Posz & Bethards, PLC
Pressure sensor using resin adhesive between sensor element and stem
In a pressure sensor made by bonding a sensor chip and a metal stem together with a resin adhesive, fluctuation of the sensor output caused by temperature changes are maximally reduced. The resin adhesive for bonding together the sensor element and the metal stem has a creep characteristic defined as CR=A&times;&sgr;B between its creep rate CR and stress &sgr; upon it with A and B being constants. The resin adhesive is selected to satisfy that the constant B is not greater than 3.5.
Denso Corporation
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inventional inventional inventional
Hiroaki Yasutoshi
Tanaka Suzuki