Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
Substrate structure with first and second conductive bumps having different widths
A substrate structure is provided, which includes a substrate body having a plurality of conductive pads, and a plurality of first conductive bumps and a plurality of second conductive bumps disposed on the conductive pads. Each of the second conductive bumps is less in width than each of the first conductive bumps, and is of a height with respect to the substrate body greater than a height of each of the first conductive bumps with respect to the substrate body. Therefore, the height difference between the first pre-solder layer and the second pre-solder layer after a reflow process can be compensated, and the first conductive bumps and the second conductive bumps thus have a uniform height.
Siliconware Precision Industries Co., Ltd.
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Lu-Yi Chang-Lun Yu-Chuan Chieh-Lung
Chen Lu Chen Lai