Birch, Stewart, Kolasch & Birch, LLP
Die stacking method
A die stacking method is provided. The die stacking method includes executing a manufacturing recipe, and loading an interposer-die mapping file according to the manufacturing recipe. The interposer-die mapping file corresponds to an interposer wafer including interposer dies. The die stacking method also includes loading a combination setting data according to the interposer-die mapping file, and loading a top die number and a top-die ID code of a top-die mapping file according to the combination setting data and the interposer-die mapping file. The top-die ID code corresponds to a top wafer including top dies, and the top die number corresponds to one of the top dies. The die stacking method also includes disposing the one of the top dies of the top wafer on one of the interposer dies of the interposer wafer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H H H H H H
H01L H01L H01L H01L H01L H01L
additional inventional inventional inventional additional inventional
Chang-Hsi Chih-Chan Larry Yi-Ting Chih-Chien Po-Wen Ming-I
Lin Li Jann Hu Chang Chuang Chiu