Heat sink assembly having a fin also functioning as a supporting bracket
A heat sink assembly (100) for cooling a heat-generating electronic component, includes a base plate (32), a plurality of fins (50) mounted on the base plate and a heat pipe (20) thermally connecting the base plate and the fins. The fins are parallel to the base plate and include a bottom fin (40) supporting the fins on the base plate. The bottom fin includes a plurality of supporting tabs (422) engaging with the base plate and separating a body (42) of the bottom fin from the base plate. The bottom fin can be used not only for dissipating heat into a surrounding environment but also for reinforcing the whole strength of the heat sink assembly.
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Foxconn Technology Co., Ltd.
H H F F H F F H
H01L H01L F28D F28D H01L F28F F28F H01L
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Yi-Qiang Wei
Wu Li