Secondary board for mounting of components having differing bonding requirements
 A system of interconnecting electrical components having conflicting bonding requirements for mounting the components to a printed circuit board. The system includes a primary printed circuit board having a pattern of through-holes and having arrangements of connection sites to receive electrical components. For example, the connection sites of the primary printed circuit board may be of the type to receive components associated with the bonding requirements of surface mounting. A secondary printed circuit board has a pattern of through-holes corresponding to the pattern of through-holes of the primary printed circuit board. The circuit boards are wave soldered or surface mounted together by means of the corresponding patterns of through-holes. Attached to the secondary printed circuit board is one or more electrical component having bonding requirements which conflict with those of the primary printed circuit board. Preferably, a tape automated bonding frame is in pressure contact with the through-holes of the secondary printed circuit board for electrical communication between the board via the through-holes. 
Hewlett-Packard Company
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Lawrence R. Cheng-Cheng
Hanlon Chang