Antonelli, Terry, Stout & Kraus, LLP
Process for forming a large area, high gate current HEMT diode
A method of manufacturing a HEMT IC using a citric acid etchant. In order that gates of different sizes may be formed with a single etching step, a citric acid etchant is used which includes potassium citrate, citric acid and hydrogen peroxide. The wafer is first spin coated with a photoresist which is then patterned by optical lithography. The wafer is dipped in the etchant to etch the exposed semiconductor material. Metal electrodes are evaporated onto the wafer and the remaining photoresist is removed with solvent.
TRW Inc.
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Roger S. Ronald W. Michael E. Richard Mark
Tsai Grundbacher Barsky Lai Kintis