McDermott Will & Emery LLP
Fan-out semiconductor package
A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and the encapsulant fills spaces between walls of the through-hole and side surfaces of the semiconductor chip, and at least portions of the encapsulant extend to a space between the first interconnection member and the second interconnection member and a space between the active surface of the semiconductor chip and the second interconnection member.
SAMSUNG ELECTRO-MECHANICS CO., LTD.
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Doo Hwan Ju Hyeon Joon Sung Hyoung Joon
Lee Kim Kim Kim