Hogan & Hartson, LLP
Chip mounting substrate, first level assembly, and second level assembly
A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.
Kabushiki Kaisha Toshiba
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Isao Shinya
Ozawa Watanabe