Volpe and Koenig, P.C.
Image pickup element housing package, and image pickup device
An imaging device accommodating package includes an insulating base body and an imaging device connecting pad. The insulating base body includes a lower surface, a through-hole and a bonding area on the bottom surface of the recess. The lower surface includes a recess. The through-hole is formed in a bottom surface of the recess in a perspective plan view. The bonding area is used for an imaging device. The imaging device connecting pad is formed on an upper surface of the insulating base body or on an inner surface of the through-hole.
KYOCERA CORPORATION
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Yousuke Akihiko Hiroshi
Moriyama Funahashi Yamada