Method for determining set value of pressure for inspection in wafer inspection apparatus
In a method for determining a set value of a pressure for inspection in a wafer inspection apparatus, a surrounding space sealable between a chuck top and a probe card by a vacuum mechanism is evacuated and a highest negative pressure in the surrounding space is measured as a reference pressure when the chuck top has floated by the evacuation. Then as a reference height position, a height position of the chuck top corresponding to the reference pressure is obtained. Further, a pressure in the surrounding space is decreased to a level lower than the reference pressure, the pressure in the surrounding space, when the chuck top reaches a target height position obtained by adding a preset overdrive amount for a press-contact state between the probe card and the wafer to the reference height position, is measured and the measured pressure is set as the set value of the pressure.
TOKYO ELECTRON LIMITED
G
G01R
inventional
Hiroshi
Yamada