Weaver Austin Villeneuve & Sampson LLP
Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation
Methods and apparatuses for passivating a fin field effect transistor (FinFET) semiconductor device and performing a gate etch using integrated atomic layer deposition (ALD) and etch processes are described herein. Methods include performing a partial gate etch, depositing a passivation layer on exposed surfaces of semiconductor fins and a gate layer by ALD, and performing a final gate etch to form one or more gate structures of the FinFET semiconductor device. The etch, deposition, and etch processes are performed in the same plasma chamber. The passivation layer is deposited on sidewalls of the gate layer to maintain a gate profile of the one or more gate structures during etching.
Lam Research Corporation
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Zhaohong Xiang Yoshie Ganesh Weiye Noel Seokhwan
Han Zhou Kimura Upadhyaya Zhu Sun Lee