Hamre, Schumann, Mueller & Larson, P.C.
Method for packaging low-K chip
Provided is a method for packaging a low-k chip, comprising: attaching onto a carrier wafer a layer of temporary strippable film; arranging inversely a chip (2-1) onto the carrier wafer via the temporary strippable film; attaching thin film layer I (2-4) onto the carrier wafer for packaging; bonding a support wafer (2-5) onto the thin film layer I (2-4) and solidifying; forming a reconstructed wafer consisting of the chip (2-1), thin film layer I (2-4), and the support wafer; detaching the reconstructed wafer from the carrier wafer; completing a rewired metal wiring (2-6) on thin film layer I (2-4); forming a metal column (2-7) at an end of the rewired metal wiring (2-6); attaching thin film layer II (2-8) onto a surface of the metal column (2-7), packaging, and solidifying; coating a metal layer (2-9) on the top of the metal column (2-7), forming BGA solder balls (2-10) on the metal layer (2-9) by means of printing or ball planting; and finally slicing into individual BGA packages the reconstructed wafer having formed the BGA solder balls (2-10).
Jiangyin Changdian Advanced Packaging Co., Ltd
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Li Jinhui Dong Zhiming
Zhang Chen Chen Lai