Jianq Chyun IP Office
Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip
An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.
Advanced Semiconductor Engineering, Inc.
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Ming-Hsiang Jian-Cheng Chia-Jung
Cheng Chen Lee