Oblon, McClelland, Maier & Neustadt, L.L.P.
Processing device, sputtering device, and collimator
A processing device according to one embodiment includes an object placement unit, a source placement unit, a collimator, and a temperature adjusting unit. The object placement unit is configured to have an object arranged. The object placement unit is configured to have an object placed thereon. The source placement unit is arranged apart from the object placement unit and configured to have a particle source placed thereon, the particle source being capable of ejecting a particle toward the object. The collimator configured to be arranged between the object placement unit and the source placement unit, includes walls, and is provided with through holes formed by the walls and extending a direction from the object placement unit to the source placement unit. The temperature adjusting unit is configured to adjust a temperature of the collimator.
Kabushiki Kaisha Toshiba
C C H H C
C23C C23C H01J H01L C23C
inventional inventional inventional inventional inventional
Shiguma Takahiro Yoshinori Masakatsu Yasuhiro
Kato Terada Tokuda Takeuchi Aoyama