Fay Sharpe LLP
Bare die integration with printed components on flexible substrate
A hybrid electronic assembly includes a substrate having conductive circuit tracings, and includes at least one opening defined within length and width dimensions of the substrate. An electronic circuit component which has conductive circuit tracings, and is located within the at least one opening of the substrate. An alignment area where a first surface of the substrate and a first surface of the electronic circuit component are aligned in a substantially planar flat relationship with the electronic circuit component. A non-alignment area where a second surface of the substrate and a second surface of the electronic circuit component are in a non-aligned relationship. A bonding material formed on at least a portion of the second surface of the substrate and on at least a portion of the electronic circuit component and where conductive traces are formed between the first surface of the substrate and the first surface of the electronic circuit component, providing electrical connections between the substrate and the electronic circuit component.
PALO ALTO RESEARCH CENTER INCORPORATED
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Gregory L. Ping Brent S.
Whiting Mei Krusor