Altis Law Group, Inc.
Heat dissipation apparatus for electronic device
A heat dissipation apparatus adapted for simultaneously cooling a first electronic component and a second electronic component includes a heat sink adapted for being thermally attached to the first electronic component, a fan duct receiving the heat sink therein and a fan mounted to the fan duct. The fan duct comprises a top plate and two side plates extending from two opposite sides of the top plate. A receiving space is defined in the fan duct between the top plate and a top of the heat sink and adapted for receiving the second electronic component. Airflow from the fan is guided by the fan duct to blow towards the heat sink and the second electronic component, simultaneously.
Foxconn Technology Co., Ltd. Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
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inventional inventional inventional additional
Jian
Liu