Sughrue Mion, PLLC
Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball
Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.
SAMSUNG ELECTRONICS CO., LTD.
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additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional inventional inventional additional additional additional additional additional additional inventional additional inventional
Jaegwon Seokhyun Chul-Yong
Jang Lee Jang