Slater Matsil, LLP
Metal cap apparatus and method
A method of forming a metal layer may include forming an opening in a substrate; forming a liner over sidewalls of the opening; filling the opening with a first metal; etching a top surface of the first metal to form a recessed top surface below a top surface of the substrate; and exposing the recessed top surface of the first metal to a solution, the solution containing a second metal different from the first metal, the exposing causing the recessed top surface of the first metal to attract the second metal to form a cap layer over the recessed top surface of the first metal.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Liang-Yueh Chih-Yi Chen-Yuan Hung-Wen
Ou Yang Chang Kao Su