Tung & Associates
Method to preserve alignment mark optical integrity
A method for protecting an alignment mark area during a CMP process including forming at least a first material layer over a process surface of a semiconductor wafer including active areas and alignment mark trenches formed in the at least one alignment mark area; forming at least a second material layer over the first material layer including the active areas and the at least one alignment mark area; lithographically patterning and etching the at least a second material layer to form at least a plurality lines of the at least a second material layer adjacent to the alignment mark trenches; and, carrying out a CMP process to remove at least a portion of the at least a second material layer.
Taiwan Semiconductor Manufacturing Co., Ltd
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Chih-Ta Chia-Shiung Gwo-Yuh Chia-Tung Feng-Jia Shih-Chi Jieh-Jang Ching-Sen
Wu Tsia Shiau Ho Shih Fu Chen Kuo