Slater Matsil, LLP
Semiconductor packages including routing dies and methods of forming same
In an embodiment, a package includes a first package structure including a first integrated circuit die having an active side and a back-side, the active side including die connectors, a second integrated circuit die adjacent the first integrated circuit die, the second integrated circuit die having an active side and a back-side, the active side including die connectors, a routing die including die connectors bonded to the active sides of the first integrated circuit die and the second integrated circuit die, the routing die electrically coupling the first integrated circuit die to the second integrated circuit die, an encapsulant encapsulating the first integrated circuit die, the second integrated circuit die, and the routing die, and a first redistribution structure on and electrically connected to the die connectors of the first integrated circuit die and the second integrated circuit die.
Taiwan Semiconductor Manufacturing Company, Ltd.
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additional inventional additional additional additional inventional additional inventional additional additional additional inventional additional inventional additional inventional additional additional additional additional additional additional additional inventional inventional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional additional inventional inventional additional additional additional additional additional additional inventional inventional additional additional additional inventional additional additional additional additional additional additional additional inventional additional additional additional additional additional additional additional inventional inventional additional additional inventional additional additional inventional inventional additional additional additional additional inventional additional inventional additional additional additional additional additional additional additional inventional inventional additional inventional
Jie Hsien-Wei Ying-Ju
Chen Chen Chen