McDermott, Will & Emery
Cu/Mo/Cu clad mounting for high frequency devices
 The semiconductor package and manufacturing method thereof whereby the inexpensive package of high thermal conductivity is obtained by applying a Cu/Mo/Cu clad material for a base plate which matches the thermal expansion of a semiconductor chip, and the inexpensive package with high heat transfer suitable for a high frequency device is obtained by controlling a thickness of glass, and a size of a lead (width, thickness), thereby to match impedance of a wiring portion with that of the semiconductor chip, by plating only necessary areas with Au, and by plating the exterior with Sn. 
Mitsubishi Denki Kabushiki Kaisha
H H H H H H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional
Kenji Tosihiro Masanobu Mitsuyuki Isao Hirotugu
Kagata Fusayasu Kohara Takada Kitamura Yamada