St. Onge Steward Johnston & Reens LLC
IC card and manufacturing method thereof
An IC card includes an antenna circuit pattern formed on an insulation film and having a wire-shaped antenna portion, a portion corresponding to a chip bump of a combi-chip, and an attachment portion to which an external contact pad is attached. The combi-chip is attached to a portion corresponding to the chip bump of the combi-chip module on the antenna circuit pattern. At least one dielectric layer is attached to the antenna circuit pattern. An external contact pad is inserted in a hole formed in part of the dielectric layer and attached to the hole and has terminals formed in an outer surface and an inner surface of a substrate and connected to one another. The terminals on the inner surface contact the attachment portion is provided on the antenna circuit pattern.
Samsung Techwin Co., Ltd.
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G06K H01L H05K H01L H01L G06K H01L H01L H05K H01L H01L H05K H01L H01L H01L H01L H01L H01L H01L G06K H01L G06K
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Seung-seob Chang-gyoo Deok-heung
Lee Kim Kim