McDermott Will & Emery LLP
Method of selectively removing silicon nitride and etching apparatus thereof
A method of selectively removing silicon nitride is provided. The method includes: providing a wafer having silicon nitride on a surface of the wafer; supplying a mixture of phosphoric acid and a silicon-containing material into a process tank, in which the mixture has a predetermined silicon concentration; and submerging the wafer into the mixture within the process tank to remove the silicon nitride. An etching apparatus of selectively removing silicon nitride is also provided.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H
H01L
inventional
Yu-Ming Ying-Hsueh Chi-Ming
Lee Changchien Yang