Brinks Gilson & Lione
Semiconductor device manufacturing method including doping from a diffused layer
The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The manufacturing method includes: providing a substrate; forming a source and a drain that are at least partially located in the substrate; forming a diffused layer on a surface of at least one of the source or the drain, where a conductivity type of the diffused layer is the same conductivity type as the source and the drain, and a doping density of a dopant contained in the diffused layer is separately greater than doping densities of dopants contained in the source and the drain; and performing an annealing processing after the diffused layer is formed. The present disclosure can increase a doping density at a surface of a source and/or a drain, helping to reduce a contact resistance, thereby improving performance of a device.
Semiconductor Manufacturing International (Shanghai) Corporation Semiconductor Manufacturing International (Beijing) Corporation
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Yong
Li