Heat dissipating device for electronic device
A heat dissipating device includes a heat sink (50) for removing heat from an electronic device (90), and a plurality of adjusters (45) for adjusting distance and contact force between the electronic device and the heat sink. The heat sink defines a plurality of receiving holes (62) for receiving respective adjusters, and a plurality of communicating through holes (66) whose diameters are smaller than those of the receiving holes. A shoulder (64) of the heat sink is formed where each receiving hole communicates with each through hole. Each adjuster comprises a connecting shaft (42), a lock screw (46) with a head (464), and a spring (44). The lock screw threadedly engages with the connecting shaft, and the spring is secured between the shoulder of the heat sink and the head.
Hon Hai Precision Ind. Co., Ltd.
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Masataka Chi-Tsung Yung-Chou
Mochzuki Peng Chen