Kinney & Lange, P.A.
Micro-die natural convection cooling system
A cooling system for an integrated circuit die comprises a heat exchanger and a heat transfer device. The heat transfer device is formed of a plurality of stacked foils. The stacked foils are fused at a heat exchanger region abutting the heat exchanger, and are fused at a die region abutting the integrated circuit die, but are flexible between the heat exchanger region and the die region.
Hamilton Sundstrand Corporation
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Jeffrey T.
Wavering