Sughrue Mion, PLLC
Fan-out semiconductor package
A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
SAMSUNG ELECTRONICS CO., LTD.
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Ju Ho Sung Han Masazumi Tae Sung
Kim Kim Amagai Jeong