Alston & Bird LLP
Fan-out antenna packaging structure and preparation method thereof
The present disclosure provides a fan-out antenna packaging structure and a preparation method thereof. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer enclosing a periphery of the semiconductor chip, a via being formed in the plastic packaging material layer; a conductive pole located in the via and running through the plastic packaging material layer from top to bottom; an antenna structure located on a first surface of the plastic packaging material layer and electrically connected with the conductive pole; a redistribution layer located on a second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the conductive pole; and a solder bump located on a surface of the redistribution layer, electrically connected with the redistribution layer and insulated from the plastic packaging material layer.
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
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Chihon Chengchung Chengtar Jangshen Yenheng
Ho Lin Wu Lin Chen