Slater Matsil, LLP
Package structures and method of forming the same
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional
Chih-Hua Chen-Hua Yu-Feng Hao-Yi
Chen Yu Chen Tsai