Slater Matsil, LLP
Package with a fan-out structure and method of forming the same
An embodiment is a device comprising a semiconductor die, an adhesive layer on a first side of the semiconductor die, and a molding compound surrounding the semiconductor die and the adhesive layer, wherein the molding compound is at a same level as the adhesive layer. The device further comprises a first post-passivation interconnect (PPI) electrically coupled to a second side of the semiconductor die, and a first connector electrically coupled to the first PPI, wherein the first connector is over and aligned to the molding compound.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Jui-Pin Chin-Chuan Jing-Cheng Yi-Chao
Hung Chang Lin Mao