Leydig, Voit & Mayer
Flexibilizers of hydroxyphenyl silicone oil-epoxy resin product and epoxy silicone oil-phenol resin product
 An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition. 
Mitsubishi Denki Kabushiki Kaisha
C C H C C C H H
C08G C08L H01L C08G C08G C08G H01L H01B
inventional inventional inventional inventional inventional inventional additional inventional
Hiromi Ichiro
Ito Takahashi