Tung & Associates
Interdigitated capacitor and method for fabrication thereof
A capacitor for use within a microelectronic product employs a first capacitor plate layer that includes a first series of horizontally separated and interconnected tines. A capacitor dielectric layer separates the first capacitor plate layer from a second capacitor plate layer. The second capacitor plate layer includes a second series of horizontally separated and interconnected tines horizontally interdigitated with the first series of horizontally separated and interconnected tines. The capacitor is formed employing a self-aligned method and the capacitor dielectric layer is formed in a serpentine shape.
Taiwan Semiconductor Manufacturing Co Ltd
H H
H01L H01L
additional inventional
Denny Li-Shyue Wen-Chin Chung-Long Chun-Hon
Tang Lai Lin Chang Chen