Luedeka, Neely & Graham
CMP slurry recycling apparatus and method for recycling CMP slurry
A polishing table 11 in the CMP apparatus 10 has a diameter smaller than the diameter of a polishing pad 12. The polishing pad 12 is disposed on the polishing table so as to cover the entire top surface of the polishing table 11. A space 13 is formed between outside of the outer peripheral surface of the polishing table 11 and under the outer peripheral bottom surface portion of the polishing pad 12 projecting outside from the edge of the polishing table 11. A trough 14 with an opening 14a on top thereof as a device for withdrawing the used slurry is disposed around the outer peripheral surface of the polishing table 11 so as to be located a part thereof in the space 13. 
LSI Logic Corporation
B B B
B24B B24D B24B
inventional inventional inventional
Hiroshi Toru Masaaki Takuya
Mizuno Kikuchi Ogitsu Nagamine