Venable LLP
Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound and a component (d1) serving as a solvent on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound dropwise discretely onto the layer of the curable composition, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the layer, and releasing the mold from the mixture layer after the curing.
CANON KABUSHIKI KAISHA
G C C
G03F C09D C09D
inventional inventional inventional
Weijun Tomonori Toshiki Keiko Timothy Brian
Liu Otani Ito Chiba Stachowiak