CKC & Partners Co., LLC
Light emitting device package structure with circuit redistribution structure and manufacturing method thereof
A light emitting device package structure includes a substrate, a circuit layer structure, a light emitting device, a first redistribution layer, a conductive connector, a second redistribution layer, and a chip. The circuit layer structure is disposed over the substrate, and the circuit layer structure includes a first circuit layer. The light emitting device is disposed over the circuit layer structure and is electrically connected with the first circuit layer. The first redistribution layer is disposed over the light emitting device and includes a second circuit layer and a conductive contact contacting the second circuit layer. The conductive connector connects the first circuit layer and the second circuit layer. The second redistribution layer is disposed over the first redistribution layer and includes a third circuit layer contacting the conductive contact. The chip is disposed over the second redistribution layer and is electrically connected with the third circuit layer.
UNIMICRON TECHNOLOGY CORP.
H H H
H01L H01L H01L
additional inventional inventional
Yu-Hua Tzyy-Jang De-Shiang Cheng-Ta Pei-Wei
Chen Tseng Liu Ko Wang