Arnold, White & Durkee
Method of forming a copper film on a ceramic body
 A film containing copper is deposited on a ceramic body, and the film and the ceramic body are heated in an oxidizing atmosphere, whereby the copper is oxidized and bonded to the body to form a metal oxide film thereon. Alternatively, a film containing copper oxide is deposited on a ceramic body, and the film and the ceramic body are heated in a non-reducing atmosphere, whereby the film is bonded to the body to form a metal oxide film thereon. A metal film consisting mainly of copper is deposited on the metal oxide film. The metal film and the metal oxide film are heated at a temperature not exceeding 1083.degree. C. in a non-oxidizing atmosphere, whereby a copper film is formed on the body. 
NGK Insulators, Ltd.
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Tetsuo Yukihisa
Watanabe Takeuchi