Birch, Stewart, Kolasch & Birch, LLP
Tablet comprising epoxy resin composition
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
Nitto Denko Corporation
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Hirofumi Shinichirou Hisataka Akihisa
Oono Sudo Ito Kuroyanagi