McKenna Long & Aldridge, LLP.
Apparatus for cutting substrate and method thereof
An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.
LG Display Co., Ltd.
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B28D Y10T B28D C03B Y10T Y10T Y02P G02F Y10T Y10T C03B C03B B65G
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Jung Sik
Kim