Brazing or soldering material and manufacturing method therefor
 Brazing or soldering materials which effectively improve the wettability of the brazing alloy or solder without using flux and a method of manufacturing such materials are provided. A metallic base is placed on turntable inside a vacuum chamber. A copper target is affixed to a sputtering electrode above the metallic base. Air is removed from the vacuum chamber through a vacuum outlet to increase the vacuum therein to a specific pressure, and carbon tetrafluoride and argon are introduced from a gas inlet to control the sputter pressure. Thereafter, turntable is rotated while a high frequency voltage is applied between the target and the metallic base to form a halide layer, such as a layer of copper fluoride, on a surface of metallic base. 
Seiko Epson Corporation
B B B Y Y C Y
B23K B23K B23K Y10S Y10T C23C Y10T
inventional inventional inventional additional additional inventional additional
Yoshiaki Katsuhiro Takuya Yasushi
Mori Takahashi Miyakawa Karasawa