Oblon, McClelland, Maier & Neustadt, L.L.P.
Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same
The photosensitive resin composition of the present invention contains a vinyl-based (co)polymer (I) obtained by polymerizing a monomer mixture (α) containing a vinyl-based monomer (a) having a phenolic hydroxyl group, a vinyl-based copolymer (II) having a weight-average molecular weight of 15,000 to 120,000, obtained by polymerizing a monomer mixture (β) containing a vinyl-based monomer (b) represented by CH2═CR1COO(R2O)kR3 (wherein R1=a hydrogen atom or a methyl group, R2=a hydrocarbon group having a carbon number of 1 to 4, R3=a hydrogen atom or a methyl group, and k=1 to 90) and a carboxyl group-containing vinyl-based monomer (c), a photosensitive substance (III), and a compound (IV) which is a specific aromatic polyhydroxy compound.
MICRO PROCESS INC.
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Saki Shintaro Akifumi Kazuo Hidetaka Shigeki
Fujita Okada Ueda Watanabe Nakagawara Watanabe