Nelson Mullins Riley & Scarborough LLP
Composition for organic electronic device encapsulant and encapsulant formed using same
A composition for an encapsulant according to an embodiment of the present application comprises: 1) a silicone resin; 2) one or more moisture absorbents; 3) one or more photoinitiators; and 4) a monomer capable of dissolving the photoinitiators.
Momentive Performance Materials Korea Co., Ltd.
C C H C C C C C C C H C H
C08L C09D H01L C08K C08G C08L C08G C08F C08L C08F H01L C08F H01L
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Sun Nan Soo Hyun-Sang
Yu Kim Choi