WPAT, P.C., Intellectual Property Attorneys
Semiconductor apparatus and method for baking coating layer
The present disclosure provides an apparatus for fabricating a semiconductor structure, including an air flow redistribution member configured to receive an air flow at a first end and eject the air flow at a second end. The air flow redistribution member includes a first air flow redistribution plate and a second air flow redistribution plate between the first air flow redistribution plate and the second end.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Yung-Yao Chen Yi
Lee Hsu