Adams & Wilks
Method of measuring film thickness
A thin film is etched by irradiating charged particles to a surface of the thin film. An etching time of the thin film is measured by observing a change in intensity of secondary charged particles emitted by etched portions of the thin film. A thickness of the thin film is calculated in accordance with the measured etching time.
Seiko Instruments Inc.
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Toshiaki Yasuhiko Toshio
Fujii Sugiyama Kodama