Haynes and Boone, LLP
Chemical treatment for lithography improvement in a negative tone development process
A material layer is formed over a substrate. A negative tone photoresist layer is formed over the material layer. An exposure process is performed to the negative tone photoresist layer. A post-exposure bake (PEB) process is performed to the negative tone photoresist layer. After the exposure process and the PEB process, the negative tone photoresist layer is treated with a solvent. The solvent contains a chemical having a greater dipole moment than n-butyl acetate (n-BA).
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
G G G G
G03F G03F G03F G03F
inventional inventional inventional inventional
Cheng-Han Ching-Yu Chin-Hsiang Wei-Han Siao-Shan
Wu Chang Lin Lai Wang