Christensen O'Connor Johnson Kindness PLLC
Method of planarizing a structure having an interpoly layer
 A method of planarizing a structure having an interpoly layer is disclosed. The method includes forming an undoped silica glass layer on at least a polysilicon region formed on a semiconductor substrate. Next, a spin-on-glass layer is formed over the undoped silica glass layer. Finally, the spin-on-glass layer is etched back, thereby planarizing the structure having the interpoly layer. 
Vanguard International Semiconductor Corporation
H
H01L
inventional
Yeur-Luen Yue-Feng Liang-Gi Chung-Ju Wei-Ray
Tu Chen Yao Lee Lin