WPAT, P.C., Intellectual Property Attorneys
Semiconductor manufacturing method and apparatus thereof
The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a photo-sensitive layer on a first surface of a semiconductor substrate. The photo-sensitive layer has a top surface. The method also includes obtaining a first profile of the first surface of the semiconductor substrate, and obtaining a second profile of the top surface of the photo-sensitive layer. The method also includes calculating a vertical displacement profile of the semiconductor substrate according to the first profile and the second profile. An apparatus for manufacturing a semiconductor structure is also disclosed.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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Yung-Yao Wen-Chih
Lee Wang