Grossman Tucker Perreault & Pfleger, PLLC
Fabrication method of two-terminal semiconductor component using trench technology
A method of fabricating a two-terminal semiconductor component using a trench technique is disclosed that includes forming a trench by etching an etching pattern formed on a substrate on which an active layer having impurities added is grown, forming a front metal layer on a front upper surface of the substrate by using an evaporation method or a sputtering method after removing the etching pattern, forming a metal plated layer on the front surface of the substrate on which the front metal layer is formed, polishing a lower surface of the substrate by using at least one of a mechanical polishing method and a chemical polishing method until the front metal layer is exposed, forming a rear metal layer on the polished substrate, and removing each component by using at least one of a dry etching method and a wet etching method.
Dongguk University Industry—Academic Corporation Foundation
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Wan-Joo Mi-Ra Jin-Koo Dae-Hong Seong-Dae
Kim Kim Rhee Min Lee