Knobbe Martens Olson & Bear LLP
Substrate structure, substrate manufacturing method and electronic device
According to one embodiment, there is provided a substrate structure including a printed-wiring board. A micro-contact sheet is soldered to the printed-wiring board, and includes a spiral terminal on a first surface thereof and a pad on a second surface thereof. The pad is electrically connected to the spiral terminal. A holding jig presses the micro-contact sheet against the printed-wiring board such that the second surface of the micro-contact sheet contacts with the printed-wiring board.
Kabushiki Kaisha Toshiba
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Tokihiko Sadao
Mori Makita