Miles & Stockbridge P.C.
Method of manufacturing a multi-chip module
Silicon chip having narrow pitches of Au bumps are mounted on a module substrate in such a way that while taking into consideration a difference in coefficient of thermal expansion between the silicon chip and the module substrate, a total pitch of electrode pads of the silicon chip is made narrower than a total pitch of the Au bumps, thereby preventing misregistration between the Au bumps and the electrode pads in the course of heat treatment to ensure reliable contact therebetween.
Renesas Technology Corp. Hitachi Hokkai Semiconductor, Ltd.
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Hiroshi Ikuo Tsukio Yoshiyuki
Kikuchi Yoshida Funaki Kado