Grounding for enclosures
 An apparatus is provided to reduce the amount of EMI generated by a circuit. The grounding of an enclosure is improved by providing a number of shaped protuberances, the protuberances having an end that penetrates a conductive region of a circuit board, such that when the circuit board is mounted to the support member, the protuberances make a penetrating electrical contact and provides for additional ground paths, thereby reducing the EMI generated by the assembly. 
Digital Equipment Corporation
H Y H
H05K Y10S H05K
inventional additional inventional
Ralph Michael Mark S. Reuben
Tusler Lewis Martinez