JCIPRNET
Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
A semiconductor package structure and manufacturing method thereof are provided. The semiconductor package structure includes a package structure and a rigid-flexible substrate. The package structure includes semiconductor dies, a molding compound and a redistribution layer. The molding compound laterally encapsulates the semiconductor dies. The redistribution layer is disposed at a front side of the semiconductor dies and electrically connected to the semiconductor dies. The rigid-flexible substrate is disposed at a side of the redistribution layer opposite to the semiconductor dies, and includes rigid structures, a flexible core and a circuit layer. The rigid structures respectively have an interconnection structure therein. The interconnection structures are electrically connected to the redistribution layer. The flexible core laterally penetrates and connects the rigid structures. The circuit layer is disposed over a surface of the flexible core, and electrically connected with the interconnection structures.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jiun-Yi Chen-Hua Chih-Yuan Chuei-Tang Tin-Hao Jeng-Shien Chung-Shi
Wu Yu Chang Wang Kuo Hsieh Liu