Patterson & Sheridan, LLP
Apparatus for etching high aspect ratio features
Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body.
Applied Materials, Inc.
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inventional additional inventional inventional
Declan Jim Zhongyi Dennis M. Huutri Farid John P. Subhash Robert S. David E. Xiaoping Alexander Jeffrey William Kelly A. Jivko Sharma
Scanlan He Koosau Dao Abooameri Holland Deshmukh Clark Gutierrez Zhou Paterson Dietz McDonough Dinev Pamarthy