The PL Law Group, PLLC
CMP pad conditioner
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
EHWA DIAMOND INDUSTRIAL CO., LTD.
B B
B24B B24B
inventional inventional
Seh Kwang Joo Han
Lee Lee