Coreless substrate having filled via pad and method of manufacturing the same
Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy.
Samsung Electro-Mechanics Co., Ltd.
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Seok Kyu Soon Jin Jong Kuk Soon Oh
Lee Cho Hong Jung