Leydig Voit & Mayer
Method of resin sealing semiconductor devices
 A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices. 
Mitsubishi Denki Kabushiki Kaisha
B B B
B29C B29C B30B
inventional inventional inventional
Hiromichi Hideaki Sueyoshi Yutaka Yasutsugu Tatsuro
Yamada Seuzaki Tanaka Morita Tsutsumi Takahashi