Mei & Mark LLP
Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
LUMENS CO., LTD.
F H H F H H H H H H
F21S H01L H01L F21S H01L H01L H05B H01L H05B H01L
inventional additional inventional inventional inventional additional inventional additional inventional additional
Tae Kyung Sung Yole In Soo Seung Hyun Seung Hoon Sung Sik Jung A
Yoo Yun Kim Oh Lee Jo Lim