McClure, Qualey & Rodack, LLP
Semiconductor device and manufacturing method thereof
A semiconductor device includes a substrate, an inter-layer dielectric layer, a contact plug, and a contact hole liner. The substrate has a source/drain region. The inter-layer dielectric layer is over the substrate and has a contact hole therein. The contact plug is electrically connected to the source/drain region through the contact hole of the inter-layer dielectric layer. The contact hole liner extends between the contact plug and a sidewall of a first portion of the contact hole. The contact hole liner terminates prior to reaching a second portion of the contact hole. The first portion is between the second portion and the source/drain region.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Kuo-Hua Hua-Feng Wen-Che Min-Yann
Pan Chen Tsai Hsieh