Jiang Chyun IP Office
Solder paste for fabricating bump
A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 &mgr;m and the average size of the metallic granules is 35 &mgr;m to 45 &mgr;m.
Advanced Semiconductor Engineering, Inc.
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H01L H01L B23K H01L H01L H01L H01L H01L H05K H05K H01L H01L H01L H01L H05K B23K H01L H01L H01L H01L B23K
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Jen-Kuang Yung-Chi Ho-Ming Shyh-Ing Tsung-Hua Chun-Hung Su Shih-Kuang Yu-Chen Chun-Chi Ching-Fu
Fang Lee Tong Wu Wu Lin Tao Chen Chou Lee Horng