Jones & Volentine, L.L.P.
Lead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing same
 A lead-on-chip package manufacturing method includes an insulating liquid adhesive depositing step on lead attaching regions formed on an active surface of a semiconductor on a wafer. The adhesive deposition may be accomplished by a screen printing method in which the adhesive is forced through hole patterns of a metal screen, or by a dispensing method in which a liquid adhesive is dispensed from needles of a dispensing head that is movable over the wafer surface and is aligned with the wafer. The dispensing technique may be applied to a plurality of chips in step-by-step fashion, or in a simultaneous manner by using a multi-needled dispensing head. 
Samsung Electronics Co., Ltd.
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Young-Jae Kyung-Seop Jeong-Woo
Song Kim Seo