McDermott, Will & Emery
Semiconductor module
The present invention is to provide a semiconductor module, which can effectively dissipate heat generated by the semiconductor components disposed on the circuit board, with a simple structure to manufacture inexpensively.
Mitsubishi Denki Kabushiki Kaisha
H H H
H01L H01L H01L
inventional inventional additional
Masaaki Nobuhiro Takao
Kusui Kato Nakajima