R. F. power transistor device with controlled common lead inductance
 An R. F. power transistor device is disclosed wherein the common lead inductance may be controlled to any desired value from zero to relatively high values. The transistor device includes an insulating member of beryllium oxide to one side of which there may be bonded the usual metal heat sink. On the other side of the beryllium oxide member there are metallized areas to which the input and output ground conductors are bonded, the input lead is bonded, the output lead is bonded and the collector of the transistor chip is bonded. One plate of an MOS capacitor is bonded to the input ground lead. In the case of grounded emitter applications, short, small wires are connected from the emitter areas of the transistor in each direction to the input ground leads and the output ground leads respectively. The base areas of the transistor are connected by short, small wire leads to the other plate areas of the MOS capacitor and to the input lead. The metallizations to which the input ground leads and output ground leads are bonded and the input and output ground leads are separated by gaps. This has the result of reducing the common lead inductance to as near zero as possible. One or more short, small wire leads are jumpered across the gap to give an added, but controlled, amount of inductance. On each side of the gap the ends of the input and output ground leads may have lateral extensions to which the jumper leads are connected at a particular lateral locations to give the desired inductance. 
Motorola, Inc.
H H H H H H H H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional inventional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional
Albert Victor
Kraybill