Slater & Matsil, L.L.P.
Apparatus and methods for semiconductor packages with improved warpage
Methods for making a substrate for semiconductor packaging with improved warpage and an apparatus. A method includes providing on a die side of a substrate at least one flip chip mounted integrated circuit die. The substrate may include through substrate vias (TSVs). An underfill is dispensed between the integrated circuit die and the substrate. Initially the underfill is left uncured. A thermal interface material is provided on the upper surface of the at least one integrated circuit die. A heat sink is mounted over the integrated circuit die and in thermal contact with the thermal interface material. A thermal cure is performed to simultaneously cure the underfill material and the thermal interface material. In another embodiment, the thermal cure may simultaneously cure an adhesive mounting the heat sink to the substrate. Solder balls are disposed on a board surface of the substrate to form a ball grid array package.
Taiwan Semiconductor Manufacturing Company, Ltd.
H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
additional additional additional inventional inventional additional inventional additional inventional additional additional inventional
Wei-Ting Yu-Chih Chien-Kuo Jing Ruei Sao-Ling
Lin Liu Chang Lu Chiu