Method for examining bonding resistance
An exemplary method for examining bonding resistance includes providing a first electronic component having a first and second reference pins. A second electronic component having a third and fourth reference pins is also provided. A first input voltage is applied to the first reference pin. A bias resistor connected between the third reference pin and ground is provided, with the third reference pin serving as an output for providing a first reference voltage. The first reference voltage is measured. Bonding resistance between the first reference pin and the third reference pin is evaluated according to the measured first reference voltage.
Innolux Display Corp.
G G
G01R G01R
additional inventional
De-Ching
Shie