Jianq Chyun IP Office
Circuit board, structural unit thereof and manufacturing method thereof
A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board.
HTC Corporation
H Y H H H H H
H05K Y10T H05K H05K H05K H01L H05K
additional additional inventional additional inventional inventional inventional
Hui-Ling Chin-Wei
Tsai Ho