Haynes and Boone, LLP
Advanced process control for new tapeout product
The present disclosure provides a semiconductor manufacturing method. The method includes providing product data of a product, the product data including a sensitive product parameter; searching existing products according to the sensitive product parameter to identify a relevant product from the existing products; determining an initial value of a processing model parameter to the product using corresponding data of the relevant product; assigning the initial value of the processing model parameter to a processing model associated with a manufacturing process; thereafter, tuning a processing recipe using the processing model; and performing the manufacturing process to a semiconductor wafer using the processing recipe.
Taiwan Semiconductor Manufacturing Company, Ltd.
G H H Y
G05B H01L H01L Y02P
inventional inventional inventional additional
Chih-Wei Jong-I Andy Shun-Ping Yu-Jen Wen-Pin Shin-Rung Jo Fei Chun-Hsien
Hsu Mou Tsen Wang Cheng Liu Lu Wang Lin