Rabin & Berdo, PC
Carrier
A carrier is provided. The carrier is bonded with a substrate having a number of contact pads through an anisotropic conductive film by thermocompression. The carrier includes a base and a number of leads, wherein the base has a base's surface on which a number of indented patterns are disposed. The leads are disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns; meanwhile, part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded to the substrate by thermocompression.
Au Optronics Corp.
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Chun-Yu Hui-Chang
Lee Chen