Myers Bigel, P.A.
Heat sink and memory module having the same
A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.
Samsung Electronics Co., Ltd.
H H F F F F F
H05K H05K F28F F28F F28D F28F F28D
inventional inventional inventional additional additional inventional inventional
Ji-Yong Yu-Sung Sung-Ki Chung-Hyun
Kim Kim Lee Ryu