Harness, Dickey & Pierce, P.L.C.
Apparatus for treating substrate
Provided is a substrate treatment apparatus using plasma. The substrate treatment apparatus includes a housing having an inner space in which a substrate is treated, a support member disposed within the housing to support the substrate, a gas supply unit supplying a gas into the housing, a plasma source generating plasma from the gas supplied into the housing, and a baffle unit disposed to surround the support member within the housing, the baffle unit including a baffle in which through holes for exhausting the gas into the inner space of the housing are defined. The baffle is divided into a plurality of areas when viewed from an upper side, and each of portions of the plurality of areas is formed of a metallic material, and each of the other portions of the plurality of areas is formed of a nonmetallic material.
Semes Co., Ltd.
H C H H
H01J C23C H01L H01J
inventional additional inventional inventional
Hyung Je Hyung Joon Seung Pyo
Woo Kim Lee