Bacon & Thomas, PLLC
Method for transferring wafers in a semiconductor tape-peeling apparatus
A wafer transfer method using a robot arm for sucking the front-side of the uppermost one of a plurality of wafers stored in a cassette, and for transferring the wafer having a tape adhered to the front-side thereof to a semiconductor tape-peeling device for tape-peeling. Although the wafer warps, the undesired effect that the robot arm crashes any of the wafers can be avoided by using this method.
Mosel Vitelic, Inc.
Y H Y
Y10T H01L Y10S
additional inventional additional
Chin-hsiang Chih-shen Kuei-chang Yun-liang
Chang Yang Tsai Ouyang