Mori & Ward, LLP
Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
According to one aspect of the present invention, a lead-free solder alloy includes 2% by mass or more and 3.1% by mass or less of Ag, more than 0% by mass and 1% by mass or less of Cu, 1% by mass or more and 5% by mass or less of Sb, 3.1% by mass or more and 4.5% by mass or less of Bi, 0.01% by mass or more and 0.25% by mass or less of Ni, and Sn.
TAMURA CORPORATION
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Daisuke Masaya Yurika Takeshi Atsushi Tsukasa
Maruyama Arai Munekawa Nakano Hori Katsuyama