Tung & Associates
Method for tape automated bonding to composite bumps
 A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder. 
Industrial Technology Research Institute
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Yu-Chi Shyuan-Jeng Pao-Yun Su-Yu Shyh-Ming Jen-Huang
Lee Ho Tang Fang Chang Jeng