Faegre Baker Daniels LLP
Compressible thermal interface materials
Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.
Honeywell International Inc.
H C H H H
H01L C09K H01L H01L H01L
additional inventional inventional inventional inventional
Liqiang Hong Min Wei Liang Wei Jun Zhe Ya Qun
Zhang Huang Chang Zeng Wang Ding Liu