Thomas, Kayden, Horstemeyer & Risley
Packaging substrate and manufacturing method thereof
A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.
ASE (Shanghai) Inc.
H H H H H H H
H01L H01L H01L H01L H01L H01L H01L
inventional additional additional additional additional additional additional
Ho-Ming Chian-Chi Song-Fu Che-Ya Kao-Ming Teck-Chong Shin-Hua Chao-Fu
Tong Lin Yang Chou Su Lee Chao Weng