Novak Druce Connolly Bove + Quigg LLP
LED package structure
An LED package structure includes a substrate, two electrodes engaged in the substrate, an LED chip, a reflective cup and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. Each of the electrodes defines a groove. The grooves surrounding the LED chip. The LED chip is mounted on one of the electrodes and electrically connected to the two electrodes. The reflective cup is mounted on the substrate and surrounds the LED chip. The encapsulation covers the LED chip and extends in the grooves of the electrodes to prevent water/moisture from entering the LED chip.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
H H H H H
H01L H01L H01L H01L H01L
inventional additional additional additional inventional
Hsin-Chiang Chieh-Ling
Lin Chang