Muncy, Geissler, Olds & Lowe, P.C.
Multi-vertical LED packaging structure
The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.
TSMC SOLID STATE LIGHTING LTD.
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inventional inventional inventional additional inventional inventional
Chun-Chih Hsin-Hsien Min-Sheng Hsiao-Wen Jui-Ping
Chang Lee Wu Lee Weng