Slater Matsil, LLP
Interconnect structure and method
A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Chih-Chien Po-Cheng Chia-Cheng Jun-Yi Tze-Liang Chen-Yuan Chung-Chi Yao-Jen Kai-Shiang
Chi Shih Chou Ruan Lee Kao Ko Chang Kuo