Integrated circuit containing DOEs of GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells
Wafers, chips, or dies that contain fill cells with structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). Such NCEM-enabled fill cells may target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes, including GATECNT-tip-to-side-short and/or GATECNT-tip-to-side-leakage failure modes. Such wafers, chips, or dies may include Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, of at least two types, all targeted to the same failure mode.
PDF Solutions, Inc.
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