Foley & Lardner LLP
Semiconductor substrate including embedded component and method of manufacturing the same
A semiconductor substrate includes a multi-layered structure, a component and a first conductive via. The multi-layered structure includes a plurality of dielectric layers and a plurality of patterned conductive layers. A topmost patterned conductive layer of the patterned conductive layers is embedded in a topmost dielectric layer of the dielectric layers. The component is embedded in the multi-layered structure. The first conductive via is electrically connected to the component and one of the patterned conductive layers. At least one of the patterned conductive layers is located at a depth spanning between a top surface of the passive layer and a bottom surface of the component
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Chih Cheng Li Chuan Cheng-Lin Po-Shu
Lee Tsai Ho Peng