Thomas, Kayden, Horstemeyer & Risley
Method for removing photoresist in metallization process
 A method for removing photoresist in a metallization process according to the invention is able to completely remove a photoresist residue remaining on the surface of a metal layer and avoids corrosion of the metal layer. In the method, a heat treatment is performed after patterning the metal layer and before removing the photoresist layer, thereby removing materials which corrode the metal layer. Therefore, corrosion to the metal layer is prevented. Next, the photoresist layer is removed by a wet strip process instead of an oxygen plasma process. As a result, the photoresist residue remaining on the surface of the metal layer cannot be oxidized into an insoluble oxide and can be completely removed. 
United Integrated Circuits Corp.
G
G03F
inventional
Hui-Ming
Chen