Lead-free solder paste and its use
A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.
Senju Metal Industry Co., Ltd. Murata Manufacturing Co., Ltd.
B Y B C B H B B B H B
B22F Y10T B22F C22C B23K H05K B23K B23K B23K H05K B23K
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Shizuharu Masafumi Kosuke Hidekiyo Ko
Watanabe Seino Nakano Takaoka Inaba