Townsend and Townsend and Crew LLP
Method for multi-frequency bonding
A method and technique for achieving a high strength bond between two substrates includes igniting a plasma using a source RF signal. The substrates are biased with a bias RF signal during surface treatment by the plasma. The treated surfaces are brought into contact. The resulting bonded substrates show an improvement over bonds attained using conventional bonding techniques.
Silicon Genesis Corporation
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Shari N. William J. Wei Mark A.
Farrens Franklin Liu Franklin