Birch, Stewart, Kolasch, and Birch, LLP
Chip package substrate having soft circuit board and method for fabricating the same
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.
Lite-On Semiconductor Corp.
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Yvon Evan Huei-Jen
Chen Liu Chen