Jianq Chyun IP Office
Electronic device package and package method thereof
An electronic device package including a substrate, a base film, a first seal, an electronic device and a second seal is provided. The first seal is disposed between the substrate and the base film and partially exposed by the base film. The electronic device is formed on the base film. The second seal disposed on the electronic device includes absorbents. A part of the second seal adheres to a part of the first seal exposed by the base film. The first seal and the second seal encapsulate the base film and the electronic device. The first seal and the second seal are the same host materials. A packaging method of an electronic device package is also provided.
Industrial Technology Research Institute
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Chih-Ming Hsuan-Yu Wen-Hong Hsin-Chu
Lai Lin Liu Chen