WPAT; P.C., Intellectual Property Attorneys
Apparatus and methods for chemical mechanical polishing
An apparatus for CMP includes a wafer carrier retaining a semiconductor wafer during a polishing operation, a slurry dispenser dispensing an abrasive slurry, and a temperature control system monitoring and controlling a temperature variation during the polishing operation. The temperature control system includes a temperature sensor detecting a temperature during the polishing operation and providing a signal corresponding to the temperature, a temperature controller coupled to the temperature sensor and receiving the signal from the temperature sensor, and a cooling device coupled to the temperature controller and providing a coolant to the apparatus for CMP.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
H H B B H
H01L H01L B24B B24B H01L
inventional inventional inventional inventional additional
Yen-Di He Hui James Jeng-Jyi Chi-Ming Yung-Yao
Tsen Peng Hwang Yang Lee