Servilla Whitney LLC
Method for conformal treatment of dielectric films using inductively coupled plasma
Disclosed are apparatus and methods for processing a substrate. The substrate having a feature with a layer thereon is exposed to an inductively coupled plasma which forms a substantially conformal layer.
Applied Materials, Inc.
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Matthew Scott Heng Malcom J. Wei Christopher S. Johanes F. David
Rogers Pan Bevan Liu Olsen Swenberg Chu