Hauptman Ham, LLP
Semiconductor component having through-silicon vias and method of manufacture
A semiconductor component includes a semiconductor substrate having an opening A first dielectric liner having a first compressive stress is disposed in the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
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Chen-Hua Ebin Hsiang-Yi Cheng-Hung Darryl Chun Hua Li-Hsien Chia-Lin Tsang-Jiuh Wen-Chih
Yu Liao Wang Chang Kuo Chang Huang Yu Wu Chiou