Steven Reiss
Method for manufacturing fingerprint identification modules
A method for manufacturing a plurality of fingerprint identification modules simultaneously is provided. A first thin film and a second thin film are formed on a first transfer base and a second transfer base respectively. The first thin film and the second thin film are cut respectively to form a plurality of first thin film units and a plurality of second thin film units. The first transfer base and the second transfer base are adhered on opposite surfaces of a substrate. The first thin film units and the second thin film units are cut respectively to form a plurality of the first piezoelectric layers and a plurality of the second piezoelectric layers. A plurality of first slits and a plurality of second slits are formed on opposite surfaces of the substrate for breaking the mother base into the fingerprint identification modules.
MiiCs & Partners Inc.
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inventional additional additional inventional inventional
Juan
Wang