Novak Druce Connolly Bove + Quigg LLP
Electronic device enclosure
The electronic device enclosure includes a case and a cooling assembly. The case includes a top plate, a bottom plate, a side plate and a mounting plate. The top plate is opposite to the bottom plate, and the side plate is substantially perpendicularly connected to the top plate and the bottom plate. The cooling assembly includes a cooler and a fan secured to the cooler. The mounting plate is secured to the top plate and the bottom plate, the fan is secured to the mounting plate and located between the mounting plate and the cooler.
Hong Fu Jin Precision Industry (WuHan) Co., Ltd. Hon Hai Precision Industry Co., Ltd.
G
G06F
inventional
Wei-Yong Chung Yun-Lung
Ma Chai Chen