Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Metal film polishing pad and method for polishing metal film using the same
The invention provides a polishing pad to polish a metal layer. The polishing pad has a storage elastic modulus at 80° C. of 200 to 900 MPa and a storage elastic modulus at 110° C. of 40 MPa or less. The invention also provides a method of polishing a metal layer using the pad.
Kuraray Co., Ltd.
C H C C C C C B
C08G H01L C08G C08G C08G C08G C08G B24B
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Hirofumi Shinya Mitsuru Chihiro
Kikuchi Kato Kato Okamoto