Lee & Morse, P.C.
CMP slurry composition for metal wiring and polishing method using the same
A CMP slurry composition for polishing a metal wire and a polishing method, the CMP slurry composition including polishing particles; an oxidant; a complexing agent; a corrosion inhibitor; and deionized water, wherein the corrosion inhibitor includes an inorganic nitrite or ammonium nitrate.
SAMSUNG SDI CO., LTD.
C C H C
C23F C23F H01L C09G
inventional inventional inventional inventional
Keun Bong Young Chul Kang Su So Hyung Dong Jin
Do Jung An Lee Kim