Stacked integrated circuit package system and method for manufacturing thereof
A method for manufacturing of a stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with a cavity therein and a base interposer exposed by the cavity; mounting an intermediate integrated circuit package over the base interposer; and mounting a top integrated circuit package over the intermediate integrated circuit package.
Stats Chippac Ltd.
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Jong-Woo Flynn SeongMin BumJoon
Ha Carson Lee Hong