System and method for implementing transformer on package substrate
A transformer system includes a package substrate having a surface. A plurality of electrically conductive pads are arranged in spaced apart relationship relative to each other on the substrate surface. A first winding is defined by a first electrically conductive path between a first input and a first output, the first electrically conductive path including at least one wire connected between at least one first pad pair of the electrically conductive pads. At least one electrically conductive pad of each first pad pair is at the substrate surface. A second winding is defined by a second electrically conductive path between a second input and a second output, the second electrically conductive path including at least one wire connected between at least one second pad pair of the electrically conductive pads. At least one electrically conductive pad of each second pad pair is at the substrate surface. The first and second electrically conductive paths are proximal each other to achieve a magnetic field coupling between the first and second windings so as to form a transformer.
Texas Instruments Incorporated
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See Taur Dirk James Fred Solti
Lee Leipold Salzman Peng