Mei & Mark LLP
Method for fabricating microfluidic devices in fused silica by picosecond laser irradiation
Method of fabricating a microfluidic device by means of inducing internal cracks in fused silica employing a picosecond laser beam, firstly utilizing irradiation of a focused temporally controlled picosecond laser beam in fused silica to generate a spatially selective modification region including randomly oriented nanocracks, then employing chemical etching to remove the irradiated area and obtain a hollow and connected three-dimensional microstructure, thereby achieving three-dimensional fabrication of microchannel structures inside the fused silica. The method can realize polarization insensitive three-dimensional uniform etching by regulating the pulse width of the picosecond laser beam, and has high chemical etch rate and selectivity, applicable for fabrication of large-sized three-dimensional microfluidic systems, high-precision 3D glass printing, etc.
East China Normal University
B B B B B B C B B B C C B B
B23K B01L B81C B23K B01L B23K C03C B23K B23K B23K C03C C03C B81C B23K
inventional inventional inventional inventional additional inventional inventional inventional additional inventional inventional inventional inventional inventional
Xiaolong Jian Ya
Li Xu Cheng