Shapiro, Gabor and Rosenberger, PLLC
Semiconductor device
A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the semiconductor device. Bonding pads formed over a principal surface of a semiconductor chip are in a rectangular shape, and an opening is formed in a protective film over each bonding pad in such a manner that an overlapping width of the protective film in a wire bonding region of each bonding pad becomes wider than an overlapping width of the protective film in a probe region of each bonding pad.
Renesas Electronics Corporation
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Hisanori Fumio Bunji Naoki Masanao Takuji
Ito Tsuchiya Yasumura Kawanabe Sato Ide