Sughrue Mion, PLLC
Method for manufacturing semiconductor chip
A method for manufacturing a semiconductor chip includes forming a front-side groove in a front surface of a substrate; forming a back-side groove wider than the front-side groove by a rotating cutting member from the back surface of the substrate toward the front-side groove; attaching a holding member having an adhesive layer to the back surface of the substrate after forming the back-side groove; dry-washing the back surface before attaching the holding member to the back surface; extending the distance between adjacent semiconductor chips by expanding the holding member attached to the back surface; and separating the semiconductor chips at the extended distance therebetween from the holding member.
FUJI XEROX CO., LTD.
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Hirokazu Takahiro Takeshi Michiaki Kenji
Matsuzaki Hashimoto Minamiru Murata Yamazaki