J. C. Patents
LED package structure and method for manufacturing same
The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.
EVERLIGHT ELECTRONICS CO., LTD.
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Jen-Hao Sheng-Wei Tzu-Lun Chia-Fong Chung-Chuan Ke-Hao Yi-Sheng Hao-Yu Chieh-Yu
Pan Chou Tseng Chou Hsieh Pan Lan Yang Kang