Muncy, Geissler, Olds & Lowe, P.C.
Stacked package device and method for fabricating the same
A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.
WINBOND ELECTRONICS CORP.
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Chia Hua Tung-Yi Yu-Cheng Hsin-Hung Chen-Hsi Meng-Chang
Ho Chan Chiao Chou Lin Chan