Hunton Andrews Kurth LLP
Plasma processing apparatus
A plasma processing apparatus configured to perform plasma processing on a conductive workpiece having a flat plate shape includes: a conductive vacuum chamber having a recessed portion which is configured to cause a processing object portion of at least one side of the workpiece having a flat plate shape to be disposed in the recessed portion and a peripheral edge portion which is provided outside the recessed portion to be continuous with the recessed portion; a holding member configured to hold the workpiece to be separated and insulated from the peripheral edge portion; a voltage application unit configured to apply a voltage between the workpiece and the vacuum chamber; and an insulating layer configured to cover a portion of the peripheral edge portion facing the workpiece.
TOYOTA JIDOSHA KABUSHIKI KAISHA
H C H C H C C H C H H
H01J C23C H01J C23C H01J C23C C23F H01J C23C H01J H01J
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Noriyuki
Kato