Jianq Chyun IP Office
Multi-layer printed circuit board structure, connector module and memory storage device
A multi-layer printed circuit board structure, a connector module and a memory storage device are provided. The multi-layer printed circuit board structure includes a first layout layer and a second layout layer. The first layout layer includes a shielding element and at least one pad. The shielding element provides the grounding voltage. The second layout layer is disposed corresponding to the first layout layer and includes at least one wire, and one end of each wire is coupled to one of the pads. A predefined proportion of the wire is covered by a projection plane of the shielding element projected on the second layout layer.
PHISON ELECTRONICS CORP.
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Shih-Kung Ta-Chuan Yun-Chieh Hsiang-Hsiung
Lin Wei Chen Yu