WPAT, P.C., Intellectual Property Attorneys
Method of manufacturing semiconductor device array
Present disclosure provides a method for manufacturing a semiconductor device array, including (1) providing a temporary substrate; (2) forming a plurality of discrete semiconductor structures over the temporary substrate; and (3) removing a surface portion of the temporary substrate to expose a peripheral bottom surface of the discrete semiconductor structure. Present disclosure also provides a method for transferring discrete semiconductor device, including (1) detaching discrete semiconductor structures of a first type from a first temporary substrate supporting the discrete semiconductor structures of the first type by a transfer stamp; (2) carrying the discrete semiconductor structures over a target substrate by the transfer stamp; and (3) dismounting the discrete semiconductor structures of the first type from the transfer stamp to predetermined sites on the target substrate. The transfer stamp includes a plurality of protrusions, positions of the plurality of protrusions being programmable to match the predetermined sites on the target substrate.
GLOBALWAFERS CO., LTD.
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Chun-Yen
Chang