Blakely Sokoloff Taylor & Zafman LLP
Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same
Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.
Samsung Electro-Mechanics Co., Ltd.
B B B B H Y Y Y H Y B H Y B Y B B H Y Y Y Y B Y B
B32B B32B B32B B32B H05K Y10T Y10T Y10T H05K Y10T B32B H05K Y10T B32B Y10T B32B B32B H05K Y10T Y10T Y10T Y10T B32B Y10T B32B
inventional inventional inventional additional additional additional additional additional inventional additional inventional additional additional inventional additional inventional inventional inventional additional additional additional additional inventional additional inventional
Seok Kyu Ki Hwan Jae Joon Jin Yong Suk Hyeon
Lee Kim Lee Ahn Cho