Schwabe, Williamson & Wyatt P.C.
Etch mask for hybrid laser scribing and plasma etch wafer singulation process
Etch masks and methods of dicing semiconductor wafers are described. In an example, an etch mask for a wafer singulation process includes a water-soluble matrix based on a solid component and water. The etch mask also includes a plurality of particles dispersed throughout the water-soluble matrix. The plurality of particles has an average diameter approximately in the range of 5-100 nanometers. A ratio of weight % of the solid component to weight % of the plurality of particles is approximately in the range of 1:0.1-1:4.
Applied Materials, Inc.
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James S. Alexander N. Ramesh Wenguang Ajay Prabhat Brad
Papanu Lerner Krishnamurthy Li Kumar Kumar Eaton