Miles & Stockbridge P.C.
Method of manufacturing a semiconductor device
Silicon chip having narrow pitches of Au bumps are mounted on a module substrate in such a way that while taking into consideration a difference in coefficient of thermal expansion between the silicon chip and the module substrate, a total pitch of electrode pads of the silicon chip is made narrower than a total pitch of the Au bumps, thereby preventing misregistration between the Au bumps and the electrode pads in the course of heat treatment to ensure reliable contact therebetween.
Hitachi, Ltd. Hitachi Hokkai Semiconductor, Ltd.
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Hiroshi Ikuo Yoshiyuki Tsukio
Kikuchi Yoshida Kado Funaki