Cantor Colburn LLP
Strained and unstrained semiconductor device features formed on the same substrate
Embodiments of the invention are directed to a configuration of semiconductor devices having a substrate and a first feature formed on the substrate, wherein the first feature includes a first preserve region having compressive strain that extends throughout the first preserve region, and wherein the first feature further includes a cut region comprising a dielectric.
INTERNATIONAL BUSINESS MACHINES CORPORATION
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Juntao Peng Kangguo
Li Xu Cheng