Townsend and Townsend and Crew LLP
Method for operating chemical mechanical polishing (“CMP”) tool for the manufacture of semiconductor devices
A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
Semiconductor Manufacturing International (Shanghai) Corporation
B B Y
B24B B24B Y10S
inventional inventional additional
Yuan Hsin Chien Hua Xiao Hua
Peng Chen Li