Muncy, Geissler, Olds & Lowe, P.C.
Chemical mechanical polishing conditioner and method for manufacturing same
A chemical mechanical polishing (abbreviated as CMP) conditioner comprises a bottom substrate, an intermediate substrate and a diamond film The intermediate substrate is provided on the bottom substrate. The intermediate substrate comprises a hollow portion, an annular portion surrounding the hollow portion, and at least one projecting ring projecting out of the annular portion away from the bottom substrate. The projecting ring comprises a plurality of bumps arranged to be spaced apart from each other along an annulus region. The bumps are extended in a radial direction of the intermediate substrate. The diamond film is provided on the intermediate substrate. The diamond film is allowed for conforming to the bumps, so as to form a plurality of the abrasive projections.
KINIK COMPANY LTD.
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C30B C08K C08K C08K B24B C08K B24D C08K
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Jui-Lin Hsin-Chun Ting-Sheng Xue-Shen
Chou Wang Huang Su