Morgan, Lewis & Bockius LLP
Semiconductor package
A semiconductor package includes a first connection structure having a first surface and a second surface and including one or more first redistribution layers, a first semiconductor chip disposed on the first surface, a second semiconductor chip disposed on the second surface, a third semiconductor chip disposed on the second surface, and at least one first passive component disposed between the second and third semiconductor chips on the second surface. The first connection structure may include a first region including a region overlapping the first passive component, and a second region including regions respectively overlapping at least portions of the second and third semiconductor chips, when viewed from above. The first region may be disposed between second regions. The first redistribution may include at least one of a power pattern and a ground pattern in the first region and include a signal pattern in the second region.
SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Yun Tae Hyung Joon Han
Lee Kim Kim