Tutunjian & Bitetto, P.C.
Dry etch method for texturing silicon and device
A method for texturing silicon includes loading a silicon wafer into a vacuum chamber, heating the silicon wafer and thermal cracking a gas to generate cracked sulfur species. The silicon wafer is exposed to the cracked sulfur species for a time duration in accordance with a texture characteristic needed for a surface of the silicon wafer.
International Business Machines Corporation
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Richard A. Jeehwan Talia S. Yun Seog
Haight Kim Gershon Lee