Slater & Matsil, L.L.P.
Methods for de-bonding carriers
A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Shih-Yi Jui-Pin Yi-Chao Kung-Chen Ying-Tz Chung Yu Yi-Lin Chun-Hsing Chih-Hao Chin-Fu Chin-Chuan Long Hua Hsien-Wen
Syu Hung Mao Yeh Hung Wang Tsai Su Chen Kao Chang Lee Liu