Li & Cai Intellectual Property (USA) Office
LED package structure and carrier thereof
An LED package structure and a carrier thereof are provided. The LED package structure includes a carrier, a plurality of LED chips, and an encapsulating colloid. The carrier includes a substrate, a ring-shaped first wall disposed on the substrate, and a ring-shaped second wall stacked on the first wall. A portion of the substrate surrounded by the first wall is defined as a die-bonding region, and the first wall, the second wall, and the die-bonding region jointly define an accommodating space. The LED chips are mounted on the die-bonding region and are arranged in the accommodating space. The encapsulating colloid is filled within the accommodating space, and the LED chips are embedded in the encapsulating colloid.
KAISTAR LIGHTING(XIAMEN) CO., LTD.
H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional inventional inventional inventional additional inventional inventional
Jing Tian Wei-Hong
Chen He Yang