Foley & Lardner
Method of forming thin metal films
 Formation of metal thin films by collimate sputtering with high productivity and high bottom coverages. The bottom coverages by collimate sputtering are increased by using a target having a high sputtered-particle emission probability in the range of angles at which the collimator passage rate is high, without increasing the aspect ratio of the collimator, that is, without lowering the productivity. 
NEC Corporation
C C H
C23C C23C H01L
inventional inventional inventional
Toshiyuki Hiroaki Toshiki
Ohta Yamada Shinmura