Birch, Stewart, Kolasch & Birch, LLP
Bonding pad structure having island portions and method for manufacturing the same
A method for fabricating a bonding pad structure includes forming a dielectric layer on a substrate; forming a first metal pattern layer in the dielectric layer. The first metal pattern layer includes a first body portion having a plurality of first openings in a central region of the first body portion and a plurality of second openings arranged along a peripheral region of the first body portion and surrounding the plurality of first openings; and a plurality of first island portions correspondingly disposed in the plurality of second openings and spaced apart from the first body portion. The method further includes forming a plurality of first interconnect structures in the dielectric layer and corresponding to the plurality of first island portions; and forming a bonding pad on the dielectric layer and directly above the first metal pattern layer.
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
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Chi-Li Shi-Hsiang Ching-Wen Hung-Wei
Tu Lu Wang Chen