Haynes and Boone, LLP
Semiconductor fin structures and methods for forming the same
An integrated circuit structure includes a semiconductor substrate, an insulation region extending into the semiconductor substrate, and a semiconductor strip between two opposite portions of the insulation region. The semiconductor strip includes an upper portion higher than top surfaces of the insulation regions and a lower portion in the insulation region. The lower portion has a sidewall including a first sidewall portion having a first slope and a second sidewall portion over and connected to the first sidewall portion. The second sidewall portion has a second slope smaller than the first slope.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Srisuda Ryan Chia-Jen Chia-Wei
Thitinun Chen Chang