Scully, Scott, Murphy & Presser, P.C.
Ultra-thin metal wires formed through selective deposition
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating a pair of ultra-thin metal wires in an opening using a selective deposition process.
GLOBALFOUNDRIES INC.
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Chih-Chao Juntao Yunpeng
Yang Li Yin