Altis Law Group, Inc.
Printed circuit board with compound via
A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.
Hon Hai Precision Industry Co., Ltd.
H H H H H
H05K H05K H05K H05K H05K
additional additional additional inventional inventional
Shou-Kuo Yung-Chieh Po-Chuan Cheng-Hsien Shin-Ting Jia-Chi Dan-Chen
Hsu Chen Hsieh Lee Yen Chen Wu