Muir Patent Law, PLLC
Display module package
A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.
SAMSUNG ELECTRONICS CO., LTD.
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inventional inventional inventional inventional
Jungho Dahye Seokhyun
Park Kim Lee