Method and device for making a metal bump with an increased height
A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.
Orient Semiconductor Electronics Limited
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Hua-Wen Wen-Lo Chia-Chieh Ning Fu-Yu Wen-Long Feng-Chang Hsuan-Jui Chung-Ming Hui-Pin
Chiang Shieh Hu Huang Huang Leu Tu Chang Chang Chen