Rothwell, Figg, Ernst & Manbeck, P.C.
Adhesive film, preparation method of semiconductor device, and semiconductor device
The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.
LG CHEM, LTD.
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inventional additional additional additional inventional additional inventional additional inventional additional inventional additional inventional additional inventional inventional additional inventional additional inventional inventional inventional inventional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional inventional inventional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional
Seung Hee Young Kook Hee Jung Se Ra Jung Hak Kwang Joo
Nam Kim Kim Kim Kim Lee