JCIPRNET
Integrated fan-out package and method of fabricating the same
An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.
Taiwan Semiconductor Manufacturing Co., Ltd.
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additional inventional additional additional additional additional inventional additional additional additional inventional additional inventional additional inventional additional inventional additional additional additional inventional additional additional inventional additional additional additional inventional additional inventional inventional additional inventional inventional additional additional inventional additional additional additional inventional additional additional additional additional additional
Hsin-Chieh Ching-Fu Ming-Yen
Huang Chang Chiu