Slater Matsil, LLP
Contact area design for solder bonding
A package component includes a dielectric layer and a metal pad over the dielectric layer. A plurality of openings is disposed in the metal pad. The first plurality of openings is separated from each other by portions of the metal pad, with the portions of the metal pad interconnected to form a continuous metal region.
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Feng Chen-Shien Pei-Chun Tin-Hao
Chen Chen Tsai Kuo