Haynes and Boone, LLP
Butted contacts and methods of fabricating the same in semiconductor devices
A semiconductor structure includes a metal gate structure disposed over a semiconductor substrate, a gate spacer disposed on a sidewall of the metal gate structure, an source/drain contact disposed over the semiconductor substrate and separated from the metal gate structure by the gate spacer, and a contact feature coupling the metal gate structure to the source/drain contact. The contact feature may be configured to include a dielectric layer disposed on a metal layer, where the dielectric layer and the metal layer are defined by continuous sidewalls.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Jia-Chuan Yu-Ming Tien-Lu Chih-Hao Chia-Hao
You Lin Lin Wang Chang