IP & T Group LLP
Multi-chip package and method of testing the same
A multi-chip package may include a controller, a storage memory and a buffer memory. The controller may be configured to output a control signal. The storage memory may be tested in response to the control signal. The buffer memory may be sequentially tested while or after testing the storage memory in response to the control signal.
SK hynix Inc.
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Seung Yeol
Lee