Hauptman Ham, LLP
Semiconductor package and method for manufacturing the same
Disclosed is a semiconductor package including: a base substrate provided with at least one cavity and made of a metallic material; at least one semiconductor chip mounted in the cavity; and a heat dissipating member arranged in a gap between an inner surface of the cavity and the semiconductor chip.
KOREA ELECTRONICS TECHNOLOGY INSTITUTE
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Jong Min Dong Su Jun Chul
Yook Kim Kim