William Park & Associates Ltd.
Semiconductor packages including stacked chips
A semiconductor package may include a first chip stack including first chips which are stacked on a package substrate. The semiconductor package may include a second chip stack including second chips which are stacked on the package substrate. The semiconductor package may include a third chip disposed on the first and second chip stacks.
SK hynix Inc.
H H H H H H H H H H H H H H H H H H H H H H H H H H G H H H G H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L G11C H01L H01L H01L G11C H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional inventional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional inventional additional additional additional inventional additional additional additional additional additional inventional additional
Seung Yeop Jin Kyoung
Lee Park