Haynes and Boone, LLP
EUV vessel inspection method and related system
A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Po-Chung Anthony Li-Jui Chun-Lin Louis Shang-Ying Chia-Chen Li-Kai Tzung-Chi Bo-Tsun Shang-Chieh
Cheng Yen Chen Chang Wu Chen Cheng Fu Liu Chien