Fitzpatrick, Cella, Harper & Scinto
Semiconductor device, process of producing semiconductor device, and ink jet recording head
When bonding inner leads of a flexible film wiring board to electrode pads of a semiconductor element substrate, by absorbing a stress generated due to a difference in thermal expansion coefficient between the flexible film wiring board and the semiconductor element substrate during cooling after heat-bonding, by a through-hole or recessed groove portion formed in the inner leads, it is possible to prevent peeling off of a bonding portion and improve the reliability.
Canon Kabushiki Kaisha
B H H B H H H H B B B
B41J H01L H01L B41J H01L H01L H01L H01L B41J B41J B41J
inventional additional additional inventional additional additional inventional inventional inventional inventional inventional
Toshihiro
Mori