Oblon, McClelland, Maier & Neustadt, L.L.P.
Semiconductor device
A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.
NuFlare Technology, Inc.
H H H H H H
H01J H01L H01J H01L H01J H01J
inventional inventional inventional inventional inventional additional
Shinsuke Kenichi Mie Hiroshi Shiro
Nabeya Kataoka Matsuo Yamashita Okada