Lead frame and light emitting diode package having the same
An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
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Yau-Tzu Lung-Hsin Hsing-Fen Wen-Liang Yu-Liang Che-Hsang Chao-Hsiung Yu-Lun Pin-Chuan
Jang Chen Lo Tseng Huang Huang Chang Hsieh Chen