Haynes and Boone, LLP
Repairing monolithic stacked integrated circuits with a redundant layer and lithography process
Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes a first plurality of circuit elements where a first portion of the first plurality of circuit elements has defects. The second layer includes a second plurality of circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second plurality of circuit elements for mitigating the defects.
Taiwan Semiconductor Manufacturing Company, Ltd.
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Wei-Pin Chin-Her Ji-Jan Jung-Rung Kuan-Yu
Changchien Chien Chen Jiang Lin