Spectrum IP Law Group LLC
Semiconductor devices and methods of manufacturing semiconductor devices
In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
Amkor Technology Singapore Holding Pte. Ltd.
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Sung Woo Yun Ah Kwang Seok Jin Seong Ji Chang Yong Jae Yeong Beom Jo Hyun
Lim Kim Oh Kim Lee Ko Ko Bae