additional additional
Wen-Fang Chang-Ming Ling-Kai Shih-Jung
Liu Lee Su Huang