Westerman, Hattori, Daniels & Adrian, LLP
Semiconductor device manufacturing method
A semiconductor device manufacturing method includes forming an insulation film containing silicon, oxygen and carbon over a semiconductor substrate by chemical vapor deposition; making UV cure on the insulation film being heated at a temperature of 350° C. or below after the forming the insulation film; and making helium plasma processing on the insulation film after the UV cure.
Fujitsu Semiconductor Limited
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Yoshiyuki Toshiki
Ohkura Mori