Lowe Hauptman & Ham, LLP
Capacitor for interposers and methods of manufacture thereof
Capacitor designs for substrates, such as interposers, and methods of manufacture thereof are disclosed. A through via is formed in the interposer, and a capacitor is formed between a lower level metallization layer and a higher level metallization layer. The capacitor may be, for example, a planar capacitor with dual capacitor dielectric layers.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Shang-Yun Shin-Puu Chun Hua Kuang-Wei Yuan-Hung Wen-Chih Der-Chyang
Hou Jeng Chang Cheng Liu Chiou Yeh