F. Chau & Associates, LLC
Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
Samsung Electronics Co., Ltd.
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additional additional inventional additional additional additional additional additional inventional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional additional inventional additional inventional additional additional additional additional additional additional inventional additional additional inventional additional inventional additional inventional
Hyun-Ik YongJin Kunho
Hwang Jung Song