JCIPRNET
Cryogenic integrated circuits
Cryogenic integrated circuits are provided. A cryogenic integrated circuit includes a thermally conductive base, a data processor, a storage device, a buffer device, a thermally conductive shield and a cooling pipe. The data processor is located on the thermally conductive base. The storage device is located on the thermally conductive base and disposed aside and electrically connected to the data processor. The buffer device is disposed on the data processor. The thermally conductive shield covers the data processor, the storage device and the buffer device. The cooling pipe is located in physical contact with the thermally conductive base and disposed at least corresponding to the data processor.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chao-Ching Yu-Sheng Jin Hung-Li Tzu-Chiang
Cheng Chen Cai Chiang Chen