Hauptman Ham, LLP
Package structure and method of forming the same
A package includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis, wherein the first work piece is rigid, and an entirety of the metal trace is on the first work piece. The package further includes a second work piece with a plurality of elongated bumps, wherein at least one of the plurality of elongated metal bumps has a second axis and at least another of the plurality of elongated metal bumps has a third axis, wherein the second and the third axes are not the same and the second axis is at a non-zero angle from the first axis, wherein the plurality of elongated bumps are electrically connected to the metal trace.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Han-Ping Yu-Feng Yuh Chern Tin-Hao
Pu Chen Shieh Kuo