Eschweiler & Potashnik, LLc
Rough anti-stiction layer for MEMS device
The present disclosure relates to a method for manufacturing a microelectromechanical systems (MEMS) package. The method comprises providing a CMOS IC including CMOS devices arranged within a CMOS substrate. The method further comprises forming and patterning a metal layer over the CMOS substrate to form an anti-stiction layer and a fixed electrode plate and forming a rough top surface for the anti-stiction layer. The method further comprises providing a MEMS IC comprising a moveable mass arranged within a recess of a MEMS substrate and bonding the CMOS IC to the MEMS IC to enclose a cavity between the moveable mass and the fixed electrode plate and the anti-stiction layer.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Jen-Hao Ren-Dou I-Shi Yu-Jui
Liu Lee Wang Chen