Birch, Stewart, Kolasch & Birch, LLP
Formation method of interconnection structure of semiconductor device
Structures and formation methods of a semiconductor device structure are provided. The method includes forming a dielectric layer over a semiconductor substrate and forming an opening in the dielectric layer to expose a conductive element. The method also includes forming a conductive layer over the conductive element and modifying an upper portion of the conductive layer using a plasma operation to form a modified region. The method further includes forming a conductive plug over the modified region.
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
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Yee-Chia Min-Hsiu Sung-Li Chih-Wei Yida Cheng-Tung Jyh-Cherng Huang-Yi Pei-Wen Chi-On
Yeo Hung Wang Chang Li Lin Sheu Huang Wu Chui