Eschweiler & Associates, LLC
Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing
Some embodiments relate to a manufacturing method for a semiconductor device. In this method, a semiconductor workpiece, which includes a metal gate electrode thereon, is provided. An opening is formed in the semiconductor workpiece to expose a surface of the metal gate. Formation of the opening leaves a polymeric residue on the workpiece. To remove the polymeric residue from the workpiece, a cleaning solution that includes an organic alkali component is used.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Pei-Hung Chun-Li Jui-Ping Shao-Yen
Chen Chou Chuang Ku