IPUSA, PLLC
Wiring board and method of manufacturing wiring board
A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.
SHINKO ELECTRIC INDUSTRIES CO., LTD.
C H H C C H H C C
C25D H01F H01F C23C C25D H01F H01F C25D C25D
inventional inventional additional additional inventional inventional additional inventional inventional
Tomoharu
Fujii