McGuireWoods LLP
Composition for positive photoresist
A photoresist composition is provided. The photoresist composition includes a polymer resin for forming a photoresist layer, a photosensitive chemical for changing solubility of the photoresist layer when exposed to some form of radiation, and 3-methoxybutyl acetate, 2-heptanone, and 4-butyrolactone as a solvent. The composition has a good photosensitivity and remainder ratio, and no unpleasant odor.
Samsung Electronics Co., Ltd.
G G
G03F G03F
inventional inventional
Hong-Sik Yun-Jung Yu-Kyung Jin-Ho Sung-Chul Ki-Soo
Park Nah Lee Ju Kang Kim