Jiang Chyun IP Office
Bump fabrication process
The present invention provides a bump fabrication process. A wafer is provided with a patterned photoresist layer formed on the wafer. The patterned photoresist layer has a plurality of openings, corresponding to bonding pads. A conductive layer is formed on the photoresist layer and the exposed bonding pads. Afterwards, a sticker film is the provided to lift off the conductive layer on the photoresist layer, while the conductive layer within the openings is not removed. A solder paste is filled into the openings. A reflow step is performed to turn the filled solder paste into globular bumps. At last, the protoresist layer is removed.
Advanced Semiconductor Engineering, Inc.
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Jau-Shoung Yu-Chen Jen-Kuang Ho-Ming Chun-Chi Yung-Chi Min-Lung Ching-Huei Chao-Fu
Chen Chou Fang Tong Lee Lee Huang Su Weng