Foley & Lardner LLP
Semiconductor device with a conductive post
A semiconductor package comprises a substrate, a pad, a first isolation layer, an interconnection layer, and a conductive post. The substrate has a first surface and a second surface opposite the first surface. The pad has a first portion and a second portion on the first surface of the substrate. The first isolation layer is disposed on the first surface and covers the first portion of the pad, and the first isolation layer has a top surface. The interconnection layer is disposed on the second portion of the pad and has a top surface. The conductive post is disposed on the top surface of the first isolation layer and on the top surface of the interconnection layer. The top surface of the first isolation layer and the top surface of the interconnection layer are substantially coplanar.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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additional additional additional additional additional inventional inventional additional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional
Yu-Ying Tien-Szu Kuang-Hsiung Sheng-Ming Yu-Tzu
Lee Chen Chen Wang Peng