Slater Matsil, LLP
Package on package devices and methods of packaging semiconductor dies
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a bump region and a tail region coupled to the bump region. The metal stud bumps are embedded in solder joints.
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung Ching Chen-Hua Chien-Hsun
Chen Yu Lee