Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Wafer polishing head
 A wafer polishing head for planarizing a wafer. The wafer polishing head comprises a carrier, a retaining ring, a first pressure chamber, a second pressure chamber and an automatic control system. The retaining ring is surrounding the carrier. The first pressure chamber having a first inner pressure is disposed above the retaining ring. The second pressure chamber having a second inner pressure is disposed on the carrier. The automatic control system is respectively coupled to the first pressure chamber and the second pressure chamber. 
United Microelectronics Corp.
B B B
B24B B24B B24B
inventional inventional inventional
Chien-Hsin Chia-Jui Juen-Kuen Peng-Yih
Lai Chang Lin Peng