Foley & Lardner LLP
Substrate, semiconductor package thereof and process of making same
A substrate, a semiconductor package thereof and a process of making the same are provided. The substrate comprises an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Sheng-Ming Tien-Szu Yu-Ying Kuang-Hsiung
Wang Chen Lee Chen