Griffin & Szipl, P.C.
Filmy adhesive for connecting circuits and circuit board
 A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40.degree. C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber. 
Hitachi Chemical Company, Ltd.
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Kazuyoshi Itsuo Kenzo Kazunori Toshiaki Osamu Akira Naoyuki
Kojima Watanabe Takemura Yamamoto Tanaka Watanabe Nagai Shiozawa