Loeb & Loeb LLP
Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same
 A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material. 
Tokuriki Honten Co., Ltd. Kyocera Corporation
C H H B H C C H C C B C H C C C C H
C04B H01L H01L B23K H05K C04B C04B H01L C04B C04B B23K C04B H01L C04B C04B C04B C04B H01L
additional additional inventional inventional inventional inventional additional additional additional additional inventional additional additional additional additional additional additional additional
Koji Osamu
Nishi Watanabe