Jiang Chyun IP Office
Bump manufacturing method
A method of forming bumps on the active surface of a silicon wafer. An under-ball metallic layer is formed over the active surface of the wafer. A plurality of first solder blocks is attached to the upper surface of the under-ball metallic layer. Each first solder block has an upper surface and a lower surface. The lower surface of each first solder block bonds with the under-ball metallic layer. The upper surfaces of the first solder blocks are planarized. A second solder block is attached to the upper surface of each first solder block and then a reflow operation is carried out.
Advanced Semiconductor Engineering, Inc.
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Chun-Chi Chao-Fu Jen-Kuang Jau-Shoung Min-Lung Yung-Chi Ching-Huei Ho-Ming
Lee Weng Fang Chen Huang Lee Su Tong