Heat dissipating module having enhanced heat dissipating efficiency
A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.
Wistron Corporation
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inventional additional inventional additional additional
Wen-Hsiung Shih-Huai Hua
Yang Cho Chen