Haynes and Boone, LLP
Method and system for tool condition monitoring based on a simulated inline measurement
A method and system for removing control action effects from inline measurement data for tool condition monitoring is disclosed. An exemplary method includes determining a control action effect that contributes to an inline measurement, wherein the inline measurement indicates a wafer characteristic of a wafer processed by a process tool; and evaluating the inline measurement without the control action effect contribution to determine a condition of the process tool.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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H01L H01L H01L C23C
additional inventional additional inventional
Po-Feng Sunny Chin-Hsiang Jo Fei Jong-I Chia-Tong
Tsai Wu Lin Wang Mou Ho