Coudert Brothers
Methods of etching through wafers and substrates with a composite etch stop layer
 Methods of wet etching through a silicon substrate using composite etch-stop layers are disclosed. In one embodiment, the composite etch stop comprises a layer of silicon dioxide and a layer of polyimide. 
Fujitsu Limited
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Michael G. Wen-chou Vincent Solomon I. Michael G. William T.
Lee Wang Beilin Peters Chou