Oliff & Berridge, PLC
Laminated semiconductor wafer, laminated chip package and method of manufacturing the same
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region.
Headway Technologies, Inc. SAE Magentics (H.K.) Ltd.
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Atsushi Yoshitaka Hiroyuki
Iijima Sasaki Ito