Burr & Brown
Bonding structure for a terminal of a susceptor of a semiconductor device manufacturing apparatus
A bonding structure including: a ceramic member made of aluminum nitride and including a hole; a terminal embedded in the ceramic member, exposed to a bottom surface of the hole, and made of molybdenum; a brazed bond layer consisting of gold (Au) only; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of molybdenum.
NGK Insulators, Ltd.
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Taichi Tomoyuki Hiroshi
Nakamura Fujii Takebayashi