Jiang Chyun IP Office
Lead-free bump fabrication process
A lead-free solder bump fabrication process for producing a plurality of lead-free solder bumps over a wafer is provided. The lead-free solder bump fabrication process includes forming a lead-free pre-formed solder bump over each bonding pad on the wafer and then forming a patterned solder mask layer over the active surface of the wafer. The openings in the solder mask layer expose the respective lead-free pre-formed solder bumps on the wafer. Thereafter, lead-free solder material is deposited into the opening. The material composition of the lead-free solder material differs from the material composition of the lead-free pre-formed solder bump. A reflow process is conducted so that the lead-free pre-formed solder bump fuses with the lead-free solder material to form a lead-free solder bump. Finally, the solder mask layer is removed.
Advanced Semiconductor Engineering, Inc.
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Ho-Ming Yu-Chen Jau-Shoung Su Ching-Huei Tsung-Hua Min-Lung Chun-Chi Jen-Kuang Yung-Chi Chao-Fu
Tong Chou Chen Tao Su Wu Huang Lee Fang Lee Weng