Jiang Chyun IP Office
Solder ball fabrication process
A solder ball fabrication process for forming solder balls over a wafer having an active layer is provided. A plurality of patterned solder mask layers is sequentially formed over the active surface of the wafer. Each patterned solder mask layer has at least an opening that exposes a solder ball pad on the wafer. The opening of the patterned solder mask layers further away from the solder ball pad is larger in diameter than the opening of the patterned solder mask close to the solder ball pad. Solder material is deposited into the openings and a reflow process is conducted to melt the solder material together so that a solder ball is formed over the solder ball pad.
Advanced Semiconductor Engineering, Inc.
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inventional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional
Min-Lung Jen-Kuang Ho-Ming Chao-Fu Yu-Chen Yung-Chi Chun-Chi Jau-Shoung Ching-Huei
Huang Fang Tong Weng Chou Lee Lee Chen Su