Circuit device and manufacturing method thereof
A circuit device is provided. The circuit device comprises a transparent substrate, a first transparent blocking layer, a first patterned conductive layer, and a second conductive layer. The transparent substrate has a first surface. The first transparent blocking layer is disposed on the first surface. The first patterned conductive layer is disposed on the first transparent blocking layer, and the second conductive layer is disposed on a side of the transparent substrate opposite to the first surface.
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Lixian Jui-Hsing Tengyue
Chen Li Zeng