Air guiding device for electronic components
An air guiding device for dissipating heat generated by an electronic component in an enclosure includes a duct (30), a guide sleeve (20) slidably attached to the duct, interengaging means for attaching the guide sleeve to the duct and a filter (40) accommodated in the duct. The duct defines a recess (38) therein. The filter is deformably and removably received in the recess. The means includes a plurality of grooves (36) defined in one of the duct and the guide sleeve and a plurality of protrusions (28) formed on the other of the duct and the guide sleeve. The protrusions are engaged in selected grooves so that a length of the guide sleeve with respect to the duct can be adjusted.
Hong Fu Jin Precision Ind (Shenzhen) Co., Ltd. Hon Hai Precision Ind. Co., Ltd.
H H
H01L H01L
inventional additional
Yun Lung
Chen