Sinorica, LLC
Dice rearrangement package structure using layout process to form a compliant configuration
A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of metal traces is electrically connected to the each pads; a protection layer is provided to cover the active surface and the other ends of the exposed metal traces is electrically connected to the plurality of conductive elements, the characteristic in that the package body is a B-stage material.
Chipmos Technologies (Bermuda) Ltd Chipmos Technologies Inc
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additional additional additional additional additional inventional additional inventional additional additional inventional additional inventional additional additional inventional inventional additional additional additional additional inventional additional additional inventional additional additional additional additional inventional additional inventional inventional additional additional inventional
Yu-Ren Geng-Shin
Chen Shen