McKay and Hodgson, LLP
Semiconductor device having insulating and interconnection layers
A semiconductor device for use in a printed circuit board is provided. In the semiconductor device, metal pillars are disposed perpendicular to bond pads of a semiconductor die. This configuration eliminates the need to form via holes for the connection of interconnection layers and the bond pads of the semiconductor die, thus simplifying the fabrication procedure of the semiconductor device. In addition, the semiconductor die is embedded in the semiconductor device. Based on this configuration, the use of the semiconductor device in a printed circuit board facilitates the stacking of a plurality of semiconductor dies and can reduce the thickness required for the stack, which make the semiconductor device light in weight and small in thickness and size.
Amkor Technology, Inc.
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H01L H01L H01L H05K H05K
inventional additional inventional additional inventional
Kyu Won Yoon Ha Chan Yok
Lee Jung Park