Slater & Matsil, L.L.P.
Inductor for post passivation interconnect
An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jie Tsung-Yuan Ying-Ju Hsien-Wei Hung-Yi Hao-Yi
Chen Yu Chen Chen Kuo Tsai