Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Layer structure for mounting semiconductor device and fabrication method thereof
A fabrication method of a layer structure for mounting a semiconductor device is provided, which includes the steps of: providing a base material, wherein the base material has a conductive layer having a first surface having a plurality of first conductive elements and an opposite second surface having a plurality of second conductive elements, and a first encapsulant formed on the first surface of the conductive layer for encapsulating the first conductive elements; partially removing the conductive layer to form a circuit layer that electrically connects the first conductive elements and the second conductive elements; and forming a second encapsulant on a bottom surface of the first encapsulant for encapsulating the circuit layer and the second conductive elements, thus reducing the fabrication difficulty and increasing the product yield.
Siliconware Precision Industries Co., Ltd.
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Fang-Lin Yi-Feng Cheng-Jen Yi-Min Hung-Chi
Tsai Chang Liu Fu Chen