Package substrate having die pad with outer raised portion and interior recessed portion
A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.
Texas Instruments Incorporated
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Saihsi Chih-Chien Eric
Jen Ho Hsieh