Li & Cai Intellectual Property (USA) Office
Light emitting diode package structure
A light emitting diode (LED) package structure is provided and includes a substrate, an LED chip and a reflective component. The substrate has a first and a second region, and the substrate includes at least one electrode pad disposed on the second region. The LED chip is disposed on the substrate and has a chip upper surface with a light emitting region and a wire bonding region. The LED chip includes at least one electrode contact located at the wire bonding region and is electrically connected to the at least one electrode pad via a metal wire. The reflective component includes a first portion and a second portion. The first portion includes a first surface flush with the light emitting region and the second portion includes a second surface above a highest point of the metal wire.
LITE-ON TECHNOLOGY CORPORATION LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
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Po-Jui Hung-Jui
Lin Chen