Myers Bigel Sibley & Sajovec, P.A.
Stacked integrated circuit package having recessed sidewalls
Microelectronic packages are fabricated by stacking integrated circuits upon one another. Each integrated circuit includes a semiconductor layer having microelectronic devices and a wiring layer on the semiconductor layer having wiring that selectively interconnects the microelectronic devices. After stacking, a via is formed that extends through at least two of the integrated circuits that are stacked upon one another. Then, the via is filled with conductive material that selectively electrically contacts the wiring. Related microelectronic packages are also described.
Samsung Electronics Co., Ltd.
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additional inventional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional
Pil-kyu Jong-Wook Jung-Ho Seung-woo Dae-Lok
Kang Lee Kim Choi Bae