CMP polishing pad having edge exclusion region of offset concentric groove pattern
The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.
Cabot Microelectronics Corporation
B
B24B
inventional
Gregory Hui-Feng Jia-Cheng Ching-Ming Kun-Shu Shi-Wei Sheng-Huan
Gaudet Chen Hsu Tsai Yang Cheng Liu