Sughrue Mion, PLLC
Semicondutor device package placed within fitting portion of wiring member and attached to heat sink
The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.
Mitsubishi Electric Corporation
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Kazuyasu Masahiko Masaki
Sakamoto Fujita Kato