Slater & Matsil, L.L.P.
Automatically adjusting baking process for low-k dielectric material
A method includes etching a low-k dielectric layer on a wafer to form an opening in the low-k dielectric layer. An amount of a detrimental substance in the wafer is measured to obtain a measurement result. Process conditions for baking the wafer are determined in response to the measurement result. The wafer is baked using the determined process conditions.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Shwang-Ming Keng-Chu Chung-Chi Chia-Cheng
Jeng Lin Ko Chou