Lee & Morse, P.C.
Copper electroplating method
A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
Samsung Electronics Co., Ltd. Adeka Corporation
H C C H C H C C
H01L C25D C25D H01L C25D H01L C25D C25D
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Jung-Sik Takehiro Takashi Ki-Hyeon Myung-Beom Shin-ichi Yuji
Choi Zushi Yamada Kim Park Tanaka Morishima