Slater Matsil, LLP
Chemical mechanical polish slurry and method of manufacture
Methods of manufacturing a chemical-mechanical polishing (CMP) slurry and methods of performing CMP process on a substrate comprising metal features are described herein. The CMP slurry may be manufactured using a balanced concentration ratio of chelator additives to inhibitor additives, the ratio being determined based on an electro potential (Ev) value of a metal material of the substrate. The CMP process may be performed on the substrate based on the balanced concentration ratio of chelator additives to inhibitor additives of the CMP slurry.
Taiwan Semiconductor Manufacturing Company, Ltd.
C C H H C H
C09G C09G H01L H01L C09G H01L
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Chun-Hao Kao-Feng Chih-Chieh Tung-Kai Hui-Chi Kei-Wei
Kung Liao Chang Chen Huang Chen