McAndrews, Held & Malloy, Ltd.
Semiconductor package and manufacturing method thereof
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
Amkor Technology, Inc.
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Min Chul Jae Ung KooWoong EunNaRa Byong Jin Chang Hun Yung Woo Wook Dong Hyun Ho Jeong Ji Hyun
Shin Lee Jeong Cho Kim Kim Lee Choi Bang Lim Kim