Additon, Higgins & Pendleton, P.A.
CMP slurry composition and polishing method using the same
A CMP slurry composition includes metal oxide particles, a diisocyanate compound, and deionized water. The CMP slurry composition is capable of selectively controlling polishing speed of a wafer surface having a convex portion and a concave portion, such that primary polishing and secondary polishing can be performed rapidly while stopping polishing of the nitride layer upon the secondary polishing.
Cheil Industries Inc.
H C C H
H01L C09G C09K H01L
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Hyun Soo Yong Soon Young Chul Yong Kuk Dong Jin
Roh Park Jung Kim Kim