Haynes and Boone, LLP
Method of using a vaporizing spray system to perform a trimming process
A method of semiconductor device fabrication including placing a substrate having a first and second features disposed thereon in a vaporizing spray deposition system. An atomizing spray head of the vaporizing spray deposition system is used to deposit a conformal polymer layer on the first and second features. The first feature having the layer of the polymer disposed thereon and having a first width. A spray trim process is performed on the first and second features having the polymer layer disposed thereon using the atomizing spray head.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Ming-Feng Kuei-Liang Ching-Yu
Shieh Lu Chang