Ladas & Parry LLP
Light emitting diode package unit, method for manufacturing the same and backlight
A light emitting diode package unit, a method for manufacturing the same and a backlight are disclosed. The light emitting diode package unit comprising a LED chip and a light uniformization structure formed above the LED chip in the direction of exiting light.
Beijing Boe Optoelectronics Technology Co., Ltd.
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Haiwei Jia Site
Sun Liu Cai