Muir Patent Consulting, PLLC
Electrical connection for multichip modules
A semiconductor chip is provided. The semiconductor chip includes a semiconductor substrate, a circuit on the substrate, an insulating layer formed on the circuit, and a plurality of electrically floating conductor lines formed on the insulating layer, at a major surface of the semiconductor chip.
Samsung Electronics Co., Ltd.
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additional additional additional additional inventional inventional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional
Seok-Chan Min-Woo
Lee Kim