Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
 The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion. 
International Business Machines Corporation
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Helen L. Kamalesh K. Steven Judith M. Nicholas G. Chin-An
Yeh Srivastava Strickman Roldan Koopman Chang