Haynes and Boone, LLP
Semiconductor structure and manufacturing method thereof
The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional inventional inventional additional additional additional inventional additional additional additional additional additional additional inventional additional additional additional inventional additional additional additional additional additional inventional additional additional additional additional
Shih-Pei Sheng-Chau Cheng-Yuan Cheng-Hsien Kuo-Ming Yeur-Luen Ming-Che
Chou Chen Tsai Chou Wu Tu Lee