Molded ink manifold with polymer coating
A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.
Silverbrook Research Pty Ltd
B B B B B
B41J B41J B41J B41J B41J
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Jan Seung Jin Susan Kia
Waszczuk Lee Williams Silverbrook