Jianq Chyun IP Office
Transfer method using thermal transfer film
A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.
Compal Electronics, Inc.
B B B
B41M B44C B41M
inventional inventional inventional
Bar-Long Ru-Jen Chen-Hua Hung-Jen
Denq Chiu Liu Chen