McDermott Will & Emery LLP
Wirebond pad for semiconductor chip or wafer
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
Megica Corporation
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additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional inventional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional additional additional
Michael Mark Chien-Kang Mou-Shiung
Chen Chou Chou Lin