Lewis Roca Rothgerber Christie LLP
Copackaging of asic and silicon photonics
A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.
Rockley Photonics Limited
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Gerald Cois Javid Chia-Te Karlheinz David Arlo Thomas Pierre
Byrd Messian Chou Muth Nelson Schrans