Antonelli, Terry, Stout & Kraus, LLP
Semiconductor device
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
Hitachi, Ltd.
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Isamu Takashi Takashi Hiroyoshi Kunihiko Shozo Hiroshi Makoto Akio Masatsugu Asao Masahiro Junichi Masanori Aizo Sueo Gen Ichiro Hiroshi Kunihiro Kazuyoshi Tetsurou Noriyuki Syuuji Akihiro
Yoshida Yamazaki Yokoyama Kokaku Nishi Nakamura Hozoji Kitano Hasebe Ogata Nishimura Ichitani Saeki Segawa Kaneda Kawai Murakami Anjoh Kikuchi Tsubosaki Oshima Matsumoto Kinjo Eguchi Yaguchi