Duane Morris LLP
Cooling system for 3D IC
A system and method of cooling a three dimensional integrated circuit (3D IC) using at least one thermoelectric cooler which is connected to the 3D IC by a plurality of conductive pillars. In some embodiments a controller controls power supply to the thermoelectric cooler, and a temperature monitor provides a temperature input to the controller. In some embodiments the controller maintains a temperature of a 3D IC within a predetermined range by cycling power to the thermoelectric cooler.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H F H H H H F H
H01L F25B H01L H01L H01L H01L F25B H01L
additional inventional inventional inventional additional additional additional additional
Chung-Cheng Jonathan Tehan Po-Hao
Chou Chen Lee