Thermally insulating bonding pad structure for solder reflow connection
A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
Hitachi Global Storage Technologies, Netherlands, B.V.
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Tatsumi Toshiki Haruhide
Tsuchiya Hirano Takahashi