Method of forming a semiconductor package and structure thereof
An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer (34, 46) over an encapsulant (32). The conductive layer includes a combination of a conductive glue (38, 48, 52) and a metal paint (36, 50). A wire loop (30) is coupled to the conductive layer and a leadframe (10).
Freescale Semiconductor, Inc.
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Jian-yong Zhi-jie
Liu Wang