JCIPRNET
Circuit board structure
A circuit board structure including a dielectric substrate having a plurality of vias, a first conductor layer, a second conductor layer, an insulating layer, and a third conductor layer. The first and the second conductor layers are disposed at opposite surfaces of the dielectric substrate. The first conductor layer forms a plurality of traces including at least one high-speed differential pair and a plurality of ground traces, wherein the vias are located on the ground traces. The electric insulated layer is disposed on the dielectric substrate and covers the first conductor layer, and the third conductor layer is disposed on the insulating layer.
Advanced Connectek Inc.
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Min-Lung Mao-Sheng Wen-Yu
Chien Chen Wang