Stevens, Davis, Miller & Mosher, LLP
Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film
The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film preferably the heat treating temperature is 70-210&deg; C.
Matsushita Electric Industrial Co., Ltd.
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Tsuyoshi Matsuo Hisahiro
Tokiwa Masuda Tanaka