Oblon, McClelland, Maier & Neustadt, L.L.P.
Connection member, semiconductor device, and stacked structure
A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.
Kabushiki Kaisha Toshiba
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additional inventional additional additional inventional additional inventional inventional additional inventional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional inventional additional inventional inventional inventional inventional inventional additional inventional inventional additional additional additional additional inventional additional additional additional inventional inventional additional inventional inventional additional additional additional inventional
Nobuto Hiroshi Tadahiro Yutaka Atsuko
Managaki Yamada Sasaki Onozuka Iida