Antonelli, Terry, Stout & Kraus, LLP
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
Hitachi, Ltd.
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Kunihiko Asao Hiroyoshi Takashi Akihiro Hiroshi Masahiro Makoto Hiroshi Syuuji Junichi Kazuyoshi Isamu Ichiro Shozo Masatsugu Sueo Tetsuro Aizo Noriyuki Kunihiro Gen Takashi Masanori Akio
Nishi Nishimura Kokaku Yamazaki Yaguchi Hozoji Ichitani Kitano Kikuchi Eguchi Saeki Oshima Yoshida Anjo Nakamura Ogata Kawai Matsumoto Kaneda Kinjo Tsubosaki Murakami Yokoyama Segawa Hasebe