Haynes And Boone, LLP
Material composition and process for substrate modification
Provided is a material composition and method for substrate modification. A substrate is patterned to include a plurality of features. The plurality of features includes a first subset of features having one or more substantially inert surfaces. In various embodiments, a priming material is deposited over the substrate, over the plurality of features, and over the one or more substantially inert surfaces. By way of example, the deposited priming material bonds at least to the one or more substantially inert surfaces. Additionally, the deposited priming material provides a modified substrate surface. After depositing the priming material, a layer is spin-coated over the modified substrate surface, where the spin-coated layer is substantially planar.
Taiwan Semiconductor Manufacturing Co., Ltd.
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Chien-Wei Wei-Han Ching-Yu Chin-Hsiang
Wang Lai Chang Lin