WPAT, PC
Semiconductor process
A semiconductor process is provided. The semiconductor process includes providing a substrate. Then, a surface treatment is performed to the substrate to form a buffer layer on the substrate. Next, a first pre-amorphous implantation is performed to the substrate.
United Microelectronics Corp.
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H01L H01L H01L H01L
inventional inventional inventional inventional
Tsai-Fu Chun-Chieh Yu-Lan Yi-Wei Tsung-Yu Chao-Ching
Hsiao Chang Chang Chen Hung Hsieh