Jiang Chyun IP Office
Solder ball attaching process
A solder ball attaching process for attaching solder balls to a wafer is provided. First, an under-ball-metallurgy layer is formed on the active surface of the wafer. Patterned masking layers are sequentially formed over the active surface of the wafer. The masking layers together form a step opening structure that exposes the under-ball-metallic layer. A solder ball is placed on the uppermost masking layer and allowed to roll so that the solder ball drops into the step opening structure by gravity. A reflow process is conducted to join the solder ball and the under-ball-metallurgy layer together. Finally, various masking layers are removed to expose the solder ball on the bonding pad of the wafer.
Advanced Semiconductor Engineering, Inc.
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Ho-Ming Yung-Chi Chao-Fu Tsung-Hua Yu-Chen Su Ching-Huei Jau-Shoung Chun-Chi Jen-Kuang Min-Lung
Tong Lee Weng Wu Chou Tao Su Chen Lee Fang Huang