Maschoff Brennan
Exposure method of wafer substrate, manufacturing method of semiconductor device, and exposure tool
A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
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Yung-Cheng Tzong-Sheng Chi-Hung Hsueh-Yi Jui-Ping Fei-Gwo Wei-Ti Kuei-Shun Shih-Chi Meng-Wei
Chen Chang Liao Chung Chuang Tsai Hsu Chen Fu Chen