Muncy, Geissler, Olds & Lowe, P.C.
High heat dissipation light emitting diode package structure having at least two light cups and lateral light emission
A present invention includes at least two light cups and a composite material base. The composite material base comprises a first surface, a second surface and a third surface adjacent to the first surface, and a fourth surface opposite to the first surface. The at least two light cups are formed on the first surface. At least two first metal plates and at least two second metal plates having different polarities and corresponding to the quantity of the light cups are provided on the second surface. One ends of the at least two first and second metal plates individually pass through the composite material base and extend into the light cup to form two electrode contacts, and the other ends of the at least two first metal plates extend to the fourth surface to form an exposed heat dissipation structure.
Excellence Opto, Inc.
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Chih-Chiang Chun-Der Tzeng-Guang Kuo-Shu
Chang Wu Tsai Tseng