Harness, Dickey & Pierce, P.L.C.
Method of fabricating semiconductor device
The method may include forming a plurality of fins on a substrate with first and second regions, forming a photoresist pattern to expose the fins of the first region, forming a material layer to cover the fins of first region and the photoresist pattern, chemically reacting the photoresist pattern the material layer to form a supplemental film on a side surface of the photoresist pattern, performing an ion implantation process using the photoresist pattern and the supplemental film as a ion injection mask to form impurity layers in the fins of the first region.
Samsung Electronics Co., Ltd.
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Kwangsub Yura Yeojin Tae Sun Jaekyung
Yoon Kim Lee Kim Seo