Dickinson Wright PLLC
Photolithography process with multiple exposures
A photolithography process with multiple exposures is provided. A photomask is placed and aligned above a wafer having a photoresist formed thereon at a predetermined distance. Multiple exposures are sequentially performed on the photoresist through the photomask. Each of the multiple exposures is provided with a respective illuminating setting that is optimized for one duty ratio of the photomask. Thereby, an optimum through-pitch performance for pattern transfer from the photomask unto the photoresist is obtained. Then, a development is performed on the photoresist.
United Microelectronics Corp.
G G G
G03F G03F G03F
inventional inventional inventional
I-Hsiung Kuei-Chun Ching-Hsu Jiunn-Ren Yeong-Song
Huang Hung Chang Hwang Yen