Method for fabricating MEMS device integrated with a semiconductor integrated circuit
A method for fabricating a semiconductor device is disclosed. A semiconductor substrate comprising a MOS transistor is provided. A MEMS device is formed over the MOS transistor. The MEMS device includes a bottom electrode in a second topmost metal layer, a diaphragm in a pad metal layer, and a cavity between the bottom electrode and the diaphragm.
UNITED MICROELECTRONICS CORP.
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inventional inventional additional additional additional additional additional additional additional additional inventional inventional additional inventional additional additional additional additional inventional
Chien-Chung Chih-Cheng Yu-Chih Min-Hung Chin-Tsai Tsong-Lin Sheng-Wei
Su Wang Chuang Wang Chang Shen Hung