Foley & Lardner LLP
Semiconductor package device and method of manufacturing the same
A semiconductor package device includes a substrate, an electronic component disposed on the substrate, and a package body. The electronic component has a first surface adjacent to the substrate and a second surface opposite to the first surface. The second surface has at least five edges, and the package body encapsulates the electronic component and exposes the second surface of the electronic component.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
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Yu-Chang Chang-Lin
Chen Yeh