Thomas, Kayden, Horstemeyer & Risley
Light emitting diode structure, LED packaging structure using the same and method of forming the same
A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure.
Industrial Technology Research Institute
H H
H01L H01L
additional inventional
Chen-Peng Ji-Feng Hung-Lieh Yao-Jun
Hsu Chen Hu Tsai