Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Method for fabricating package structure
A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.
Siliconware Precision Industries Co., Ltd.
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Cho-Hsin Chih-Hsien Chia-Yang Chao-Ya Hsin-Lung
Chang Chiu Chen Yang Chung