Ostrolenk, Faber, Gerb & Soffen, LLP
Method of fabricating a wire bond with multiple stitch bonds
The invention provides a wire bond bonding a wire to a connection pad of an electronic device, and a method of forming the wire bond. A first stitch bond is formed on the connection pad, and a second stitch bond is next formed on the connection pad that is contiguous with the first stitch bond.
ASM Technology Singapore Pte Ltd.
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Yam Mo Zuo Cheng Wei Chee Wai
Wong Shen Liu Siew