Sughrue Mion, PLLC
Semiconductor package
A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.
SAMSUNG ELECTRONICS CO., LTD.
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Pyung Hwa Jung Soo Sung Hawn Won
Han Kim Bae Choi