Morgan, Lewis & Bockius LLP
Electronic component and manufacturing method thereof
An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Doo Ho Hyung Seok Hyun Jun Jong Pil Hyung Gon Jung Il
Yoo Roh Choi Lee Kim Kim