Harness, Dickey & Pierce, P.L.C.
Fan-out semiconductor package having redistribution line structure
A fan-out semiconductor package including a redistribution line structure is provided. The fan-out semiconductor package includes a plurality of redistribution line insulating layers and a plurality of redistribution line patterns arranged on at least one of an upper surface and a lower surface of each of the plurality of redistribution line insulating layers; at least one semiconductor chip arranged on the redistribution line structure and occupying a footprint having a horizontal width that is less than a horizontal width of the redistribution line structure; and a molding member surrounding the at least one semiconductor chip on the redistribution line structure and having a horizontal width that is greater than the horizontal width of the redistribution line structure, wherein the plurality of redistribution line insulating layers have a cascade structure.
Samsung Electronics Co., Ltd.
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inventional additional additional additional additional additional inventional additional additional inventional additional inventional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional inventional additional inventional inventional additional additional inventional additional additional additional additional additional additional inventional additional
Jong-Youn Seok-Hyun
Kim Lee