Slater Matsil, LLP
Integrated fan-out package including voltage regulators and methods forming same
A method includes adhering a voltage regulator die over a carrier through a die-attach film, with the die-attach film being in the voltage regulator die and encircles metal pillars of the voltage regulator die, encapsulating the voltage regulator die in an encapsulating material, and planarizing the encapsulating material. A back portion of the voltage regulator die is removed to expose a through-via in a semiconductor substrate of the voltage regulator die. The method further includes forming first redistribution lines over the encapsulating material and electrically coupled to the through-via, replacing the die-attach film with a dielectric material, forming second redistribution lines on an opposite side of encapsulating material than the first redistribution lines, and bonding an additional device die to the second redistribution lines. The voltage regulator die is electrically coupled to the additional device die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional additional inventional inventional additional additional additional additional inventional additional inventional inventional additional additional inventional additional inventional additional inventional additional inventional additional inventional inventional additional inventional inventional additional additional inventional additional inventional additional inventional additional inventional
Chih-Yuan Chuei-Tang Jeng-Shien Chen-Hua
Chang Wang Hsieh Yu