Foley & Lardner LLP
Semiconductor package structure and method for manufacturing the same
A semiconductor package structure includes a first substrate, at least one first semiconductor element and a second substrate. The first semiconductor element is attached to the first substrate. The second substrate defines a cavity and includes a plurality of thermal vias. One end of each of the thermal vias is exposed in the cavity, and the first semiconductor element is disposed within the cavity and thermally connected to the thermal vias.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Yu-Chang Bo-Syun Chin-Li Tang-Yuan Meng-Kai Jin-Feng
Chen Chen Kao Chen Shih Yang