Harness, Dickey & Pierce, P.L.C.
Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules
An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.
SAMSUNG ELECTRONICS CO., LTD.
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Jun-Woo Jae Yong Yun Tae Su-Young Je Suk Joon Seo
Park Park Lee Lee Lee Yim