Integrated circuit including NCEM-enabled, via-open/resistance-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gate
An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of via opens and/or resistances.
PDF Solutions, Inc.
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Michaels Yokoyama Weiland Strojwas Fiscus Kibarian Strojwas O'Sullivan Liao Rauscher Vallishayee Eisenmann Lam Rovner Doong De Matsuhashi Hess Cheng Haigh Brozek Lee Ciplickas Comensoli Lin Taylor