William Park & Associates Ltd.
Semiconductor packages including through mold ball connectors and methods of manufacturing the same
There is provided a structure and a method of manufacturing a semiconductor package. The method includes disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, recessing a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, and mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.
SK hynix Inc.
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Ki Jun Jong Hoon Yeon Seung Hyeong Seok
Sung Kim Jung Choi