Semiconductor package and method for processing and bonding a wire
A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.
Advanced Semiconductor Engineering, Inc.
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Jian Cheng Cheng Tsung Hsiao Chuan Yi Shao Chang Ying Chih Cheng Wei Chi Tsung Yueh Ho Ming
Chen Hsu Chang Lai Hung Hung Yih Tsai Tong