JCIPRNET
Semiconductor packages with shortened talking path
Semiconductor packages are disclosed. A semiconductor package includes an integrated circuit, a first die and a second die. The first die includes a first bonding structure and a first seal ring. The first bonding structure is bonded to the integrated circuit and disposed at a first side of the first die. The second die includes a second bonding structure. The second bonding structure is bonded to the integrated circuit and disposed at a first side of the second die. The first side of the first die faces the first side of the second die. A first portion of the first seal ring is disposed between the first side and the first bonding structure, and a width of the first portion is smaller than a width of a second portion of the first seal ring.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional additional inventional inventional additional additional inventional additional additional inventional additional inventional inventional inventional additional additional additional additional inventional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional inventional additional additional additional inventional additional
Jie Chih-Chia Hsien-Wei Ming-Fa
Chen Hu Chen Chen