Parks IP Law LLC
Methods and systems for reinforced adhesive bonding using solder elements and flux
The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.
GM GLOBAL TECHNOLOGY OPERATIONS LLC
B B B B
B23K B23K B23K B23K
inventional inventional inventional inventional
Yongbing Blair E. Xin
Li Carlson Yang