Bacon & Thomas, PLLC
Method of transferring devices by lateral etching of a sacrificial layer
The present invention relates to a method for transferring devices. A sacrificing layer is positioned before the devices are manufactured, and a transition substrate is pasted on the devices. Then, a method for lateral wet etching or a method for lateral wet etching with mechanical stripping is applied for removing or stripping the sacrificing layer so as to separate the devices and a substrate. The separated devices are transferred to the transition substrate so as to meet the requirements for various products and applications.
Industrial Technology Research Institute
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inventional additional inventional
Ching-Hsuan Yu-Cheng Jung-Fang Wen-Tung
Tang Chen Chang Wang