Method for fabricating a semiconductor device having self aligned source (SAS) crossing trench
In order to provide a method for preventing the channel length from being shortened as well as reducing the SAS resistance, the semiconductor device according to the present invention is manufactured by forming continuous linear trench lines on a semiconductor substrate, forming gate oxide lines on the semiconductor substrate between the trench lines, forming gate lines on the trench lines and the gate oxide lines, the gate lines being substantially perpendicular to the trench lines, etching the gate oxide lines and trench lines positioned between the gate lines, to form an etched region forming self aligned sources (SASs) by implanting impurity ions into the etched region, forming spacers on sidewalls of the gate lines, and implanting impurity ions in the SAS region using the spacers as a mask.
DongbuAnam Semiconductor Inc.
H H
H01L H01L
inventional inventional
Jum Soo Sung Mun
Kim Jung