Camera module and assembling process thereof
A camera module and an assembling process thereof are provided. The camera module includes a composite printed circuit board, an image sensing chip and an underfill. The composite printed circuit board includes a signal terminal to be connected with a conductive bump of the image sensing chip. The underfill is formed around a connecting region between the conductive bump and the signal terminal.
Primax Electronics Ltd.
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Chun-Tsai
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