Lowe Hauptman & Ham, LLP
Interconnect structure and method for forming the same
A interconnect structure includes a conductive layer formed in a dielectric layer. An adhesion layer is formed between the dielectric layer and a substrate. The adhesion layer has a carbon content ratio greater than a carbon content ratio of the dielectric layer.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Po-Cheng Yu-Yun Chia Cheng Joung-Wei
Shih Peng Chou Liou