Paul & Paul
Method of connecting module layers suitable for the production of microstructure modules and a microstructure module
A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.
Atotech Deutschland GmbH
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Konrad Oliver Heinrich Carsten Ralph Wolfgang Olaf Christian
Crämer Ringtunatus Meyer Schwiekendick Herber Friz Kurtz Madry