CKC & Partners Co., LLC
Stacked structure and method for manufacturing the same
A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.
UNIMICRON TECHNOLOGY CORP.
H H H H H H Y H H H H H H
H05K H05K H05K H05K H05K H05K Y02P H05K H05K H05K H05K H05K H05K
inventional additional inventional additional inventional additional additional additional inventional additional inventional additional additional
Yu-Hua Cheng-Ta Kai-Ming Tzyy-Jang Pu-Ju
Chen Ko Yang Tseng Lin