Eschweiler & Potashnik, LLC
Lithographic overlay sampling
Some embodiments of the present disclosure relate to a method of alignment which includes defining a plurality of fields on the face of a wafer, and organizing the plurality of fields into an orthogonal field structure and two or more continuous field structures. A first number of alignment structure positions are measured within each field of the two or more continuous field structures, and a second number of alignment structure positions are measured within each field of the orthogonal field structure, the second number being greater than the first number. The feature or layer is then aligned to the previously formed feature or layer based upon the measured alignment structure positions of the two or more continuous field structures and the orthogonal field structure.
Taiwan Semiconductor Manufacturing Co., Ltd.
H G G
H01L G03F G01B
inventional inventional additional
Ying Ying Yung-Yao Yi-Ping Shin-Rung
Wang Lee Hsieh Lu