Tutunjian & Bitetto, PC
Self-aligned top via scheme
A semiconductor device includes a base structure including a lower level via and a lower level dielectric layer, a conductive pillar including an upper level line and an upper level via disposed on the lower level via, and a protective structure disposed between the lower level via and the upper level line. The protective structure includes a material having an etch rate less than or equal to that of the lower level via.
INTERNATIONAL BUSINESS MACHINES CORPORATION
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Juntao Ruilong Kangguo Carl Chih-Chao
Li Xie Cheng Radens Yang