WPAT, P.C., Intellectual Property Attorneys
Apparatus for polarizing a semiconductor wafer and method for fabricating a magnetic semiconductor device
The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
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H01L H01L G11C H01L H01L
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Wen-Chih Keith Kuang-Kuo Li Jim-Wei Chia-Hsun
Wang Koai Tseng Wu Chang