Lee & Morse, P.C.
Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same
A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
EHWA Diamond Industrial Co., Ltd. SAMSUNG ELECTRONICS CO., LTD.
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Hyo-san Seh-kwang Joo-han Sung-oh Myung-ki Sun-gyu Kyu-min Yung-jun Chan-ki
Lee Lee Lee Park Hong Park Oh Kim Yang