Morgan Lewis & Bockius LLP
Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device
A semiconductor wafer provided with columnar electrodes which have plated nickel, palladium, and gold films successively formed at the top thereof, or have a plated solder film at their top. The semiconductor wafer can be preferably used for producing a chip-sized semiconductor device provided with columnar electrodes to which an external connection terminal, such as a solder ball, is to be bonded. Methods of producing the semiconductor wafer and device by use of plating are also disclosed.
Shinko Electric Industries, Co., Ltd.
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Tsuyoshi Yoshihiro Shinichi
Kobayashi Ihara Wakabayashi