Winkle, PLLC
Methods of forming substrate microvias with anchor structures
Methods of forming anchor structures in package substrate microvias are described. Those methods and structures may include forming a titanium layer in an opening of a package substrate using a first deposition process, wherein the opening comprises an undercut region, and wherein the first conductive layer does not substantially form in an anchor region of the undercut region. The titanium layer may then be re-sputtered using a second deposition process, wherein the titanium layer is formed in the anchor region.
Intel Corporation
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Sri Ranga Sai Qinglei
Boyapati Zhang