Method of cleaning test probes
 Contaminants that accumulate on test probes utilized to contact aluminum pads on integrated circuit chips cause the probe resistance to become unacceptably high. As disclosed herein, the contaminants (predominantly a mixture of aluminum and aluminum oxide) are substantially removed by immersing the probes in boiling water. Adding small quantities of phosphoric and/or hydrofluoric acids to the water further improves the cleaning action. 
Bell Telephone Laboratories, Incorporated
B B
B08B B08B
inventional inventional
Jitendra Chuan C.
Kumar Chang