Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die
The present disclosure provides an electronic packaging structure. A photonic die is disposed on an electronic package, and an optical guide die is not disposed on the electronic package. As the optical guide die malfunctions, only the optical guide die, rather than the whole electronic package and the photonic die, which may still function well, needs to be replaced. Therefore, the replacement cost is reduced, and the lifespan of the electronic packaging structure is increased. The present disclosure also provides a method for manufacturing the electronic packaging structure.
Siliconware Precision Industries Co., Ltd.
G H G H G
G02B H04B G01J H01L G01J
additional inventional inventional inventional inventional
Jin-Wei Cheng-Kai
You Chang