Lerner, David, Littenberg, Krumholz & Mentlik, LLP
Compact microelectronic assembly having reduced spacing between controller and memory packages
A microelectronic package has terminals at a surface of a substrate having first and second half areas, each half area extending from a diagonal that bisects the first surface and a respective opposite corner of the first surface. Terminals for carrying data and address information in the first half area provide first memory channel access to a first memory storage array, and terminals for carrying data and address information in the second half area provide second memory channel access to a second memory storage array. The package may include first and second microelectronic elements overlying a same surface of the substrate which may be stacked in transverse orientations.
Invensas Corporation
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Zhuowen Yong
Sun Chen