JCIP Global Inc.
Chip packaging structure, and packaging method thereof
The present invention provides a chip packaging structure, and a packaging method thereof. The structure comprises a silicon-based main body and chip electrodes. The silicon-based main body is provided with a passivation layer on a front face thereof and passivation layer openings are provided on the passivation layer. The chip electrodes have rear faces embedded in the front face of the silicon-based main body. Front faces of the chip electrodes are exposed through the passivation layer openings. A dielectric layer is provided on an upper surface of the passivation layer, and dielectric layer openings are provided. Metal protrusion structures are provided on the front faces of the chip electrodes. An encapsulation layer is provided on side walls and a rear face of the silicon-based main body. The chip packaging structure of the present invention employs insulation protection on side walls to avoid electrical leakage and short circuit conditions.
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional inventional additional inventional inventional additional additional inventional additional inventional additional inventional inventional additional inventional additional additional additional additional inventional additional additional inventional additional inventional additional inventional inventional additional additional additional inventional inventional additional inventional additional additional inventional additional
Hong Li Zhiming Dong Qicai Jinhui
Xu Zhang Lai Chen Chen Chen