Thomason, Moser & Patterson
Method and apparatus to improve the side wall and bottom coverage in IMP process by using magnetic field
 The present invention provides a method and apparatus for achieving conformal step coverage in a deposition process. In at least one aspect, a target provides a source of material to be sputtered by a plasma and then ionized by an inductive coil. At least a portion of the electrons provided by the plasma and ionized target material are deflected by a magnetic field established adjacent to the substrate. Under the influence of the attracted electrons, positively charged particles are induced to move in the direction of the electrons. The magnetic field may be provided by one or more magnets located internally or externally to the processing chamber and which can be rotated to ensure uniform deposition of the electrons and ions on the device features. 
Applied Materials, Inc.
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Keith Wei Praburam James Van
Miller Wang Gopalraja Gogh