Thomas, Kayden, Horstemeyer & Risley
Semiconductor package and process for making the same
A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.
Advanced Semiconductor Engineering Inc.
H H H H H H H H H H H H H H H H G H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L G01L H01L
additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional inventional additional
Sang-Bae Dae-Hoon Seok-Won
Park Jung Lee