Jones, Tullar & Cooper, P.C.
Printed circuit board, and prepreg for a printed circuit board
A fluororesin-impregnated adhesive layer 7 such as PFA is formed on one face or both faces of a prepreg 1 in which a fluororesin-impregnated layer 3 such as PTFE is impregnated and held into E-glass cloth 2 that serves as a basic material of the prepreg. The prepreg has a (mass of 30 g/m2 or less, and is woven by filament bundles each of which is configured by 120 or less glass filaments. Copper foil 5 is placed on the fluororesin-impregnated adhesive layer 7 to form a predetermined conductor pattern on the surface, thereby producing a printed circuit board having a thickness of 0.2 mm or less. Therefore, the printed circuit board is excellent in dielectric characteristics, electrical insulation resistance between through holes, and its long-term reliability, and superior also in flexibility. Consequently, the printed circuit board is applicable to any use such as a high-frequency circuit.
Nippon Pillar Packing Co., Ltd.
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Yasuhiko Kouji Hitoshi Toshimitsu
Ichino Ohnishi Kanzaki Tanii