Muir Patent Consulting, PLLC
Image sensor package and method of manufacturing the same
An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
Samsung Electronics Co., Ltd.
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Yung-Cheol Byoung-Rim Jae-Cheon Seok-Won
Kong Seo Do Lee