Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
Wiring board and a semiconductor device using the same
A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
Kabushiki Kaisha Toshiba
H H G H H H G G
H05K H01L G02B H01L H05K H05K G02B G02B
additional additional additional additional inventional additional inventional additional
Hideto Keiji Hiroshi
Furuyama Takaoka Yamada