Perman & Green
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
 Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate. 
International Business Machines Corporation
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Jungihl Jae M. George F. Mark O. Edward A. Emanuel I. James M. Sarah H. Peter R. Farid Y. Thomas M. Robert R. Shaji Young-Ho Rao Jon A. Robert A. Friedel
Kim Park Walker Neisser Giess Cooper Brownlow, deceased Knickerbocker Duncombe Aoude Shaw Shaw Farooq Kim Vallabhaneni Van Hise Rita Muller-Landau