Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Polishing pad
To provide a polishing pad (14) useful for polishing semiconductor materials having a high hardness. The polishing pad (14) is used for polishing a workpiece (16) in combination with loose grains and comprises a polishing surface (15) comprising a textile of high-tenacity organic fibers, the fiber has a tenacity of not lower than 15 cN/dtex. In the textile, the high-tenacity organic fiber may have a single fiber fineness within the range between 0.3 dtex and 15 dtex, or a total fineness of within the range between 3 dtex and 3,000 dtex. The fiber may include, for example, a fully-aromatic polyester fiber.
Maruishi Sangyo Co., Ltd. Kuraray Co., Ltd.
B D B
B24B D03D B24D
inventional inventional inventional
Takashi Yukio Shinya Toshiyasu Tetsuya
Katayama Goto Kato Yajima Watanabe