Toler Law Group, PC
Electrostatic discharge diodes and methods of forming electrostatic discharge diodes
A method includes thinning a back-side of a substrate to expose a portion of a first via that is formed in the substrate. The method also includes forming a first diode at the back-side of the substrate. The first diode is coupled to the first via.
Qualcomm Incorporated
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Taehyun Vidhya Brian Matthew Chiew-Guan Jung Pill Shiqun
Kim Ramachandran Henderson Tan Kim Gu