Birch, Stewart, Kolasch & Birch LLP
Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus
A scribing apparatus simultaneously performs scribing processes for a TFT substrate and a C/F substrate in the same location, thereby efficiently utilizing equipment spaced and achieving enhanced productivity. A substrate cutting apparatus is equipped with the scribing apparatus, and a substrate cutting method uses the substrate cutting apparatus. The scribing apparatus includes a stage for attracting a first mother substrate including first and second conjoined substrates, a scribing belt for holding a second mother substrate including conjoined third and fourth substrates, and a head unit for forming cracks in the second substrate of the first mother substrate or in the third substrate of the second mother substrate
LG Display Co., Ltd.
Y Y B B C B B G Y C C B C B B Y B
Y02P Y10T B23K B23K C03B B23K B23K G02F Y10T C03B C03B B23K C03B B28D B28D Y10T B23K
additional additional inventional additional inventional inventional inventional additional additional inventional inventional additional inventional inventional inventional additional inventional
Jung Sik
Kim