Rosenberg, Klein & Lee
Three-dimensional microprobe array
The present invention discloses a three-dimensional microprobe array assembly structure, wherein spacers are used in assembling edge-type microprobe arrays to form a three-dimensional structure, and the spacers reveal conductive pads of the edge-type microprobe arrays to benefit wire bonding. The present invention detects depths and angles and thus increases detection reliability. Besides, in the present invention, the related IC is integrated with the spacer to achieve circuit integration and reduce cost.
National Chiao Tung University
G G
G01R G01R
additional inventional
Jin-Chern Chih-Wei
Chiou Chang