Foley & Lardner LLP
Semiconductor substrate, semiconductor package, and method for forming the same
The present disclosure provides a semiconductor substrate, including a first patterned conductive layer, a dielectric structure on the first patterned conductive layer, wherein the dielectric structure having a side surface, a second patterned conductive layer on the dielectric structure and extending on the side surface, and a third patterned conductive layer on the second patterned conductive layer and extending on the side surface. The present disclosure provides a semiconductor package including the semiconductor substrate. A method for manufacturing the semiconductor substrate and the semiconductor package is also provided.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Cheng-Lin Chih-Cheng
Ho Lee