Moser Patterson & Sheridan
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.
Applied Materials Inc.
H B H B
H01L B24B H01L B24B
inventional inventional inventional inventional
Fred C. Kapila Yongsik Yongqi Shijian Rajeev Jui-Lung Shi-Ping Rahul Gary David Tony S.
Redeker Wijekoon Moon Hu Li Bajaj Li Wang Surana Lam Mai Kaushal