Maier & Maier, PLLC
Three-dimensional packaging structure and packaging method of power devices
A three-dimensional packaging structure and a packaging method of power devices. The packaging structure includes power devices, direct copper bonded substrates (i.e., DBC substrates), flexible printed circuit boards (i.e., FPC boards), bonding wires, heat dissipation substrates, decoupling capacitors, a heatsink with integrating the fan, shells, and forms a half-bridge circuit structure composed by the power devices. The power circuit structure is optimized, parasitic inductance in the commutation loop is reduced by mutual inductance cancellation, thus overvoltage and oscillation during the power device switching process can be reduced. Additionally, by using the flexible characteristic of the flexible PCB, a three-dimensional packaging structure is formed and power density is improved.
Huazhong University of Science and Technology
H H H H H H H H H H H H H H H H H H H
H05K H05K H01L H01L H05K H05K H05K H01L H05K H01L H05K H05K H01L H02M H05K H05K H01L H05K H05K
additional additional inventional additional inventional inventional inventional additional inventional inventional inventional inventional inventional additional inventional additional inventional inventional inventional
Yuxiong Zhizhao Yong Cai Yu
Li Huang Kang Chen Chen