Dual cure, low-solvent silicone pressure sensitive adhesives
A pressure sensitive adhesive composition includes an alkenyl-terminated polydiorganosiloxane, a silanol-terminated polydiorganosiloxane, a resinous copolymer, an organohydrogenpolysiloxane with terminal Si&#8212;H groups, a hydrosilation catalyst, and an organic cross-linking agent. The composition provides excellent high temperature adhesion properties and enables coatable formulations with low solvent content.
General Electric Company
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Ference David F. Shaow B. Ronald A. Roy M.
Horkay Townsend Lin Greenberg Griswold