Ohlandt, Greeley, Ruggiero and Perle, LLP
Bulk ruthenium chemical mechanical polishing composition
The compositions of the present disclosure polish surfaces or substrates that at least partially include ruthenium. The composition includes a synergistic combination of ammonia and oxygenated halogen compound. The composition may further include abrasive and acid(s). A polishing composition for use on ruthenium materials may include ammonia, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; hydrogen periodate, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; silica, present in an amount of 0.01 wt % to 12 wt %, based on the total weight of the composition; and organic sulfonic add, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition, wherein the pH of the composition is between 6 and 8.
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
H C C H C
H01L C23F C23F H01L C09G
inventional inventional inventional inventional inventional
Ting-Kai David (Tawei) Yannan Liqing (Richard) Bin
Huang Lin Liang Wen Hu