Onello & Mello, LLP
Wafer structures and wafer bonding methods
Wafer structures and wafer bonding methods are provided. In some embodiments, a wafer bonding method includes providing a conductive wafer and a plurality of insulating wafers, the conductive wafer being larger than the insulating wafers; performing a pre-treatment operation on the conductive wafer, the insulating wafers, or both; and directly bonding the insulating wafers to the conductive wafer.
Samsung Electronics Co., Ltd.
B B Y Y B H B B B
B32B B32B Y10T Y10T B32B H01L B32B B32B B32B
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Kyoung-Kook Yu-Sik Sang-Joon
Kim Kim Park