Wenderoth, Lind & Ponack, L.L.P.
Method of manufacturing three-dimensional printed wiring board
An efficient method of manufacturing a three-dimensional printed wiring board is provided in which a conductor foil can be reliably heat-fused to the board at a relatively low temperature and the three-dimensional shape such as convex and concave of a mold can be reproduced precisely with no residual stress.The method comprises the steps of providing a filmy insulator comprising a thermoplastic resin composition containing 65-35 wt % of a polyaryl ketone resin having a crystal-melting peak temperature of 260&deg; C. or over, and 35-65 wt % of an amorphous polyetherimide resin, and having a glass transition temperature as measured when the temperature is increased for differential scanning calorie measurement of 150-230&deg; C. superposing a conductor foil on one or both sides of the filmy insulating member, heat-fusing the conductor foil so that the thermoplastic resin composition will satisfy the relation between the crystal-melting calorie &Dgr; Hm and the crystallizing calorie &Dgr; Hc as expressed by the following formula (I), etching the conductor foil to form a conductor circuit, and deforming the printed wiring circuit obtained three-dimensionally.[(&Dgr;Hm&#8722;&Dgr;Hc)/&Dgr;Hm]&lE;0.5&#8195;&#8195;(I):[(&Dgr;Hm&#8722;&Dgr;Hc)/&Dgr;Hm]&gE;0.7&#8195;&#8195;(II):
Mitsubishi Plastics Inc. Denso Corporation
Y H H Y Y H H H H H H H H
Y10T H05K H05K Y10T Y10T H01K H05K H05K H05K H05K H05K H05K H05K
additional inventional additional additional additional inventional inventional additional additional additional additional additional additional
Koichiro Shingetsu Kazuya Jun Makoto Kaoru Toshihiro
Taniguchi Yamada Sanada Takagi Totani Nomoto Miyake