Moser Taboada
Methods and apparatus for co-sputtering multiple targets
Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
APPLIED MATERIALS, INC.
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Hanbing Anantha K. Srinivas Lavinia Wei W. Ashish
Wu Subramani Guggilla Nistor Wang Goel