Townsend and Townsend and Crew, LLP
Fabrication method of semiconductor test piece
 A fabrication method for a test piece for observing non-contact regions in a pair of bonded semiconductor substrates includes thinning one substrate of a pair of bonded semiconductor substrates, grade-polishing the thinned semiconductor substrate and the bonded semiconductor substrates to have a predetermined graded angle relative their bonded surfaces, and dry-etching an area around the bonded surfaces of the grade-polished semiconductor substrates to reveal faults. With the thusly fabricated test piece, micro non-contact regions can be simply observed and crystal faults existing on the bonded surfaces as well as in the micro non-contact regions can be easily detected. 
Korea Intstitute of Science and Technology
H H
H01L H01L
inventional additional
Yun Hi Dong Ky Nam Yang Byeong Kwon Myung Hwan Keun Ha
Lee Shin Lee Ju Oh Koh