Ishimaru & Associates LLP
Integrated circuit packaging system with stacking option and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling a first integrated circuit die on the component side; coupling stacking interconnects on the component side around the first integrated circuit die; forming a package body on the component side, the first integrated circuit die, and the stacking interconnects; forming vertical insertion cavities through the package body and on the stacking interconnects; and forming a trench, in the package body, adjacent to the vertical insertion cavities for reducing a package warping stress.
STATS ChipPAC Ltd.
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SeongMin Byung Joon SeongHun
Lee Han Mun