Muncy, Geissler, Olds & Lowe, P.C.
Electronic device casing including coupling structure and method of manufacturing same
A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.
Sunteng New Technology Co., Ltd.
Y B B B H B B H
Y10T B29C B29C B29C H05K B29C B29L H05K
additional inventional additional additional inventional inventional additional inventional
Wen-Cheng
Wang