J.C. Patents
Structure of substrate
A substrate having a metallic panel and an insulator is provided. The metallic panel comprises two patterned metallic layers. The two patterned metallic layers are disposed on the respective sides of the metallic panel and connected with each other. The metallic panel has an upper surface and a lower surface. The heat dissipating pathway between the upper and the lower surface is constructed using a metal. The insulator is positioned in the gaps between the patterned metallic layers.
Unimicron Technology Corp.
H H H H H H H H H H H H H H H
H01L H01L H05K H05K H05K H01L H01L H01L H05K H01L H01L H01L H01L H01L H05K
additional additional additional inventional inventional additional additional additional additional additional additional additional additional inventional additional
Chih Ming Tzyy-Jang Cheng Po Chung W.
Chang Tseng Yu Ho