Novak Druce Connolly Bove + Quigg LLP
Image sensor module and camera module using same
An image sensor module includes a ceramic substrate, an image sensor, a conductive film, a flexible print circuit board (FPCB), and a stiffening plate. The ceramic substrate includes an upper surface and a lower surface opposite to the upper surface, the ceramic substrate defines a transparent hole on the upper surface and a receiving recess on the lower surface. The transparent hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The FPCB is electrically connected to the lower surface of the ceramic substrate by the conductive film. The stiffening plate is positioned on one side of the FPCB opposite to the ceramic substrate.
Hon Hai Precision Industry Co., Ltd.
H H
H04N H04N
inventional inventional
Chien-Liang Yu-Tsan Yu-Shu Wen-Chang Shin-Wen
Chou Cheng Lin Chen Chen