Jianq Chyun IP Office
Carrier and method for fabricating coreless packaging substrate
A fabrication method of a coreless packaging substrate is provided, including the steps of: forming an inner built-up circuit board on a carrier; removing the carrier; and symmetrically forming a first outer built-up structure and a second outer built-up structure on top and bottom surfaces of the inner built-up circuit board, respectively. The present invention effectively increases the product yield, saves the fabrication cost, and reduces wastes.
Unimicron Technology Corp.
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Chung W. Dyi-Chung Sheng-Yuah Tzyy-Jang Huan-Ling
Ho Hu He Tseng Lee