Jones Day
Overmolding encapsulation process and encapsulated article made therefrom
A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.
Micron Technology, Inc.
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H01L H01L H01L B29C H01L Y10T H01L H01L H01L B29C H01L H01L Y10T H01L H01L B29C H01L Y10T H01L
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Todd O. Mark S.
Bolken Johnson