Ellsworth IP Group PLLC
Plasma processing method of semiconductor manufacturing apparatus
Plasma processing methods of a semiconductor manufacturing apparatus which can minimize the amount of impurities adhered to the surface of a wafer, when a desired process using plasma is performed. According to the plasma processing methods of the semiconductor manufacturing apparatus, after the desired process is completed, the plasma generated over the wafer is diffused, and then the wafer is de-chucked.
SAMSUNG Electronics Co., Ltd.
H H
H01J H01L
inventional inventional
Jong-Bum In-Joong Min-Woung Seung-Heong Hyun-Su Ki-Sang
Kim Kim Choi Lee Jun Kim