Haynes and Boone, LLP
Semiconductor device having a bonding pad and shield structure and method of manufacturing the same
A method of fabricating a semiconductor device includes providing a device substrate having a front side and a back side corresponding to a front side and a back side of the semiconductor device, forming, on the front side of the device substrate, a metal feature, forming, on the back side of the device substrate, an insulating layer, forming, on the back side of the semiconductor device, a trench exposing the metal feature, forming a bonding pad in the trench in electrical communication with the metal feature, and forming, on the insulating layer, a metal shield, in which the metal shield and the bonding pad have different thicknesses relative to each other.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Shuang-Ji Jen-Cheng Wen-De Jeng-Shyan Dun-Nian Cheng-Ying
Tsai Liu Wang Lin Yaung Ho