WPAT, P.C., Intellectual Property Attorneys
Method for manufacturing semiconductor device and manufacturing method of the same
The present disclosure provides a method for wafer bonding, including providing a wafer, forming a sacrificial layer on a top surface of the first wafer, trimming an edge of the first wafer to obtain a first wafer area, cleaning the top surface of the first wafer, removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer having a second wafer area greater than the first wafer area.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Hau-Yi Kuo-Hwa Chih-Hui Cheng-Hsien Yung-Lung
Hsiao Tzeng Huang Chou Lin