Sinorica, LLC
Packaging method involving rearrangement of dice
A packaging method is disclosed that comprises attaching a plurality of dice, each having a plurality of bonding pads disposed on an active surface, to an adhesive layer on a substrate. A polymer material is formed over at least a portion of both the substrate and the plurality of dice and a molding apparatus is used on the substrate to force the polymer material to substantially fill around the plurality of dice. The molding apparatus is removed to expose a surface of the polymer material and a plurality of cutting streets is formed on an exposed surface of the polymer material. The substrate is removed to expose the active surface of the plurality of dice.
Chipmos Technologies (Bermuda) Ltd Chipmos Technologies Inc
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Tz-Cheng Geng-Shin Yu-Ren
Chiu Shen Chen