Birch, Stewart, Kolasch & Birch, LLP
Die paddle for receiving an integrated circuit die in a plastic substrate
A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.
Silicon Integrated Systems Corp.
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Wei-Chi Wei-Feng Chung-Ju
Liu Lin Wu