Antonelli, Terry, Stout & Kraus, LLP.
Adhesive for bonding circuit members, circuit board, and method of producing the same
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.
Hitachi Chemical Company, Ltd.
H H Y H Y H H H H H H H H H H H H H H H H H H Y Y H C H H H H H H H H H Y H H H H H H H H H Y H Y H H H H H H Y Y H H H H
H01L H01L Y10T H01L Y10T H01L H01L H01L H01L H01L H01L H01L H05K H01L H01L H01L H01L H01L H05K H05K H01L H01L H01L Y10T Y10T H01L C09J H01L H05K H01L H01L H01L H01L H01L H01L H01L Y10T H01L H01L H01L H01L H01L H01L H01L H01L H01L Y10T H01L Y10T H01L H05K H01L H05K H01L H01L Y10T Y10T H01L H01L H01L H01L
inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional inventional additional additional additional additional additional additional inventional additional additional additional additional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional
Osamu Kenzo Itsuo Akira Kazuhiro Kazuyoshi
Watanabe Takemura Watanabe Nagai Isaka Kojima