Embedding additive particles in encapsulant of electronic device
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
Infineon Technologies AG
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Joachim Peh Hean Chew Theng Jagen Yik Yee Soon Lock Poh Cheng Swee Kah
Mahler Teh Tai Krishnan Tan Goh Lim Lee