ScienBiziP, P.C.
Manufacturing method for metallic housing of electronic device
A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Foxconn Technology Co., Ltd.
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H05K B22C B22D B22D B22D B22D H05K B22D B22D B22D B22D B22D H05K B22C B22D
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Chun-Jung Chen-Shen Wen-Hsiung Cai-Hua Yue-Jian
Chang Lin Chang Wang Li