Coudert Brothers
Flip chip pre-assembly underfill process
 An encapsulation process for flip-chip bonding chips to a substrate encapsulates solder balls on the chip in a separate encapsulation process in which the chip is coated with encapsulation layer and then a portion of the encapsulation layer is removed to expose a portion of the solder balls. 
Fujitsu Limited
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Michael G. Dashun S. Wen-chou Vincent Yasuhito
Peters Zhou Wang Takahashi