Sughrue, Mion, Zinn, Macpeak & Seas, PLLC
Socket for chip package test
 A socket for a semiconductor device having solder balls includes a circuit substrate, an interposing sheet and a holder. The circuit substrate has conductive bumps on one side thereof corresponding to the solder balls, respectively. The interposing sheet has interposing electrodes through the interposing sheet corresponding to the solder balls, respectively. The diameter of each interposing electrode is greater than that of each solder ball. The holder holds the semiconductor device on the circuit substrate through the interposing sheet under a load such that the interposing electrodes electrically connects the solder balls to the conductive bumps, respectively. 
NEC Corporation
H G H H
H05K G01R H01L H01R
additional inventional additional additional
Noriaki
Kato