Ladas & Parry LLP
Method of manufacturing wiring substrate to which semiconductor chip is mounted
The present invention discloses a method of manufacturing a wiring substrate to which a semiconductor chip mounted. The method includes the steps of forming a base, forming a peeling layer on the base, forming a capacitor having a plurality of layers on the peeling layer, and forming a wiring part in the capacitor for connecting the capacitor to the semiconductor chip.
Shinko Electric Industries Co., Ltd.
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Kiyoshi Tomoo Noriyoshi Akio
Oi Yamasaki Shimizu Rokugawa