Maschoff Brennan
PCB board, manufacturing method of PCB board and electrical device
The present disclosure provides a PCB board, a manufacturing method of a PCB board, and an electrical device, where the PCB board includes an insulating dielectric layer which is a glass substrate layer including a top surface and a bottom surface disposed oppositely; a conductive wiring layer which is disposed on a top surface of the insulating dielectric layer; and a top ink layer which is coated on the conductive wiring layer. According to the technical solution provided by the embodiment of the disclosure, the PCB board does not generate the phenomenon of deformation warping, and the conductive wiring layer is not easily peeled off from the insulating medium layer, and the use performance of the PCB board is good.
ZOPOISE TECHNOLOGY (ZHUZHOU) CO., LTD.
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Zhibin Weixiong Yikai Bruce Guicheng Jie Wei
Zhang Liu Xu Pi Yin Dong Kang