F. Chau & Associates, LLC
Semiconductor package having magnetic connection member
Provided is a semiconductor package including a wiring substrate having top and bottom surfaces. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.
SAMSUNG ELECTRONICS CO., LTD.
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Hyunsuk Seungbae Soojae Sangsu
Chun Lee Park Ha