McClure, Qualey & Rodack, LLP
Wafer support device and method for removing lift pin therefrom
A wafer support device includes a susceptor, at least one lift pin, at least one lift pin support base and at least one pad. The susceptor has a bottom surface and a top surface configured to support a wafer. The susceptor has at least one through hole extending between the bottom surface and the top surface. The lift pin is at least partially telescopically received in the through hole of the susceptor. The lift pin support base has at least one coupling feature thereon. The pad is detachably coupled with the coupling feature and supports the lift pin.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
B H Y Y H H
B23B H01L Y10T Y10T H01L H01L
inventional inventional additional additional inventional inventional
Chen-Liang Zong-Han Chin-Szu Yu-Shan
Chang Hu Lee Shih