Eschweiler & Potashnik, LLC
Integrated antenna on interposer substrate
The present disclosure, in some embodiments, relates to an integrated antenna structure. The structure includes an excitable element and a first ground plane. The first ground plane is disposed between a first surface of a semiconductor substrate and the excitable element. A first line that is normal to the first surface of the semiconductor substrate extends through both the first ground plane and the excitable element. A second ground plane is separated from the first ground plane by the semiconductor substrate. The second ground plane is electrically coupled to the first ground plane.
Taiwan Semiconductor Manufacturing Co., Ltd.
H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01Q H01L H01L H01L H01Q H01L H01L H01L H01L H01L H01L H01Q
inventional inventional additional additional additional inventional additional additional additional inventional inventional additional additional additional additional inventional inventional
Bo-Jr Chin-Chou Yun-Han Chin-Her William Wu
Huang Liu Lee Chien Shen