Sughrue, Mion,Zinn, Macpeak & Seas, PLLC
Chip scale package type of semiconductor device
 A semiconductor device in which the space between a semiconductor chip and an auxiliary wiring plate is sealed with resin. The auxiliary wiring plate has insulating layers and on both sides of the routing conductor, the insulating layer on the side of the semiconductor chip has a hole being led from the routing conductor to the electrode of the semiconductor chip, the metal filled in the hole and the metal bump formed so as to protrude from the hole serves as an inner electrode. The semiconductor device can be manufactured by the TAB technique. 
Nitto Denko Corporation
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Kazumasa Megumu Satoshi Hideyuki Hisataka Nobuhiko
Igarashi Nagasawa Tanigawa Usui Ito Yoshio