Hauptman Ham, LLP
Wafer scale image sensor package and optical mechanism
There is provided an optical mechanism including a substrate, an image chip, a light source and a securing member. The image chip and the light source are attached to the substrate. The securing member is secured to the substrate and includes a first containing space for accommodating the light source, a second containing space for accommodating the image chip and a blocking region between the first containing space and the second containing space.
PIXART IMAGING INC
H H H
H01L H01L H01L
inventional inventional inventional
Hui-Hsuan Tien-Chia
Chen Liu