Tung & Associates
Optoelectronic transceiver having integrated optical and electronic components
An optoelectronic transceiver that has integrated optical and electronic components, and can be passively aligned by a flip-chip method and a mechanical method is provided. The optoelectronic transceiver can be constructed by the key components of a circuit board, a silicon sub-mount, at least two IC chips formed on a silicon sub-mount, a microlens array, an optical fiber, and a receptacle for housing the silicon sub-mount, the at least two IC chips, the microlens array and the optical fiber connector in an aligned configuration. The at least two IC chips preferably include a laser diode, a laser diode driver, a photodetector and a photodetector amplifier. The mechanical alignment between a microlens array and a silicon sub-mount is performed by indentations provided in the surfaces of the two parts and the placement of spacer balls in the indentations.
Industrial Technology Research Institute
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G02B G02B G02B G02B
inventional inventional inventional inventional
Chung-Tao Bi-Chu Chih-Hsiang Chien
Chang Wu Ko Chen