Slater Matsil, LLP
Integrated circuit package and method of forming same
Integrated circuit packages and methods of forming same are provided. A method includes attaching a first die and a second die to a carrier, the first die having a first contact pad, the second die having a second contact pad, the first contact pad and the second contact pad having different structures. A release layer is formed over the first die and the second die. An encapsulant is injected between the carrier and the release layer. One or more redistribution layers (RDLs) are formed over the first die, the second die and the encapsulant, the first contact pad and the second contact pad being in electrical contact with the one or more RDLs.
Taiwan Semiconductor Manufacturing Company, Ltd.
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inventional inventional additional additional inventional inventional inventional inventional inventional additional additional additional inventional additional additional additional inventional inventional additional inventional additional additional additional inventional inventional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional inventional additional inventional inventional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional
Chung-Shi Yu-Jen Hao-Yi Yu-Feng Kuo Lung
Liu Cheng Tsai Chen Pan