Sughrue Mion, PLLC
Conductive composition for thin film printing and method for forming thin film conductive pattern
Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×103 to 2×105 mPa·s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.
SHOWA DENKO K.K.
C B H H H C H C H H C
C09D B41F H05K H01B H05K C09D H05K C09D H05K H01B C09D
inventional additional additional inventional inventional inventional inventional inventional inventional inventional inventional
Shoichiro Takahiko Masumi Jun Hiroshi
Wakabayashi Ono Kuritani Dou Uchida