Duane Morris LLP
Bead for 2.5D/3D chip packaging application
An integrated circuit package having a multilayer interposer has one or more metal wiring beads provided in the interposer, each of the one or more metal wiring beads has a convoluted wiring pattern that is formed in one of the multiple layers of wiring structures in the interposer, and two terminal end segments connected to the power lines in the integrated circuit package, wherein the one or more metal wiring beads operate as power noise filters.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Chewn-Pu Chuei-Tang Feng Wei Der-Chyang Huan-Neng
Jou Wang Kuo Yeh Chen