Roberts Mlotkowski Safran Cole & Calderon, P.C.
Three dimensional organic or glass interposer
A three-dimensional organic structure or glass interposer structure and methods of manufacture are disclosed. The method includes forming lined metal vias in a substrate. The method further includes removing the substrate, leaving the lined metal vias. The method further includes forming a new substrate about the lined metal vias. The method also includes connecting the lined metal vias to wiring layers using back end of the line processes.
GLOBALFOUNDRIES INC.
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Melissa A. William F. Mukta G. Jin Andrew J. Kathryn E.
Smith Landers Farooq Liu Martin Schlichting