Zirconium as an adhesion material in a multi-layer metallic structure
 A layer of zirconium can be used as an adhesion layer between a ceramic or polyimide substrate and subsequently applied metallic layers. Following the zirconium layer, copper can be deposited followed by a reaction barrier layer and a wettable surface layer such as gold. This type of structure can be used for pin bracing, chip joining, and/or wire connections. 
International Business Machines Corporation
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Jungihl Da-Yuan Walter F. Sheree H.
Kim Shih Lange Wen