Myers Bigel Sibley & Sajovec
Semiconductor packages having warpage compensation
A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package.
Samsung Electronics Co., Ltd.
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Seok-won Chi-young Hyon-chol Su-chang Heung-kyu
Lee Lee Kim Lee Kwon