Beveridge, DeGrandi & Weilacher
Semiconductor wafer surface grinding apparatus
 A grinding apparatus comprising a supporting base and at least one grinding wheel assembly disposed to face to the supporting base. The supporting base includes at least one holding table and the surface of the holding table protrudes beyond the surface of the supporting base. The grinding wheel assembly includes a rotatably mounted supporting shaft and a grinding wheel mounted to the supporting shaft. At least the surface layer of the holding table is made of 2MgO.SiO.sub.2 -type ceramics. 
Disco Abrasive Systems, Ltd.
B B
B24B B24B
inventional inventional
Toshiyuki
Mori