Rankin, Hill & Clark LLP
Wiring substrate and semiconductor package
A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a flat-plate shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a flat-plate shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a first signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode.
Shinko Electric Industries Co., Ltd.
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Tomoharu
Fujii