Harness, Dickey & Pierce, P.L.C.
Methods of transferring semiconductor elements and manufacturing semiconductor devices
The present disclosure relates to a method of transferring semiconductor elements from a non-flexible substrate to a flexible substrate. The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements grown or formed on a non-flexible substrate may be effectively transferred to a resin layer while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements.
SAMSUNG ELECTRONICS CO., LTD.
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Jin-seung Jun-Hee Chang-youl Eun-hyoung
Sohn Choi Moon Cho