Morgan, Lewis & Bockius LLP
System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.
Nanoconduction, Inc.
H H H Y H Y Y H H B H H H H H
H01L H01L H01L Y10S H01L Y10S Y10S H01L H01L B82Y H01L H01L H01L H01L H01L
inventional inventional additional additional additional additional additional additional additional inventional additional inventional additional additional additional
Meyya Carlos Jun
Meyyappan Dangelo Li