Slater Matsil, LLP
Methods for making multi-die package with bridge layer
A method is provided. The method includes attaching a bridge layer to a first substrate. The method also includes forming a first connector, the first connector electrically connecting the bridge layer to the first substrate. The method also includes coupling a first die to the bridge layer and the first substrate, and coupling a second die to the bridge layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional inventional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional additional inventional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional inventional additional inventional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional additional inventional additional inventional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional inventional additional inventional additional additional additional
Chen-Shien Yu-Feng Wei Sen Mirng-Ji
Chen Chen Chang Lii