McDermott Will & Emery LLP
Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes forming a structure protruding from a substrate, forming a dielectric layer covering the structure, forming a dummy layer covering the dielectric layer, and performing a planarization process to completely remove the dummy layer. A material of the dummy layer has a slower removal rate to the planarization process than a material of the dielectric layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Ching-Sen Jieh-Jang Feng-Jia Wei-Chieh Chin-Wei Hsia-Wei
Kuo Chen Shiu Huang Liang Chen