Fitzpatrick, Cella, Harper & Scinto
Polishing apparatus and method
 In order to efficiently polish a large-area member to be polished to a desired shape, a polishing apparatus includes a first polishing station including a first holding unit for holding a member to be polished in a state in which a surface to be polished thereof is upwardly placed, and a first polishing head for holding and rotating a polishing pad whose polishing surface is larger than the surface to be polished in a state of contacting the surface to be polished, a detection station for detecting a polished state of the surface to be polished in a state in which the surface to be polished is upwardly placed, and a second polishing station including a second holding unit for holding the member to be polished in a state in which the surface to be polished thereof is upwardly placed, and a second polishing head for holding and rotating a polishing pad whose polishing surface is smaller than the surface to be polished in a state of contacting the surface to be polished. 
Canon Kabushiki Kaisha
B B B B
B24B B24B B24B B24B
inventional inventional inventional inventional
Osamu Matsuomi Satoshi Kazuo Takashi
Ikeda Nishimura Ohta Takahashi Kamono