Organic spin-on anti-reflective coating over inorganic anti-reflective coating
A method of manufacturing a semiconductor. A conventional bottom anti-reflective coating is applied over a reflective surface, for example an inter-layer dielectric. A second anti-reflective coating is deposited over the first anti-reflective coating. The second anti-reflective coating is organic and may be deposited through a spin-on process. The organic anti-reflective coating may be deposited with more exacting optical properties and better control of the layer thickness than conventional bottom anti-reflective coatings applied via chemical vapor deposition processes. The combination of the two layers of anti-reflective materials, the materials having differing optical properties, demonstrates superior control of reflections from underlying materials compared with conventional art methods. More particularly, an organic anti-reflective coating in conjunction with an inorganic anti-reflective coating may cancel reflections across a wide range of thicknesses in an underlying dielectric layer. The superior anti-reflective structure of embodiments of the present invention allow patterning of semiconductor structures at smaller critical dimensions with greater accuracy, rendering competitive advantages in device speed, density and cost.
Advanced Micro Devices, Inc.
H G
H01L G03F
inventional inventional
Wenmei Angela T. Dawn Kouros
Li Hui Hopper Ghandehari