Rabin & Berdo, P.C.
Semiconductor die having input/output cells and contact pads in the periphery of a substrate
 The width of an input/output forming region is matched with the minimum width adoptable as a layout interval between pads in advance. Pads corresponding to (least common multiple).div.(layout interval between pads) in number are disposed so as to correspond to input/output cells corresponding to (least common multiple).div.(width of input/output cell forming region) in number, based on the least common multiple between the width of each input/output cell forming region and the layout interval between the pads. Owing to such a construction, a semiconductor device can be provided which meets user demands with ease and in a short time. 
Oki Electric Industry Co., Ltd.
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Shinichiro
Watanabe