Blakely, Sokoloff, Taylor & Zafman, LLP
Micromechanical and microoptomechanical structures with single crystal silicon exposure step
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Microscan Systems, Inc. Xerox Corporation
B B B B B G
B81C B81C B81C B81C B81B G02B
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Joel A. Jingkuang Chuang-Chia Peter M. Andrew J. Alex T.
Kubby Chen Lin Gulvin Zosel Tran