Hoffmann & Baron, LLP
Low dielectric composite material and laminate and printed circuit board thereof
The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a composite material having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and a laminate and printed circuit board having the properties of high glass transition temperature, low dielectric properties, halogen-free flame retardancy, low thermal expansion coefficient of the laminate, etc., can be made from the composite material.
Elite Electronic Material (Zhong Shan) Co., Ltd.
C B C H B H H C B C B B B C B H H H B B B B B B B B C B B B C B B
C08K B32B C09D H05K B32B H05K H05K C08K B32B C08K B32B B32B B32B C03C B32B H05K H05K H05K B32B B32B B32B B32B B32B B32B B32B B32B C09D B32B B32B B32B C09D B32B B32B
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Xiangnan Changyuan Hao Lianhui Chen-Yu
Li Li Chen Cai Hsieh