Leydig, Voit & Mayer, Ltd.
Mold for resin-sealing of semiconductor devices
A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.
Mitsubishi Denki Kabushiki Kaisha
H H B H
H01L H01L B29C H01L
inventional additional inventional additional
Kiyoharu Hiromichi Yoshiyuki Toru Tetsuya Hideji
Kato Yamada Mishima Ueno Hirose Aoki