Howson & Howson LLP
Method of bonding semiconductor elements and junction structure
[Problem] The present invention provides a method for bonding semiconductor elements while assuring excellent electric conductivity and transparency at an interface, and a junction structure according to the bonding method. The present invention also provides a method for bonding semiconductor elements wherein excellent electric conductivity is assured at an interface and optical characteristics favorable for element characteristics can be designed, and a junction structure according to the bonding method.[Solution] Electrically conductive nano particles which are not covered with organic molecules are arrayed on a surface of one semiconductor element without causing optical loss, and another semiconductor element is pressure-bonded thereagainst.
National Institute of Advanced Industrial Science and Technology
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Hidenori Kikuo
Mizuno Makita