McDermott Will & Emery LLP
Method and apparatus of fabricating semiconductor device
An object is to provide a semiconductor device in which uniform properties are intended and high yields are provided. Process steps are provided in which variations are adjusted in doping and annealing process steps that are subsequent process steps so as to cancel in-plane variations in a substrate caused by dry etching to finally as well provide excellent in-plane consistency in a substrate.
Panasonic Corporation
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inventional inventional additional additional
Katsumi Bunji Tomohiro Ichiro Hiroyuki Yuichiro Cheng-Guo Hisataka
Okashita Mizuno Okumura Nakayama Ito Sasaki Jin Kanada