Interconnect structure for integrated circuits
 A semiconductor integrated device support structure having a transmission line interconnect structure in a metal block on which the devices are mounted. The metal block is formed photolithographically from layers which define X,Y sections of the block. A plurality of stacked layers contains the complete wireline interconnect network. Each wire is a true coaxial transmission line having an inner conductor, a surrounding dielectric material and an outer conductor. By appropriate choice of radii of the inner conductor and the surrounding dielectric material, favorable impedances may be selected. 
Hewlett-Packard Company
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Cheng-Cheng
Chang