Wolf, Greenfield & Sacks, P.C.
Oxalic amide ligands, and uses thereof in copper-catalyzed coupling reaction of aryl halides
The present invention provides oxalic amide ligands and uses thereof in copper-catalyzed coupling reaction of aryl halides. Specifically, the present invention provides a use of a compound represented by formula I, wherein definitions of each group are described in the specification. The compound represented by formula I can be used as a ligand in copper-catalyzed coupling reaction of aryl halides for the formation of C—N, C—O and C—S bonds.
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C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C B C C C C B C C C B C C C C B B C B C C C C C C C C C C C C
C07D C07D C07D C07C C07D C07C C07D C07C C07D C07D C07D C07D C07D C07D C07D C07C C07D C07D C07C C07D C07D C07D C07C C07D C07C C07D C07D C07B C07C C07D C07D C07C C07D C07D C07C C07B C07D C07D C07D C07D B01J C07C C07D C07D C07D B01J C07C C07D C07D B01J C07D C07D C07D C07C B01J B01J C07D B01J C07B C07D C07D C07D C07D C07C C07D C07C C07D C07D C07D C07D
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Mengyang Junli Shanghua Haibo Wei Dawei
Fan Yin Xia Wu Zhou Ma