Harness, Dickey & Pierce, P.L.C.
Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate
The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
HISENSE USA CORPORATION HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD. HISENSE INTERNATIONAL CO., LTD.
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inventional additional inventional additional inventional inventional
Wei Lin Wei
Zhao Yu Cui