Light emitting diode package substrate and light emitting diode package element
A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Chao-Hsiung Hsin-Chiang Pin-Chuan Lung-Hsin Hou-Te Wen-Liang
Chang Lin Chen Chen Lin Tseng