KED & Associates, LLP
Light emitting device package and ultraviolet lamp having the same
Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.
LG INNOTEK CO., LTD.
H H H H
H01L H01L H01L H01L
additional additional additional inventional
Yu Dong Byung Mok Gun Kyo Su Jung
Kim Kim Lee Jung