Myers Bigel, P.A.
Semiconductor package with interposer
A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a molding layer covering side walls of the first semiconductor chip and including through holes, an interposer on the first semiconductor chip and the molding layer, conductive connectors in the through holes of the molding layer and connected to the first package substrate and the interposer, and an insulating filler including a first portion that fills the through holes of the molding layer so as to surround side walls of the conductive connectors.
SAMSUNG ELECTRONICS CO., LTD.
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Choongbin Jihwang Jongbo Jungwoo Kyoungsei
Yim Kim Shim Kim Choi