Lowe Hauptman Ham & Berner
LED package frame and LED package having the same
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
Samsung Electro-Mechanics Co., Ltd.
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Ho Sik Hyung Suk Hun Joo Jung Kyu Young Sam Bum Jin Seung Ick Young June
Ahn Kim Hahm Park Park Kim Lee Jeong