Maschoff Brennan
CIS structure with complementary metal grid and deep trench isolation and method for manufacturing the same
A CMOS image sensor structure includes a substrate and pixel portions. Each pixel portion includes intersection areas, the border areas each of which is located between any two adjacent ones of the intersection areas, and a central area surrounded by the intersection areas and the border areas. Each pixel portion includes a device layer, an anti-reflective coating layer, discrete reflective structures, discrete metal blocking structures, a passivation layer and a color filter. The device layer is disposed on the substrate. Trenches are formed in the device layer and the substrate corresponding to the border areas respectively. The anti-reflective coating layer conformally covers the device layer, the substrate and the trenches. The reflective structures are disposed in the trenches. The metal blocking structures overly the anti-reflective coating layer in the intersection areas. The passivation layer conformally covers the metal blocking structures. The color filter is disposed on the passivation layer.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Chun-Hao Kuo-Cheng Yun-Wei Yung-Lung Tsung-Han Bo-Tsung
Chou Lee Cheng Hsu Tsai Tsai