Novak Druce Connolly Bove + Quigg LLP
Flip chip light emitting diode packaging structure
A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Hou-Te Chao-Hsiung Lung-Hsin Pin-Chuan
Lin Chang Chen Chen