Hauptman Ham, LLP
Polishing pad and method of using
A polishing pad includes a first region having a first geometric property and a first material property. The polishing pad further includes a second region having a second geometric property and a second material property, wherein the second region is closer to an edge of the polishing pad than the first region. The first geometric property is different from the second geometric property; or the first material property is different from the second material property.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Shih-Sian ChunHung Sheng-Chen Jung-Yu
Huang Chen Wang Li