Fish & Associates, LLP
Via fill formulations which are electrically and/or thermally conductive, or non-conductive
 A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle. 
Johnson Matthey Electronics, Inc.
H H H Y Y H
H05K H05K H05K Y10T Y10T H01B
additional additional inventional additional additional inventional
Jesse L. Xiao-Qi Alan Nancy E.
Pedigo Zhou Grieve Iwamoto