Hauptman Ham, LLP
Wafer on wafer stack method of forming and method of using the same
A method of forming a wafer on wafer (WOW) stack includes forming a predetermined array of connecting elements on a surface of a first wafer, the first wafer including dies of a first type. The dies of the first type have a first functionality. The method further includes bonding a second wafer to the first wafer using the predetermined array of connecting elements, the second wafer including dies of a second type. The dies of the second type have a separate functionality different from the first functionality. Bonding the second wafer to the first wafer comprises bonding an integer number of dies of the second type to a corresponding die of the first type. A total area of the dies of the second type bonded to the corresponding die of the first type is less than or equal to an area of the corresponding die of the first type.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H H H H H H H H H
H04N H01L H01L H01L H01L H04N H01L H01L H01L
inventional inventional inventional inventional inventional inventional inventional inventional inventional
Sandeep Kumar Yun-Han
Goel Lee