Idea Intellectual Limited
Method for manufacturing multi-layer circuit board capable of being applied with electrical testing
A multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board.
KINSUS INTERCONNECT TECHNOLOGY CORP.
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Chin-Hsi Chao-Lung Chin-Kuan Shuo-Hsun Yu-Te
Chang Wang Liu Chang Lu