Microfluidic sensor package structure and method
In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.
Amkor Technology, Inc.
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Yung Woo Jae Ung Do Hyun Hyung II Chan Ha Byong Jin Ji Young
Lee Lee Na Jeon Hwang Kim Chung