Chip Law Group
Semiconductor chip mounted on a packaging substrate
A semiconductor chip includes a chip body and a plurality of solder-including electrodes provided on an element-formation surface of the chip body. A packaging substrate includes a substrate body, and a plurality of wirings and a solder resist layer that are provided on a front surface of the substrate body. The plurality of solder-including electrodes include a plurality of first electrodes and a plurality of second electrodes. The plurality of first electrodes supply a first electric potential, and the plurality of second electrodes supply a second electric potential different from the first electric potential. The plurality of first electrodes and the plurality of second electrodes are disposed alternately in both a row direction and a column direction, in a central part of the chip body. The plurality of wirings include a plurality of first wirings and a plurality of second wirings. The plurality of first wirings connect the plurality of first electrodes, and the plurality of second wirings connect the plurality of second electrodes.
SONY CORPORATION
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additional additional inventional additional additional inventional additional additional inventional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional inventional additional additional additional additional additional inventional inventional additional inventional additional additional additional additional additional additional
Kazuki Hiroyuki Makoto Yuji
Sato Yamada Murai Takaoka