Haynes and Boone, LLP
Methods of forming through silicon via openings
A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.
TSMC Solid State Lighting Ltd.
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Hsing-Kuo Hung-Yi Hsin-Hsien Chun-Lin Chyi Shyuan
Hsia Kuo Wu Chang Chern