McDermott Will & Emery LLP
Method for manufacturing a semiconductor device and a coating material
In a method of manufacturing a semiconductor device, an underlying structure is formed. A surface grafting layer is formed on the underlying structure. A photo resist layer is formed on the surface grafting layer. The surface grafting layer includes a coating material including a backbone polymer, a surface grafting unit coupled to the backbone polymer and an adhesion unit coupled to the backbone polymer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ching-Yu Yahru Chien-Chih Chin-Hsiang Yu-Ling Chang
Chang Cheng Chen Lin Chien