Blakely, Sokoloff, Taylor & Zafman LLP
Laser cavity formation for embedded dies or components in substrate build-up layers
An apparatus including a package substrate including a plurality of layers of conductive material, the package substrate including a cavity; and a device in the cavity, wherein an ultimate layer of the plurality of layers of conductive material defines contacts to contact points of the device. An apparatus including a package substrate comprising a plurality of conductive layers and a silicon bridge die disposed between ones of the plurality of conductive layers and an ultimate layer of the plurality of conductive layers defines contact points to contact points of the silicon bridge die; and a logic die coupled to the contact points of the ultimate layer of the plurality of layers of conductive layers.
Intel Corporation
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Nikhil Sri Ranga Chong Qinglei Stefanie M. Islam A.
Sharma Boyapati Zhang Zhang Lotz Salama