Merchant & Gould P.C.
Packaging structures for metallic bonding based opto-electronic device and manufacturing methods thereof
The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.
NUCTECH COMPANY LIMITED Tsinghua University
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Ziran Qingjun Yaohong Nan Zhiqiang Huishao Shuwei Wenjian Xiang Yuanjing Yinong
Zhao Zhang Liu Bai Chen He Li Zhang Zou Li Liu