Fitzpatrick, Cella, Harper & Scinto
Precise polishing apparatus and method
The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.
Canon Kabushiki Kaisha
B B H B H
B24B B24B H01L B24B H01L
inventional inventional additional inventional inventional
Shinzo Mikichi Matsuomi Takashi Kazuo
Uchiyama Ban Nishimura Kamono Takahashi