Jackson IPG PLLC
Method for making semiconductor electrodes
A method for making semiconductor electrodes includes provided a wafer. The wafer includes at least one conductive unit, a plurality of first connective units connected to the conductive unit, a plurality of first metal layers connected to the first connective units and a plurality of second connective units connected to the first metal layers. Photo-resist is provided on the first and second connective units. A second metal layer is provided on each of the first metal layers via using an electroplating device. The wafer is cut through the photo-resist, thus forming semiconductor electrodes.
Atomic Energy Council-Institute of Nuclear Energy Research
H C C C C
H01L C25D C25D C25D C25D
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Keng-Shen Chun-Ling Ying-Ru Chih-Hung
Liu Chang Chen Wu