Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Temporary adhesive composition, and method of producing thin wafer
A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.
Shin-Etsu Chemical Co., Ltd.
H H C H H H C C H H C C C C
H01L H01L C08L H01L H01L H01L C08G C09J H01L H01L C08G C08G C08G C09J
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Hideyuki Masahiro Hideto Shohei Masahiro
Ito Furuya Kato Tagami Yoshizawa