F. Chau & Associates, LLC
Semiconductor chip, semiconductor package and fabricating method thereof
Provided are a semiconductor chip, a semiconductor package and a fabricating method thereof, which can reduce or prevent cracks from being generated or propagated due to an external pressure. The semiconductor chip includes a semiconductor substrate including a first region and a second region, a plurality of interlayer insulation layers formed on the semiconductor substrate, a first crack stopper formed in the plurality of interlayer insulation layers of the first region, an interconnector formed in the plurality of interlayer insulation layers of the second region, a pad wire formed on the plurality of interlayer insulation layers, electrically connected to the interconnector in the second region and extending to the first region, a bonding pad on the plurality of interlayer insulation layers of the first region, electrically connected to the pad wire, and a protection layer covering the pad wire and exposing the bonding pad. The first crack stopper is positioned at a lower level than the bonding pad and is formed to completely surround the bonding pad while not overlapping with the bonding pad and not being connected to the pad wire.
SAMSUNG ELECTRONICS CO., LTD.
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Jeong-Woon Seok-Ha Hyun-Pil
Kim Lee Noh