McAndrews, Held & Malloy, Ltd.
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces; an encapsulant encapsulating the side surfaces of the semiconductor die; a contact pad on the first surface of the semiconductor die; and a redistribution layer coupled to the contact pad The redistribution layer may include a linear portion and a circular pad, and a hemispherical conductive bump on the circular pad may include a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump. The second surface of the semiconductor die may be coplanar with a surface of the encapsulant. A dielectric layer may cover a portion of the first surface of the semiconductor die and a first surface of the encapsulant.
Amkor Technology, Inc.
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Jin Young Doo Hyun Dong Jin SungKyu Jin Han YoonJoo SeungJae Jae Hun Jong Sik Se Woong
Kim Park Kim Kim Kim Kim Lee Bae Paek Cha