Slater Matsil, LLP
Fingerprint sensor device and method
A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Yu-Jen Hao-Yi Yu-Feng Chung-Shi Yu-Chih Chih-Wei Chih-Hua
Yu Cheng Tsai Chen Liu Huang Lin Chen