Foley & Lardner LLP
Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Mei-Lin Yu-Shun Yuan-Chun Chih-Hung Yi-Cheng Kuang-Hsiung Ko-Pu
Hsieh Hsieh Chen Hsu Hsu Chen Wu