Hauptman Ham, LLP
Method of using a polishing system
A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Chih-Jen Shih-Chi You-Hua Chen-Ming Chih-Tsung Kun-Tai Chih-Yuan Min Hao Soon-Kang Chin-Hsiang
Wu Lin Chou Huang Lee Wu Yang Hong Huang Chang