Oblon, McClelland, Maier & Neustadt, L.L.P.
Polymer material, foam obtained from same, and polishing pad using those
The subject is to provide a polymer material which enables to improve planarity and planarization efficiency of a polished surface and is useful as a polishing pad which generates only a few scratches. The said subject is solved by a polymer material having a tensile modulus at 50° C. after saturation swelling with 50° C. water of 130 to 800 MPa, a loss tangent at 50° C. of not more than 0.2, and a contact angle with water of not more than 80°.
KURARAY CO., LTD.
C C C C B C C H C C C
C08G C08J C08G C08G B24B C08G C08G H01L C08G C08J C08G
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Shunji Shinya Chihiro Hirofumi
Kaneda Kato Okamoto Kikuchi