Myers Bigel & Sibley, P.A.
Semiconductor package including stacked semiconductor chips and a redistribution layer
Semiconductor packages including stacked semiconductor chips are provided. The semiconductor packages may include first semiconductor chips and a second semiconductor chip that are stacked sequentially on a board. The semiconductor packages may also include a wiring layer on the memory chips and the wiring layer may include redistribution patterns and redistribution pads. Each of the memory chips may include a data pad. The data pads of the first semiconductor chips may be electrically connected to the board via the second semiconductor chip, some of redistribution patterns, and some of redistribution pads.
Samsung Electronics Co., Ltd.
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additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional inventional additional additional additional additional additional inventional additional additional additional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional
Kyung-Man Hye-Jin Sung-Hoon Sang-Ho Seok-Chan
Kim Kim Chun An Lee