Ladas & Parry LLP
Precursor solution for polyimide/silica composite material, its manufacture method, and polymide/silica composite material having low volume shrinkage
A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)(4−x) to allow the silica moiety to carry a photo-polymerizable unsaturated group; and adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9, and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.
Eternal Chemical Co., Ltd.
Y C C
Y10T C08K C09D
additional additional inventional
Meng-Yen Chin-Min Chung-Hao Cheng-Tyng Yu-Wen Chung-Jen Kuo-Huang Chung-Hung Wen-Chang Hsin-Wei Shu-Wan Min-Chi Chin-Chang
Chou An Wu Yen Wang Wu Hsieh Chang Chen Huang Lu Wang Chuang