WPAT, P.C., Intellectual Property Attorneys
Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a first sidewall substantially orthogonal to the first surface and the second surface; an isolation layer surrounding and contacted with the first sidewall of the substrate; a die disposed over the second surface of the substrate; a first conductive bump disposed at the first surface of the substrate; and a second conductive bump disposed between the substrate and the die.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Chien-Kuo Chi-Yang Jung Tsung Kuan-Lin Chih-Hao
Chang Yu Cheng Ho Lin