McCormick, Paulding & Huber LLP
Grounding device for bundled cables
A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.
Times Microwave Systems, Inc.
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additional additional inventional
Yunchuan Wei Raymond Jun Tao Xin Jason Paul Kevin Tai
Zhu Wang Allard Zhang Duan Fu Zhu Merola Moyher Qui