Perman & Green
Process for producing ceramic circuit structures having conductive vias
 Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate. 
International Business Machines Corporation
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Mark O. Thomas M. Peter R. Young-Ho Robert A. Edward A. Sarah H. Jon A. Friedel Farid Y. Rao Jungihl Emanuel I. Robert R. James M. Jae M. Shaji George F.
Neisser Shaw Duncombe Kim Rita Giess Knickerbocker Van Hise Muller-Landau Aoude Vallabhaneni Kim Cooper Shaw Brownlow, deceased Park Farooq Walker