Metal interconnect structure and method for fabricating the same
A method for fabricating metal interconnect structure includes the steps of: forming a first metal interconnection in a first inter-metal dielectric (IMD) layer on a substrate; forming a cap layer on the first metal interconnection; forming a second IMD layer on the cap layer; performing a first etching process to remove part of the second IMD layer for forming an opening; performing a plasma treatment process; and performing a second etching process to remove polymers from bottom of the opening.
UNITED MICROELECTRONICS CORP.
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Kun-Chen Shih-Chun Tzu-Hao Tsung-Yin Chih-Sheng Yi-How Yang-Chou
Ho Tsai Fu Hsieh Chang Chou Lin