Saile Ackerman LLC
Top layers of metal for integrated circuits
The present invention adds one or more thick layers of polymer dielectric and one or more layers of thick, wide metal lines on top of a finished semiconductor wafer, post-passivation. The thick, wide metal lines may be used for long signal paths and can also be used for power buses or power planes, clock distribution networks, critical signal, and re-distribution of I/O pads.
Megica Corporation
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Chien-Kang Mou-Shiung Chiu-Ming
Chou Lin Chou