Lee IP Law, P.C.
Redistribution substrate, method of manufacturing the same, and semiconductor package including the same
A redistribution substrate includes a first conductive pattern including a first lower pad and a second lower pad, the first and second lower pads being within a first insulating layer, a second conductive pattern including a first upper pad and a second upper pad, the first and second upper pads being on the first insulating layer, a first via connecting the first lower pad and the first upper pad to each other in the first insulating layer, a second via connecting the second lower pad and the second upper pad to each other in the first insulating layer, and a capacitor between the first lower pad and the first via.
SAMSUNG ELECTRONICS CO., LTD.
H H H H H H H H H H H
H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L H01L
inventional inventional additional inventional additional inventional inventional inventional inventional additional inventional
Seokhyun
Lee