Work piece including a sacrificial cover layer for laser drilling substrates
A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
Corning Incorporated
B H B B B B B C C B Y C
B23K H05K B23K B23K B23K B23K B23K C23F C03B B23K Y10T C03B
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Paul John Aric Bruce Xinghua Jeffrey John Garrett Andrew John Tyler John Christopher
Shustack Shorey Li Domey Piech Keech Thomas