Canon USA Inc IP Division
Microstructural body and production method therefor
A microstructural body includes a substrate such as an electrode substrate, a support portion, one post that fixes the support portion to the substrate, a frame-shaped movable portion provided around outer periphery of the support portion, and an elastic support portion that elastically connects the movable portion and the support portion. The elastic support portion supports the frame-shaped movable portion such that the movable portion is movable relative to the support portion. The elastic support portion includes torsion springs and an elastically deformable connecting portion.
Canon Kabushiki Kaisha
B B G Y B B
B81C B81B G02B Y10T B81B B81B
additional additional inventional additional inventional additional
Shinichiro Takahisa
Watanabe Kato