Stanzione & Kim, LLP
IC package and method of manufacturing the same
An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
Samsung Electronics Co., Ltd.
H H Y H H H H H H H H H H H H H H H
H05K H01L Y02P H01L H05K H05K H01L H01L H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L
additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional
Young Jun Sung Wook Tae Sang Hyun Joo Se Yeong Jung Hyeon
Moon Kang Park Han Jang Kim