Duane Morris LLP
Image sensor fabrication method and structure
A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Fu-Tien Chin Chen Yu-Kung Chung-Sheng Jack Te-Fu Bii-Junq Yi-Ming Hung-Jen Chih-Kung
Weng Kuo Hsiao Hsiung Deng Tseng Chang Dai Hsu Chang