Sherr & Jiang, PLLC
Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same
A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material.
Dongbu HiTek Co., Ltd.
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additional additional additional additional additional additional inventional additional inventional inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional
Jun-Il Sung-Jin
Kim Kim