Westerman, Hattori, Daniels & Adrian, LLP
Method for manufacturing semiconductor device
To provide a method for manufacturing a semiconductor device, which the method is capable of efficient mass production of high-performance semiconductor devices by, upon manufacture of a semiconductor device, eliminating unwanted features (e.g., side lobes) created together with a resist pattern by thickening the resist pattern, to reduce the burden in designing photomasks and to increase depth of focus. The method of the present invention for manufacturing a semiconductor device includes at least: forming a resist pattern on a work surface and applying over a surface of the resist pattern a resist pattern thickening material to thereby thicken the resist pattern to eliminate an unwanted feature created together with the resist pattern.
Fujitsu Semiconductor Limited
H H G
H01L H01L G03F
inventional inventional inventional
Yuji Hajime
Setta Yamamoto