Collard & Roe, P.C.
Chip bonding method and bonding device
A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
BOE TECHNOLOGY GROUP CO., LTD.
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Haiwei Jing Feng Zhenxing Lili Linhui Chao Qiangwei Chuhang Ke
Sun Liu Qu Tang Wang Gong Liu Cui Wang Meng