Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor package
A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a substrate having at least a carrying region and a cutting region defined on a surface thereof, wherein the cutting region surrounds the carrying region; disposing at least an electronic element on the carrying region of the substrate; disposing a shield having a recess portion and at least a positioning member extending outwards, on the carrying region of the substrate with the electronic element received in the recess portion and the positioning member extending outwards to the cutting region; and performing a cutting process along the cutting region to remove portions of the positioning member and the substrate. Therefore, the shield is precisely positioned on the substrate.
Siliconware Precision Industries Co., Ltd.
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inventional additional additional additional inventional additional inventional additional additional
Hsin-Lung Tien-Chung Kuang-Neng Tsung-Hsien
Chung Huang Chung Hsu