Carrier assembly for semiconductor IC (integrated circuit) packages
A semiconductor chip package carrier assembly is provided with a tray component having depending support legs that support multiple semiconductor chip packages in open package pockets, with a cover component having depending clamping legs in open package pockets that register with the tray component open package pockets, and with snap latches that securely and removably join the cover component to the tray component in a manner whereby each contained semiconductor chip package is locked by the depending support legs and depending clamping legs in a fixed position with respect to the tray and cover components throughout all spatial orientations of the assembly.
H H
H01L H01L
inventional additional
Ching T.
Chang