Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Semiconductor integrated circuit device having multilevel interconnection
One via contact through which upper and lower interconnections of a multilevel interconnection are connected to each other is provided when the width or volume of the lower interconnection is not larger than a given value. A plurality of via contacts are arranged at regular intervals, each of which is not larger than a given value, in an effective diffusion region of voids included in the lower interconnection, when the width or volume of the lower interconnection exceeds a given value.
Kabushiki Kaisha Toshiba
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additional inventional inventional inventional
Kenji Koji Hisashi
Yoshida Miyamoto Kaneko