Staas & Halsey LLP
Method for providing a partial plating
 A method for providing a partial plating to a lead pin, comprising the steps of plating an entire surface of the lead pin; covering a first part of a plated surface of the lead pin by a gel member; and subjecting a second part of the plated surface of the lead pin, which extends out of the gel member, to a metal-coating removing agent, to remove a metal coating of the second part of the plated surface. The plating step may include providing a composite plating on the entire surface of the lead pin, and the subjecting step may include removing an uppermost metal layer of the composite plating by the metal-coating removing agent. The composite plating may include a nickel base layer and a gold uppermost layer deposited on the nickel base layer. The gel member may be formed from a non-oily clay or paper-mache for handcraft use. 
Fujitsu Takamisawa Component Limited
H C H
H01L C23F H01L
additional inventional additional
Kazuyiki Nobuyuki Masayuki Kouji Katsumasa Ryoji Yoshinobu
Futaki Takei Takeuchi Nishimura Yoshinari Arai Miyanoo